WO2023073843A1 - Substrate fixing structure, machine, and robot - Google Patents

Substrate fixing structure, machine, and robot Download PDF

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Publication number
WO2023073843A1
WO2023073843A1 PCT/JP2021/039713 JP2021039713W WO2023073843A1 WO 2023073843 A1 WO2023073843 A1 WO 2023073843A1 JP 2021039713 W JP2021039713 W JP 2021039713W WO 2023073843 A1 WO2023073843 A1 WO 2023073843A1
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WO
WIPO (PCT)
Prior art keywords
substrate
fixing structure
machine
housing
board
Prior art date
Application number
PCT/JP2021/039713
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French (fr)
Japanese (ja)
Inventor
泰地 田口
慶太郎 稲垣
秀俊 植松
Original Assignee
ファナック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by ファナック株式会社 filed Critical ファナック株式会社
Priority to PCT/JP2021/039713 priority Critical patent/WO2023073843A1/en
Priority to TW111136447A priority patent/TW202317339A/en
Publication of WO2023073843A1 publication Critical patent/WO2023073843A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack

Definitions

  • the present invention relates to substrate fixing technology, and more particularly to substrate fixing structures, machines, and robots.
  • a known technique is to fix the printed circuit board for the actuator that drives the machine inside the machine housing.
  • vibrations or shocks due to external or internal factors are transmitted to the machine housing, and the transmission of vibrations from the housing to the substrate can damage the substrate.
  • the heat generated by the heat generating elements such as power semiconductors and integrated circuits on the substrate is difficult to transfer to the housing of the machine, the heat generating elements will easily reach the rated temperature and the rated current will decrease.
  • Patent Document 1 discloses a radar antenna drive device having a support means for rotatably supporting a radar antenna body and a motor fixed to the support means for rotationally driving the radar antenna body. It is described that a vibration absorbing member made of a ferrite composite material is inserted in the vibration propagation path to.
  • Patent Document 2 discloses a first transmission shaft for extracting rotational power of a drive motor, a second transmission shaft for vertically moving a slider by the power from the first transmission shaft, and a spoiler support member that is connected to the slider and vertically moves the spoiler. are supported by a metal core frame, the core frame is assembled and set in a housing made of synthetic resin, and a vibration absorbing material is interposed in the contact area between the core frame and the housing.
  • Patent Document 3 in an integrated electric power steering device, heat is conducted from a heating element on a control board to a mechanism member via a heat conduction member to suppress the temperature, and the heat conduction member is connected to the control board and the mechanism member. It is described to act as a vibration absorber during
  • Patent Document 4 in an electronic device, spacers are arranged around electronic components and on both sides of a substrate, the spacers are connected to rigid members on both sides of the substrate, It is described that a vibration absorbing member is arranged between the substrate.
  • Patent Document 5 discloses a robot arm having a housing, which converts a DC voltage output from an AC motor having a predetermined drive voltage and a power supply that outputs a predetermined DC voltage into an AC voltage. and a substrate on which a driving circuit for driving the motor is mounted, and the substrate is arranged in surface contact with a predetermined surface of the housing.
  • Patent Document 6 describes that a door that can be opened and closed is provided to the device body, and a printed circuit board is fixed to the door side.
  • An object of the present invention is to provide a board fixing technique that increases the reliability of the board in view of the conventional problems.
  • One aspect of the present disclosure includes a substrate for an actuator that drives a machine, vibration absorbers arranged on both sides of the substrate, and a fixing portion that sandwiches the substrate and the vibration absorber and fixes them to a housing of the machine.
  • a substrate fixing structure comprising: Another aspect of the present disclosure provides a machine or robot comprising a substrate securing structure as described above.
  • the vibrations are absorbed by the vibration absorbing material, and transmission of the vibrations to the board is reduced. damage can be reduced. As a result, the MTBF (Mean Time Between Failures) can be increased. As a result, it is possible to provide a substrate fixing structure that enhances the reliability of the substrate. According to another aspect of the present disclosure, such a substrate fixing structure can provide a highly reliable machine or robot.
  • FIG. 1 is a perspective view of a machine with a substrate fixing structure of the first embodiment;
  • FIG. It is a block diagram of a substrate of the first embodiment. It is a bottom view of the board
  • FIG. 4 is a IV-IV cross-sectional view of the substrate fixing structure of the first embodiment;
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example;
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of another modified example;
  • It is a bottom view of the board
  • FIG. 4 is a IV-IV cross-sectional view of the substrate fixing structure of the first embodiment
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example;
  • FIG. 11 is an isolated view of the substrate fixing structure of the third embodiment;
  • FIG. 4 is a cross-sectional view of a substrate fixing structure of a comparative example;
  • FIG. 1 is a perspective view of a machine 1 with a substrate fixing structure of the first embodiment.
  • the machine 1 is composed of robots such as single-axis robots, multi-axis robots, parallel-link robots, and humanoid robots.
  • the machine 1 may consist of industrial machines such as machine tools, construction machines, agricultural machines, conveyors, or other machines such as vehicles, aircraft, home appliances, and the like.
  • the machine 1 of this embodiment comprises an articulated robot, in particular a collaborative robot.
  • the machine 1 includes hollow housings 10 to 16, actuators 21 to 26 that drive the machine 1, substrates 31 to 36 for the actuators 21 to 26, and a filament 41 that electrically connects the substrates 31 to 36. .about.52.
  • the housings 10 to 16 are links of the machine 1 that are connected to each other for relative movement.
  • the zeroth housing 10 is a fixed base that is fixed at a predetermined position
  • the first housing 11 is a swing barrel that is rotatably supported with respect to the zeroth housing 10 about the first axis J1.
  • the second housing 12 is an upper arm rotatably supported with respect to the first housing 11 about a second axis J2 perpendicular to the first axis J1, and the third housing 13 is parallel to the second axis J2.
  • the forearm is rotatably supported with respect to the second housing 12 about the third axis J3.
  • a fourth housing 14 , a fifth housing 15 , and a sixth housing 16 are triaxial wrist units attached to the second housing 13 .
  • the fourth housing 14 is a first wrist element supported rotatably with respect to the third housing 13 about a fourth axis J4 perpendicular to the third axis J3.
  • the housings 11-14 are provided with separating parts 11a-14a that can be separated from the housings 11-14. Separating portions 11a to 14a are covers that form part of housings 11 to 14, and by separating separating portions 11a to 14a from housings 11 to 14, maintenance and maintenance of actuators 21 to 26 or substrates 31 to 36 can be performed. exchange becomes possible.
  • the actuators 21-26 are fixed inside the housings 10-16. Alternatively, in other embodiments, some or all of the plurality of actuators 21-26 may be fixed outside the housings 10-16. Actuators 21-26 are comprised of rotary actuators, but in other embodiments actuators 21-26 may be comprised of linear actuators.
  • the actuators 21 to 26 are electromagnetic actuators, and although not shown, each includes an electric motor and an operation detection section that detects the operation of the electric motor (see FIG. 2).
  • the actuators 21-26 may consist of actuators in which other mechanical elements such as speed reducers, shafts, bearings, gears, brakes, etc. are coupled to the electric motor.
  • the electric motor is composed of an AC motor such as an induction motor or a synchronous motor, but in other embodiments, the electric motor may be composed of a DC motor.
  • the motion detector is composed of a mechanical, optical, magnetic, electromagnetic induction, or other encoder.
  • the first actuator 21 rotates the first housing 11 around the first axis J1
  • the second actuator 22 rotates the second housing 12 around the second axis J2.
  • the third actuator 23 rotates the third housing 13 around the third axis J3
  • the fourth actuator 24 rotates the fourth housing 14 around the fourth axis J4.
  • the fifth actuator 25 rotates the fifth housing 15 around the fifth axis J5, and the sixth actuator 26 rotates the sixth housing 16 around the sixth axis J6.
  • the boards 31-36 are printed boards (driving devices) that supply electric power to the electric motors of the actuators 21-26.
  • the substrates 31-36 are fixed inside the housings 10-16.
  • the first substrate 31 is fixed inside the first housing 11
  • the second substrate 32 and the third substrate 33 are fixed inside the second housing 12 .
  • the fourth substrate 34 and the fifth substrate 35 are fixed inside the third housing 13
  • the sixth substrate 36 is fixed inside the fourth housing 14 .
  • the first board 31 supplies power to the electric motor of the first actuator 21
  • the second board 32 supplies power to the electric motor of the second actuator 22
  • the third board 33 powers the motor of the third actuator 23 and the fourth board 34 powers the motor of the fourth actuator 24
  • the fifth board 35 powers the motor of the fifth actuator 25 and the sixth board 36 powers the motor of the sixth actuator 26 .
  • the filaments 41-52 are electrical cables electrically connected to the substrates 31-36.
  • a first filament 41 electrically connects the controller 40 of the machine 1 to the first substrate 31 and a second filament 42 electrically connects the first substrate 31 to the first actuator 21 .
  • a third filament 43 electrically connects the first substrate 31 to the second substrate 32 , and a fourth filament 44 electrically connects the second substrate 32 to the second actuator 22 .
  • a fifth filament 45 electrically connects the second substrate 32 to the third substrate 33
  • a sixth filament 46 electrically connects the third substrate 33 to the third actuator 23 .
  • the seventh filament 47 electrically connects the third substrate 33 to the fourth substrate 34
  • the eighth filament 48 electrically connects the fourth substrate 34 to the fourth actuator 24
  • a ninth filament 49 electrically connects the fourth substrate 34 to the fifth substrate 35
  • a tenth filament 50 electrically connects the fifth substrate 35 to the fifth actuator 25
  • the eleventh filament 51 electrically connects the fifth substrate 35 to the sixth substrate 36
  • a twelfth filament 52 electrically connects the sixth substrate 36 to the sixth actuator 26 .
  • the filaments 41, 43, 45, 47, 49, and 51 daisy-chain connect the substrates 31 to 36 and the controller 40, and the controller 40 connects the filaments 41, 43, 45, Power and signals are supplied to the substrates 31-36 via 47,49,51. That is, the filaments 41, 43, 45, 47, 49, 51 are electrical cables including power lines and signal lines.
  • the filaments 41, 43, 45, 47, 49, and 51 pass through through-holes of the actuators 21-26 (see through-holes 21c and 22c in FIG. 7), although not shown.
  • the filaments 42, 44, 46, 48, 50, 52 electrically connect the substrates 31-36 to the actuators 21-26.
  • the substrates 31-36 supply power to the motors of the actuators 21-26 via the filaments 42,44,46,48,50,52. That is, the filaments 42, 44, 46, 48, 50, 52 are electrical cables including power lines.
  • FIG. 2 is a block diagram of the substrate 31 of the first embodiment.
  • the actuator 21 driven and controlled by the substrate 31 includes an electric motor 21a and an operation detection section 21b that detects the operation of the electric motor 21a.
  • the electric motor 21a of this embodiment is composed of an AC motor, but in other embodiments, it may be composed of a DC motor.
  • the substrate 31 includes various electronic components that are heat generating elements.
  • the substrate 31 has a control section 60 , a drive section 61 and a current detection section 69 .
  • the control unit 60 supplies electric power to the electric motor 21a based on a command signal for the electric motor 21a from the host board (the control device 40 in this example) and a detection signal for the electric motor 21a from the operation detection unit 21b and the current detection unit 69. is provided with a control circuit for controlling the
  • the drive unit 61 includes an inverter circuit that converts the power from the host board (control device 40 in this example) from direct current to alternating current based on a signal from the control unit 60 .
  • the current detection unit 69 includes a current sensor of magnetic field detection type, resistance detection type, or the like.
  • the control circuit of the control unit 60 is composed of an integrated circuit that performs PWM (pulse width modulation) control of the inverter circuit of the driving unit 61.
  • PFM pulse frequency modulation
  • PAM pulse amplitude modulation
  • the integrated circuit is implemented by a semiconductor integrated circuit such as an MCU (micro controller unit) or LSI (large-scale integration), which is a heating element.
  • the inverter circuit of the drive unit 61 is composed of a voltage type inverter circuit, but may be composed of a current type inverter circuit in other embodiments.
  • the voltage type inverter circuit includes a capacitor 62 and switching elements 63-68.
  • the switching elements 63 to 68 are implemented by power semiconductors such as FETs (field-effect transistors), IGBTs (Insulated gate bipolar transistors), and IPMs (intelligent power modules), which are heating elements.
  • the control circuit of the control unit 60 adjusts the frequency, cycle, duty, etc. of the U-phase, V-phase, and W-phase three-phase AC voltages based on the command signal and detection signal from the electric motor 21a, and generates switching signals.
  • the inverter circuit of the drive unit 61 sequentially turns on and off the switching elements 63 to 68 based on the switching signal of the control unit 60 to supply the three-phase alternating current to the windings of the electric motor 21a.
  • the electric motor 21a operates, and the first actuator 21 rotates the first housing 11 around the first axis J1.
  • the drive unit 61 sequentially turns on and off the switching elements 63 to 68 based on the switching signal of the control unit 60, supplies three-phase alternating current to the motors of the other actuators 22 to 26,
  • Other actuators 22-26 rotate housings 12-16 about second axis J2-sixth axis J6.
  • the machine 1 operates, but when the vibration or impact of the machine 1 due to external or internal factors is transmitted to the boards 31 to 36 through the housings 11 to 16, soldering on the boards 31 to 36 occurs.
  • the substrates 31 to 36 may be damaged due to peeling of the electronic parts or disconnection of wiring between the electronic parts. Therefore, the substrates 31-36 of this embodiment are fixed to the housings 11-16 via vibration absorbing materials so that the vibration or impact of the machine 1 is less likely to be transmitted to the substrates 31-36.
  • FIG. 3 is a bottom view of the substrate fixing structure of the first embodiment
  • FIG. 4A is a IV-IV sectional view of the substrate fixing structure of the first embodiment.
  • the substrate fixing structure of the first substrate 31 for the first actuator 21 described with reference to FIG. 1 will be described in detail.
  • the substrate fixing structure of the first embodiment includes a substrate 31 for the actuators 21 that drive the machine 1 and vibration absorbers arranged on both sides of the substrate 31 so that the vibration or impact of the machine 1 is less likely to be transmitted to the substrate 31. and a fixing portion 81 that sandwiches the substrate 31 and the vibration absorbing material 80 and fixes them to the housing 11 of the machine.
  • the substrate 31 is formed in a substantially circular or substantially elliptical shape in plan view so as to match the internal shapes of the housings 10-16.
  • the substrate 31 may be substantially rectangular in plan view.
  • the substrate 31 is sandwiched between a vibration absorbing member 80a arranged on the front side of the substrate 31 and a vibration absorbing member 80b arranged on the back side of the substrate 31.
  • the fixing portions 81 are arranged at equal intervals (in this example, at intervals of 120 degrees) in the circumferential direction of the substrate 31 having a shape such as a substantially circular or substantially elliptical shape so that the substrate 31 is not displaced.
  • the fixed portions 81 may be arranged at the corners of the substantially rectangular substrate 31 .
  • the vibration absorbing material 80 is also called a vibration damping material, a shock absorbing material, a shock absorbing material, or the like. Vibration absorbing material 80 is formed of an elastomer such as gel, soft rubber, soft foam, or combinations thereof.
  • the vibration absorbing material 80 includes a vibration absorbing material 80 a arranged on the front side of the substrate 31 and a vibration absorbing material 80 b arranged on the back side of the substrate 31 .
  • the vibration absorbing material 80a arranged on the front side of the substrate 31 and the vibration absorbing material 80b arranged on the back side of the substrate 31 are formed of the same material and in the same shape.
  • the surface of the vibration absorber 80 should have a relatively high coefficient of friction so that the vibration absorber 80 does not slide on the surface of the substrate 31 .
  • the vibration absorbing material 80 may have an uneven surface or a jagged surface.
  • the fixing portion 81 includes a holding member 82 that holds the substrate 31 and the vibration absorbing material 80 between them, and a fixing member 83 that fixes the holding member 82 to the housing 11 of the machine 1 .
  • the holding member 82 is made of a rigid body such as metal or hard resin.
  • the sandwiching member 82 has a substantially U-shaped portion when viewed in cross section.
  • the sandwiching member 82 sandwiches the substrate 31 and the vibration absorbing material 80 with the U-shaped portion.
  • the fixing member 83 has a fastening member such as a screw including a male thread, a female thread and the like.
  • a fixing member 83 fixes the clamping member 82 to the housing 11 of the machine 1 .
  • the inner wall height H of the U-shaped portion of the holding member 82 By forming the inner wall height H of the U-shaped portion of the holding member 82 to be smaller than the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31, the two vibration absorbing members 80a and 80b are compressed, and substrate 31 is tightly attached by vibration absorbing materials 80a and 80b.
  • the height H of the U-shaped portion of the clamping member 82 is drawn larger than the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b in order to facilitate understanding of the components.
  • the height H of the U-shaped portion is actually smaller than the thickness T including the substrate 31 and the vibration absorbing members 80a and 80b.
  • the substrate 31 is fixed to the housing 11 of the machine 1 .
  • the vibration absorbing material 80 absorbs the vibration, so that the transmission of the vibration to the substrate 31 is reduced.
  • peeling of the electronic components soldered on the substrate 31 and disconnection of wiring between the electronic components are suppressed, and damage to the substrate 31 can be reduced. Consequently, the MTBF (Mean Time Between Failures) can be increased.
  • FIG. 4B is a IV-IV cross-sectional view of a modified substrate fixing structure.
  • the holding member 82 includes two holding members, a first holding member 82a and a second holding member 82b, which hold the substrate 31 and the vibration absorbing material 80, and the fixing member 83 holds the substrate 31 and the vibration absorber 80 together.
  • 4A in that the first holding member 82a and the second holding member 82b are fixed to the housing 11 by penetrating the absorbing member 80, the first holding member 82a, and the second holding member 82b.
  • the two clamping members 82a and 82b do not have the U-shaped portion described above and are completely separated.
  • the fixing member 83 has a fastening member such as a screw including, for example, a male thread and a female thread.
  • the fixing member 83 penetrates the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31, the substrate 31 is prevented from being displaced and the vibration absorbing members 80 are prevented from sliding. can be firmly fixed.
  • the fixing member 83 penetrates the elastically deformable vibration absorbing material 80a and fixes the two completely separated holding members, that is, the first holding member 82a and the second holding member 82b, to the housing 11, the above-mentioned holding is performed. It is not necessary to adjust the dimensions of the height H of the U-shaped portion of the member 82 and the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31 in advance.
  • the substrate fixing structure of the modification also has a secondary effect of being easy to manufacture.
  • the vibration absorbing material 80 does not include two vibration absorbing materials 80a and 80b arranged on both the front side and the back side of the substrate 31, but on the front side and the back side of the substrate 31. It may be composed of one vibration absorbing material 80 having U-shaped portions (U-shaped portions arranged on both sides of the substrate 31) sandwiching both sides of the back side.
  • FIG. 4C is a IV-IV cross-sectional view of another modified substrate fixing structure.
  • the holding member 82 includes two holding members, a first holding member 82a and a second holding member 82b, which hold the substrate 31 and the vibration absorbing material 80, and the fixing member 83 is the first holding member.
  • a support member 83a that supports the member 82a and the second holding member 82b, a fastening member 83b that fastens the first holding member 82a and the second holding member 82b to the support member 83a, and a fastening that fastens the support member 83a to the housing 11. It is different from the substrate fixing structure of FIG. 4A in that the member 83c is provided.
  • the two clamping members 82a and 82b have the above-described U-shaped portions, and clamp the substrate 31 and the vibration absorbing material 80 by the U-shaped portions.
  • the support member 83a is formed in a substantially triangular, substantially L-shaped plate shape when viewed from the side, like a so-called shelf support.
  • the fastening members 83b and 83c are composed of screws including male threads and female threads.
  • the holding member 82 By configuring the holding member 82 with the two holding members 82a and 82b, the assembly process of sandwiching and assembling the substrate 30 and the vibration absorbing material 80 is facilitated. Further, since the fixing member 83 is provided with the supporting member 83a for supporting the two holding members 82a and 82b, the substrate 31, the vibration absorbing member 80, and the holding member 82 can be unitized (hereinafter referred to as "substrate holding unit"). ), by changing the shape of the support member 83, the board clamping unit can be easily fixed to the other housings 12 to 16 having a shape different from the shape of the housing 11. .
  • the vibration absorbing material 80 includes the vibration absorbing material 80a arranged on the front side of the substrate 31 and the vibration absorbing material 80b arranged on the back side of the substrate 31.
  • Vibration absorbers 80a and 80b are also different from the substrate fixing structure of FIG. 4A in that they are both formed in a substantially L shape when viewed in cross section. Since the substantially L-shaped vibration absorbers 80a and 80b are engaged with the side edges of the substrate 31, positioning of the vibration absorbers 80a and 80b is facilitated.
  • the two vibration absorbing members 80a and 80b arranged on the front side and the back side of the substrate 31 are in contact with each other on the side edges of the substrate 31 and have a substantially U-shape in cross section.
  • the vibration absorber 80 does not comprise two vibration absorbers 80a, 80b arranged on both the front and back sides of the substrate 31, but a single vibration absorber sandwiching both the front and back sides of the substrate 31. It may be composed of a vibration absorbing material 80 . Thereby, the vibration absorber 80 can be positioned more easily.
  • FIG. 5 is a bottom view of the substrate fixing structure of the second embodiment
  • FIG. 6A is a cross-sectional view of the substrate fixing structure VI-VI of the second embodiment.
  • the substrate fixing structure of the first substrate 31 for the first actuator 21 described with reference to FIG. 1 will be described, but it should be noted that the second substrate 32 to the sixth substrate 36 also have similar substrate fixing structures.
  • want to be In the substrate fixing structure of the first embodiment since the substrate 31 is separated from the housing 11 of the machine 1 by the vibration absorbing material 80, there is a possibility that the heat dissipation of the heat generating elements on the substrate 31 is deteriorated.
  • the substrate fixing structure of the second embodiment includes power semiconductors (switching elements 63 to 68) such as FETs, IGBTs, and IPMs, which are heating elements on the substrate 31, and integrated circuits such as MCUs and LSIs (control unit 60). ) to the housing 11 of the machine 1 , a heat transfer section 90 is further provided for connecting the heat generating element on the substrate 31 to the housing 11 of the machine 1 .
  • the heat transfer section 90 preferably includes a flexible and thin metal sheet so that the vibration of the housing 11 is less likely to be transferred to the substrate 31 .
  • the metal sheet is formed of a relatively high thermal conductivity metal such as aluminum, copper, or alloys thereof.
  • the heat transfer section 90 includes a heat absorption surface 91 connected to the heat generating elements on the substrate 31 and a heat dissipation surface 92 connected to the housing 11 .
  • the heat transfer section 90 further includes a heat conductive resin that adheres the heat absorbing surface 91 of the metal sheet to the heat generating elements (the switching elements 63 to 68 and the control section 60).
  • the heat absorbing surface 91 is adhered to a plurality of heat generating elements (the switching elements 63 to 68 and the control section 60) with heat conductive resin.
  • the heat absorbing surface 91 of each may be adhered to a specific heat generating element by means of heat conductive resin.
  • the heat transfer section 90 may further include a heat conductive resin that adheres the heat dissipation surface 92 of the metal sheet to the housing 11 of the machine 1 .
  • the heat dissipation surface 92 is adhered to the housing 11 of the machine 1 by thermally conductive resin. Each may be adhered to the body 11 .
  • the heat dissipation surface 92 may be fastened to the housing 11 with metal screws such as bolts and nuts.
  • the thermally conductive resin mentioned above may be a thermally conductive resin in which thermally conductive fibers are interconnected in a matrix resin.
  • the heat-conducting fiber includes aluminum nitride, magnesium oxide, boron nitride, alumina, anhydrous magnesium carbonate, silicon oxide, zinc oxide, etc.
  • the matrix resin includes polyimide resin, silicon resin, epoxy resin, phenolic resin, etc. and heat-resistant resins such as thermoplastic resins such as polyphenylene sulfide resins, polycarbonate resins, polybutylene terephthalate resins, and polyacetal resins.
  • the heat generated by the power semiconductors (switching elements 63 to 68) and the integrated circuit (control section 60), which are heat generating elements on the substrate 31, is transferred to the heat absorption surface 91 of the heat transfer section 90 as indicated by the heat transfer path H1.
  • the heat is radiated to the inside of the housing 11 of the machine 1, and the heat is transferred from the heat absorbing surface 91 to the heat radiating surface 92 of the heat transfer section 90 to the housing 11 of the machine 1 as indicated by the heat transfer path H2.
  • FIG. 6B is a IV-IV cross-sectional view of a modified substrate fixing structure.
  • the board fixing structure of the modification differs from the board fixing structure of FIG. 6A in that the heat transfer section 90 connects the board 31 itself to the housing 11 of the machine 1 . If there is no electronic component on the back side of the substrate 31 , the heat absorbing surface 91 of the heat transfer section 90 should be in close contact with the back side of the substrate 31 . The heat absorption surface 91 is adhered to the back side of the substrate 31 with the heat conductive resin described above, or fastened to the back side of the substrate 31 with metal screws.
  • the heat generated by the heat generating elements (the switching elements 63 to 68 and the control unit 60) arranged on the front side of the substrate 31 is radiated to the gas inside the housing 11 of the machine 1 as indicated by the heat transfer path H1.
  • heat is transferred from the substrate 31 to the heat dissipation surface 92 via the heat absorption surface 91 as indicated by the heat transfer path H2, and is radiated to the housing 11 of the machine 1.
  • the substrate fixing structures shown in FIGS. 6A and 6B may be used together, and the heat absorbing surface 91 of the heat transfer section 90 may be adhered to the heating elements of the substrate 31 and may be in close contact with the back side of the substrate 31 .
  • the transmission of vibration to the substrate 31 is reduced by the vibration absorbing material 80, and the heat generated by the heating element on the substrate 31 is efficiently dissipated by the heat transfer section 90. can.
  • the heating elements on the substrate 31 are less likely to reach the rated temperature, and the rated current can be increased, so the operating performance of the machine 1 can be improved.
  • the substrate fixing structure of the third embodiment will be described in detail below. Note that only parts different from the substrate fixing structure of the first embodiment will be described. Referring to FIG. 1 again, in the substrate fixing structure of the first embodiment, when performing maintenance or replacement of the substrates 31 to 36, two steps are performed: removing the separating portions 11a to 14a and then removing the substrates 31 to 36. It has to go through and takes time. Therefore, the substrate fixing structure of the third embodiment differs from the substrate fixing structure of the first embodiment in that the substrates 31 to 36 are fixed to the separating portions 11a to 14a that can be separated from the housings 11 to 14 of the machine 1. different.
  • FIG. 7 is an exploded view of the substrate fixing structure of the third embodiment.
  • FIG. 7 representatively illustrates two separate parts 11a and 12a separated from the two housings 11 and 12 of the machine 1, respectively.
  • the first substrate 31 is fixed to a first separation portion 11a separable from the first housing 11, and the second substrate 32 and the third substrate 33 are fixed to a second separation portion 12a separable from the second housing 12.
  • the fourth substrate 34 and the fifth substrate 35 are fixed to the third separating portion 13a separable from the third housing 13, and the sixth substrate 36 is attached to the fourth housing.
  • 14 is fixed to a fourth separating portion 14a that can be separated from .
  • the first substrate 31 further includes connectors 70-72 capable of separating the filaments 41-43. (see also Figure 2).
  • the first connector 70 allows the first filament 41 to be separated from the first substrate 31,
  • the second connector 71 allows the second filament 42 to be separated from the first substrate 31, and
  • the third connector 72 allows the third filament.
  • the body 43 is made separable from the first substrate 31 .
  • the second board 32 and the third board 33 are further provided with connectors 73-78 that can separate the filaments 43-47.
  • a fourth connector 73 allows the third filament 43 to be separated from the second substrate 32
  • a fifth connector 74 allows the fourth filament 44 to be separated from the second substrate 32
  • a sixth connector 75 allows the fifth filament to be separated.
  • the body 45 is made separable from the second substrate 32 .
  • a seventh connector 76 allows the fifth filament 45 to be separated from the third substrate 33
  • an eighth connector 77 allows the sixth filament 46 to be separated from the third substrate 33
  • a ninth connector 78 allows the seventh wire to be separated.
  • the strip 47 is made separable from the third substrate 33 .
  • the fourth board 34 to the sixth board 36 are also provided with connectors capable of separating the filaments 47 to 52 in the same manner.
  • first actuator 21 further includes a connector 71a capable of separating the second filamentous body 42 from the first actuator 21 instead of or in addition to the second connector 71 of the first substrate 31.
  • second actuator 22 further comprises a connector 74a capable of separating the fourth filament 44 from the second actuator 22 instead of or in addition to the fifth connector 74 of the second substrate 32.
  • the substrates 31 to 36 are fixed to the separating portions 11a to 14a that are separable from the housings 11 to 14, and the linear bodies 41 to 52 are separable.
  • a substrate fixing structure in which the substrates 31 to 36 and the separation portions 11a to 14a are unitized is configured (hereinafter referred to as "substrate separation unit").
  • the strips 41 to 52 are separated from the connectors 70 to 78, 71a, and 74a while the boards 31 to 36 are fixed to the separating portions 11a to 14a. Since the substrate separation unit can be detached from the machine 1 for maintenance and replacement of the substrates 31 to 36, the maintenance time and replacement time for the substrates 31 to 36 can be shortened. As a result, the MTTR (mean time to restore) can be shortened.
  • FIG. 8 is a cross-sectional view of a substrate fixing structure of a comparative example.
  • the substrate fixing structure of the comparative example includes a substrate 31 for the actuator of the machine 1 , a support metal fitting 84 fixed to the housing 11 to support the substrate 31 , and a fastening system for fastening the substrate 31 and the support metal fitting 84 to the housing 11 .
  • a member 83 is provided.
  • the substrate fixing structure of the comparative example is different from the substrate fixing structure of the above-described embodiment in that it does not include the vibration absorbers 80 arranged on both sides of the substrate 31 .
  • the vibration is transmitted to the substrate 31 via the support bracket 84. Communicate directly.
  • the substrate 31 may be damaged due to peeling of the electronic components soldered on the substrate 31 or disconnection of the wiring between the electronic components.
  • the substrate fixing structure of the above-described embodiment even if vibration or shock occurs in the housings 10 to 16 of the machine 1 when the machine 1 operates, the vibration is absorbed by the vibration absorbing material 80, Since the transmission of vibrations to 31-36 is reduced, breakage of substrates 31-36 can be reduced. In other words, the MTBF (mean time between failures) can be increased. As a result, it is possible to provide a substrate fixing structure that enhances the reliability of the substrates 31-36. Moreover, such a substrate fixing structure can provide a highly reliable machine or robot.

Abstract

This substrate fixing structure comprises: a substrate for an actuator that drives a machine; vibration absorbers disposed on both sides of the substrate; and a fixing part that grips the substrate and the vibration absorbers and fixes the same to a housing of the machine.

Description

基板固定構造、機械、及びロボットSUBSTRATE FIXED STRUCTURES, MACHINE AND ROBOT
 本発明は、基板固定技術に関し、特に基板固定構造、機械、及びロボットに関する。 The present invention relates to substrate fixing technology, and more particularly to substrate fixing structures, machines, and robots.
 機械を駆動するアクチュエータ用のプリント基板を機械の筐体内に固定する技術が知られている。機械が動作すると、外的因子又は内的因子による振動又は衝撃が機械の筐体に伝達し、筐体から基板に振動が伝達すると、基板が破損することがある。また、基板上のパワー半導体、集積回路等の発熱素子の発熱が機械の筐体へ伝熱し難いと、発熱素子が定格温度に達し易くなり、定格電流が低下してしまう。本願に関連する背景技術としては、後述の文献が公知である。 A known technique is to fix the printed circuit board for the actuator that drives the machine inside the machine housing. As the machine operates, vibrations or shocks due to external or internal factors are transmitted to the machine housing, and the transmission of vibrations from the housing to the substrate can damage the substrate. Moreover, if the heat generated by the heat generating elements such as power semiconductors and integrated circuits on the substrate is difficult to transfer to the housing of the machine, the heat generating elements will easily reach the rated temperature and the rated current will decrease. As background art related to the present application, the following documents are known.
 特許文献1には、レーダ空中線本体を回転自在に支持する支持手段と、支持手段に固定されてレーダ中空線本体を回転駆動するモータと、を有するレーダ空中線の駆動装置において、モータからレーダ空中線本体への振動伝播経路にフェライト複合材料からなる振動吸収部材を介挿したことが記載されている。 Patent Document 1 discloses a radar antenna drive device having a support means for rotatably supporting a radar antenna body and a motor fixed to the support means for rotationally driving the radar antenna body. It is described that a vibration absorbing member made of a ferrite composite material is inserted in the vibration propagation path to.
 特許文献2には、駆動モータの回転動力を取出す第1伝導軸と、第1伝導軸からの動力によりスライダを上下動させる第2伝導軸と、スライダと連結しスポイラーを上下動させるスポイラー支持部材とを金属性のコアフレームにより支承し、コアフレームを合成樹脂製のハウジング内に組付けセットし、コアフレームとハウジングとの接触領域に振動吸収材を介在させたことが記載されている。 Patent Document 2 discloses a first transmission shaft for extracting rotational power of a drive motor, a second transmission shaft for vertically moving a slider by the power from the first transmission shaft, and a spoiler support member that is connected to the slider and vertically moves the spoiler. are supported by a metal core frame, the core frame is assembled and set in a housing made of synthetic resin, and a vibration absorbing material is interposed in the contact area between the core frame and the housing.
 特許文献3には、一体型電動パワーステアリング装置において、制御基板上の発熱素子から熱伝導部材を介して機構部材に熱伝導されて温度抑制されると共に、熱伝導部材が制御基板と機構部材との間において振動吸収材として働くことが記載されている。 In Patent Document 3, in an integrated electric power steering device, heat is conducted from a heating element on a control board to a mechanism member via a heat conduction member to suppress the temperature, and the heat conduction member is connected to the control board and the mechanism member. It is described to act as a vibration absorber during
 特許文献4には、電子機器において、電子部品の周囲に、且つ、基板の両側にスペーサを配置して、基板の両側においてスペーサを剛性部材と接続し、スペーサと剛性部材との間又はスペーサと基板との間に振動吸収部材を配置したことが記載されている。 In Patent Document 4, in an electronic device, spacers are arranged around electronic components and on both sides of a substrate, the spacers are connected to rigid members on both sides of the substrate, It is described that a vibration absorbing member is arranged between the substrate.
 特許文献5には、筐体を備えたロボットアームであって、所定の駆動電圧を有する交流モータと、所定の直流電圧を出力する電源から出力される直流電圧を交流電圧へと変換して交流モータを駆動する駆動回路を搭載した基板と、を備え、基板が筐体の所定面に面接触して配置されることが記載されている。 Patent Document 5 discloses a robot arm having a housing, which converts a DC voltage output from an AC motor having a predetermined drive voltage and a power supply that outputs a predetermined DC voltage into an AC voltage. and a substrate on which a driving circuit for driving the motor is mounted, and the substrate is arranged in surface contact with a predetermined surface of the housing.
 特許文献6には、機器本体に対して開閉可能な扉を設け、扉側にプリント基板を固定することが記載されている。 Patent Document 6 describes that a door that can be opened and closed is provided to the device body, and a printed circuit board is fixed to the door side.
実開平2-150813号公報Japanese Utility Model Laid-Open No. 2-150813 特開2020-197188号公報JP 2020-197188 A 特開2013-147050号公報JP 2013-147050 A 特開2005-260252号公報JP 2005-260252 A 特開2020-025999号公報Japanese Patent Application Laid-Open No. 2020-025999 特開昭59-149099号公報JP-A-59-149099
 本発明は、従来の問題点に鑑み、基板の信頼性が高まる基板固定技術を提供することを目的とする。 An object of the present invention is to provide a board fixing technique that increases the reliability of the board in view of the conventional problems.
 本開示の一態様は、機械を駆動するアクチュエータ用の基板と、基板の両側に配置される振動吸収材と、基板と振動吸収材を挟持して機械の筐体に固定する固定部と、を備える、基板固定構造を提供する。
 本開示の他の態様は、前述の基板固定構造を備える機械又はロボットを提供する。
One aspect of the present disclosure includes a substrate for an actuator that drives a machine, vibration absorbers arranged on both sides of the substrate, and a fixing portion that sandwiches the substrate and the vibration absorber and fixes them to a housing of the machine. a substrate fixing structure comprising:
Another aspect of the present disclosure provides a machine or robot comprising a substrate securing structure as described above.
 本開示の一態様によれば、機械が動作する際に機械の筐体に振動又は衝撃が発生しても、振動吸収材によって振動が吸収され、基板への振動の伝達が低減するため、基板の破損を低減できる。ひいてはMTBF(平均故障間隔)を増大できる。ひいては、基板の信頼性が高まる基板固定構造を提供できる。
 本開示の他の態様によれば、斯かる基板固定構造により、信頼性の高い機械又はロボットを提供できる。
According to one aspect of the present disclosure, even if vibrations or impacts occur in the housing of the machine when the machine operates, the vibrations are absorbed by the vibration absorbing material, and transmission of the vibrations to the board is reduced. damage can be reduced. As a result, the MTBF (Mean Time Between Failures) can be increased. As a result, it is possible to provide a substrate fixing structure that enhances the reliability of the substrate.
According to another aspect of the present disclosure, such a substrate fixing structure can provide a highly reliable machine or robot.
第一実施形態の基板固定構造を備える機械の透視図である。1 is a perspective view of a machine with a substrate fixing structure of the first embodiment; FIG. 第一実施形態の基板のブロック図である。It is a block diagram of a substrate of the first embodiment. 第一実施形態の基板固定構造の底面図である。It is a bottom view of the board|substrate fixing structure of 1st embodiment. 第一実施形態の基板固定構造のIV-IV断面図である。FIG. 4 is a IV-IV cross-sectional view of the substrate fixing structure of the first embodiment; 変形例の基板固定構造のIV-IV断面図である。FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example; 他の変形例の基板固定構造のIV-IV断面図である。FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of another modified example; 第二実施形態の基板固定構造の底面図である。It is a bottom view of the board|substrate fixing structure of 2nd embodiment. 第二実施形態の基板固定構造のVI-VI断面図である。It is a VI-VI cross-sectional view of the substrate fixing structure of the second embodiment. 変形例の基板固定構造のIV-IV断面図である。FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example; 第三実施形態の基板固定構造の分離図である。FIG. 11 is an isolated view of the substrate fixing structure of the third embodiment; 比較例の基板固定構造の断面図である。FIG. 4 is a cross-sectional view of a substrate fixing structure of a comparative example;
 以下、添付図面を参照して本開示の実施形態を詳細に説明する。各図面において、同一又は類似の構成要素には同一又は類似の符号が付与されている。また、以下に記載する実施形態は、特許請求の範囲に記載される発明の技術的範囲及び用語の意義を限定するものではない。 Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In each drawing, the same or similar components are given the same or similar reference numerals. Moreover, the embodiments described below do not limit the technical scope of the invention described in the claims and the meaning of the terms.
 以下、第一実施形態の基板固定構造について詳細に説明する。図1は第一実施形態の基板固定構造を備える機械1の透視図である。機械1は、単軸ロボット、多軸ロボット、パラレルリンク型ロボット、ヒューマノイド等のロボットで構成される。或いは、他の実施形態において、機械1は、工作機械、建設機械、農業機械、コンベア等の産業機械、又は車両、航空機、家電等の他の機械で構成されることもある。本実施形態の機械1は、多関節ロボット、特に協働ロボットで構成されている。機械1は、中空の筐体10~16と、機械1を駆動するアクチュエータ21~26と、アクチュエータ21~26用の基板31~36と、基板31~36を電気的に接続する線条体41~52と、を備えている。 The substrate fixing structure of the first embodiment will be described in detail below. FIG. 1 is a perspective view of a machine 1 with a substrate fixing structure of the first embodiment. The machine 1 is composed of robots such as single-axis robots, multi-axis robots, parallel-link robots, and humanoid robots. Alternatively, in other embodiments, the machine 1 may consist of industrial machines such as machine tools, construction machines, agricultural machines, conveyors, or other machines such as vehicles, aircraft, home appliances, and the like. The machine 1 of this embodiment comprises an articulated robot, in particular a collaborative robot. The machine 1 includes hollow housings 10 to 16, actuators 21 to 26 that drive the machine 1, substrates 31 to 36 for the actuators 21 to 26, and a filament 41 that electrically connects the substrates 31 to 36. .about.52.
 筐体10~16は、互いに相対運動可能に連結された機械1のリンクである。第零筐体10は所定位置に固定される固定ベースであり、第一筐体11は第一軸線J1回りに第零筐体10に対して回転可能に支持された旋回胴である。第二筐体12は第一軸線J1に直交する第二軸線J2回りに第一筐体11に対して回転可能に支持された上腕であり、第三筐体13は第二軸線J2に平行な第三軸線J3回りに第二筐体12に対して回転可能に支持された前腕である。第四筐体14、第五筐体15、及び第六筐体16は、第二筐体13に取付けられた三軸の手首ユニットである。 The housings 10 to 16 are links of the machine 1 that are connected to each other for relative movement. The zeroth housing 10 is a fixed base that is fixed at a predetermined position, and the first housing 11 is a swing barrel that is rotatably supported with respect to the zeroth housing 10 about the first axis J1. The second housing 12 is an upper arm rotatably supported with respect to the first housing 11 about a second axis J2 perpendicular to the first axis J1, and the third housing 13 is parallel to the second axis J2. The forearm is rotatably supported with respect to the second housing 12 about the third axis J3. A fourth housing 14 , a fifth housing 15 , and a sixth housing 16 are triaxial wrist units attached to the second housing 13 .
 第四筐体14は、第三軸線J3に直交する第四軸線J4回りに第三筐体13に対して回転可能に支持された第一手首要素であり、第五筐体15は、第四軸線J4に直交する第五軸線J5回りに第四筐体14に対して回転可能に支持された第二手首要素であり、第六筐体16は第五軸線J5に直交する第六軸線J6回りに第五筐体15に対して回転可能に支持された第三手首要素である。 The fourth housing 14 is a first wrist element supported rotatably with respect to the third housing 13 about a fourth axis J4 perpendicular to the third axis J3. A second wrist element supported rotatably with respect to the fourth housing 14 about a fifth axis J5 orthogonal to the fourth axis J4, and a sixth housing 16 is supported by a sixth axis orthogonal to the fifth axis J5. A third wrist element rotatably supported with respect to the fifth housing 15 around J6.
 筐体11~14は、筐体11~14から分離可能な分離部11a~14aを備えている。分離部11a~14aは筐体11~14の一部を構成するカバーであり、分離部11a~14aを筐体11~14から分離することにより、アクチュエータ21~26又は基板31~36の保守や交換が可能になる。 The housings 11-14 are provided with separating parts 11a-14a that can be separated from the housings 11-14. Separating portions 11a to 14a are covers that form part of housings 11 to 14, and by separating separating portions 11a to 14a from housings 11 to 14, maintenance and maintenance of actuators 21 to 26 or substrates 31 to 36 can be performed. exchange becomes possible.
 アクチュエータ21~26は筐体10~16の内部に固定されている。或いは、他の実施形態において、複数のアクチュエータ21~26のうちの一部又は全部は筐体10~16の外部に固定されることもある。アクチュエータ21~26はロータリーアクチュエータで構成されるが、他の実施形態において、アクチュエータ21~26はリニアアクチュエータで構成されることもある。 The actuators 21-26 are fixed inside the housings 10-16. Alternatively, in other embodiments, some or all of the plurality of actuators 21-26 may be fixed outside the housings 10-16. Actuators 21-26 are comprised of rotary actuators, but in other embodiments actuators 21-26 may be comprised of linear actuators.
 アクチュエータ21~26は電磁アクチュエータであり、図示しないが、電動機と、電動機の動作を検出する動作検出部と、を備えている(図2参照)。或いは、他の実施形態において、アクチュエータ21~26は、減速機、軸、軸受、歯車、ブレーキ等の他の機械要素を電動機に連結したアクチュエータで構成されることもある。電動機は、誘導モータ、同期モータ等の交流モータで構成されるが、他の実施形態において、電動機は直流モータで構成されてもよい。動作検出部は、機械式、光学式、磁気式、電磁誘導式等のエンコーダで構成される。 The actuators 21 to 26 are electromagnetic actuators, and although not shown, each includes an electric motor and an operation detection section that detects the operation of the electric motor (see FIG. 2). Alternatively, in other embodiments, the actuators 21-26 may consist of actuators in which other mechanical elements such as speed reducers, shafts, bearings, gears, brakes, etc. are coupled to the electric motor. The electric motor is composed of an AC motor such as an induction motor or a synchronous motor, but in other embodiments, the electric motor may be composed of a DC motor. The motion detector is composed of a mechanical, optical, magnetic, electromagnetic induction, or other encoder.
 第一アクチュエータ21は第一軸線J1回りに第一筐体11を回転し、第二アクチュエータ22は第二軸線J2回りに第二筐体12を回転する。第三アクチュエータ23は第三軸線J3回りに第三筐体13を回転し、第四アクチュエータ24は第四軸線J4回りに第四筐体14を回転する。第五アクチュエータ25は第五軸線J5回りに第五筐体15を回転し、第六アクチュエータ26は第六軸線J6回りに第六筐体16を回転する。 The first actuator 21 rotates the first housing 11 around the first axis J1, and the second actuator 22 rotates the second housing 12 around the second axis J2. The third actuator 23 rotates the third housing 13 around the third axis J3, and the fourth actuator 24 rotates the fourth housing 14 around the fourth axis J4. The fifth actuator 25 rotates the fifth housing 15 around the fifth axis J5, and the sixth actuator 26 rotates the sixth housing 16 around the sixth axis J6.
 基板31~36はアクチュエータ21~26の電動機に電力を供給するプリント基板(駆動装置)である。基板31~36は筐体10~16の内部に固定されている。第一基板31は第一筐体11の内部に固定され、第二基板32及び第三基板33は第二筐体12の内部に固定されている。第四基板34及び第五基板35は第三筐体13の内部に固定され、第六基板36は第四筐体14の内部に固定されている。 The boards 31-36 are printed boards (driving devices) that supply electric power to the electric motors of the actuators 21-26. The substrates 31-36 are fixed inside the housings 10-16. The first substrate 31 is fixed inside the first housing 11 , and the second substrate 32 and the third substrate 33 are fixed inside the second housing 12 . The fourth substrate 34 and the fifth substrate 35 are fixed inside the third housing 13 , and the sixth substrate 36 is fixed inside the fourth housing 14 .
 第一基板31は第一アクチュエータ21の電動機に電力を供給し、第二基板32は第二アクチュエータ22の電動機に電力を供給する。第三基板33は第三アクチュエータ23の電動機に電力を供給し、第四基板34は第四アクチュエータ24の電動機に電力を供給する。第五基板35は第五アクチュエータ25の電動機に電力を供給し、第六基板36は第六アクチュエータ26の電動機に電力を供給する。 The first board 31 supplies power to the electric motor of the first actuator 21 , and the second board 32 supplies power to the electric motor of the second actuator 22 . The third board 33 powers the motor of the third actuator 23 and the fourth board 34 powers the motor of the fourth actuator 24 . The fifth board 35 powers the motor of the fifth actuator 25 and the sixth board 36 powers the motor of the sixth actuator 26 .
 線条体41~52は基板31~36に電気的に接続する電気ケーブルである。第一線条体41は機械1の制御装置40を第一基板31に電気的に接続し、第二線条体42は第一基板31を第一アクチュエータ21に電気的に接続する。第三線条体43は第一基板31を第二基板32に電気的に接続し、第四線条体44は第二基板32を第二アクチュエータ22に電気的に接続する。第五線条体45は第二基板32を第三基板33に電気的に接続し、第六線条体46は第三基板33を第三アクチュエータ23に電気的に接続する。 The filaments 41-52 are electrical cables electrically connected to the substrates 31-36. A first filament 41 electrically connects the controller 40 of the machine 1 to the first substrate 31 and a second filament 42 electrically connects the first substrate 31 to the first actuator 21 . A third filament 43 electrically connects the first substrate 31 to the second substrate 32 , and a fourth filament 44 electrically connects the second substrate 32 to the second actuator 22 . A fifth filament 45 electrically connects the second substrate 32 to the third substrate 33 , and a sixth filament 46 electrically connects the third substrate 33 to the third actuator 23 .
 第七線条体47は第三基板33を第四基板34に電気的に接続し、第八線条体48は第四基板34を第四アクチュエータ24に電気的に接続する。第九線条体49は第四基板34を第五基板35に電気的に接続し、第十線条体50は第五基板35を第五アクチュエータ25に電気的に接続する。第十一線条体51は第五基板35を第六基板36に電気的に接続する。第十二線条体52は第六基板36を第六アクチュエータ26に電気的に接続する。 The seventh filament 47 electrically connects the third substrate 33 to the fourth substrate 34 , and the eighth filament 48 electrically connects the fourth substrate 34 to the fourth actuator 24 . A ninth filament 49 electrically connects the fourth substrate 34 to the fifth substrate 35 , and a tenth filament 50 electrically connects the fifth substrate 35 to the fifth actuator 25 . The eleventh filament 51 electrically connects the fifth substrate 35 to the sixth substrate 36 . A twelfth filament 52 electrically connects the sixth substrate 36 to the sixth actuator 26 .
 このように線条体41、43、45、47、49、51は基板31~36と制御装置40をデイジーチェーン接続(数珠繋ぎに接続)し、制御装置40は線条体41、43、45、47、49、51を介して基板31~36に電力及び信号を供給する。つまり線条体41、43、45、47、49、51は電力線と信号線を含む電気ケーブルである。線条体41、43、45、47、49、51は、図示しないが、アクチュエータ21~26の貫通孔を貫通する(図7の貫通孔21c、22cを参照されたい)。 In this way, the filaments 41, 43, 45, 47, 49, and 51 daisy-chain connect the substrates 31 to 36 and the controller 40, and the controller 40 connects the filaments 41, 43, 45, Power and signals are supplied to the substrates 31-36 via 47,49,51. That is, the filaments 41, 43, 45, 47, 49, 51 are electrical cables including power lines and signal lines. The filaments 41, 43, 45, 47, 49, and 51 pass through through-holes of the actuators 21-26 (see through- holes 21c and 22c in FIG. 7), although not shown.
 一方、線条体42、44、46、48、50、52は基板31~36をアクチュエータ21~26に電気的に接続する。基板31~36は線条体42、44、46、48、50、52を介してアクチュエータ21~26の電動機に電力を供給する。つまり線条体42、44、46、48、50、52は電力線を含む電気ケーブルである。 On the other hand, the filaments 42, 44, 46, 48, 50, 52 electrically connect the substrates 31-36 to the actuators 21-26. The substrates 31-36 supply power to the motors of the actuators 21-26 via the filaments 42,44,46,48,50,52. That is, the filaments 42, 44, 46, 48, 50, 52 are electrical cables including power lines.
 図2は第一実施形態の基板31のブロック図である。ここでは、図1を参照して説明した第一アクチュエータ21用の第一基板31の構成について詳細に説明するが、第二基板32~第六基板36も同様の構成を備えることに留意されたい。基板31によって駆動制御されるアクチュエータ21は、電動機21aと、電動機21aの動作を検出する動作検出部21bと、を備えている。前述の通り、本実施形態の電動機21aは、交流モータで構成されるが、他の実施形態では、直流モータで構成されることもある。 FIG. 2 is a block diagram of the substrate 31 of the first embodiment. Here, the configuration of the first substrate 31 for the first actuator 21 described with reference to FIG. 1 will be described in detail, but it should be noted that the second substrate 32 to the sixth substrate 36 also have similar configurations. . The actuator 21 driven and controlled by the substrate 31 includes an electric motor 21a and an operation detection section 21b that detects the operation of the electric motor 21a. As described above, the electric motor 21a of this embodiment is composed of an AC motor, but in other embodiments, it may be composed of a DC motor.
 基板31は、発熱素子である種々の電子部品を備えている。基板31は、制御部60、駆動部61、及び電流検出部69を備えている。制御部60は、上位基板(本例では制御装置40)からの電動機21aの指令信号と、動作検出部21b及び電流検出部69からの電動機21aの検出信号とに基づき、電動機21aに供給する電力を制御する制御回路を備えている。駆動部61は、制御部60からの信号に基づき、上位基板(本例では制御装置40)からの電力を直流から交流に変換するインバータ回路を備えている。電流検出部69は、磁場検出式、抵抗検出式等の電流センサを備えている。 The substrate 31 includes various electronic components that are heat generating elements. The substrate 31 has a control section 60 , a drive section 61 and a current detection section 69 . The control unit 60 supplies electric power to the electric motor 21a based on a command signal for the electric motor 21a from the host board (the control device 40 in this example) and a detection signal for the electric motor 21a from the operation detection unit 21b and the current detection unit 69. is provided with a control circuit for controlling the The drive unit 61 includes an inverter circuit that converts the power from the host board (control device 40 in this example) from direct current to alternating current based on a signal from the control unit 60 . The current detection unit 69 includes a current sensor of magnetic field detection type, resistance detection type, or the like.
 制御部60の制御回路は、駆動部61のインバータ回路をPWM(pulse width modulation)制御する集積回路で構成されるが、他の実施形態では、PFM(pulse frequency modulation)、PAM(pulse amplitude modulation)等の他の変調方式で制御する集積回路で構成されることもある。例えば集積回路は、発熱素子である、MCU(micro controller unit)、LSI(large-scale integration)等の半導体集積回路で実装される。 The control circuit of the control unit 60 is composed of an integrated circuit that performs PWM (pulse width modulation) control of the inverter circuit of the driving unit 61. In other embodiments, PFM (pulse frequency modulation) and PAM (pulse amplitude modulation) are used. It may be composed of an integrated circuit controlled by other modulation methods such as. For example, the integrated circuit is implemented by a semiconductor integrated circuit such as an MCU (micro controller unit) or LSI (large-scale integration), which is a heating element.
 駆動部61のインバータ回路は、電圧型インバータ回路で構成されるが、他の実施形態では、電流型インバータ回路で構成されることもある。電圧型インバータ回路は、コンデンサ62と、スイッチング素子63~68と、を備えている。例えばスイッチング素子63~68は、発熱素子である、FET(field-effect transistor)、IGBT(Insulated gate bipolar transistor)、IPM(intelligent power module)等のパワー半導体で実装される。 The inverter circuit of the drive unit 61 is composed of a voltage type inverter circuit, but may be composed of a current type inverter circuit in other embodiments. The voltage type inverter circuit includes a capacitor 62 and switching elements 63-68. For example, the switching elements 63 to 68 are implemented by power semiconductors such as FETs (field-effect transistors), IGBTs (Insulated gate bipolar transistors), and IPMs (intelligent power modules), which are heating elements.
 制御部60の制御回路は、電動機21aの指令信号及び検出信号に基づき、U相、V相、及びW相の三相交流電圧における周波数、周期、デューティ等を調整し、スイッチング信号を生成する。駆動部61のインバータ回路は、制御部60のスイッチング信号に基づき、スイッチング素子63~68を順次オンオフし、三相交流を電動機21aの巻線に供給する。これにより、電動機21aが動作し、第一アクチュエータ21が第一軸線J1回りに第一筐体11を回転する。 The control circuit of the control unit 60 adjusts the frequency, cycle, duty, etc. of the U-phase, V-phase, and W-phase three-phase AC voltages based on the command signal and detection signal from the electric motor 21a, and generates switching signals. The inverter circuit of the drive unit 61 sequentially turns on and off the switching elements 63 to 68 based on the switching signal of the control unit 60 to supply the three-phase alternating current to the windings of the electric motor 21a. As a result, the electric motor 21a operates, and the first actuator 21 rotates the first housing 11 around the first axis J1.
 同様に、他の基板32~36も、駆動部61が制御部60のスイッチング信号に基づいてスイッチング素子63~68を順次オンオフし、三相交流を他のアクチュエータ22~26の電動機に供給し、他のアクチュエータ22~26が第二軸線J2~第六軸線J6回りに筐体12~16を回転する。以上により、機械1が動作するが、外的因子又は内的因子による機械1の振動又は衝撃が筐体11~16を介して基板31~36に伝達すると、基板31~36上に半田付けした電子部品が剥離したり、又は電子部品間の配線が断線したりして、基板31~36が破損することがある。そこで、機械1の振動又は衝撃が基板31~36に伝達し難くなるように、本実施形態の基板31~36は振動吸収材を介して筐体11~16に固定される。 Similarly, in the other substrates 32 to 36, the drive unit 61 sequentially turns on and off the switching elements 63 to 68 based on the switching signal of the control unit 60, supplies three-phase alternating current to the motors of the other actuators 22 to 26, Other actuators 22-26 rotate housings 12-16 about second axis J2-sixth axis J6. As described above, the machine 1 operates, but when the vibration or impact of the machine 1 due to external or internal factors is transmitted to the boards 31 to 36 through the housings 11 to 16, soldering on the boards 31 to 36 occurs. The substrates 31 to 36 may be damaged due to peeling of the electronic parts or disconnection of wiring between the electronic parts. Therefore, the substrates 31-36 of this embodiment are fixed to the housings 11-16 via vibration absorbing materials so that the vibration or impact of the machine 1 is less likely to be transmitted to the substrates 31-36.
 図3は第一実施形態の基板固定構造の底面図であり、図4Aは第一実施形態の基板固定構造のIV-IV断面図である。ここでは、図1を参照して説明した第一アクチュエータ21用の第一基板31の基板固定構造について詳細に説明するが、第二基板32~第六基板36も同様の基板固定構造を備えることに留意されたい。機械1の振動又は衝撃が基板31に伝達し難くなるように、第一実施形態の基板固定構造は、機械1を駆動するアクチュエータ21用の基板31と、基板31の両側に配置される振動吸収材80と、基板31と振動吸収材80を挟持して機械の筐体11に固定する固定部81と、を備えている。 FIG. 3 is a bottom view of the substrate fixing structure of the first embodiment, and FIG. 4A is a IV-IV sectional view of the substrate fixing structure of the first embodiment. Here, the substrate fixing structure of the first substrate 31 for the first actuator 21 described with reference to FIG. 1 will be described in detail. Please note. The substrate fixing structure of the first embodiment includes a substrate 31 for the actuators 21 that drive the machine 1 and vibration absorbers arranged on both sides of the substrate 31 so that the vibration or impact of the machine 1 is less likely to be transmitted to the substrate 31. and a fixing portion 81 that sandwiches the substrate 31 and the vibration absorbing material 80 and fixes them to the housing 11 of the machine.
 基板31は、筐体10~16の内部形状に適合するように、平面視で略円形、略楕円形に形成される。或いは、他の実施形態において、基板31は平面視で略矩形に形成されてもよい。基板31は、基板31の表側に配置される振動吸収材80aと、基板31の裏側に配置される振動吸収材80bとにより、狭着されている。基板31が位置ずれしないように、固定部81は略円形、略楕円形等の形状の基板31の周方向に等間隔(本例では120度間隔)で配置される。或いは、他の実施形態において、固定部81は略矩形の基板31の角部に配置されることもある。 The substrate 31 is formed in a substantially circular or substantially elliptical shape in plan view so as to match the internal shapes of the housings 10-16. Alternatively, in another embodiment, the substrate 31 may be substantially rectangular in plan view. The substrate 31 is sandwiched between a vibration absorbing member 80a arranged on the front side of the substrate 31 and a vibration absorbing member 80b arranged on the back side of the substrate 31. As shown in FIG. The fixing portions 81 are arranged at equal intervals (in this example, at intervals of 120 degrees) in the circumferential direction of the substrate 31 having a shape such as a substantially circular or substantially elliptical shape so that the substrate 31 is not displaced. Alternatively, in another embodiment, the fixed portions 81 may be arranged at the corners of the substantially rectangular substrate 31 .
 振動吸収材80は、振動緩衝材、衝撃吸収材、緩衝材等とも称される。振動吸収材80は、ゲル、軟質ゴム、軟質発泡体、又はこれら組み合わせ等のエラストマーで形成される。振動吸収材80は、基板31の表側に配置される振動吸収材80aと、基板31の裏側に配置される振動吸収材80bと、を備えている。基板31の表側に配置される振動吸収材80aと、基板31の裏側に配置される振動吸収材80bとは同一材料で同一形状に形成される。振動吸収材80が基板31の表面上を滑動しないように、振動吸収材80の表面は比較的高い摩擦係数を有するとよい。例えば振動吸収材80は、凹凸表面、ギザギザ表面を有しているとよい。 The vibration absorbing material 80 is also called a vibration damping material, a shock absorbing material, a shock absorbing material, or the like. Vibration absorbing material 80 is formed of an elastomer such as gel, soft rubber, soft foam, or combinations thereof. The vibration absorbing material 80 includes a vibration absorbing material 80 a arranged on the front side of the substrate 31 and a vibration absorbing material 80 b arranged on the back side of the substrate 31 . The vibration absorbing material 80a arranged on the front side of the substrate 31 and the vibration absorbing material 80b arranged on the back side of the substrate 31 are formed of the same material and in the same shape. The surface of the vibration absorber 80 should have a relatively high coefficient of friction so that the vibration absorber 80 does not slide on the surface of the substrate 31 . For example, the vibration absorbing material 80 may have an uneven surface or a jagged surface.
 固定部81は、基板31と振動吸収材80を挟持する挟持部材82と、挟持部材82を機械1の筐体11に固定する固定部材83と、を備えている。挟持部材82は、金属、硬質樹脂等の剛体で形成される。挟持部材82は、断面視で略コ字状のコ字部を備えている。挟持部材82は、コ字部によって基板31と振動吸収材80を挟持する。固定部材83は、雄ねじ、雌ねじ等を含むねじ等の締結部材を備えている。固定部材83は、挟持部材82を機械1の筐体11に固定する。 The fixing portion 81 includes a holding member 82 that holds the substrate 31 and the vibration absorbing material 80 between them, and a fixing member 83 that fixes the holding member 82 to the housing 11 of the machine 1 . The holding member 82 is made of a rigid body such as metal or hard resin. The sandwiching member 82 has a substantially U-shaped portion when viewed in cross section. The sandwiching member 82 sandwiches the substrate 31 and the vibration absorbing material 80 with the U-shaped portion. The fixing member 83 has a fastening member such as a screw including a male thread, a female thread and the like. A fixing member 83 fixes the clamping member 82 to the housing 11 of the machine 1 .
 挟持部材82のコ字部の内壁高さHを、基板31と基板31の両側に配置される二つの振動吸収材80a、80bとを含む厚みTより小さく形成することにより、二つの振動吸収材80a、80bが圧縮され、基板31が振動吸収材80a、80bによって狭着される。なお、図4Aでは、構成要素の把握を容易にするため、挟持部材82のコ字部の高さHが基板31と二つの振動吸収材80a、80bとを含む厚みTより大きく描かれているが、実際はコ字部の高さHが基板31と振動吸収材80a、80bとを含む厚みTより小さいことに留意されたい。以上により、基板31は機械1の筐体11に固定される。 By forming the inner wall height H of the U-shaped portion of the holding member 82 to be smaller than the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31, the two vibration absorbing members 80a and 80b are compressed, and substrate 31 is tightly attached by vibration absorbing materials 80a and 80b. In FIG. 4A, the height H of the U-shaped portion of the clamping member 82 is drawn larger than the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b in order to facilitate understanding of the components. However, it should be noted that the height H of the U-shaped portion is actually smaller than the thickness T including the substrate 31 and the vibration absorbing members 80a and 80b. As described above, the substrate 31 is fixed to the housing 11 of the machine 1 .
 以上のような基板固定構造において、機械1が動作して外的因子又は内的因子による振動又は衝撃が筐体11に伝達した場合、振動は筐体11から固定部81に振動が伝達するが、振動吸収材80が振動を吸収するため、基板31への振動の伝達が低減する。これにより、基板31上に半田付けした電子部品の剥離や電子部品間の配線の断線が抑制され、基板31の破損を低減できる。ひいてはMTBF(平均故障間隔)を増加できる。 In the substrate fixing structure as described above, when the machine 1 operates and vibration or impact due to an external factor or an internal factor is transmitted to the housing 11, the vibration is transmitted from the housing 11 to the fixing portion 81. , the vibration absorbing material 80 absorbs the vibration, so that the transmission of the vibration to the substrate 31 is reduced. As a result, peeling of the electronic components soldered on the substrate 31 and disconnection of wiring between the electronic components are suppressed, and damage to the substrate 31 can be reduced. Consequently, the MTBF (Mean Time Between Failures) can be increased.
 図4Bは変形例の基板固定構造のIV-IV断面図である。本例の基板固定構造では、挟持部材82が基板31と振動吸収材80を挟持する第一挟持部材82a及び第二挟持部材82bという二つの挟持部材を含み、固定部材83が、基板31、振動吸収材80、第一挟持部材82a、及び第二挟持部材82bを貫通して第一挟持部材82aと第二挟持部材82bを筐体11に固定する点で、図4Aの基板固定構造と異なる。二つの挟持部材82a、82bは、前述のコ字部を備えておらず、完全に分離されている。固定部材83は、例えば雄ねじ、雌ねじ等を含むねじ等の締結部材を備えている。 FIG. 4B is a IV-IV cross-sectional view of a modified substrate fixing structure. In the substrate fixing structure of this example, the holding member 82 includes two holding members, a first holding member 82a and a second holding member 82b, which hold the substrate 31 and the vibration absorbing material 80, and the fixing member 83 holds the substrate 31 and the vibration absorber 80 together. 4A in that the first holding member 82a and the second holding member 82b are fixed to the housing 11 by penetrating the absorbing member 80, the first holding member 82a, and the second holding member 82b. The two clamping members 82a and 82b do not have the U-shaped portion described above and are completely separated. The fixing member 83 has a fastening member such as a screw including, for example, a male thread and a female thread.
 固定部材83が基板31と基板31の両側に配置される二つの振動吸収材80a、80bとを貫通することにより、基板31の位置ずれや振動吸収材80の滑動が防止されるため、基板31の固定を強固にできる。また、固定部材83は弾性変形する振動吸収材80aを貫通して第一挟持部材82aと第二挟持部材82bという完全に分離された二つの挟持部材を筐体11に固定するため、前述の挟持部材82のコ字部の高さHと、基板31と基板31の両側に配置される二つの振動吸収材80a、80bとを含む厚みTとの寸法を予め調整する必要がない。このため、変形例の基板固定構造は製造が容易という副次的効果も奏する。なお、振動吸収材80の更なる変形例として、振動吸収材80は、基板31の表側と裏側の両側に配置される二つの振動吸収材80a、80bを備えるのではなく、基板31の表側と裏側の両側を挟み込むコ字部(基板31の両側に配置されるコ字部)を有する一つの振動吸収材80で構成されてもよい。 Since the fixing member 83 penetrates the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31, the substrate 31 is prevented from being displaced and the vibration absorbing members 80 are prevented from sliding. can be firmly fixed. In addition, since the fixing member 83 penetrates the elastically deformable vibration absorbing material 80a and fixes the two completely separated holding members, that is, the first holding member 82a and the second holding member 82b, to the housing 11, the above-mentioned holding is performed. It is not necessary to adjust the dimensions of the height H of the U-shaped portion of the member 82 and the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31 in advance. Therefore, the substrate fixing structure of the modification also has a secondary effect of being easy to manufacture. As a further modified example of the vibration absorbing material 80, the vibration absorbing material 80 does not include two vibration absorbing materials 80a and 80b arranged on both the front side and the back side of the substrate 31, but on the front side and the back side of the substrate 31. It may be composed of one vibration absorbing material 80 having U-shaped portions (U-shaped portions arranged on both sides of the substrate 31) sandwiching both sides of the back side.
 図4Cは他の変形例の基板固定構造のIV-IV断面図である。本例の基板固定構造では、挟持部材82が、基板31と振動吸収材80を挟持する第一挟持部材82a及び第二挟持部材82bという二つの挟持部材を含み、固定部材83が、第一挟持部材82aと第二挟持部材82bを支持する支持部材83aと、第一挟持部材82aと第二挟持部材82bを支持部材83aに締結する締結部材83bと、支持部材83aを筐体11に締結する締結部材83cと、を備えている点で、図4Aの基板固定構造と異なる。二つの挟持部材82a、82bは、前述のコ字部を備えており、コ字部によって基板31と振動吸収材80を挟持する。支持部材83aは、いわゆる棚受けのように、側面視で略三角形、略L字形に板状に形成される。締結部材83b、83cは、雄ねじ、雌ねじ等を含むねじ等で構成される。 FIG. 4C is a IV-IV cross-sectional view of another modified substrate fixing structure. In the substrate fixing structure of this example, the holding member 82 includes two holding members, a first holding member 82a and a second holding member 82b, which hold the substrate 31 and the vibration absorbing material 80, and the fixing member 83 is the first holding member. A support member 83a that supports the member 82a and the second holding member 82b, a fastening member 83b that fastens the first holding member 82a and the second holding member 82b to the support member 83a, and a fastening that fastens the support member 83a to the housing 11. It is different from the substrate fixing structure of FIG. 4A in that the member 83c is provided. The two clamping members 82a and 82b have the above-described U-shaped portions, and clamp the substrate 31 and the vibration absorbing material 80 by the U-shaped portions. The support member 83a is formed in a substantially triangular, substantially L-shaped plate shape when viewed from the side, like a so-called shelf support. The fastening members 83b and 83c are composed of screws including male threads and female threads.
 挟持部材82が二つの挟持部材82a、82bで構成されることにより、基板30と振動吸収材80を挟み込んで組み立てる組立工程が容易になる。また、固定部材83が二つの挟持部材82a、82bを支持する支持部材83aを備えることにより、基板31、振動吸収材80、及び挟持部材82をユニット化できるため(以下、「基板挟持ユニット」と称する。)、支持部材83の形状を変更すれば、筐体11の形状とは異なる形状を有する他の筐体12~16であっても基板挟持ユニットを容易に筐体12~16に固定できる。 By configuring the holding member 82 with the two holding members 82a and 82b, the assembly process of sandwiching and assembling the substrate 30 and the vibration absorbing material 80 is facilitated. Further, since the fixing member 83 is provided with the supporting member 83a for supporting the two holding members 82a and 82b, the substrate 31, the vibration absorbing member 80, and the holding member 82 can be unitized (hereinafter referred to as "substrate holding unit"). ), by changing the shape of the support member 83, the board clamping unit can be easily fixed to the other housings 12 to 16 having a shape different from the shape of the housing 11. .
 また、本例の基板固定構造では、振動吸収材80は、基板31の表側に配置される振動吸収材80aと、基板31の裏側に配置される振動吸収材80bと、を備えているが、振動吸収材80a、80bはいずれも断面視で略L字形に形成されている点でも、図4Aの基板固定構造と異なる。略L字形の振動吸収材80a、80bは基板31の側縁部に係止されるため、振動吸収材80a、80bの位置決めが容易になる。また、基板31の表側と裏側に配置される二つの振動吸収材80a、80bは、基板31の側端部上で互いに接触し、断面視で略コ字形を呈している。他の実施形態では、振動吸収材80は、基板31の表側と裏側の両側に配置される二つの振動吸収材80a、80bを備えるのではなく、基板31の表側と裏側の両側を挟み込む一つの振動吸収材80で構成されてもよい。これにより、振動吸収材80をより容易に位置決めできる。 In the substrate fixing structure of this example, the vibration absorbing material 80 includes the vibration absorbing material 80a arranged on the front side of the substrate 31 and the vibration absorbing material 80b arranged on the back side of the substrate 31. Vibration absorbers 80a and 80b are also different from the substrate fixing structure of FIG. 4A in that they are both formed in a substantially L shape when viewed in cross section. Since the substantially L-shaped vibration absorbers 80a and 80b are engaged with the side edges of the substrate 31, positioning of the vibration absorbers 80a and 80b is facilitated. The two vibration absorbing members 80a and 80b arranged on the front side and the back side of the substrate 31 are in contact with each other on the side edges of the substrate 31 and have a substantially U-shape in cross section. In another embodiment, the vibration absorber 80 does not comprise two vibration absorbers 80a, 80b arranged on both the front and back sides of the substrate 31, but a single vibration absorber sandwiching both the front and back sides of the substrate 31. It may be composed of a vibration absorbing material 80 . Thereby, the vibration absorber 80 can be positioned more easily.
 以下、第二実施形態の基板固定構造について詳細に説明する。第一実施形態の基板固定構造とは異なる部分についてのみ説明することに留意されたい。図5は第二実施形態の基板固定構造の底面図であり、図6Aは第二実施形態の基板固定構造VI-VI断面図である。ここでは、図1を参照して説明した第一アクチュエータ21用の第一基板31の基板固定構造について説明するが、第二基板32~第六基板36も同様の基板固定構造を備えることに留意されたい。第一実施形態の基板固定構造では、基板31が振動吸収材80によって機械1の筐体11から分離されるため、基板31上の発熱素子の放熱が悪化する可能性がある。 The substrate fixing structure of the second embodiment will be described in detail below. Note that only parts different from the substrate fixing structure of the first embodiment will be described. FIG. 5 is a bottom view of the substrate fixing structure of the second embodiment, and FIG. 6A is a cross-sectional view of the substrate fixing structure VI-VI of the second embodiment. Here, the substrate fixing structure of the first substrate 31 for the first actuator 21 described with reference to FIG. 1 will be described, but it should be noted that the second substrate 32 to the sixth substrate 36 also have similar substrate fixing structures. want to be In the substrate fixing structure of the first embodiment, since the substrate 31 is separated from the housing 11 of the machine 1 by the vibration absorbing material 80, there is a possibility that the heat dissipation of the heat generating elements on the substrate 31 is deteriorated.
 そこで、第二実施形態の基板固定構造は、基板31上の発熱素子である、FET、IGBT、IPM等のパワー半導体(スイッチング素子63~68)や、MCU、LSI等の集積回路(制御部60)の発熱を機械1の筐体11に放熱するため、基板31上の発熱素子を機械1の筐体11に接続する伝熱部90をさらに備えている。伝熱部90は、筐体11の振動が基板31に伝達され難くなるように、柔軟で薄い金属シートを備えているとよい。例えば金属シートは、アルミニウム、銅、又はこれら合金等の比較的高い熱伝導率の金属で形成される。伝熱部90は、基板31上の発熱素子に接続される吸熱面91と、筐体11に接続される放熱面92と、を備えている。 Therefore, the substrate fixing structure of the second embodiment includes power semiconductors (switching elements 63 to 68) such as FETs, IGBTs, and IPMs, which are heating elements on the substrate 31, and integrated circuits such as MCUs and LSIs (control unit 60). ) to the housing 11 of the machine 1 , a heat transfer section 90 is further provided for connecting the heat generating element on the substrate 31 to the housing 11 of the machine 1 . The heat transfer section 90 preferably includes a flexible and thin metal sheet so that the vibration of the housing 11 is less likely to be transferred to the substrate 31 . For example, the metal sheet is formed of a relatively high thermal conductivity metal such as aluminum, copper, or alloys thereof. The heat transfer section 90 includes a heat absorption surface 91 connected to the heat generating elements on the substrate 31 and a heat dissipation surface 92 connected to the housing 11 .
 伝熱部90は、金属シートの吸熱面91を発熱素子(スイッチング素子63~68や制御部60)に接着する熱伝導樹脂をさらに備えている。吸熱面91は熱伝導樹脂によって複数の発熱素子(スイッチング素子63~68や制御部60)に接着しているが、他の実施形態において、基板固定構造は複数の伝熱部90を備え、複数の吸熱面91が熱伝導樹脂によって特定の発熱素子にそれぞれ接着してもよい。 The heat transfer section 90 further includes a heat conductive resin that adheres the heat absorbing surface 91 of the metal sheet to the heat generating elements (the switching elements 63 to 68 and the control section 60). The heat absorbing surface 91 is adhered to a plurality of heat generating elements (the switching elements 63 to 68 and the control section 60) with heat conductive resin. The heat absorbing surface 91 of each may be adhered to a specific heat generating element by means of heat conductive resin.
 また、伝熱部90は、金属シートの放熱面92を機械1の筐体11に接着する熱伝導樹脂をさらに備えていてもよい。放熱面92は熱伝導樹脂によって機械1の筐体11に接着しているが、他の実施形態において、基板固定構造は複数の伝熱部90を備え、複数の放熱面92が機械1の筐体11にそれぞれ接着してもよい。また、別の実施形態において、放熱面92は、ボルト、ナット等の金属製ねじで筐体11に締結されてもよい。 In addition, the heat transfer section 90 may further include a heat conductive resin that adheres the heat dissipation surface 92 of the metal sheet to the housing 11 of the machine 1 . The heat dissipation surface 92 is adhered to the housing 11 of the machine 1 by thermally conductive resin. Each may be adhered to the body 11 . In another embodiment, the heat dissipation surface 92 may be fastened to the housing 11 with metal screws such as bolts and nuts.
 前述の熱伝導樹脂は、熱伝導ファイバをマトリックス樹脂の中で相互連鎖させた熱伝導樹脂でよい。例えば熱伝導ファイバは、窒化アルミニウム、酸化マグネシウム、窒化ホウ素、アルミナ、無水炭酸マグネシウム、酸化ケイ素、酸化亜鉛等を含み、例えばマトリックス樹脂は、ポリイミド樹脂、シリコン樹脂、エポキシ樹脂、フェノール樹脂等の熱硬化性樹脂、又は、ポリフェニレンスルファイド樹脂、ポリカーボネート樹脂、ポリブチレンテレフタレート樹脂、ポリアセタール樹脂等の熱可塑性樹脂等の耐熱性樹脂を含む。 The thermally conductive resin mentioned above may be a thermally conductive resin in which thermally conductive fibers are interconnected in a matrix resin. For example, the heat-conducting fiber includes aluminum nitride, magnesium oxide, boron nitride, alumina, anhydrous magnesium carbonate, silicon oxide, zinc oxide, etc. For example, the matrix resin includes polyimide resin, silicon resin, epoxy resin, phenolic resin, etc. and heat-resistant resins such as thermoplastic resins such as polyphenylene sulfide resins, polycarbonate resins, polybutylene terephthalate resins, and polyacetal resins.
 以上により、基板31上の発熱素子であるパワー半導体(スイッチング素子63~68)や集積回路(制御部60)の発熱は、伝熱経路H1で示すように伝熱部90の吸熱面91に伝熱して機械1の筐体11の内部へ輻射すると共に、伝熱経路H2で示すように伝熱部90の吸熱面91から放熱面92へ伝熱して機械1の筐体11へ放熱される。 As described above, the heat generated by the power semiconductors (switching elements 63 to 68) and the integrated circuit (control section 60), which are heat generating elements on the substrate 31, is transferred to the heat absorption surface 91 of the heat transfer section 90 as indicated by the heat transfer path H1. The heat is radiated to the inside of the housing 11 of the machine 1, and the heat is transferred from the heat absorbing surface 91 to the heat radiating surface 92 of the heat transfer section 90 to the housing 11 of the machine 1 as indicated by the heat transfer path H2.
 図6Bは変形例の基板固定構造のIV-IV断面図である。変形例の基板固定構造では、伝熱部90が基板31それ自体を機械1の筐体11に接続する点で、図6Aの基板固定構造とは異なる。基板31の裏側に電子部品が無い場合、伝熱部90の吸熱面91が基板31の裏側に密着するとよい。吸熱面91は、前述の熱伝導樹脂によって基板31の裏側に接着するか、又は、金属製ねじによって基板31の裏側に締結される。これにより、基板31の表側に配置された発熱素子(スイッチング素子63~68や制御部60)の発熱は、伝熱経路H1で示すように機械1の筐体11の内部の気体へ輻射されると共に、伝熱経路H2で示すように基板31から吸熱面91を介して放熱面92へ伝熱して機械1の筐体11へ放熱される。 FIG. 6B is a IV-IV cross-sectional view of a modified substrate fixing structure. The board fixing structure of the modification differs from the board fixing structure of FIG. 6A in that the heat transfer section 90 connects the board 31 itself to the housing 11 of the machine 1 . If there is no electronic component on the back side of the substrate 31 , the heat absorbing surface 91 of the heat transfer section 90 should be in close contact with the back side of the substrate 31 . The heat absorption surface 91 is adhered to the back side of the substrate 31 with the heat conductive resin described above, or fastened to the back side of the substrate 31 with metal screws. As a result, the heat generated by the heat generating elements (the switching elements 63 to 68 and the control unit 60) arranged on the front side of the substrate 31 is radiated to the gas inside the housing 11 of the machine 1 as indicated by the heat transfer path H1. At the same time, heat is transferred from the substrate 31 to the heat dissipation surface 92 via the heat absorption surface 91 as indicated by the heat transfer path H2, and is radiated to the housing 11 of the machine 1. FIG.
 図6A及び図6Bに示す基板固定構造は併用してもよく、伝熱部90の吸熱面91は、基板31の発熱素子に接着すると共に、基板31の裏側に密着することもある。以上のように第二実施形態の基板固定構造によれば、振動吸収材80によって基板31への振動の伝達を低減しつつ、伝熱部90によって基板31上の発熱素子の発熱を効率良く放熱できる。ひいては、基板31上の発熱素子が定格温度に達し難くなり、定格電流を増加できるため、機械1の動作性能を向上できる。 The substrate fixing structures shown in FIGS. 6A and 6B may be used together, and the heat absorbing surface 91 of the heat transfer section 90 may be adhered to the heating elements of the substrate 31 and may be in close contact with the back side of the substrate 31 . As described above, according to the substrate fixing structure of the second embodiment, the transmission of vibration to the substrate 31 is reduced by the vibration absorbing material 80, and the heat generated by the heating element on the substrate 31 is efficiently dissipated by the heat transfer section 90. can. As a result, the heating elements on the substrate 31 are less likely to reach the rated temperature, and the rated current can be increased, so the operating performance of the machine 1 can be improved.
 以下、第三実施形態の基板固定構造について詳細に説明する。第一実施形態の基板固定構造とは異なる部分についてのみ説明することに留意されたい。図1を再び参照すると、第一実施形態の基板固定構造では、基板31~36の保守時や交換時に、分離部11a~14aを取り外した後、さらに基板31~36を取り外すという二つの工程を経る必要があり、手間が掛かる。そこで、第三実施形態の基板固定構造は、機械1の筐体11~14から分離可能な分離部11a~14aに基板31~36を固定する点で、第一実施形態の基板固定構造とは異なる。 The substrate fixing structure of the third embodiment will be described in detail below. Note that only parts different from the substrate fixing structure of the first embodiment will be described. Referring to FIG. 1 again, in the substrate fixing structure of the first embodiment, when performing maintenance or replacement of the substrates 31 to 36, two steps are performed: removing the separating portions 11a to 14a and then removing the substrates 31 to 36. It has to go through and takes time. Therefore, the substrate fixing structure of the third embodiment differs from the substrate fixing structure of the first embodiment in that the substrates 31 to 36 are fixed to the separating portions 11a to 14a that can be separated from the housings 11 to 14 of the machine 1. different.
 図7は第三実施形態の基板固定構造の分解図である。図7には、機械1の二つの筐体11、12からそれぞれ分離した二つの分離部11a、12aが代表的に例示されている。第一基板31は第一筐体11から分離可能な第一分離部11aに固定され、第二基板32と第三基板33は第二筐体12から分離可能な第二分離部12aに固定されている。また、図示しないが、図1を再び参照すると、第四基板34と第五基板35は第三筐体13から分離可能な第三分離部13aに固定され、第六基板36は第四筐体14から分離可能な第四分離部14aに固定されている。 FIG. 7 is an exploded view of the substrate fixing structure of the third embodiment. FIG. 7 representatively illustrates two separate parts 11a and 12a separated from the two housings 11 and 12 of the machine 1, respectively. The first substrate 31 is fixed to a first separation portion 11a separable from the first housing 11, and the second substrate 32 and the third substrate 33 are fixed to a second separation portion 12a separable from the second housing 12. ing. Further, although not shown, referring to FIG. 1 again, the fourth substrate 34 and the fifth substrate 35 are fixed to the third separating portion 13a separable from the third housing 13, and the sixth substrate 36 is attached to the fourth housing. 14 is fixed to a fourth separating portion 14a that can be separated from .
 図7を参照すると、第一基板31に接続する線条体41~43を第一基板31から分離するため、第一基板31は線条体41~43を分離可能なコネクタ70~72をさらに備えている(図2も参照されたい)。第一コネクタ70は第一線条体41を第一基板31から分離可能にし、第二コネクタ71は第二線条体42を第一基板31から分離可能にし、第三コネクタ72は第三線条体43を第一基板31から分離可能にする。 Referring to FIG. 7, in order to separate the filaments 41-43 connected to the first substrate 31 from the first substrate 31, the first substrate 31 further includes connectors 70-72 capable of separating the filaments 41-43. (see also Figure 2). The first connector 70 allows the first filament 41 to be separated from the first substrate 31, the second connector 71 allows the second filament 42 to be separated from the first substrate 31, and the third connector 72 allows the third filament. The body 43 is made separable from the first substrate 31 .
 同様に、第二基板32及び第三基板33も線条体43~47を分離可能なコネクタ73~78をさらに備えている。第四コネクタ73は第三線条体43を第二基板32から分離可能にし、第五コネクタ74は第四線条体44を第二基板32から分離可能にし、第六コネクタ75は第五線条体45を第二基板32から分離可能にする。 Similarly, the second board 32 and the third board 33 are further provided with connectors 73-78 that can separate the filaments 43-47. A fourth connector 73 allows the third filament 43 to be separated from the second substrate 32, a fifth connector 74 allows the fourth filament 44 to be separated from the second substrate 32, and a sixth connector 75 allows the fifth filament to be separated. The body 45 is made separable from the second substrate 32 .
 第七コネクタ76は第五線条体45を第三基板33から分離可能にし、第八コネクタ77は第六線条体46を第三基板33から分離可能にし、第九コネクタ78は第七線条体47を第三基板33から分離可能にする。さらに、図示しないが、同様に第四基板34~第六基板36も線条体47~52を分離可能なコネクタを備えている。 A seventh connector 76 allows the fifth filament 45 to be separated from the third substrate 33, an eighth connector 77 allows the sixth filament 46 to be separated from the third substrate 33, and a ninth connector 78 allows the seventh wire to be separated. The strip 47 is made separable from the third substrate 33 . Furthermore, although not shown, the fourth board 34 to the sixth board 36 are also provided with connectors capable of separating the filaments 47 to 52 in the same manner.
 また、第一アクチュエータ21は、第一基板31の第二コネクタ71の代わりに又は第二コネクタ71に加えて、第二線条体42を第一アクチュエータ21から分離可能なコネクタ71aをさらに備えていてもよい。同様に、第二アクチュエータ22は、第二基板32の第五コネクタ74の代わりに又は第五コネクタ74に加えて、第四線条体44を第二アクチュエータ22から分離可能なコネクタ74aをさらに備えていてもよい。 Further, the first actuator 21 further includes a connector 71a capable of separating the second filamentous body 42 from the first actuator 21 instead of or in addition to the second connector 71 of the first substrate 31. may Similarly, the second actuator 22 further comprises a connector 74a capable of separating the fourth filament 44 from the second actuator 22 instead of or in addition to the fifth connector 74 of the second substrate 32. may be
 以上のように第三実施形態の基板固定構造は、基板31~36が、筐体11~14から分離可能な分離部11a~14aに固定され、且つ、線条体41~52を分離可能なコネクタ70~78、71a、74aを備えることにより、基板31~36と分離部11a~14aをユニット化した基板固定構造を構成している(以下、「基板分離ユニット」と称する。)。第三実施形態の基板固定構造によれば、基板31~36が分離部11a~14aに固定された状態で、線条体41~52をコネクタ70~78、71a、74aから分離するだけで、基板分離ユニットを機械1から取り外して基板31~36の保守や交換を実施できるため、基板31~36の保守時間や交換時間を短縮できる。ひいてはMTTR(平均復旧時間)を短縮できる。 As described above, in the substrate fixing structure of the third embodiment, the substrates 31 to 36 are fixed to the separating portions 11a to 14a that are separable from the housings 11 to 14, and the linear bodies 41 to 52 are separable. By providing the connectors 70 to 78, 71a, and 74a, a substrate fixing structure in which the substrates 31 to 36 and the separation portions 11a to 14a are unitized is configured (hereinafter referred to as "substrate separation unit"). According to the board fixing structure of the third embodiment, the strips 41 to 52 are separated from the connectors 70 to 78, 71a, and 74a while the boards 31 to 36 are fixed to the separating portions 11a to 14a. Since the substrate separation unit can be detached from the machine 1 for maintenance and replacement of the substrates 31 to 36, the maintenance time and replacement time for the substrates 31 to 36 can be shortened. As a result, the MTTR (mean time to restore) can be shortened.
 図8は比較例の基板固定構造の断面図である。比較例の基板固定構造は、機械1のアクチュエータ用の基板31と、筐体11に固定されていて基板31を支持する支持金具84と、基板31と支持金具84を筐体11に締結する締結部材83と、を備えている。つまり、比較例の基板固定構造は、基板31の両側に配置される振動吸収材80を備えていない点で、前述の実施形態の基板固定構造とは異なる。比較例の基板固定構造では、機械1が動作して外的因子又は内的因子による機械1の振動又は衝撃が機械1の筐体11に伝達すると、振動が支持金具84を介して基板31に直接伝達する。つまり、基板31上に半田付けした電子部品が剥離したり、又は電子部品間の配線が断線したりして、基板31が破損することがある。 FIG. 8 is a cross-sectional view of a substrate fixing structure of a comparative example. The substrate fixing structure of the comparative example includes a substrate 31 for the actuator of the machine 1 , a support metal fitting 84 fixed to the housing 11 to support the substrate 31 , and a fastening system for fastening the substrate 31 and the support metal fitting 84 to the housing 11 . A member 83 is provided. In other words, the substrate fixing structure of the comparative example is different from the substrate fixing structure of the above-described embodiment in that it does not include the vibration absorbers 80 arranged on both sides of the substrate 31 . In the substrate fixing structure of the comparative example, when the machine 1 operates and the vibration or impact of the machine 1 due to external factors or internal factors is transmitted to the housing 11 of the machine 1, the vibration is transmitted to the substrate 31 via the support bracket 84. Communicate directly. In other words, the substrate 31 may be damaged due to peeling of the electronic components soldered on the substrate 31 or disconnection of the wiring between the electronic components.
 しかし、前述の実施形態の基板固定構造によれば、機械1が動作する際に機械1の筐体10~16に振動又は衝撃が発生しても、振動吸収材80によって振動が吸収され、基板31~36への振動の伝達が低減するため、基板31~36の破損を低減できる。つまりMTBF(平均故障間隔)を増大できる。ひいては、基板31~36の信頼性が高まる基板固定構造を提供できる。また、斯かる基板固定構造により、信頼性の高い機械又はロボットを提供できる。 However, according to the substrate fixing structure of the above-described embodiment, even if vibration or shock occurs in the housings 10 to 16 of the machine 1 when the machine 1 operates, the vibration is absorbed by the vibration absorbing material 80, Since the transmission of vibrations to 31-36 is reduced, breakage of substrates 31-36 can be reduced. In other words, the MTBF (mean time between failures) can be increased. As a result, it is possible to provide a substrate fixing structure that enhances the reliability of the substrates 31-36. Moreover, such a substrate fixing structure can provide a highly reliable machine or robot.
 本明細書において種々の実施形態について説明したが、本発明は、前述の実施形態に限定されるものではなく、以下の特許請求の範囲に記載された範囲内において種々の変更を行えることを認識されたい。 Although various embodiments have been described herein, it is recognized that the present invention is not limited to the embodiments described above and that various modifications can be made within the scope of the following claims. want to be
 1 機械
 10~16 筐体
 11a~14a 分離部
 21~26 アクチュエータ
 21a 電動機
 21b 動作検出部
 21c 貫通孔
 31~36 基板
 40 制御装置
 41~52 線条体
 60 制御部
 61 駆動部
 62 コンデンサ
 63~68 スイッチング素子
 69 電流検出部
 70~78 コネクタ
 71a、74a コネクタ
 80、80a、80b 振動吸収材
 81 固定部
 82、82a、82b 挟持部材
 83 固定部材
 83a 支持部材
 83b、83c 締結部材
 90 伝熱部
 91 吸熱面
 92 放熱面
 H1、H2 伝熱経路
 J1~J6 軸線
1 Machine 10-16 Case 11a-14a Separating Part 21-26 Actuator 21a Electric Motor 21b Operation Detecting Part 21c Penetration Hole 31-36 Substrate 40 Control Device 41-52 Linear Body 60 Control Part 61 Driving Part 62 Capacitor 63-68 Switching Element 69 Current detector 70-78 Connectors 71a, 74a Connectors 80, 80a, 80b Vibration absorber 81 Fixing part 82, 82a, 82b Clamping member 83 Fixing member 83a Supporting member 83b, 83c Fastening member 90 Heat transfer part 91 Heat absorption surface 92 Heat dissipation surface H1, H2 Heat transfer path J1 to J6 Axis

Claims (14)

  1.  機械を駆動するアクチュエータ用の基板と、
     前記基板の両側に配置される振動吸収材と、
     前記基板と前記振動吸収材を挟持して前記機械の筐体に固定する固定部と、
     を備える、基板固定構造。
    a substrate for an actuator that drives a machine;
    vibration absorbers disposed on both sides of the substrate;
    a fixing part that sandwiches the substrate and the vibration absorbing material and fixes them to the housing of the machine;
    A substrate fixing structure.
  2.  前記固定部は、前記基板と前記振動吸収材を挟持する挟持部材と、前記挟持部材を前記機械の筐体に固定する固定部材と、を備える、請求項1に記載の基板固定構造。 The substrate fixing structure according to claim 1, wherein the fixing portion includes a clamping member that clamps the board and the vibration absorbing material, and a fixing member that secures the clamping member to the housing of the machine.
  3.  前記挟持部材は前記基板と前記振動吸収材を挟持する第一挟持部材及び第二挟持部材を含み、前記固定部材は、前記基板、前記振動吸収材、前記第一挟持部材、及び前記第二挟持部材を貫通して前記第一挟持部材と前記第二挟持部材を前記機械の筐体に固定する、請求項2に記載の基板固定構造。 The clamping member includes a first clamping member and a second clamping member clamping the substrate and the vibration absorbing member, and the fixing member comprises the substrate, the vibration absorbing material, the first clamping member, and the second clamping member. 3. The substrate fixing structure according to claim 2, wherein said first clamping member and said second clamping member are fixed to the housing of said machine by passing through members.
  4.  前記挟持部材は前記基板と前記振動吸収材を挟持する第一挟持部材及び第二挟持部材を含み、前記固定部材は、前記第一挟持部材と前記第二挟持部材を支持する支持部材と、前記第一挟持部材と前記第二挟持部材を前記支持部材に締結する締結部材と、前記支持部材を前記機械の筐体に締結する締結部材と、を備える、請求項2に記載の基板固定構造。 The clamping member includes a first clamping member and a second clamping member clamping the substrate and the vibration absorbing material, and the fixing member comprises a support member for supporting the first clamping member and the second clamping member; 3. The substrate fixing structure according to claim 2, comprising a fastening member that fastens the first holding member and the second holding member to the support member, and a fastening member that fastens the support member to a housing of the machine.
  5.  前記振動吸収材は、前記基板の表側に配置される振動吸収材と、前記基板の裏側に配置される振動吸収材と、を含む、請求項1から4のいずれか一項に記載の基板固定構造。 5. The substrate fixing according to claim 1, wherein the vibration absorbing material includes a vibration absorbing material arranged on the front side of the board and a vibration absorbing material arranged on the back side of the board. structure.
  6.  前記振動吸収材は、前記基板の表側と裏側の両側を挟み込むコ字部を備える、請求項1から5のいずれか一項に記載の基板固定構造。 The board fixing structure according to any one of claims 1 to 5, wherein the vibration absorbing material has a U-shaped portion sandwiching both the front side and the back side of the board.
  7.  前記基板上の発熱素子及び前記基板の少なくとも一方を前記機械の筐体に接続する伝熱部をさらに備える、請求項1から6のいずれか一項に記載の基板固定構造。 The substrate fixing structure according to any one of claims 1 to 6, further comprising a heat transfer section that connects at least one of the heating element on the substrate and the substrate to the housing of the machine.
  8.  前記伝熱部は柔軟な金属シートを備える、請求項7に記載の基板固定構造。 The substrate fixing structure according to claim 7, wherein the heat transfer part comprises a flexible metal sheet.
  9.  前記伝熱部は前記金属シートを前記発熱素子に接着する熱伝導樹脂をさらに備える、請求項8に記載の基板固定構造。 The substrate fixing structure according to claim 8, wherein the heat transfer part further comprises a heat conductive resin that adheres the metal sheet to the heat generating element.
  10.  前記基板は前記機械の筐体から分離可能な分離部に固定されている、請求項1から9のいずれか一項に記載の基板固定構造。 The board fixing structure according to any one of claims 1 to 9, wherein the board is fixed to a separation section separable from the housing of the machine.
  11.  前記基板に電気的に接続する線条体と、前記線条体を前記基板から分離可能なコネクタと、をさらに備える、請求項1から10のいずれか一項に記載の基板固定構造。 The board fixing structure according to any one of claims 1 to 10, further comprising a filamentary body electrically connected to the board, and a connector capable of separating the filamentous body from the board.
  12.  前記アクチュエータに電気的に接続する線条体と、前記線条体を前記アクチュエータから分離可能なコネクタと、をさらに備える、請求項1から11のいずれか一項に記載の基板固定構造。 The substrate fixing structure according to any one of claims 1 to 11, further comprising a filamentary body electrically connected to the actuator, and a connector capable of separating the filamentous body from the actuator.
  13.  請求項1から12のいずれか一項に記載の基板固定構造を備える機械。 A machine comprising the substrate fixing structure according to any one of claims 1 to 12.
  14.  請求項1から12のいずれか一項に記載の基板固定構造を備えるロボット。 A robot comprising the substrate fixing structure according to any one of claims 1 to 12.
PCT/JP2021/039713 2021-10-27 2021-10-27 Substrate fixing structure, machine, and robot WO2023073843A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477283U (en) * 1990-11-19 1992-07-06
WO2011013509A1 (en) * 2009-07-31 2011-02-03 ボッシュ株式会社 Electronic device
JP2013229414A (en) * 2012-04-25 2013-11-07 Hitachi Automotive Systems Ltd Electronic control device
JP2018170357A (en) * 2017-03-29 2018-11-01 富士高分子工業株式会社 Thermally conductive sheet
JP2020148232A (en) * 2019-03-12 2020-09-17 三菱電機株式会社 Supporting material, assembling component, electronic apparatus and assembling method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477283U (en) * 1990-11-19 1992-07-06
WO2011013509A1 (en) * 2009-07-31 2011-02-03 ボッシュ株式会社 Electronic device
JP2013229414A (en) * 2012-04-25 2013-11-07 Hitachi Automotive Systems Ltd Electronic control device
JP2018170357A (en) * 2017-03-29 2018-11-01 富士高分子工業株式会社 Thermally conductive sheet
JP2020148232A (en) * 2019-03-12 2020-09-17 三菱電機株式会社 Supporting material, assembling component, electronic apparatus and assembling method

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