TW202306868A - Feeding and discharging device for base material, feeding method and discharging method - Google Patents

Feeding and discharging device for base material, feeding method and discharging method Download PDF

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TW202306868A
TW202306868A TW110145127A TW110145127A TW202306868A TW 202306868 A TW202306868 A TW 202306868A TW 110145127 A TW110145127 A TW 110145127A TW 110145127 A TW110145127 A TW 110145127A TW 202306868 A TW202306868 A TW 202306868A
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area
substrate
carrying device
processed
driven
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TW110145127A
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TWI814161B (en
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吳凝香
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大陸商超捷半導體設備（深圳）有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/88—Separating or stopping elements, e.g. fingers
    • B65G47/8876—Separating or stopping elements, e.g. fingers with at least two stops acting as gates
    • B65G47/8884—Stops acting asynchronously, e.g. one stop open, next one closed or the opposite
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Abstract

The invention relates to the technical field of base material conveying, in particular to a feeding and discharging device for a base material. The device comprises a conveying device, a first bearing device, a second bearing device, a plate feeding area, a plate discharging area, a first transfer treatment area and a second transfer treatment area. A treatment device comprises a feeding area and a discharging area, a to-be-processed base material is conveyed to the feeding area to be processed from the plate feeding area through the first transfer treatment area by the first bearing device and the second bearing device in sequence, and the processed base material is conveyed to the plate discharging area from the discharging area through the second transfer treatment area by the first bearing device and the second bearing device in sequence. The invention further relates to a base material feeding method which adopts the feeding and discharging device for the base material. The invention further relates to a base material discharging method which adopts the feeding and discharging device for the base material. When the first bearing device moves out of the feeding area, the second bearing device can move to the feeding area, continuous feeding of base materials is achieved, and waiting time is saved.

Description

基材的上下料裝置及上料方法、下料方法Substrate loading and unloading device, loading method, and unloading method

本發明涉及基材運送技術領域，尤其涉及一種基材的上下料裝置及上料方法、下料方法。The invention relates to the technical field of substrate transportation, in particular to a substrate loading and unloading device, a feeding method, and a feeding method.

市面上的基材的運送方式，通常是透過運送機構從裝載區直接運送至處理裝置處，以及從處理裝置處直接運送至卸載區，在從裝載區運送至處理裝置處時，後一個運送機構需要等待前一個運送機構從處理裝置處移至原位置後才能夠移至處理裝置處，增加了基材在運送過程中的等待時間。同理，在從處理裝置處運送至卸載區時，後一個運送機構需要等待前一個運送機構從卸載區移至原位置後才能夠移至卸載區進行卸載處理，也增加了基材在運送過程中的等待時間。The transportation method of the substrate on the market is usually directly transported from the loading area to the processing device through the transport mechanism, and directly transported from the processing device to the unloading area. When transporting from the loading area to the processing device, the latter transport mechanism It is necessary to wait for the previous conveying mechanism to move from the processing device to the original position before moving to the processing device, which increases the waiting time of the substrate during the conveying process. In the same way, when transporting from the processing device to the unloading area, the latter transport mechanism needs to wait for the previous transport mechanism to move from the unloading area to its original position before moving to the unloading area for unloading, which also increases the substrate's time in the transport process. waiting time in .

因此，現有技術存在不足，需要改進。Therefore, there are deficiencies in the prior art and need to be improved.

為克服基材在上下料過程中等待時間過長的技術問題，本發明提供了一種基材的上下料裝置及上料方法、下料方法。In order to overcome the technical problem of too long waiting time in the loading and unloading process of the substrate, the invention provides a loading and unloading device, a loading method and a blanking method for the substrate.

本發明解決技術問題的方案是提供一種基材的上下料裝置，包含傳送裝置、第一承載裝置、第二承載裝置、上板區、下板區、第一中轉處理區及第二中轉處理區，處理裝置包含上料區及下料區，待加工的基材被第一承載裝置及第二承載裝置依序從上板區經第一中轉處理區運送至上料區進行加工處理，已加工的基材被第一承載裝置及第二承載裝置依序從下料區經第二中轉處理區運送至下板區。The solution of the present invention to solve the technical problem is to provide a substrate loading and unloading device, which includes a conveying device, a first carrying device, a second carrying device, an upper board area, a lower board area, a first transfer processing area and a second transfer device The processing area, the processing device includes a loading area and an unloading area, the substrate to be processed is transported from the upper plate area to the loading area through the first transfer processing area by the first carrying device and the second carrying device in sequence, for processing, The processed base material is sequentially transported from the unloading area to the lower plate area through the second transfer processing area by the first carrying device and the second carrying device.

本發明進一步提供一種基材的上料方法，其採用上述的基材的上下料裝置， 包含如下步驟：步驟S11：第一承載裝置被傳送裝置帶動至上板區並裝載第一待加工基材；步驟S12：第一承載裝置被傳送裝置帶動並將第一待加工基材從上板區運送至第一中轉處理區，第二承載裝置被傳送裝置帶動至上板區並裝載第二待加工基材；步驟S13：第一承載裝置被傳送裝置帶動並將第一待加工基材從第一中轉處理區運送並放至上料區，第二承載裝置被傳送裝置帶動並將第二待加工基材從上板區運送至第一中轉處理區；步驟S14：第一承載裝置被傳送裝置帶動至上板區，第二承載裝置被傳送裝置帶動並將第二待加工基材從第一中轉處理區運送至上料區，完成一次上料。The present invention further provides a substrate loading method, which adopts the above-mentioned substrate loading and unloading device, comprising the following steps: Step S11: the first carrying device is driven to the upper plate area by the conveying device and loaded with the first substrate to be processed; Step S12: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first transfer processing area, and the second carrying device is driven by the conveying device to the upper plate area and loads the second substrate to be processed material; step S13: the first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area; the second carrying device is driven by the conveying device and transfers the second substrate to be processed The material is transported from the upper plate area to the first transfer processing area; step S14: the first carrying device is driven to the upper plate area by the conveying device, and the second carrying device is driven by the conveying device to transfer the second substrate to be processed from the first transfer area The processing area is transported to the feeding area to complete a feeding.

較佳地，在步驟S12中，基材的上下料裝置包含第一止擋機構，當第一承載裝置被傳送裝置帶動並將第一待加工基材從上板區運送至第一中轉處理區時，第一止擋機構工作，以阻止在第一承載裝置離開第一中轉處理區之前，第二承載裝置進入第一中轉處理區。Preferably, in step S12, the loading and unloading device for the substrate includes a first stopper mechanism, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first intermediate processing zone, the first stop mechanism works to prevent the second carrying device from entering the first transfer processing area before the first carrying device leaves the first transfer processing area.

較佳地，在步驟S13中，當第一承載裝置被傳送裝置帶動並將第一待加工基材從第一中轉處理區運送至上料區時，第一止擋機構停止工作，以解除對第二承載裝置運送至第一中轉處理區的阻止。Preferably, in step S13, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the feeding area, the first stopper mechanism stops working, so as to release the stopper. Preventing the second carrying device from being transported to the first transfer processing area.

較佳地，第一待加工基材透過被第一承載裝置夾持或吸附的方式裝載至第一承載裝置處；第二待加工基材透過被第二承載裝置夾持或吸附的方式裝載至第二承載裝置處。Preferably, the first substrate to be processed is loaded to the first carrier by being clamped or adsorbed by the first carrier; the second substrate to be processed is loaded to the first carrier by being clamped or adsorbed by the second carrier. at the second carrier.

較佳地，第一待加工基材與第二待加工基材為覆銅箔板或印刷電路板。Preferably, the first substrate to be processed and the second substrate to be processed are copper clad boards or printed circuit boards.

本發明進一步提供一種基材的上料方法，其採用上述的基材的上下料裝置，包含如下步驟：步驟S21：第一承載裝置被傳送裝置帶動至下料區並裝載第一已加工基材；步驟S22：第一承載裝置被傳送裝置帶動並將第一已加工基材從下料區運送至第二中轉處理區，第二承載裝置被傳送裝置帶動至下料區並裝載第二已加工基材；步驟S23：第一承載裝置被傳送裝置帶動並將第一已加工基材從第二中轉處理區運送並放至下板區，第二承載裝置被傳送裝置帶動並將第二已加工基材從下料區運動至第二中轉處理區；步驟S24：第一承載裝置被傳送裝置帶動至下料區，第二承載裝置被傳送裝置帶動並將第二已加工基材從第二中轉處理區運送至下板區，完成一次下料。The present invention further provides a substrate loading method, which uses the above-mentioned substrate loading and unloading device, and includes the following steps: Step S21: the first carrying device is driven by the conveying device to the unloading area and loaded with the first processed substrate ; Step S22: The first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to the second transfer processing area, and the second carrying device is driven by the conveying device to the unloading area and loads the second processed base material Process the substrate; step S23: the first carrying device is driven by the conveying device and transports the first processed substrate from the second transfer processing area to the lower plate area, and the second carrying device is driven by the conveying device and transfers the second The processed base material moves from the unloading area to the second transfer processing area; step S24: the first carrying device is driven to the unloading area by the conveying device, and the second carrying device is driven by the conveying device to move the second processed base material from the The second transfer processing area is transported to the unloading area to complete one unloading.

較佳地，在步驟S22中，基材的上下料裝置包含第二止擋機構，當第一承載裝置被傳送裝置帶動並將第一已加工基材從下料區運送至第二中轉處理區，第二止擋機構工作，以阻止在第一承載裝置離開第二中轉處理區之前，第二承載裝置進入第二中轉處理區。Preferably, in step S22, the loading and unloading device for the base material includes a second stopper mechanism, when the first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to the second intermediate processing zone, the second stop mechanism works to prevent the second carrying device from entering the second transfer processing area before the first carrying device leaves the second transfer processing area.

較佳地，在步驟S23中，基材的上下料裝置包含第三止擋機構，當第一承載裝置被傳送裝置帶動並將第一已加工基材從第二中轉處理區運送並放至下板區時，第二止擋機構停止工作，以解除對第二承載裝置運送至第二中轉處理區的阻止，同時第三止擋機構工作，以阻止在第一承載裝置離開下板區之前，第二承載裝置進入下板區。Preferably, in step S23, the loading and unloading device for the base material includes a third stopper mechanism, when the first carrying device is driven by the conveying device and transports the first processed base material from the second transfer processing area to the When in the lower plate area, the second stopper mechanism stops working to remove the prevention of the second carrying device from being transported to the second transfer processing area, and at the same time the third stopper mechanism works to prevent the first carrying device from leaving the lower plate area. Before, the second carrying device entered the lower plate area.

較佳地，在步驟S24中，當第一承載裝置被傳送裝置帶動至下料區時，第三止擋機構停止工作，以解除對第二承載裝置運送至下板區的阻止。Preferably, in step S24, when the first carrying device is driven to the unloading area by the conveying device, the third stop mechanism stops working, so as to release the prevention of the second carrying device being transported to the lower plate area.

相較於現有技術，本發明的基材的上下料裝置及上料方法、下料方法具有如下優點：Compared with the prior art, the substrate loading and unloading device, loading method, and blanking method of the present invention have the following advantages:

在第一承載裝置從上料區移出時，第二承載裝置即可移至上料區，無需等待第一承載裝置移至上板區即可實現基材的持續上料，節省了基材在上料過程中的等待時間，有利於增加基材的處理效率，擴大企業生產效益。When the first carrying device is moved out of the loading area, the second carrying device can be moved to the loading area, without waiting for the first carrying device to move to the upper plate area, the continuous loading of the substrate can be realized, saving the substrate in the loading area The waiting time in the process is conducive to increasing the processing efficiency of the substrate and expanding the production efficiency of the enterprise.

在第一承載裝置從下板區移出時，第二承載裝置即可移至下板區，無需等待第一承載裝置移至下料區即可實現基材的持續下料，節省了基材在下料過程中的等待時間，減少了基材在處理過程中總體所需要的時間，有利於擴大企業生產效益。When the first carrying device moves out from the lower plate area, the second carrying device can move to the lower plate area, and the continuous unloading of the base material can be realized without waiting for the first carrying device to move to the unloading area, saving the base material in the lower plate area. The waiting time in the material process reduces the overall time required for the substrate in the processing process, which is conducive to expanding the production efficiency of the enterprise.

為了使本發明的目的、技術方案及優點更加清楚明白，以下結合附圖及實施例，對本發明進行進一步詳細說明。應當理解的是，此處所說明的具體實施例僅用於解釋本發明，並不用於限定本發明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

本發明的說明書、申請專利範圍及上述附圖說明中的術語「包含」和「具有」以及它們的任何變形，意圖在於覆蓋不排他的包含。本發明的說明書、申請專利範圍或上述附圖中的術語「第一」 和「第二」等是用於區別不同對象，而不是用於說明特定的順序。The terms "comprising" and "having" in the description of the present invention, the scope of the patent application and the description of the above drawings, as well as any variations thereof, are intended to cover non-exclusive inclusion. The terms "first" and "second" in the description of the present invention, the scope of the patent application or the above drawings are used to distinguish different objects, rather than to describe a specific order.

請參閱圖1，本發明提供一種基材的上下料裝置，用於提供基材至處理裝置19進行處理及取回處理後的基材，包含控制部(圖中未繪示出)及與控制部電性連接的傳送裝置13、第一承載裝置11、第二承載裝置12、上板區15、下板區16、第一中轉處理區17及第二中轉處理區18，處理裝置19包含上料區20及下料區21，第一承載裝置11及第二承載裝置12分別與傳送裝置13連接並且可以被傳送裝置13帶動運動，在控制部的控制下，待加工的基材被第一承載裝置11及第二承載裝置12依序從上板區15經第一中轉處理區17運送至上料區20以供處理裝置19對基板進行加工處理，已加工的基材被第一承載裝置11及第二承載裝置12在控制部的控制下依序從下料區21經第二中轉處理區18運送至下板區16以便完成基板的卸載。Please refer to FIG. 1, the present invention provides a substrate loading and unloading device, which is used to provide the substrate to the processing device 19 for processing and retrieve the processed substrate, including a control unit (not shown in the figure) and a control unit The transmission device 13, the first carrying device 11, the second carrying device 12, the upper plate area 15, the lower plate area 16, the first transfer processing area 17 and the second transfer processing area 18, and the processing device 19 are electrically connected Including the loading area 20 and the unloading area 21, the first carrying device 11 and the second carrying device 12 are respectively connected to the conveying device 13 and can be moved by the conveying device 13. Under the control of the control part, the substrate to be processed is The first carrying device 11 and the second carrying device 12 are sequentially transported from the upper plate area 15 to the loading area 20 through the first transfer processing area 17 for the processing device 19 to process the substrate, and the processed base material is processed by the first The carrying device 11 and the second carrying device 12 are sequentially transported from the unloading area 21 to the lower plate area 16 through the second transfer processing area 18 under the control of the control unit so as to complete the unloading of the substrates.

進一步地，基材的上下料裝置進一步包含與控制部電性連接的第一止擋機構、第二止擋機構及第三止擋機構(圖中未繪示出)，第一止擋機構設置在上板區15中，第二止擋機構設置在下料區21中，第三止擋機構設置在第二中轉處理區18，第一止擋機構與第二止擋機構用於在工作時對位於其內的承載裝置進行阻擋以防止承載裝置之間發生碰撞。Further, the loading and unloading device for the substrate further includes a first stop mechanism, a second stop mechanism and a third stop mechanism (not shown in the figure) electrically connected to the control unit, the first stop mechanism is set In the upper plate area 15, the second stop mechanism is arranged in the blanking area 21, the third stop mechanism is arranged in the second transfer processing area 18, and the first stop mechanism and the second stop mechanism are used for Carriers located therein are blocked to prevent collisions between the carriers.

請參閱圖2，進一步地，本發明進一步提供一種基材的上料方法，其採用上述的基材的上下料裝置，包含如下步驟：Please refer to Fig. 2, further, the present invention further provides a method for loading a substrate, which uses the above-mentioned substrate loading and unloading device, comprising the following steps:

步驟S11：第一承載裝置被傳送裝置帶動至上板區並裝載第一待加工基材。Step S11: the first carrying device is driven by the conveying device to the upper plate area and loaded with the first substrate to be processed.

在步驟S11中，第一承載裝置可透過外部裝置或工作人員協助以實現對第一待加工基材的裝載。In step S11 , the first carrying device can load the first substrate to be processed with the help of an external device or a worker.

步驟S12：第一承載裝置被傳送裝置帶動並將第一待加工基材從上板區運送至第一中轉處理區，第二承載裝置被傳送裝置帶動至上板區並裝載第二待加工基材。Step S12: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first transfer processing area, and the second carrying device is driven by the conveying device to the upper plate area and loads the second substrate to be processed material.

較佳地，第一待加工基材與第二待加工基材為覆銅箔板或印刷電路板，具體可根據實際情況進行設置。Preferably, the first substrate to be processed and the second substrate to be processed are copper clad boards or printed circuit boards, which can be set according to actual conditions.

較佳地，第一待加工基材透過被第一承載裝置夾持或吸附的方式裝載至第一承載裝置處；第二待加工基材透過被第二承載裝置夾持或吸附的方式裝載至第二承載裝置處，但本發明不限定於此。在其他實施例中，第一承載裝置與第二承載裝置也可透過螺絲固定等方式以實現基材的裝載，具體可根據實際情況進行設置。Preferably, the first substrate to be processed is loaded to the first carrier by being clamped or adsorbed by the first carrier; the second substrate to be processed is loaded to the first carrier by being clamped or adsorbed by the second carrier. The second carrying device, but the present invention is not limited thereto. In other embodiments, the first carrying device and the second carrying device can also be fixed by screws to realize the loading of the substrate, which can be set according to actual conditions.

在步驟S12中，當第一承載裝置被傳送裝置帶動並將第一待加工基材從上板區運送至第一中轉處理區時，第一止擋機構工作，以阻止在第一承載裝置離開第一中轉處理區之前，第二承載裝置進入第一中轉處理區。In step S12, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to the first transfer processing area, the first stopper mechanism works to prevent the first carrying device from Before leaving the first transfer processing area, the second carrying device enters the first transfer processing area.

第一止擋機構的設置可有效防止第二承載裝置與第一承載裝置因產生接觸而導致結構被破壞的可能性，有利於提升第一承載裝置及第二承載裝置的使用壽命。The arrangement of the first stopper mechanism can effectively prevent the possibility of structure damage caused by the contact between the second bearing device and the first bearing device, which is beneficial to improve the service life of the first bearing device and the second bearing device.

步驟S13：第一承載裝置被傳送裝置帶動並將第一待加工基材從第一中轉處理區運送並放至上料區，第二承載裝置被傳送裝置帶動並將第二待加工基材從上板區運送至第一中轉處理區。Step S13: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the The upper plate area is transported to the first transfer processing area.

在步驟S13中，當第一承載裝置被傳送裝置帶動並將第一待加工基材從第一中轉處理區運送至上料區時，第一止擋機構停止工作，以解除對第二承載裝置運送至第一中轉處理區的阻止。In step S13, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to the loading area, the first stopper mechanism stops working to release the pressure on the second carrying device. The prevention of transport to the first transit processing area.

步驟S14：第一承載裝置被傳送裝置帶動至上板區，第二承載裝置被傳送裝置帶動並將第二待加工基材從第一中轉處理區運送至上料區，完成一次上料。Step S14: The first carrying device is driven to the plate loading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second substrate to be processed from the first transfer processing area to the loading area, completing one loading.

請參閱圖3，進一步地，本發明進一步提供一種基材的下料方法，其採用上述的基材的上下料裝置，包含如下步驟：Please refer to Fig. 3, further, the present invention further provides a method for unloading a base material, which uses the above-mentioned unloading device for a base material, comprising the following steps:

步驟S21：第一承載裝置被傳送裝置帶動至下料區並裝載第一已加工基材；Step S21: the first carrying device is driven by the conveying device to the unloading area and loaded with the first processed substrate;

步驟S22：第一承載裝置被傳送裝置帶動並將第一已加工基材從下料區運送至第二中轉處理區，第二承載裝置被傳送裝置帶動至下料區並裝載第二已加工基材。Step S22: The first carrying device is driven by the conveying device and transports the first processed substrate from the unloading area to the second transfer processing area, and the second carrying device is driven by the conveying device to the unloading area and loads the second processed substrate Substrate.

較佳地，第一已加工基材與第二已加工基材為覆銅箔板或印刷電路板，具體可根據實際情況進行設置。Preferably, the first processed base material and the second processed base material are copper clad boards or printed circuit boards, which can be set according to actual conditions.

較佳地，第一已加工基材透過被第一承載裝置夾持或吸附的方式裝載至第一承載裝置處；第二已加工基材透過被第二承載裝置夾持或吸附的方式裝載至第二承載裝置處，但本發明不限定於此。在其他實施例中，第一承載裝置與第二承載裝置也可透過螺絲固定等方式實現基材的裝載，具體可根據實際進行設置。Preferably, the first processed substrate is loaded to the first carrier by being clamped or adsorbed by the first carrier; the second processed substrate is loaded to the first carrier by being clamped or adsorbed by the second carrier. The second carrying device, but the present invention is not limited thereto. In other embodiments, the first carrying device and the second carrying device can also realize the loading of the base material through screw fixing, etc., which can be set according to actual conditions.

在步驟S22中，當第一承載裝置被傳送裝置帶動並將第一已加工基材從下料區運送至第二中轉處理區，第二止擋機構工作，以阻止在第一承載裝置離開第二中轉處理區之前，第二承載裝置進入第二中轉處理區。In step S22, when the first carrying device is driven by the conveying device and transports the first processed substrate from the unloading area to the second transfer processing area, the second stop mechanism works to prevent the first carrying device from leaving Before the second transfer processing area, the second carrying device enters the second transfer processing area.

第二止擋機構的設置可有效防止第一承載裝置與第二承載裝置因產生接觸而導致結構被破壞的可能性，有利於提升第一承載裝置及第二承載裝置的使用壽命。The arrangement of the second stopper mechanism can effectively prevent the possibility of structure damage caused by the contact between the first bearing device and the second bearing device, and is beneficial to improve the service life of the first bearing device and the second bearing device.

步驟S23：第一承載裝置被傳送裝置帶動並將第一已加工基材從第二中轉處理區運送並放至下板區，第二承載裝置被傳送裝置帶動並將第二已加工基材從下料區運動至第二中轉處理區。Step S23: The first carrying device is driven by the conveying device and transports the first processed substrate from the second transfer processing area to the lower plate area, and the second carrying device is driven by the conveying device and transfers the second processed substrate Move from the unloading area to the second transfer processing area.

步驟S23進一步包含如下步驟：Step S23 further comprises the following steps:

在步驟S23中，當第一承載裝置被傳送裝置帶動並將第一已加工基材從第二中轉處理區運送並放至下板區時，第二止擋機構停止工作，以解除對第二承載裝置運送至第二中轉處理區的阻止，同時第三止擋機構工作，以阻止在第一承載裝置離開下板區之前，第二承載裝置進入下板區。In step S23, when the first carrying device is driven by the conveying device and transports the first processed base material from the second transfer processing area to the lower plate area, the second stopper mechanism stops working, so as to release the restriction on the second stopper. The second carrying device is prevented from being transported to the second transfer processing area, and at the same time, the third stopper mechanism works to prevent the second carrying device from entering the lower plate area before the first carrying device leaves the lower plate area.

透過第三止擋結構的止擋作用，可有效防止第一承載裝置與第二承載裝置在下板區的接觸，有利於防止第一承載裝置與第二承載裝置因發生接觸而導致損壞的機率，有利於提升使用壽命。Through the stop function of the third stop structure, it can effectively prevent the contact between the first carrying device and the second carrying device in the lower plate area, which is beneficial to prevent the probability of damage caused by the contact between the first carrying device and the second carrying device, It is beneficial to improve the service life.

步驟S24：第一承載裝置被傳送裝置帶動至下料區，第二承載裝置被傳送裝置帶動並將第二已加工基材從第二中轉處理區運送至下板區，完成一次下料。Step S24: The first carrying device is driven to the unloading area by the conveying device, and the second carrying device is driven by the conveying device to transport the second processed base material from the second transfer processing area to the unloading area, completing a discharge.

在步驟S24中，當第一承載裝置被傳送裝置帶動至下料區時，第三止擋機構停止工作，以解除對第二承載裝置運送至下板區的阻止。In step S24, when the first carrying device is driven to the unloading area by the conveying device, the third stop mechanism stops working, so as to release the prevention of the second carrying device being transported to the lower plate area.

請參閱圖4，本發明的基材的上下料裝置透過基材的上料方法、下料方法進行工作時，在上料時：第一承載裝置被傳送裝置帶動至上板區並裝載第一待加工基材，隨後從上板區運送至第一中轉處理區，第二承載裝置被傳送裝置帶動至上板區並裝載第二待加工基材，第一承載裝置被傳送裝置帶動並將第一待加工基材從第一中轉處理區運送並放至上料區，隨後第二承載裝置被傳送裝置帶動並將第二待加工基材從上板區運送至第一中轉處理區，第一承載裝置被傳送裝置帶動至上板區，第二承載裝置被傳送裝置帶動並將第二待加工基材從第一中轉處理區運送至上料區，完成一次上料。處理裝置對位於上料區的待加工基材進行處理，在處理過程中，第一承載裝置與第二承載裝置一直承載著第一待加工基材與第二待加工基材。在下料時：第一承載裝置被傳送裝置帶動至下料區並裝載第一已加工基材，隨後第一承載裝置被傳送裝置帶動並將第一已加工基材從下料區運送至第二中轉處理區，第二承載裝置被傳送裝置帶動至下料區並裝載第二已加工基材，接著第一承載裝置被傳送裝置帶動並將第一已加工基材從第二中轉處理區運送並放至下板區，第二承載裝置被傳送裝置帶動並將第二已加工基材從下料區運動至第二中轉處理區，最後第一承載裝置被傳送裝置帶動至下料區，第二承載裝置被傳送裝置帶動並將第二已加工基材從第二中轉處理區運送至下板區，完成一次下料。其中，第一承載裝置與第二承載裝置在傳送裝置的帶動下不斷對處理裝置進行上料及下料作業。Please refer to Fig. 4, when the substrate loading and unloading device of the present invention works through the substrate loading and unloading methods, when feeding: the first carrying device is driven to the upper plate area by the conveying device and loads the first The base material is processed, then transported from the upper plate area to the first transfer processing area, the second carrying device is driven by the conveying device to the upper plate area and loaded with the second substrate to be processed, the first carrying device is driven by the conveying device and the first The substrate to be processed is transported from the first transfer area to the loading area, and then the second carrying device is driven by the conveyor to transport the second substrate to be processed from the upper plate area to the first transfer area. The carrying device is driven to the upper plate area by the conveying device, and the second carrying device is driven by the conveying device and transports the second substrate to be processed from the first transfer processing area to the feeding area, completing one feeding. The processing device processes the substrate to be processed located in the loading area. During the processing, the first carrying device and the second carrying device always carry the first substrate to be processed and the second substrate to be processed. When unloading: the first carrying device is driven by the conveying device to the unloading area and loaded with the first processed substrate, then the first carrying device is driven by the conveying device and transports the first processed substrate from the unloading area to the second In the transfer processing area, the second carrying device is driven by the conveying device to the unloading area and loaded with the second processed substrate, and then the first carrying device is driven by the conveying device to transport the first processed substrate from the second transfer processing area Transport and put it to the lower plate area, the second carrying device is driven by the conveying device and moves the second processed substrate from the unloading area to the second transfer processing area, and finally the first carrying device is driven by the conveying device to the unloading area , the second carrying device is driven by the conveying device and transports the second processed base material from the second transfer processing area to the lower plate area to complete a blanking. Wherein, the first carrying device and the second carrying device are driven by the conveying device to continuously perform loading and unloading operations on the processing device.

可以理解的是，第一承載裝置與第二承載裝置僅用於區分上下料的先後順序，並不用於對位於傳送裝置上的承載裝置的個數進行限制，其可以設置有多個，具體數目可根據實際需求進行設置。It can be understood that the first carrying device and the second carrying device are only used to distinguish the sequence of loading and unloading, and are not used to limit the number of carrying devices located on the conveying device. There may be multiple, specific numbers It can be set according to actual needs.

作為一種具體實施例，在第一承載裝置從一個工位被傳送裝置運至下一個工位時，傳送裝置即帶動位於第一承載裝置後一個工位處的第二承載裝置朝第一承載裝置原來所處的工位運動，使得在第一承載裝置運動至下一個工位時，第二承載裝置運動至第一承載裝置原來所處的工位，相較於第一承載裝置完全運動至下一個工位處時第一承載裝置才被傳送裝置帶動運動，本發明有利於提高基材的運送效率及生產效率。具體地，當第一承載裝置從一個工位運動至與下一個工位的三分之一處時，第二承載裝置即開始運動，但本發明不限定於此。在其他實施例中，第一承載裝置與第二承載裝置可同步運動，或在第一承載裝置運動至一個工位與下一個工位之間的某一位置時，第二承載裝置開始運動，只要滿足第一承載裝置在運動至下一個工位處時第二承載裝置運動至第一承載裝置原來所處的工位即可。As a specific embodiment, when the first carrying device is transported from one station to the next station by the conveying device, the conveying device drives the second carrying device located at a station behind the first carrying device toward the first carrying device. The original station moves so that when the first carrying device moves to the next station, the second carrying device moves to the station where the first carrying device was originally located, compared with the first carrying device completely moving to the next position. The first carrying device is only moved by the conveying device when it is at a station, and the present invention is beneficial to improve the conveying efficiency and production efficiency of the base material. Specifically, when the first carrying device moves from one station to one-third of the next station, the second carrying device starts to move, but the present invention is not limited thereto. In other embodiments, the first carrying device and the second carrying device can move synchronously, or when the first carrying device moves to a position between one station and the next station, the second carrying device starts to move, It only needs to satisfy that when the first carrying device moves to the next station, the second carrying device moves to the original station where the first carrying device is located.

相較於現有技術，本發明的基材的上下料裝置及上料方法、下料方法具有如下優點：Compared with the prior art, the substrate loading and unloading device, loading method, and blanking method of the present invention have the following advantages:

在第一承載裝置從上料區移出時，第二承載裝置即可移至上料區，無需等待第一承載裝置移至上板區即可實現基材的持續上料，節省了基材在上料過程中的等待時間，有利於增加基材的處理效率，擴大企業生產效益。When the first carrying device is moved out of the loading area, the second carrying device can be moved to the loading area, without waiting for the first carrying device to move to the upper plate area, the continuous loading of the substrate can be realized, saving the substrate in the loading area The waiting time in the process is conducive to increasing the processing efficiency of the substrate and expanding the production efficiency of the enterprise.

在第一承載裝置從下板區移出時，第二承載裝置即可移至下板區，無需等待第一承載裝置移至下料區即可實現基材的持續下料，節省了基材在下料過程中的等待時間，減少了基材在處理過程中總體所需要的時間，有利於擴大企業生產效益。When the first carrying device moves out from the lower plate area, the second carrying device can move to the lower plate area, and the continuous unloading of the base material can be realized without waiting for the first carrying device to move to the unloading area, saving the base material in the lower plate area. The waiting time in the material process reduces the overall time required for the substrate in the processing process, which is conducive to expanding the production efficiency of the enterprise.

以上所述僅為本發明的較佳實施例，並非因此限制本發明的申請專利範圍，凡是在本發明的構思之內所作的任何修改、等同替換和改進等均應包含在本發明的專利保護範圍內。The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any modifications, equivalent replacements and improvements made within the concept of the present invention should be included in the patent protection of the present invention. within range.

11:第一承載裝置 12:第二承載裝置 13:傳送裝置 15:上板區 16:下板區 17:第一中轉處理區 18:第二中轉處理區 19:處理裝置 20:上料區 21:下料區 S11,S12,S13,S14,S21,S22,S23,S24:步驟 11: The first carrying device 12: Second carrying device 13: Transmission device 15: Upper board area 16: Lower plate area 17: The first transit processing area 18: The second transit processing area 19: Processing device 20: Feeding area 21: Unloading area S11, S12, S13, S14, S21, S22, S23, S24: steps

圖1是本發明之基材的上下料裝置與處理裝置的具體系統的方塊示意圖。 圖2是本發明之基材上料方法的具體流程示意圖。 圖3是本發明之基材下料方法的具體流程示意圖。 圖4是本發明之基材在上下料過程中的簡圖。 FIG. 1 is a schematic block diagram of a specific system of a substrate loading and unloading device and a processing device of the present invention. Fig. 2 is a schematic flow chart of the substrate loading method of the present invention. Fig. 3 is a schematic flow chart of the method for blanking the base material of the present invention. Fig. 4 is a schematic diagram of the substrate of the present invention during loading and unloading.

S11,S12,S13,S14:步驟 S11, S12, S13, S14: steps

Claims (10)

一種基材的上下料裝置，用於提供基材至一處理裝置進行處理以及取回處理後的基材，其中該基材的上下料裝置包含一傳送裝置、一第一承載裝置、一第二承載裝置、一上板區、一下板區、一第一中轉處理區及一第二中轉處理區，該處理裝置包含一上料區及一下料區，待加工的基材被該第一承載裝置及該第二承載裝置依序從該上板區經該第一中轉處理區運送至該上料區進行加工處理，已加工的基材被該第一承載裝置及該第二承載裝置依序從該下料區經該第二中轉處理區運送至該下板區。A substrate loading and unloading device, used to provide substrates to a processing device for processing and retrieve the processed substrates, wherein the substrate loading and unloading device includes a conveying device, a first carrying device, a second Carrying device, an upper board area, a lower board area, a first transfer processing area and a second transfer processing area, the processing device includes a feeding area and a lower feeding area, the base material to be processed is covered by the first The carrying device and the second carrying device are sequentially transported from the upper plate area through the first transfer processing area to the loading area for processing, and the processed base material is carried by the first carrying device and the second carrying device Sequentially transport from the unloading area to the lower plate area through the second transfer processing area. 一種基材的上料方法，其採用如請求項1所述之基材的上下料裝置，其中該基材的上料方法包含如下步驟： 步驟S11：一第一承載裝置被一傳送裝置帶動至一上板區並裝載一第一待加工基材； 步驟S12：該第一承載裝置被該傳送裝置帶動並將該第一待加工基材從該上板區運送至一第一中轉處理區，一第二承載裝置被該傳送裝置帶動至該上板區並裝載一第二待加工基材； 步驟S13：該第一承載裝置被該傳送裝置帶動並將該第一待加工基材從該第一中轉處理區運送並放至一上料區，該第二承載裝置被該傳送裝置帶動並將該第二待加工基材從該上板區運送至該第一中轉處理區； 步驟S14：該第一承載裝置被該傳送裝置帶動至該上板區，該第二承載裝置被該傳送裝置帶動並將該第二待加工基材從該第一中轉處理區運送至該上料區，完成一次上料。 A method for feeding a substrate, which uses the device for loading and unloading a substrate as described in Claim 1, wherein the method for feeding a substrate comprises the following steps: Step S11: a first carrying device is driven by a conveying device to an upper plate area and loaded with a first substrate to be processed; Step S12: The first carrying device is driven by the conveying device and transports the first substrate to be processed from the upper plate area to a first transfer processing area, and a second carrying device is driven by the conveying device to the upper plate area. The plate area is loaded with a second substrate to be processed; Step S13: the first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area to a loading area, the second carrying device is driven by the conveying device and transporting the second substrate to be processed from the upper plate area to the first intermediate processing area; Step S14: The first carrying device is driven by the conveying device to the upper plate area, the second carrying device is driven by the conveying device and transports the second substrate to be processed from the first transfer processing area to the upper plate area. In the material area, one feeding is completed. 如請求項2所述之基材的上料方法，其中在該步驟S12中，該基材的上下料裝置包含一第一止擋機構，當該第一承載裝置被該傳送裝置帶動並將該第一待加工基材從該上板區運送至該第一中轉處理區時，該第一止擋機構工作，以阻止在該第一承載裝置離開該第一中轉處理區之前，該第二承載裝置進入該第一中轉處理區。The substrate loading method as described in Claim 2, wherein in the step S12, the loading and unloading device for the substrate includes a first stopper mechanism, when the first carrying device is driven by the conveying device and the When the first base material to be processed is transported from the upper plate area to the first intermediate processing area, the first stopper mechanism works to prevent the first carrying device from leaving the first intermediate processing area. The second carrying device enters the first transfer processing area. 如請求項3所述之基材的上料方法，其中在該步驟S13中，當該第一承載裝置被該傳送裝置帶動並將該第一待加工基材從該第一中轉處理區運送至該上料區時，該第一止擋機構停止工作，以解除對該第二承載裝置運送至該第一中轉處理區的阻止。The method for loading substrates according to claim 3, wherein in step S13, when the first carrying device is driven by the conveying device and transports the first substrate to be processed from the first transfer processing area When arriving at the loading area, the first stopper mechanism stops working, so as to release the prevention of the second carrying device from being transported to the first transfer processing area. 如請求項2所述之基材的上料方法，其中該第一待加工基材透過被該第一承載裝置夾持或吸附的方式裝載至該第一承載裝置處；該第二待加工基材透過被該第二承載裝置夾持或吸附的方式裝載至該第二承載裝置處。The substrate loading method as described in Claim 2, wherein the first substrate to be processed is loaded onto the first carrier by being clamped or adsorbed by the first carrier; the second substrate to be processed is The materials are loaded onto the second carrying device by being clamped or adsorbed by the second carrying device. 如請求項2所述之基材的上料方法，其中該第一待加工基材與該第二待加工基材為覆銅箔板或印刷電路板。The method for loading substrates according to claim 2, wherein the first substrate to be processed and the second substrate to be processed are copper clad boards or printed circuit boards. 一種基材的下料方法，其採用如請求項1所述之基材的上下料裝置，其中該基材的下料方法包含如下步驟： 步驟S21：一第一承載裝置被一傳送裝置帶動至一下料區並裝載一第一已加工基材； 步驟S22：該第一承載裝置被該傳送裝置帶動並將該第一已加工基材從該下料區運送至一第二中轉處理區，一第二承載裝置被該傳送裝置帶動至該下料區並裝載一第二已加工基材； 步驟S23：該第一承載裝置被該傳送裝置帶動並將該第一已加工基材從該第二中轉處理區運送並放至一下板區，該第二承載裝置被該傳送裝置帶動並將該第二已加工基材從該下料區運動至該第二中轉處理區； 步驟S24：該第一承載裝置被該傳送裝置帶動至該下料區，該第二承載裝置被該傳送裝置帶動並將該第二已加工基材從該第二中轉處理區運送至該下板區，完成一次下料。 A substrate blanking method, which uses the substrate loading and unloading device as described in claim 1, wherein the substrate blanking method includes the following steps: Step S21: a first carrying device is driven by a conveying device to the unloading area and loaded with a first processed substrate; Step S22: The first carrying device is driven by the conveying device and transports the first processed base material from the unloading area to a second transfer processing area, and a second carrying device is driven by the conveying device to the lower The material area is loaded with a second processed substrate; Step S23: The first carrying device is driven by the conveying device and transports the first processed substrate from the second transfer processing area to the lower platen area, the second carrying device is driven by the conveying device and the second processed substrate moves from the unloading area to the second intermediate processing area; Step S24: the first carrying device is driven by the conveying device to the unloading area, the second carrying device is driven by the conveying device and transports the second processed substrate from the second transfer processing area to the lower Plate area, complete a blanking. 如請求項7所述之基材的下料方法，其中在該步驟S22中，該基材的上下料裝置包含一第二止擋機構，當該第一承載裝置被該傳送裝置帶動並將該第一已加工基材從該下料區運送至該第二中轉處理區，該第二止擋機構工作，以阻止在該第一承載裝置離開該第二中轉處理區之前，該第二承載裝置進入該第二中轉處理區。The method for unloading the base material according to claim 7, wherein in the step S22, the loading and unloading device for the base material includes a second stopper mechanism, when the first carrying device is driven by the conveying device and the The first processed base material is transported from the unloading area to the second transfer processing area, and the second stopper mechanism works to prevent the second transfer processing area before the first carrying device leaves the second transfer processing area. The carrying device enters the second transfer processing area. 如請求項8所述之基材的下料方法，其中在該步驟S23中，該基材的上下料裝置包含一第三止擋機構，當該第一承載裝置被該傳送裝置帶動並將該第一已加工基材從該第二中轉處理區運送並放至該下板區時，該第二止擋機構停止工作，以解除對該第二承載裝置運送至該第二中轉處理區的阻止，並且一第三止擋機構工作，以阻止在該第一承載裝置離開該下板區之前，該第二承載裝置進入該下板區。The substrate material blanking method as described in Claim 8, wherein in the step S23, the substrate loading and unloading device includes a third stopper mechanism, when the first carrying device is driven by the conveying device and the When the first processed base material is transported from the second transfer processing area to the lower plate area, the second stopper mechanism stops working, so as to release the transfer of the second carrier device to the second transfer processing area. and a third stop mechanism works to prevent the second carrying device from entering the lower plate area before the first carrying device leaves the lower plate area. 如請求項9所述之基材的下料方法，其中在該步驟S24中，當該第一承載裝置被該傳送裝置帶動至該下料區時，該第三止擋機構停止工作，以解除對該第二承載裝置運送至該下板區的阻止。The material blanking method for the base material according to claim 9, wherein in the step S24, when the first carrying device is driven to the material blanking area by the conveying device, the third stopper mechanism stops working to release The prevention of transport of the second carrier to the lower deck area.
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