TW202312849A - Electronic and heat dissipation assembly - Google Patents

Abstract

The heat dissipation assembly is used for thermally coupling a heat source. The heat dissipating assembly includes a thermoelectric cooling chip and a heat sink. The thermoelectric cooling chip has a cold side and a hot side. The cold side faces away the hot side. The cold surface is used to thermally couple the heat source. The heat sink is thermally coupled to the hot surface of the thermoelectric cooling chip.

Description

Electronics and Cooling Components

The invention relates to an electronic device and a heat dissipation component, in particular to an electronic device and a heat dissipation component.

Generally speaking, a computer mainly includes a casing, a power supply, a motherboard, a central processing unit, a display card, and an expansion card. The power supply and the motherboard are installed in the casing, and the central processing unit, display card and expansion card are installed on the motherboard. When the computer is running, the central processing unit is responsible for data calculation, and the display card is responsible for image calculation, both of which will generate a lot of heat. Therefore, computer manufacturers generally install cooling devices such as fans or water-cooling radiators to dissipate heat from the central processing unit or display card.

However, as the amount of data calculation becomes larger and the speed of data calculation becomes higher and higher, the heat dissipation performance of the existing fans or water-cooled radiators no longer meets the requirements. Therefore, how to further improve the heat dissipation efficiency of the heat dissipation device has become a major design issue.

The present invention provides an electronic device and a heat dissipation component, so as to improve the heat dissipation efficiency of the heat dissipation device.

A heat dissipation component disclosed in an embodiment of the present invention is used for thermally coupling a heat source. The cooling component includes a cooling chip and a radiator. The cooling chip has a cold side and a hot side. The cold side faces away from the hot side. The cold side is used to thermally couple the heat source. The heat sink is thermally coupled to the hot surface of the cooling chip.

An electronic device disclosed in another embodiment of the present invention includes a heat source, a cooling chip and a heat sink. The cooling chip has a cold side and a hot side. The cold side faces away from the hot side. The cold side is thermally coupled to the heat source. The heat sink is thermally coupled to the hot surface of the cooling chip.

The heat dissipation component disclosed in another embodiment of the present invention is used for thermally coupling a heat source. The cooling component includes a first-level radiator and a second-level radiator. The first stage radiator has a cold surface and a hot surface. The cold side faces away from the hot side. The cold side is used to thermally couple the heat source. The second-level radiator is thermally coupled to the thermal surface of the first-level radiator. The heat dissipation capacity of the first stage radiator is greater than that of the second stage radiator.

According to the electronic device and heat dissipation assembly of the above embodiment, by adding a cooling chip between the heat source and the radiator, the heat source can be dissipated quickly through the cooling chip, and the waste heat generated by the cooling chip can pass through the radiator Stable transfer to the outside world.

In addition, because the heat dissipation capacity of the cooling chip is greater than that of the radiator, the semiconductor refrigeration technology is green and environmentally friendly, and its thermal inertia is very small, so the cooling and heating time is very fast. In the case of good heat dissipation at the hot end and no load at the cold end , the cooling chip can reach the maximum temperature difference in less than one minute after power on. Therefore, multi-stage liquid cooling can be realized, which can not only increase the heat dissipation effect, but also use higher water temperature for liquid cooling to reduce energy consumption.

In addition, the requirement for the surface area of the heat sink can be reduced. In addition to reducing the total volume of the heat sink and occupying less space to achieve the same heat dissipation effect, the manufacturing process is simplified and mass production is easy. The required water temperature does not have to be too low, which can reduce energy consumption. In this way, it can meet the needs of customers with low cost and high performance, and has broad application prospects.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic side view of an electronic device according to a first embodiment of the present invention. FIG. 2 is an exploded schematic view of the electronic device in FIG. 1 .

The electronic device of this embodiment includes a heat source and a heat dissipation component. The heat source is, for example, a CPU or an image processor. The cooling component includes a cooling chip and a radiator. The cooling chip is, for example, a semiconductor cooling chip. The working principle of the semiconductor refrigeration chip is based on the Peltier principle, that is, when a circuit composed of two different conductors is used and a direct current is passed through. In addition to Joule heat, some other heat is released at the joint, and heat is absorbed at the other joint, and this phenomenon caused by the Peltier effect is reversible. When the current direction is changed, the exothermic and endothermic joints also change. The heat absorbed and released is proportional to the current intensity I[A], and is related to the properties of the two conductors and the temperature of the hot end.

The cooling chip has a cold side and a hot side. The cold side faces away from the hot side. The cold side is thermally coupled to the heat source. Specifically, the cooling chip includes a first layer chip and a second layer chip. The second wafer is stacked on the first wafer, and the cross-sectional area of the first wafer is larger than that of the second wafer. The first wafer is in thermal contact with a heat source. The heat sink is in thermal contact with the second layer chip.

The heat sink is thermally coupled to the hot surface of the cooling chip, and is used to transfer the heat generated by the cooling chip to the outside. The radiator is, for example, a liquid cooling radiator, commonly known as a water cooling head. The radiator has a water inlet and a water outlet. The water inlet and the water outlet are used to connect a pump and a water cooling row through the pipeline, so that the radiator, the pump and the water cooling row together form a cooling flow channel, and the working fluid such as water and refrigerant is driven in the cooling flow through the pump. A cooling cycle is formed in the tunnel. In this way, the heat energy generated during the operation of the cooling chip can be transferred to the water-cooled row through the working fluid, and then transferred to the outside through the water-cooled row.

In this embodiment, the radiator and the cooling chip can be coated with thermal paste to reduce the thermal resistance between the radiator and the cooling chip.

In this embodiment, a cooling chip is added between the heat source and the heat sink, that is, the heat source can be quickly dissipated through the cooling chip, and the waste heat generated by the cooling chip can be stably transferred to the outside through the heat sink. Since the heat dissipation capacity of the cooling chip is greater than that of the radiator, the semiconductor refrigeration technology is green and environmentally friendly, and its thermal inertia is very small, so the cooling and heating time is very fast. When the heat dissipation of the hot end is good and the cold end is empty, power on In less than a minute, the cooled wafer reaches the maximum temperature difference. Therefore, multi-stage liquid cooling can be realized, which can not only increase the heat dissipation effect, but also use higher water temperature for liquid cooling to reduce energy consumption. In addition, the requirement for the surface area of the heat sink can be reduced, making the manufacturing process simple and easy for mass production. The required water temperature does not have to be too low, which can reduce energy consumption. In this way, it can meet the needs of customers with low cost and high performance, and has broad application prospects.

The cooling chip of this embodiment has a wide application range, and the temperature difference range of the cooling chip can be realized from plus 90° C. to minus 130° C., which can more effectively lower the surface temperature of the heat source. In addition, the cooling chip can also be applied to a high-power heat source, so the cooling chip of the embodiment has a wide range of applications, and can achieve effective heat dissipation for heat sources with different powers.

The heat sink and cooling chip mentioned above are just examples, but not limited thereto. In detail, in other embodiments, the heat dissipation component can also be changed into a heat dissipation component for thermally coupling a heat source. The cooling component includes a first-level radiator and a second-level radiator. The first stage radiator has a cold surface and a hot surface. The cold side faces away from the hot side. The cold side is used to thermally couple the heat source. The second-level radiator is thermally coupled to the thermal surface of the first-level radiator. The heat dissipation capacity of the first stage radiator is greater than that of the second stage radiator.

According to the electronic device and heat dissipation assembly of the above embodiment, by adding a cooling chip between the heat source and the radiator, the heat source can be dissipated quickly through the cooling chip, and the waste heat generated by the cooling chip can pass through the radiator Stable transfer to the outside world.

In addition, because the heat dissipation capacity of the cooling chip is greater than that of the radiator, the semiconductor refrigeration technology is green and environmentally friendly, and its thermal inertia is very small, so the cooling and heating time is very fast. In the case of good heat dissipation at the hot end and no load at the cold end , the cooling chip can reach the maximum temperature difference in less than one minute after power on. Therefore, multi-stage liquid cooling can be realized, which can not only increase the heat dissipation effect, but also use higher water temperature for liquid cooling to reduce energy consumption.

In addition, the requirement for the surface area of the heat sink can be reduced. In addition to reducing the total volume of the heat sink and occupying less space to achieve the same heat dissipation effect, the manufacturing process is simplified and mass production is easy. The required water temperature does not have to be too low, which can reduce energy consumption. In this way, it can meet the needs of customers with low cost and high performance, and has broad application prospects.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

1: Electronic device 10: heat source 20: Cooling components 100: cooling chip 101: cold noodles 102: hot noodles 110: The first layer of wafer 120: second layer wafer 200: Radiator 210: water inlet 220: water outlet

FIG. 1 is a schematic side view of an electronic device according to a first embodiment of the present invention. FIG. 2 is an exploded schematic view of the electronic device in FIG. 1 .

1: Electronic device

10: heat source

20: Cooling components

100: cooling chip

110: The first layer of wafer

120: second layer wafer

200: Radiator

Claims (10)

A heat dissipation component for thermally coupling a heat source, the heat dissipation component comprising: A cooling chip has a cold side and a hot side, the cold side faces away from the hot side, the cold side is used for thermally coupling the heat source; and a heat sink is thermally coupled to the hot side of the cooling chip. The heat dissipation component as claimed in claim 1, wherein the cooling chip is a semiconductor cooling chip. The cooling assembly as described in claim 2, wherein the cooling chip includes a first layer chip and a second layer chip, the second layer chip is stacked on the first layer chip, and the lateral surface of the first layer chip The section area is larger than the cross section area of the second wafer, the first wafer is used for thermal contact with the heat source, and the heat sink is thermally contacted with the second wafer. The heat dissipation assembly according to claim 1, wherein the heat sink is a liquid cooling heat sink. An electronic device comprising: A heat source; a cooling chip having a cold side and a hot side facing away from the hot side, the cold side thermally coupled to the heat source; and a heat sink thermally coupled to the hot side of the cooling chip. The electronic device according to claim 5, wherein the heat source is a central processing unit or an image processing unit. The electronic device according to claim 5, wherein the cooling chip is a semiconductor cooling chip. The electronic device as described in claim 7, wherein the cooling chip includes a first-layer chip and a second-layer chip, the second-layer chip is stacked on the first-layer chip, and the lateral surface of the first-layer chip The section area is larger than the cross section area of the second wafer, the first wafer is used for thermal contact with the heat source, and the heat sink is thermally contacted with the second wafer. The electronic device according to claim 5, wherein the radiator is a liquid-cooled radiator. A heat dissipation component for thermally coupling a heat source, the heat dissipation component comprising: a first-stage radiator having a cold side and a hot side, the cold side facing away from the hot side, the cold side being used to thermally couple the heat source; and a second-stage radiator thermally coupled to the first-stage On the hot surface of the radiator, the heat dissipation capability of the first stage radiator is greater than the heat dissipation capability of the second stage radiator.

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