TW202301531A - 基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式 - Google Patents

基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式 Download PDF

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Publication number
TW202301531A
TW202301531A TW111108935A TW111108935A TW202301531A TW 202301531 A TW202301531 A TW 202301531A TW 111108935 A TW111108935 A TW 111108935A TW 111108935 A TW111108935 A TW 111108935A TW 202301531 A TW202301531 A TW 202301531A
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TW
Taiwan
Prior art keywords
moving
unit
holding
substrate
adjustment
Prior art date
Application number
TW111108935A
Other languages
English (en)
Chinese (zh)
Inventor
三根陽介
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202301531A publication Critical patent/TW202301531A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
TW111108935A 2021-03-25 2022-03-11 基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式 TW202301531A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-051493 2021-03-25
JP2021051493 2021-03-25

Publications (1)

Publication Number Publication Date
TW202301531A true TW202301531A (zh) 2023-01-01

Family

ID=83397111

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108935A TW202301531A (zh) 2021-03-25 2022-03-11 基板搬送裝置、塗佈處理裝置、基板搬送方法及基板搬送程式

Country Status (3)

Country Link
JP (1) JPWO2022202396A1 (https=)
TW (1) TW202301531A (https=)
WO (1) WO2022202396A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200502070A (en) * 2003-07-04 2005-01-16 Rorze Corp Carrying apparatus and carrying control method for sheet-like objects
JP4426276B2 (ja) * 2003-10-06 2010-03-03 住友重機械工業株式会社 搬送装置、塗布システム、及び検査システム
JP2008302487A (ja) * 2007-06-11 2008-12-18 Olympus Corp 基板吸着装置及び基板搬送装置並びに外観検査装置
JP4495752B2 (ja) * 2007-11-06 2010-07-07 東京エレクトロン株式会社 基板処理装置及び塗布装置
JP7101583B2 (ja) * 2018-10-04 2022-07-15 東京エレクトロン株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JPWO2022202396A1 (https=) 2022-09-29
WO2022202396A1 (ja) 2022-09-29

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