TW202222556A - 熱傳導性片材及熱傳導性片材之製造方法 - Google Patents

熱傳導性片材及熱傳導性片材之製造方法 Download PDF

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Publication number
TW202222556A
TW202222556A TW110139009A TW110139009A TW202222556A TW 202222556 A TW202222556 A TW 202222556A TW 110139009 A TW110139009 A TW 110139009A TW 110139009 A TW110139009 A TW 110139009A TW 202222556 A TW202222556 A TW 202222556A
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TW
Taiwan
Prior art keywords
thermally conductive
conductive sheet
conductive filler
filler
sheet
Prior art date
Application number
TW110139009A
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English (en)
Chinese (zh)
Inventor
佐藤勇磨
荒巻慶輔
久保佑介
Original Assignee
日商迪睿合股份有限公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=79239800&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW202222556(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW202222556A publication Critical patent/TW202222556A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW110139009A 2020-10-21 2021-10-21 熱傳導性片材及熱傳導性片材之製造方法 TW202222556A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-176566 2020-10-21
JP2020176566A JP6989675B1 (ja) 2020-10-21 2020-10-21 熱伝導性シート及び熱伝導性シートの製造方法

Publications (1)

Publication Number Publication Date
TW202222556A true TW202222556A (zh) 2022-06-16

Family

ID=79239800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110139009A TW202222556A (zh) 2020-10-21 2021-10-21 熱傳導性片材及熱傳導性片材之製造方法

Country Status (3)

Country Link
JP (2) JP6989675B1 (ja)
TW (1) TW202222556A (ja)
WO (1) WO2022085284A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514344B2 (ja) * 2001-02-07 2010-07-28 電気化学工業株式会社 熱伝導性樹脂成形体及びその用途
JP2009094110A (ja) * 2007-10-03 2009-04-30 Denki Kagaku Kogyo Kk 放熱部材、及びそのシート、およびその製造方法
JP5330910B2 (ja) * 2009-07-03 2013-10-30 電気化学工業株式会社 樹脂組成物及びその用途
JP2012023335A (ja) * 2010-06-17 2012-02-02 Sony Chemical & Information Device Corp 熱伝導性シート及びその製造方法
JP2013131564A (ja) * 2011-12-20 2013-07-04 Dexerials Corp 熱伝導性シート、この熱伝導性シートを用いた半導体装置及び半導体装置の製造方法
JP5798210B2 (ja) * 2013-07-10 2015-10-21 デクセリアルズ株式会社 熱伝導性シート
EP3419399B1 (en) * 2016-04-11 2020-08-26 Sekisui Polymatech Co., Ltd. Heat conductive sheet
WO2020105601A1 (ja) * 2018-11-20 2020-05-28 積水ポリマテック株式会社 熱伝導性シート及びその製造方法

Also Published As

Publication number Publication date
WO2022085284A1 (ja) 2022-04-28
JP2022067780A (ja) 2022-05-09
JP6989675B1 (ja) 2022-01-05
JP2022068136A (ja) 2022-05-09

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