TW202313247A - Semiconductor strip grinding apparatus - Google Patents

Abstract

The invention discloses a semiconductor strip grinding device. The semiconductor strip grinding apparatus includes a chuck table configured to support a semiconductor strip, a grinding unit configured to grind a surface portion of the semiconductor strip supported by the chuck table, and a trimming unit configured to trim the grinding unit when the semiconductor strip is loaded onto or unloaded from the chuck table.

Description

Semiconductor strip grinding device

The present disclosure relates to a semiconductor strip grinding device. More particularly, the present disclosure relates to a semiconductor tape grinding apparatus for grinding a protective molding layer of a semiconductor tape to reduce the thickness of the semiconductor tape.

The semiconductor tape can be manufactured by a die bonding process of bonding a semiconductor die on a substrate such as a printed circuit board or a lead frame and a molding process of encapsulating the semiconductor die with a molding resin such as epoxy.

A semiconductor tape grinding apparatus may be used to grind and remove a surface portion of the protective molding layer made of molding resin to reduce the thickness of the semiconductor tape to a predetermined thickness. The semiconductor tape grinding apparatus may include a chuck table for supporting the semiconductor tape and a grinding unit for grinding and removing a surface portion of the semiconductor tape.

The present disclosure provides an improved semiconductor tape grinding apparatus capable of increasing productivity.

According to some embodiments of the present disclosure, the semiconductor tape grinding apparatus may include: a chuck table configured to support the semiconductor tape, a grinding unit configured to grind a surface portion of the semiconductor tape supported by the chuck table, and A dressing unit configured to dress the grinding unit when the semiconductor strip is loaded onto or unloaded from the chuck table.

According to some embodiments of the present disclosure, the semiconductor tape grinding apparatus may further include: a first horizontal driving part configured to horizontally move the chuck table between a processing area below the grinding unit and a loading and unloading area separated from the processing area. , the semiconductor strips are loaded and unloaded in the loading and unloading area, and a second horizontal driving part configured to horizontally move the trimming unit between the processing area and a standby area separated from the processing area.

According to some embodiments of the present disclosure, the first horizontal driving part and the second horizontal driving part may be configured to coaxially move the chuck table and the dressing unit.

According to some embodiments of the present disclosure, the semiconductor tape grinding apparatus may further include a thickness measurement unit configured to measure a thickness of the semiconductor tape while grinding the semiconductor tape.

According to some embodiments of the present disclosure, the semiconductor tape grinding apparatus may further include a second thickness measuring unit configured to measure a thickness of the semiconductor tape after the semiconductor tape is ground.

According to some embodiments of the present disclosure, the semiconductor tape grinding apparatus may further include a tape cleaning unit configured to clean the semiconductor tape while or after grinding the semiconductor tape.

According to some embodiments of the present disclosure, the grinding unit may include a plurality of grindstones for grinding a surface portion of the semiconductor strip, a grinding wheel to which the grindstones are installed, and a rotation driving part configured to rotate the grinding wheel. In this case, the grinding stones may be arranged circumferentially along the lower edge portion of the grinding wheel.

According to some embodiments of the present disclosure, the semiconductor tape grinding apparatus may further include a grindstone cleaning unit disposed under the grinding unit and configured to clean the grindstone.

According to some embodiments of the present disclosure, the dressing unit may include a dressing wheel disposed below the grinding wheel, and a second rotation driving part configured to rotate the dressing wheel.

According to some embodiments of the present invention, an information tag recording wheel ID information may be attached to the wheel, and a reader configured to read the wheel ID information recorded in the information tag may be mounted on the rotation driving part.

According to some embodiments of the present disclosure, the semiconductor tape grinding apparatus may further include: a tape extraction unit configured to extract a semiconductor tape from a magazine configured to receive a plurality of semiconductor tapes, the semiconductor tapes extracted from the magazine A vacuum table on which the tape is placed and configured to vacuum absorb the lower surface of the semiconductor tape, and a tape delivery unit configured to pick up the semiconductor tape placed on the vacuum table and transfer it to the chuck table.

According to some embodiments of the present disclosure, the vacuum table may be configured to be movable in a vertical direction, and the tape conveying unit may include a vacuum picker configured to be movable in a vertical direction and vacuum-adsorb the upper surface of the semiconductor tape to pick up the semiconductor tape. , by raising the vacuum table and lowering the vacuum picker, the semiconductor ribbon can be transferred from the vacuum table to the vacuum picker in a state of being in close contact between the vacuum table and the vacuum picker.

According to the embodiments of the present disclosure as described above, the dressing step for the grinding unit may be performed by the dressing unit when loading or unloading the semiconductor tape onto or from the chuck table. As a result, no additional time is required for the dressing step of the grinding unit, so that the hourly throughput of the semiconductor strip grinding device can be greatly increased. Further, the thickness measuring unit can measure the thickness of the semiconductor strip in real time when the semiconductor strip is being ground, so as to control the thickness of the semiconductor strip more accurately. In addition, the grinding stone cleaning unit may perform the grinding stone cleaning step simultaneously with the semiconductor tape grinding step, thereby greatly reducing the time required for the semiconductor tape grinding process. As a result, the productivity of the semiconductor tape grinding apparatus can be greatly improved.

The above summary of the present disclosure is not intended to describe each illustrated embodiment, or every implementation, of the present disclosure. The Detailed Description and Claims that follow more particularly exemplify these embodiments.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the present invention is not limited to the embodiments described below and can be implemented in various other forms. The following embodiments are provided not to fully complete the present invention, but to fully convey the scope of the present invention to those skilled in the art.

In this specification, when it is mentioned that a component is on or connected to another component or layer, it may be directly on or directly connected to another component or layer, or it may also There may be intervening components or layers. In contrast, it will be understood that when a component is referred to as being directly on or connected to another component or layer, this means that there are no intervening components present. Also, although terms such as first, second, and third are used to describe various regions and layers in various embodiments of the present invention, the regions and layers are not limited to these terms.

The terms used below are used to describe specific embodiments only, and do not limit the present invention. Also, unless otherwise defined herein, all terms including technical or scientific terms may have the same meanings as commonly understood by those skilled in the art.

Embodiments of the invention are described with reference to schematic illustrations of idealized embodiments. Accordingly, variations in manufacturing methods and/or tolerances can be expected from the form of the drawings. Therefore, the description of the embodiments of the present invention is not limited to the specific form or area in the drawings, and further includes deviations in form. These regions may be purely schematic and their form may not describe or depict the exact form or structure in any given region and are not intended to limit the scope of the invention.

FIG. 1 is a schematic top view of a semiconductor tape grinding apparatus according to an embodiment of the present disclosure.

Referring to FIG. 1 , according to an embodiment of the present disclosure, a semiconductor tape grinding apparatus 100 may be used to grind and remove a surface portion of a semiconductor tape 10 , thereby reducing the thickness of the semiconductor tape 10 to a predetermined thickness. Specifically, the semiconductor tape 10 may be manufactured by bonding a semiconductor die on a substrate such as a printed circuit board or a lead frame, and then forming a protective molding layer on the substrate using a molding resin such as epoxy. The semiconductor tape grinding apparatus 100 may be used to grind and remove a surface portion of the protective molding layer of the semiconductor tape 10 such that the semiconductor tape 10 has a predetermined thickness.

The semiconductor tape grinding apparatus 100 may include a chuck table 130 for supporting the semiconductor tape 10 , and a grinding unit 140 for grinding and removing a surface portion of the semiconductor tape 10 loaded on the chuck table 130 . As shown in FIG. 1 , for example, the semiconductor tape grinding apparatus 100 may include two chuck tables 130 and two grinding units 140 . However, the number of chuck tables 130 and grinding units 140 may vary, and thus the scope of the present invention will not be limited thereto.

Fig. 2 is a schematic side view of the grinding unit shown in Fig. 1 and the first horizontal driving part, Fig. 3 is a schematic front view of the grinding unit shown in Fig. 1 and the first horizontal driving part, Fig. 4 is a diagram Schematic bottom view of the grinding wheel and grinding stone shown in 2.

2 to 4, the grinding unit 140 may include a plurality of grinding stones 142 for grinding the surface portion of the semiconductor strip 10, a grinding wheel 144 on which the grinding stones 142 are mounted, and a rotary mechanism for rotating the grinding wheel 144. drive unit 146 . In particular, the grindstone 142 may be installed on a lower surface of the grindstone 144 and may be arranged in a circumferential direction along a lower edge portion of the grindstone 144 .

According to an embodiment of the present disclosure, the semiconductor tape grinding apparatus 100 may include a first horizontal driving part 132 for moving the chuck table 130 in a horizontal direction, for example, along a Y-axis direction, as shown in FIG. 2 . The first horizontal driving part 132 can operate between a processing area (in which the step of grinding the semiconductor strip 10 is performed) provided below the grinding unit 140 and a loading and unloading area (in which the processing area is spaced apart in the horizontal direction) The chuck table 130 is moved horizontally between loading and unloading the semiconductor tape 10 in the area. In addition, the first horizontal driving part 132 may reciprocate the chuck table 130 in the horizontal direction in the processing area to grind the surface portion of the semiconductor strip 10 .

Although not shown in the drawing, the semiconductor tape grinding apparatus 100 may include a vertical driving part (not shown) for moving the grinding unit 140 in a vertical direction. The vertical driving part can adjust the grinding thickness of the semiconductor strip 10 by adjusting the height of the grinding unit 140 . Alternatively, the semiconductor tape grinding apparatus 100 may include a second vertical driving part (not shown) for vertically moving the chuck table 130 to adjust the height of the semiconductor tape 10 .

The first horizontal driving part 132 may include a first movable block 136 configured to move along a guide rail 134 extending in a Y-axis direction, and the chuck table 130 may be disposed on the first movable block 136 . In this case, although not shown in the drawing, the chuck table 130 may have a plurality of vacuum holes to vacuum absorb the lower surface of the semiconductor tape 10 .

Referring again to FIG. 1 , according to an embodiment of the present disclosure, the semiconductor tape grinding apparatus 100 may include grinding the semiconductor tape 10 when loading or unloading the semiconductor tape 10 onto or from the chuck table 130 . Unit 140 performs a trimming unit 150 of a trimming step. The conditioning unit 150 may serve to remove impurities accumulated on the grindstone 142 and improve the surface condition of the grindstone 142 when a grinding step is performed.

FIG. 5 is a schematic side view of the trimming unit and the second horizontal driving part shown in FIG. 1 .

Referring to FIG. 5 , the semiconductor tape grinding apparatus 100 may include a second horizontal driving part 160 for horizontally moving the trimming unit 150 so as to perform the trimming step as described above when performing the loading and unloading step of the semiconductor tape 10, that is, The dressing step is performed while the chuck table 130 is spaced apart from the grinding unit 140 .

For example, the second horizontal driving part 160 may horizontally move the finishing unit 150 between the processing area and a standby area separated from the processing area. Specifically, the second horizontal driving part 160 can move the trimming unit 150 along the Y-axis direction. That is, the first horizontal driving part 132 and the second horizontal driving part 160 may be respectively configured to coaxially move the chuck table 130 and the dressing unit 150 . For example, the second horizontal driving part 160 may include a second movable block 162 configured to move along the guide rail 134 extending along the Y-axis direction, and the trimming unit 150 may be disposed on the second movable block 162 .

The dressing unit 150 may be moved by the second horizontal driving part 160 to be positioned below the grinding unit 140, the dressing unit 150 may include a dressing wheel 152 disposed below the grinding unit 140 to correspond to an edge portion of the lower surface of the grinding wheel 144, and A second rotary drive portion 156 for rotating the dressing wheel 152 . In this case, the vertical drive may lower the grinding unit 140 such that at least one grinding stone 142 comes into contact with the dressing wheel 152 . Optionally, the semiconductor tape grinding apparatus 100 may include a third vertical drive (not shown) for adjusting the height of the dressing wheel 152 .

As described above, in a state where at least one grindstone 142 is in contact with the dressing wheel 152 , the rotation driving part 146 can rotate the grinding wheel 144 at a predetermined speed, and the second rotation driving part 156 can rotate the dressing wheel 152 at a predetermined speed. The surface condition of the grinding stone 142 can be improved by the rotation of the dressing wheel 152 and the rotation of the grinding wheel 144 .

Meanwhile, although not shown in the drawings, the grinding unit 140 may be configured to supply cooling water to cool the grindstone 142 and remove impurities when performing the grinding step and the dressing step. For example, cooling water may be supplied to the grinding stone 142 through the rotation driving part 146 and the grinding wheel 144 .

Referring again to FIG. 3 , an information tag 148, such as an RFID (Radio Frequency Identification) tag recorded with ID information of the grinding wheel 144, may be attached to the grinding wheel 144 and used to read the ID information recorded in the information tag 148 of the grinding wheel 144. The extractor 166 may be mounted on the rotation driving part 146. After the semiconductor tape 10 is loaded onto the chuck table 130 , the reader 166 may check whether the grinding wheel 144 mounted on the rotation driving part 146 is suitable for grinding the loaded semiconductor tape 10 . Therefore, an error in performing the grinding step of the semiconductor strip 10 by an unsuitable grinding wheel can be prevented. In particular, the grinding wheel 144 is detachably mounted on the rotary drive portion 146 . Therefore, when an unsuitable grinding wheel is mounted on the rotary driving portion 146, it can be replaced with a new suitable grinding wheel.

Referring again to FIG. 2 , according to an embodiment of the present disclosure, the semiconductor tape grinding apparatus 100 may include a tape cleaning unit 170 for cleaning the semiconductor tape 10 . The strip cleaning unit 170 may spray cleaning liquid onto the semiconductor strip 10 to remove impurities on the semiconductor strip 10 when and/or after performing the grinding step of the semiconductor strip 10 . For example, water can be used as the cleaning liquid, and impurities can be sufficiently removed from the semiconductor strip 10 by spraying water at a predetermined pressure.

Further, as shown in FIG. 3 , a grindstone cleaning unit 174 may be disposed under the grindstone unit 140 to clean the grindstone 142 . The grindstone cleaning unit 174 may spray cleaning liquid to the grindstone 142 to remove impurities in the grindstone 142 . For example, water may be used as the cleaning liquid, and impurities can be sufficiently removed from the grindstone 142 by spraying water at a predetermined pressure.

In particular, the semiconductor tape 10 may have a rectangular plate shape having a length and a width, and the chuck table 130 may have a rectangular block shape corresponding to the semiconductor tape 10 . In addition, the chuck table 130 may be arranged in the Y-axis direction, and the first horizontal driving part 132 may make the chuck table 130 and the semiconductor tape 10 move along the longitudinal direction of the chuck table 130 and the semiconductor tape 10, that is, along the Y-axis. direction to move. The grinding stone cleaning unit 174 may be disposed on one side of the movement path of the chuck table 130 to spray cleaning liquid toward the grinding stone 142 . Specifically, the grindstone cleaning unit 174 may spray cleaning liquid toward the grindstone 142 when performing the grinding step of the semiconductor strip 10 . In addition, the grindstone cleaning unit 174 may spray cleaning liquid toward the grindstone 142 when performing the dressing step of the grindstone 142 .

According to an embodiment of the present disclosure, as shown in FIG. 2 , the semiconductor tape grinding apparatus 100 may include a thickness measurement unit 178 for measuring the thickness of the semiconductor tape 10 when performing a grinding step on the semiconductor tape 10 . A touch sensor with a measuring head in contact with the upper surface of the semiconductor strip 10 may be used as the thickness measurement unit 178 . For example, UNIMAR ^™ , a universal gauge for grinding machines available from MARPOSS in Bentivoglio, Italy, may be used as the thickness measurement unit 178 . The thickness measurement unit 178 may be disposed on one side of the grinding unit 140 along the Y-axis direction, and measures the thickness of the semiconductor strip 10 in a contact manner. As described above, the thickness of the semiconductor tape 10 can be measured in real time by the thickness measuring unit 178 when the grinding step of the semiconductor tape 10 is performed, so that the thickness control of the semiconductor tape 10 can be performed more accurately.

Specifically, the thickness measurement unit 178 can measure the thickness of the semiconductor strip 10 in real time when the rough grinding step or the semi-finishing step is performed on the semiconductor strip 10 . However, the measuring head may be spaced apart from the semiconductor strip 10 while finishing steps are being performed on the semiconductor strip 10 . Specifically, when the measuring head comes into contact with the semiconductor strip 10 during the finishing step of the semiconductor strip 10, contact marks of the measuring head may be generated on the upper surface of the semiconductor strip 10 after the finishing step is completed. Therefore, it is preferable to separate the measuring head from the semiconductor strip 10 when performing finishing steps on the semiconductor strip 10 .

Meanwhile, a non-contact sensor such as a laser ranging sensor may be used as the thickness measurement unit 178 . In this case, however, measurement accuracy may be deteriorated due to the grinding fluid supplied onto the semiconductor strip 10 and impurities generated in the grinding step of the semiconductor strip 10 .

In addition, the semiconductor tape grinding apparatus 100 may include a brush 154 for cleaning the measuring head of the thickness measuring unit 178 as shown in FIG. 5 . The brush 154 can be used to remove impurities on the measuring head, and can be configured to be moved by the second horizontal driving part 160 . For example, the brush 154 may be connected to the second movable block 162 or the second rotary drive 156, and the second horizontal drive 160 may reciprocate the brush 154 in the Y-axis direction to remove impurities from the measuring head.

Referring again to FIG. 1 , the semiconductor tape grinding apparatus 100 may further include a second thickness measurement unit 180 for measuring the thickness of the semiconductor tape 10 after the grinding step of the semiconductor tape 10 is performed. For example, the second thickness measurement unit 180 may be disposed between the grinding unit 140 and the thickness measurement unit 178, and may measure the thickness of the semiconductor strip 10 after the grinding step of the semiconductor strip 10 is completed.

For example, although not shown in detail, the second thickness measurement unit 180 may include a probe configured to be vertically movable to contact the upper surface of the semiconductor tape 10, and may The height of the probe is measured with the surfaces in contact to calculate the thickness of the semiconductor strip 10 . As another example, a non-contact type sensor such as a laser ranging sensor may be used as the second thickness measurement unit 180 .

Meanwhile, although not shown in the figure, the second thickness measurement unit 180 may be configured to be movable in a horizontal direction, for example, along the X-axis direction, so as to measure the thickness of the semiconductor strip 10 at a plurality of measurement points of the semiconductor strip 10 . For example, the semiconductor tape grinding apparatus 100 may further include a third horizontal driving part (not shown) for moving the second thickness measurement unit 180 in the X-axis direction.

In addition, the second thickness measuring unit 180 may measure an initial thickness of the semiconductor tape 10 before performing the grinding step of the semiconductor tape 10 and may predetermine the grinding thickness of the semiconductor tape 10 based on the measured initial thickness. For example, although not shown in the figure, the semiconductor strip grinding apparatus 100 may include a control unit (not shown) for controlling the grinding unit 140, the dressing unit 150, the first horizontal drive part 132 and the second horizontal drive The operation of the section 160, the vertical driving section, etc., and the control unit may predetermine the grinding thickness of the semiconductor strip 10 based on the measured initial thickness.

According to an embodiment of the present disclosure, the semiconductor tape grinding apparatus 100 may include a loading unit 102 for supplying the semiconductor tape 10 and an unloading unit 188 for unloading the semiconductor tape 10 after performing a grinding process. For example, a first magazine 50 configured to receive a plurality of semiconductor strips may be disposed on the loading unit 102 and a second magazine 52 for receiving the semiconductor strips 10 may be disposed on the unloading unit 188 after the grinding process is complete. . In addition, the semiconductor tape grinding apparatus 100 may include a tape extracting unit 104 configured to extract the semiconductor tape 10 from the first magazine 50, on which the semiconductor tape 10 extracted from the first magazine 50 is placed, and configured It is a vacuum table 116 that vacuum absorbs the lower surface of the semiconductor tape 10 , and a tape delivery unit 120 configured to pick up the semiconductor tape 10 placed on the vacuum table 116 and transport the semiconductor tape 10 to the chuck table 130 .

6 and 7 are schematic front views of the vacuum table and the strip delivery unit shown in FIG. 1 .

Referring to FIGS. 6 and 7 , the vacuum table 116 may be configured to be movable in a vertical direction by a table elevator 118 . After the semiconductor tape 10 extracted from the first magazine 50 by the tape extracting unit 104 is placed on the vacuum table 116 , the vacuum table 116 can vacuum absorb the lower surface of the semiconductor tape 10 . For example, the vacuum table 116 may have a rectangular plate shape, and may have a plurality of vacuum holes (not shown) for vacuum adsorption of the lower surface of the semiconductor strip 10 .

The tape extracting unit 104 may include: a pusher 106 for pushing one of the semiconductor tapes accommodated in the first magazine 50 so as to protrude from the first magazine 50, for clamping the semiconductor tape from the first magazine 50 The gripper 108 of the semiconductor strip 10 protruding in 50 is used to move the gripper 108 in the horizontal direction (for example, along the X-axis direction) to transport the semiconductor strip 10 to the gripper driving part 110 on the vacuum table 116 (see FIG. 1 ), and the conveyor rail 112 for guiding the semiconductor tape 10 to move between the first magazine 50 and the vacuum table 116 .

In addition, although not shown in the figure, the first magazine 50 may be configured to be movable in the vertical direction by a first magazine driving part (not shown), and the first magazine driving part may adjust the first magazine. 50 so that the height of the semiconductor strip 10 to be extracted corresponds to the pusher 106 .

The tape transfer unit 120 may include a vacuum picker 122 configured to vacuum absorb the upper surface of the semiconductor tape 10 to pick up the semiconductor tape 10 , and a picker driving part 124 configured to move the vacuum picker 122 . The pickup driver 124 can rotate the vacuum pickup 122 to adjust the direction of the vacuum pickup 122 , and can move the vacuum pickup 122 vertically and horizontally (X-axis direction). As shown in FIG. 1 , the tape delivery unit 120 may include two vacuum pickers 122 . However, since the number of vacuum pickups 122 may vary, the scope of the present disclosure will not be so limited.

According to an embodiment of the present disclosure, after the semiconductor tape 10 is placed on the vacuum table 116 , the lower surface of the semiconductor tape 10 may be vacuum adsorbed to the upper surface of the vacuum table 116 . Therefore, when the semiconductor strip 10 is warped, the semiconductor strip 10 can be flattened on the vacuum table 116 , so that the semiconductor strip 10 can be easily picked up by the vacuum picker 122 .

In particular, as shown in FIG. 7 , the table lifter 118 can raise the vacuum table 116 after the semiconductor strip 10 is vacuum-adsorbed on the vacuum table 116, and the pickup driving part 124 can lower the vacuum pickup 122 such that the vacuum pickup 122 The lower surface is in close contact with the upper surface of the semiconductor strip 10 . As a result, the lower and upper surfaces of the semiconductor tape 10 may be in close contact between the vacuum table 116 and the vacuum picker 122 , and then the semiconductor tape 10 may be transferred from the vacuum table 116 to the vacuum picker 122 . Therefore, even if the lower surface of the semiconductor strip 10 is not sufficiently vacuum-adsorbed on the vacuum table 116 due to the relatively large degree of warpage of the semiconductor strip 10, the semiconductor strip 10 can be closely contacted between the vacuum table 116 and the vacuum picker 122. Therefore, the semiconductor strip 10 can be transferred to the vacuum picker 122 in a sufficiently flat state.

In addition, the pickup driver 124 can move the vacuum pickup 122 so that the semiconductor strip 10 is in close contact with the chuck table 130 , so that the semiconductor strip 10 can be vacuum-adsorbed on the chuck table 130 . As a result, even when the supplied semiconductor strip 10 has warp, the semiconductor strip 10 can be supplied onto the chuck table 130 in a sufficiently flat state, and thus the grinding process of the semiconductor strip 10 can be performed more uniformly.

Referring again to FIG. 1 , a first lower cleaning unit 128 for cleaning the lower surface of the semiconductor tape 10 picked up by the vacuum picker 122 may be disposed between the vacuum table 116 and the chuck table 130 . The first lower cleaning unit 128 can spray cleaning liquid and/or cleaning gas onto the lower surface of the semiconductor tape 10, and thus, before the semiconductor tape 10 is loaded onto the chuck table 130, the The lower surface is sufficiently free of impurities. For example, water and air can be used as cleaning fluid and cleaning gas, respectively.

After the grinding step is performed by the grinding unit 140 , the semiconductor strip 10 may be picked up by the vacuum picker 122 and then transported to the drying unit 186 . In this case, a second lower cleaning unit 184 for removing impurities from the lower surface of the semiconductor tape 10 may be disposed between the chuck table 130 and the drying unit 186 . The second lower cleaning unit 184 may spray cleaning liquid and/or cleaning gas onto the lower surface of the semiconductor strip 10 to remove impurities therefrom. In addition, the second lower cleaning unit 184 may spray drying gas to the lower surface of the semiconductor strip 10 to dry it. For example, water can be used as cleaning fluid and air can be used as cleaning and drying gas.

The drying unit 186 may spray a drying gas, such as air, onto the upper surface of the semiconductor tape 10 . Although not shown in the figure, the semiconductor tape 10 dried on the drying unit 186 may be received in the second magazine 52 by a tape receiving unit (not shown).

According to the embodiment of the present disclosure as described above, the dressing step of the grinding unit 140 by the dressing unit 150 may be performed while loading or unloading the semiconductor tape 10 onto or from the chuck table 130 . Therefore, no extra time is required to perform the dressing step on the grinding unit 140 , and thus the hourly conveyance of the semiconductor tape grinding apparatus 100 can be greatly increased. In addition, the thickness measurement unit 178 can measure the thickness of the semiconductor strip 10 in real time while the semiconductor strip 10 is being ground, thereby controlling the thickness of the semiconductor strip 10 more precisely. In addition, the grinding stone cleaning unit 174 may perform the cleaning step of the grinding stone 142 simultaneously with the grinding step of the semiconductor tape 10 , thereby greatly reducing the time required for the grinding process of the semiconductor tape 10 . As a result, the productivity of the semiconductor tape grinding apparatus 100 can be greatly improved.

Although example embodiments of the present disclosure have been described with reference to certain embodiments, they are not limited thereto. Accordingly, it will be readily understood by those skilled in the art that various modifications and changes can be made thereto without departing from the spirit and scope of the present disclosure as defined by the appended claims.

10: Semiconductor strip 50: The first magazine 52: The second magazine 100: Semiconductor strip grinding device 102: Loading unit 104: strip extraction unit 106: pusher 108: fixture 110: Fixture driving part 112: conveyor rail 116: vacuum table 118: lift 120: Strip conveying unit 122: Vacuum pickup 124:Pickup drive unit 128: The first lower cleaning unit 130: chuck table 132: The first horizontal drive unit 134: guide rail 136: the first movable block 140: Grinding unit 142: millstone 144: grinding wheel 146:Rotary drive unit 148:Information label 150: Trimming unit 152: Dressing wheel 154: brush 156: The second rotary drive unit 160: Second horizontal drive unit 162: the second movable block 166: Reader 170: strip cleaning unit 174: Millstone cleaning unit 178: Thickness measurement unit 180: Second thickness measurement unit 184: Second lower cleaning unit 186: drying unit 188: Unload unit

Embodiments can be understood in more detail from the following description in conjunction with the drawings, in which:

1 is a schematic top view of a semiconductor strip grinding device according to an embodiment of the present invention;

Fig. 2 is a schematic side view of the grinding unit and the first horizontal driving part shown in Fig. 1;

Fig. 3 is a schematic front view of the grinding unit and the first horizontal driving part shown in Fig. 1;

Fig. 4 is a schematic bottom view of the grinding wheel and the grindstone shown in Fig. 2;

Fig. 5 is a schematic side view of the trimming unit and the second horizontal driving part shown in Fig. 1; and

6 and 7 are schematic front views of the vacuum table and strip delivery unit shown in FIG. 1 .

While various modifications and alternatives may be made to the various embodiments, details thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the claimed invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the claims.

10: Semiconductor strip

50: The first magazine

52: The second magazine

100: Semiconductor strip grinding device

102: Loading unit

104: strip extraction unit

110: Fixture driving part

116: vacuum table

120: Strip conveying unit

122: Vacuum pickup

124:Pickup drive unit

128: The first lower cleaning unit

130: chuck table

132: The first horizontal drive unit

140: Grinding unit

150: Trimming unit

160: Second horizontal drive unit

178: Thickness measurement unit

180: Second thickness measurement unit

184: Second lower cleaning unit

186: drying unit

188: Unload unit

Claims (12)

A semiconductor strip grinding device, comprising: a chuck table configured to support a semiconductor strip; a grinding unit configured to grind a surface portion of the semiconductor strip supported by the chuck table; and A dressing unit configured to dress the grinding unit when the semiconductor tape is loaded onto or unloaded from the chuck table. The semiconductor strip grinding device as described in Claim 1, further comprising: A first horizontal drive portion configured to horizontally move the chuck table between a processing area below the grinding unit and a loading and unloading area separated from the processing area, in which the semiconductor strip is in the loading and unloading area carry out loading and unloading; and A second horizontal driving portion configured to horizontally move the trimming unit between the processing area and a standby area spaced apart from the processing area. The semiconductor tape grinding device according to claim 2, wherein the first horizontal driving unit and the second horizontal driving unit are configured to coaxially move the chuck table and the dressing unit. The semiconductor tape grinding apparatus as recited in claim 1, further comprising a thickness measuring unit configured to measure the thickness of the semiconductor tape while grinding the semiconductor tape. The semiconductor tape grinding apparatus as recited in claim 1, further comprising a second thickness measuring unit configured to measure the thickness of the semiconductor tape after grinding the semiconductor tape. The semiconductor tape grinding apparatus as recited in claim 1, further comprising a tape cleaning unit configured to clean the semiconductor tape while or after grinding the semiconductor tape. The semiconductor strip grinding device as described in claim 1, wherein the grinding unit includes: a plurality of grindstones for grinding surface portions of said semiconducting strip; the grinding wheel on which the grinding stone is mounted; and a rotary drive configured to rotate the grinding wheel, Wherein the grinding stones are arranged circumferentially along the lower edge portion of the grinding wheel. The semiconductor tape grinding device according to claim 7, further comprising a grinding stone cleaning unit disposed below the grinding unit and configured to clean the grinding stone. The semiconductor strip grinding device as described in claim 7, wherein the trimming unit includes: a dressing wheel disposed below the grinding wheel; and A second rotary drive portion configured to rotate the dressing wheel. The semiconductor tape grinding apparatus as described in claim 7, wherein an information tag on which ID information of the grinding wheel is recorded is attached to the grinding wheel, and A reader configured to read the ID information of the grinding wheel recorded in the information tag is mounted on the rotation driving portion. The semiconductor strip grinding device as described in Claim 1, further comprising: a tape withdrawal unit configured to withdraw a plurality of semiconductor tapes from a magazine configured to receive the plurality of semiconductor tapes; a vacuum table on which is placed the semiconductor tape extracted from the magazine and configured to vacuum absorb the lower surface of the semiconductor tape; and A tape conveying unit configured to pick up the semiconductor tape placed on the vacuum table and convey it to the chuck table. The semiconductor tape grinding device according to claim 11, wherein the vacuum table is configured to be movable in a vertical direction, The tape delivery unit includes a vacuum picker configured to be movable in a vertical direction and vacuum-adsorb the upper surface of the semiconductor tape to pick up the semiconductor tape, and By raising the vacuum table and lowering the vacuum picker, the semiconductor ribbon is transferred from the vacuum table to the vacuum while being in close contact between the vacuum table and the vacuum picker. picker.

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