TW202225229A - 樹脂組成物、硬化物、半導體密封材料、及半導體裝置 - Google Patents

樹脂組成物、硬化物、半導體密封材料、及半導體裝置 Download PDF

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Publication number
TW202225229A
TW202225229A TW110141096A TW110141096A TW202225229A TW 202225229 A TW202225229 A TW 202225229A TW 110141096 A TW110141096 A TW 110141096A TW 110141096 A TW110141096 A TW 110141096A TW 202225229 A TW202225229 A TW 202225229A
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TW
Taiwan
Prior art keywords
resin
resin composition
phenol
aforementioned
preferable
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TW110141096A
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English (en)
Chinese (zh)
Inventor
矢本和久
青山和賢
秋元源祐
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日商Ｄｉｃ股份有限公司
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Publication of TW202225229A publication Critical patent/TW202225229A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
TW110141096A 2020-11-16 2021-11-04 樹脂組成物、硬化物、半導體密封材料、及半導體裝置 TW202225229A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-190382 2020-11-16
JP2020190382 2020-11-16

Publications (1)

Publication Number Publication Date
TW202225229A true TW202225229A (zh) 2022-07-01

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TW110141096A TW202225229A (zh) 2020-11-16 2021-11-04 樹脂組成物、硬化物、半導體密封材料、及半導體裝置

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JP (1) JP7205673B2 (https=)
TW (1) TW202225229A (https=)
WO (1) WO2022102489A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022151177A (ja) * 2021-03-26 2022-10-07 住友ベークライト株式会社 封止用樹脂組成物および半導体素子の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07196767A (ja) * 1993-12-28 1995-08-01 Nippon Kayaku Co Ltd エポキシ樹脂組成物およびその硬化物
JP3962935B2 (ja) * 1998-01-19 2007-08-22 大日本インキ化学工業株式会社 エポキシ樹脂組成物
KR100799146B1 (ko) * 2003-08-21 2008-01-29 아사히 가세이 케미칼즈 가부시키가이샤 감광성 조성물 및 그 경화물
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
US20140228483A1 (en) * 2013-02-13 2014-08-14 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
WO2015152037A1 (ja) * 2014-03-31 2015-10-08 明和化成株式会社 フェノール樹脂、該フェノール樹脂を含むエポキシ樹脂組成物、該エポキシ樹脂組成物の硬化物、及び該硬化物を有する半導体装置
TWI731986B (zh) * 2016-06-29 2021-07-01 日商迪愛生股份有限公司 苯酚酚醛清漆樹脂、硬化性樹脂組成物及其硬化物

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JP7205673B2 (ja) 2023-01-17
WO2022102489A1 (ja) 2022-05-19
JPWO2022102489A1 (https=) 2022-05-19

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