TW202239819A - 聚醯亞胺前驅體的選擇方法、樹脂組成物的製造方法、聚醯亞胺前驅體、樹脂組成物及硬化物 - Google Patents
聚醯亞胺前驅體的選擇方法、樹脂組成物的製造方法、聚醯亞胺前驅體、樹脂組成物及硬化物 Download PDFInfo
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- polyimide precursor
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- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 1
- 229940033123 tannic acid Drugs 0.000 description 1
- 235000015523 tannic acid Nutrition 0.000 description 1
- 229920002258 tannic acid Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| WOPCT/JP2021/003345 | 2021-01-29 | ||
| PCT/JP2021/003345 WO2022162895A1 (ja) | 2021-01-29 | 2021-01-29 | ポリイミド前駆体の選択方法、樹脂組成物の製造方法、ポリイミド前駆体、樹脂組成物及び硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202239819A true TW202239819A (zh) | 2022-10-16 |
Family
ID=82654337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111104003A TW202239819A (zh) | 2021-01-29 | 2022-01-28 | 聚醯亞胺前驅體的選擇方法、樹脂組成物的製造方法、聚醯亞胺前驅體、樹脂組成物及硬化物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022162895A1 (https=) |
| TW (1) | TW202239819A (https=) |
| WO (1) | WO2022162895A1 (https=) |
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| WO2025205567A1 (ja) * | 2024-03-27 | 2025-10-02 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980032200A (ko) * | 1996-10-28 | 1998-07-25 | 포만제프리엘 | 유전체 조성물 및 집적회로 소자 |
| DE60012764T2 (de) * | 1999-01-21 | 2005-08-25 | Asahi Kasei Kabushiki Kaisha | Polyamidsäureester |
| JP2002040658A (ja) * | 2000-07-27 | 2002-02-06 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、これを用いた半導体装置及び電子部品 |
| JP5461372B2 (ja) * | 2010-11-26 | 2014-04-02 | 株式会社ジャパンディスプレイ | 配向膜形成用溶媒、それを用いた配向膜材料および液晶表示装置の製造方法 |
| JP6245180B2 (ja) * | 2012-12-21 | 2017-12-13 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体樹脂組成物 |
| JP6167089B2 (ja) * | 2014-03-27 | 2017-07-19 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
| JP2015224261A (ja) * | 2014-05-26 | 2015-12-14 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体を含む樹脂組成物、硬化膜、及びその製造方法 |
| JP2019031597A (ja) * | 2017-08-07 | 2019-02-28 | 東レ株式会社 | 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法 |
| JP7313180B2 (ja) * | 2018-04-23 | 2023-07-24 | 旭化成株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法 |
| CN110835408B (zh) * | 2018-08-16 | 2022-06-03 | 长兴材料工业股份有限公司 | 聚酰亚胺的制备方法 |
| JP7331860B2 (ja) * | 2018-10-15 | 2023-08-23 | 日産化学株式会社 | 感光性絶縁膜組成物 |
| JP7491116B2 (ja) * | 2020-07-22 | 2024-05-28 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
| JP7521299B2 (ja) * | 2020-07-22 | 2024-07-24 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
-
2021
- 2021-01-29 JP JP2022577968A patent/JPWO2022162895A1/ja active Pending
- 2021-01-29 WO PCT/JP2021/003345 patent/WO2022162895A1/ja not_active Ceased
-
2022
- 2022-01-28 TW TW111104003A patent/TW202239819A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022162895A1 (https=) | 2022-08-04 |
| WO2022162895A1 (ja) | 2022-08-04 |
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