JPWO2022162895A1 - - Google Patents
Info
- Publication number
- JPWO2022162895A1 JPWO2022162895A1 JP2022577968A JP2022577968A JPWO2022162895A1 JP WO2022162895 A1 JPWO2022162895 A1 JP WO2022162895A1 JP 2022577968 A JP2022577968 A JP 2022577968A JP 2022577968 A JP2022577968 A JP 2022577968A JP WO2022162895 A1 JPWO2022162895 A1 JP WO2022162895A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/003345 WO2022162895A1 (ja) | 2021-01-29 | 2021-01-29 | ポリイミド前駆体の選択方法、樹脂組成物の製造方法、ポリイミド前駆体、樹脂組成物及び硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022162895A1 true JPWO2022162895A1 (https=) | 2022-08-04 |
Family
ID=82654337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022577968A Pending JPWO2022162895A1 (https=) | 2021-01-29 | 2021-01-29 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022162895A1 (https=) |
| TW (1) | TW202239819A (https=) |
| WO (1) | WO2022162895A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025205567A1 (ja) * | 2024-03-27 | 2025-10-02 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135199A (ja) * | 1996-10-28 | 1998-05-22 | Internatl Business Mach Corp <Ibm> | 集積回路素子及び作製プロセス |
| WO2000043439A1 (fr) * | 1999-01-21 | 2000-07-27 | Asahi Kasei Kabushiki Kaisha | Ester d'acide polyamique |
| JP2002040658A (ja) * | 2000-07-27 | 2002-02-06 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、これを用いた半導体装置及び電子部品 |
| JP2012113212A (ja) * | 2010-11-26 | 2012-06-14 | Hitachi Displays Ltd | 配向膜形成用溶媒、それを用いた配向膜材料および液晶表示装置の製造方法 |
| WO2014097594A1 (ja) * | 2012-12-21 | 2014-06-26 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体樹脂組成物 |
| JP2015224261A (ja) * | 2014-05-26 | 2015-12-14 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体を含む樹脂組成物、硬化膜、及びその製造方法 |
| JP2016027357A (ja) * | 2014-03-27 | 2016-02-18 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
| JP2019031597A (ja) * | 2017-08-07 | 2019-02-28 | 東レ株式会社 | 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法 |
| JP2020024374A (ja) * | 2018-04-23 | 2020-02-13 | 旭化成株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法 |
| JP2020026534A (ja) * | 2018-08-16 | 2020-02-20 | 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． | ポリイミドを調製するための方法 |
| WO2020080207A1 (ja) * | 2018-10-15 | 2020-04-23 | 日産化学株式会社 | 感光性絶縁膜組成物 |
| JP2022021933A (ja) * | 2020-07-22 | 2022-02-03 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
| JP2022021934A (ja) * | 2020-07-22 | 2022-02-03 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
-
2021
- 2021-01-29 JP JP2022577968A patent/JPWO2022162895A1/ja active Pending
- 2021-01-29 WO PCT/JP2021/003345 patent/WO2022162895A1/ja not_active Ceased
-
2022
- 2022-01-28 TW TW111104003A patent/TW202239819A/zh unknown
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135199A (ja) * | 1996-10-28 | 1998-05-22 | Internatl Business Mach Corp <Ibm> | 集積回路素子及び作製プロセス |
| WO2000043439A1 (fr) * | 1999-01-21 | 2000-07-27 | Asahi Kasei Kabushiki Kaisha | Ester d'acide polyamique |
| JP2002040658A (ja) * | 2000-07-27 | 2002-02-06 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、これを用いた半導体装置及び電子部品 |
| JP2012113212A (ja) * | 2010-11-26 | 2012-06-14 | Hitachi Displays Ltd | 配向膜形成用溶媒、それを用いた配向膜材料および液晶表示装置の製造方法 |
| WO2014097594A1 (ja) * | 2012-12-21 | 2014-06-26 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体樹脂組成物 |
| JP2016027357A (ja) * | 2014-03-27 | 2016-02-18 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
| JP2015224261A (ja) * | 2014-05-26 | 2015-12-14 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体を含む樹脂組成物、硬化膜、及びその製造方法 |
| JP2019031597A (ja) * | 2017-08-07 | 2019-02-28 | 東レ株式会社 | 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法 |
| JP2020024374A (ja) * | 2018-04-23 | 2020-02-13 | 旭化成株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法 |
| JP2020026534A (ja) * | 2018-08-16 | 2020-02-20 | 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． | ポリイミドを調製するための方法 |
| WO2020080207A1 (ja) * | 2018-10-15 | 2020-04-23 | 日産化学株式会社 | 感光性絶縁膜組成物 |
| JP2022021933A (ja) * | 2020-07-22 | 2022-02-03 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
| JP2022021934A (ja) * | 2020-07-22 | 2022-02-03 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202239819A (zh) | 2022-10-16 |
| WO2022162895A1 (ja) | 2022-08-04 |
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