TW202219122A - 聚合物組成物、清漆、以及聚醯亞胺薄膜 - Google Patents
聚合物組成物、清漆、以及聚醯亞胺薄膜 Download PDFInfo
- Publication number
- TW202219122A TW202219122A TW110133173A TW110133173A TW202219122A TW 202219122 A TW202219122 A TW 202219122A TW 110133173 A TW110133173 A TW 110133173A TW 110133173 A TW110133173 A TW 110133173A TW 202219122 A TW202219122 A TW 202219122A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- formula
- polymer
- compound
- structural unit
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-152368 | 2020-09-10 | ||
JP2020152368 | 2020-09-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202219122A true TW202219122A (zh) | 2022-05-16 |
Family
ID=80632388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110133173A TW202219122A (zh) | 2020-09-10 | 2021-09-07 | 聚合物組成物、清漆、以及聚醯亞胺薄膜 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022054765A1 (ko) |
KR (1) | KR20230066345A (ko) |
CN (1) | CN116057109B (ko) |
TW (1) | TW202219122A (ko) |
WO (1) | WO2022054765A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2022220286A1 (ko) * | 2021-04-16 | 2022-10-20 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102976983B (zh) * | 2012-10-25 | 2015-10-21 | 华中科技大学 | 一种砜基含氟二胺化合物和聚酰亚胺薄膜材料及其制法 |
JP6456293B2 (ja) * | 2013-09-30 | 2019-01-23 | 株式会社ネオス | 親水撥油性付与剤およびこれを含有する組成物 |
JP6627510B2 (ja) | 2013-11-27 | 2020-01-08 | 宇部興産株式会社 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
WO2016121817A1 (ja) | 2015-01-29 | 2016-08-04 | 宇部興産株式会社 | ポリイミド前駆体組成物およびそれを用いた絶縁被覆層の製造方法 |
KR102463845B1 (ko) * | 2015-12-24 | 2022-11-04 | 주식회사 두산 | 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 |
JP6672987B2 (ja) * | 2016-04-21 | 2020-03-25 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂組成物及びその成形品 |
TWI746611B (zh) * | 2016-08-03 | 2021-11-21 | 日商日產化學工業股份有限公司 | 剝離層形成用組成物、以及含有其的積層體 |
KR102471861B1 (ko) * | 2017-12-22 | 2022-11-29 | 주식회사 두산 | 폴리아믹산 용액 및 이를 이용한 투명 폴리이미드 수지 필름 |
WO2019188305A1 (ja) * | 2018-03-28 | 2019-10-03 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
JP7375318B2 (ja) * | 2018-05-16 | 2023-11-08 | 東レ株式会社 | ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物およびその膜状物、それを含む積層体、ならびにフレキシブルデバイス |
KR20210097095A (ko) * | 2018-11-28 | 2021-08-06 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름 |
JP7392657B2 (ja) * | 2018-12-13 | 2023-12-06 | 三菱瓦斯化学株式会社 | ポリイミド樹脂組成物及びポリイミドフィルム |
-
2021
- 2021-09-06 WO PCT/JP2021/032709 patent/WO2022054765A1/ja active Application Filing
- 2021-09-06 KR KR1020237007962A patent/KR20230066345A/ko active Search and Examination
- 2021-09-06 JP JP2022547589A patent/JPWO2022054765A1/ja active Pending
- 2021-09-06 CN CN202180054894.0A patent/CN116057109B/zh active Active
- 2021-09-07 TW TW110133173A patent/TW202219122A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230066345A (ko) | 2023-05-15 |
CN116057109B (zh) | 2024-05-14 |
JPWO2022054765A1 (ko) | 2022-03-17 |
CN116057109A (zh) | 2023-05-02 |
WO2022054765A1 (ja) | 2022-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6996609B2 (ja) | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム | |
JPWO2019151336A1 (ja) | ポリイミド樹脂組成物及びポリイミドフィルム | |
JP7375749B2 (ja) | ポリアミド-イミド樹脂、ポリアミド-イミドワニス及びポリアミド-イミドフィルム | |
TW202222910A (zh) | 聚合物組成物、清漆、以及聚醯亞胺薄膜 | |
WO2021132196A1 (ja) | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム | |
TWI789432B (zh) | 聚醯亞胺、聚醯亞胺清漆及聚醯亞胺薄膜 | |
TW202219122A (zh) | 聚合物組成物、清漆、以及聚醯亞胺薄膜 | |
TW202302713A (zh) | 聚醯亞胺樹脂組成物、聚醯亞胺前驅體組成物、清漆、及聚醯亞胺薄膜 | |
TW202248292A (zh) | 聚醯亞胺前驅物組成物 | |
TW202309153A (zh) | 醯亞胺-醯胺酸共聚物及其製造方法、清漆、及聚醯亞胺薄膜 | |
TWI774848B (zh) | 聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜 | |
WO2021210640A1 (ja) | イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム | |
WO2021210641A1 (ja) | イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム | |
TWI804604B (zh) | 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 | |
WO2023182038A1 (ja) | 重合体の製造方法、ワニス、及びワニスの製造方法 | |
TW202214747A (zh) | 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 | |
WO2021153379A1 (ja) | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム | |
WO2024058194A1 (ja) | ポリイミドフィルムの製造方法 | |
TW202208514A (zh) | 聚醯亞胺樹脂、聚醯亞胺清漆以及聚醯亞胺薄膜 | |
WO2021177145A1 (ja) | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム | |
WO2023249023A1 (ja) | ポリイミドワニスの製造方法 | |
WO2023234085A1 (ja) | ポリイミド樹脂前駆体及びポリイミド樹脂 | |
TW202120595A (zh) | 聚醯亞胺樹脂組成物、聚醯亞胺清漆、以及聚醯亞胺薄膜 | |
TW202136393A (zh) | 聚醯亞胺薄膜之製造方法 | |
TW202216851A (zh) | 聚醯亞胺樹脂、聚醯胺酸、清漆及聚醯亞胺薄膜 |