TW202244611A - 感光性樹脂組成物、硬化物、顯示裝置、有機el顯示裝置及半導體裝置 - Google Patents

感光性樹脂組成物、硬化物、顯示裝置、有機el顯示裝置及半導體裝置 Download PDF

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Publication number
TW202244611A
TW202244611A TW111106307A TW111106307A TW202244611A TW 202244611 A TW202244611 A TW 202244611A TW 111106307 A TW111106307 A TW 111106307A TW 111106307 A TW111106307 A TW 111106307A TW 202244611 A TW202244611 A TW 202244611A
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TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
compound
weight
alkali
Prior art date
Application number
TW111106307A
Other languages
English (en)
Chinese (zh)
Inventor
福島航
首藤勇太
原田早葵
亀本聡
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202244611A publication Critical patent/TW202244611A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
TW111106307A 2021-02-26 2022-02-22 感光性樹脂組成物、硬化物、顯示裝置、有機el顯示裝置及半導體裝置 TW202244611A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-029607 2021-02-26
JP2021029607 2021-02-26

Publications (1)

Publication Number Publication Date
TW202244611A true TW202244611A (zh) 2022-11-16

Family

ID=83049291

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111106307A TW202244611A (zh) 2021-02-26 2022-02-22 感光性樹脂組成物、硬化物、顯示裝置、有機el顯示裝置及半導體裝置

Country Status (3)

Country Link
JP (1) JPWO2022181419A1 (https=)
TW (1) TW202244611A (https=)
WO (1) WO2022181419A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202412021A (zh) * 2022-09-02 2024-03-16 日商Ｊｓｒ股份有限公司 導電膜的製造方法、分散液、感放射線性樹脂組成物、發光元件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5061703B2 (ja) * 2007-04-25 2012-10-31 東レ株式会社 感光性樹脂組成物
JP2009020246A (ja) * 2007-07-11 2009-01-29 Toray Ind Inc 感光性樹脂組成物、これを用いた絶縁性樹脂パターンの製造方法および有機電界発光素子
US8530119B2 (en) * 2009-05-20 2013-09-10 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same
US8530133B2 (en) * 2010-09-28 2013-09-10 Promerus, Llc Preparation of norbornane-based PAC ballasts
JP2016158863A (ja) * 2015-03-02 2016-09-05 株式会社日立製作所 医用画像撮像装置及び撮像断面調整方法

Also Published As

Publication number Publication date
JPWO2022181419A1 (https=) 2022-09-01
WO2022181419A1 (ja) 2022-09-01

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