TW202206383A - Dividing mechanism of brittle material substrate - Google Patents
Dividing mechanism of brittle material substrate Download PDFInfo
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- TW202206383A TW202206383A TW110101915A TW110101915A TW202206383A TW 202206383 A TW202206383 A TW 202206383A TW 110101915 A TW110101915 A TW 110101915A TW 110101915 A TW110101915 A TW 110101915A TW 202206383 A TW202206383 A TW 202206383A
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- brittle material
- material substrate
- top plate
- breaking
- lifting mechanisms
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
Abstract
Description
本發明係關於一種將脆性材料基板分斷之機構。The present invention relates to a mechanism for dividing a brittle material substrate.
作為將玻璃基板等脆性材料基板分斷之手法,廣為人知的有如下之手法:使彎曲應力作用在預先沿著分斷預定位置在表面形成刻劃線之基板,藉由使(垂直)裂紋從刻劃線伸展,將該脆性材料基板分斷。As a method for breaking a brittle material substrate such as a glass substrate, a method is widely known in which bending stress is applied to a substrate on which a scribe line is formed on the surface along a predetermined position for breaking, and a (vertical) crack is formed from the scribe. The scribe line stretches, breaking the brittle material substrate.
作為由該手法所進行之分斷的具體態樣,已衆所周知的有如下之裝置,即,該裝置將形成有刻劃線之脆性材料基板之隔著該刻劃線之兩側分別固定在固定台與可動(傾動)台,藉由使可動台在與刻劃線之延伸方向垂直的面内旋動或傾動,使裂紋從刻劃線伸展,將該脆性材料基板分斷(例如,參照專利文獻1及專利文獻2)。 [先前技術文獻] [專利文獻]As a specific aspect of the division by this method, there is known a device for fixing both sides of a brittle material substrate on which a scribe line is formed across the scribe line, respectively. On the fixed table and the movable (tilting) table, by rotating or tilting the movable table in a plane perpendicular to the extending direction of the scribe line, cracks are extended from the scribe line, and the brittle material substrate is divided (for example, Refer to Patent Document 1 and Patent Document 2). [Prior Art Literature] [Patent Literature]
[專利文獻1]日本特開2017-177453號公報 [專利文獻2]日本特開2019-196281號公報[Patent Document 1] Japanese Patent Laid-Open No. 2017-177453 [Patent Document 2] Japanese Patent Laid-Open No. 2019-196281
[發明所欲解決之問題][Problems to be Solved by Invention]
在專利文獻1所揭示之裝置之情形,由於可動台的動作僅為繞一旋動軸的旋動,因此,在分斷之時,脆性材料基板限於受到沿著刻劃線之延伸方向的繞旋動軸之力。In the case of the device disclosed in Patent Document 1, since the movement of the movable table is only rotation around a rotation axis, the brittle material substrate is limited to being subjected to rotation along the extending direction of the scribed line when it is split. The power of the rotating shaft.
又,在專利文獻2所揭示之裝置之情形,傾動台由在鉛直方向上進退(升降)自如的1個支承軸支承,並且藉由將這些傾動台與支承軸之整體設為可沿著傾斜面升降,除了在和刻劃線之延伸方向垂直的面内的旋動動作之外,亦將傾動台整體之升降動作(往鉛直方向之偏移動作)設為可能。In addition, in the case of the device disclosed in Patent Document 2, the tilt table is supported by one support shaft that can move forward and backward (elevate) in the vertical direction, and the tilt table and the support shaft are integrally formed so that the tilt table can be tilted along the vertical direction. In addition to the rotational movement in the plane perpendicular to the extending direction of the scribed line, the surface lifting and lowering movement (shifting movement in the vertical direction) of the entire tilt table is also possible.
然而,不論在何種情形,作用於脆性材料基板之力,皆限於和刻劃線之延伸方向垂直的面内的力。However, in any case, the force acting on the brittle material substrate is limited to the force in the plane perpendicular to the extending direction of the scribe line.
對此,存在有藉由使力從各種方向對脆性材料基板作用來提高分斷自由度,而將各種種類的脆性材料基板更合適且確實地分斷之一定的需求。In this regard, there is a certain demand for more appropriately and surely breaking various types of brittle material substrates by increasing the degree of freedom of breaking by applying a force to the brittle material substrate from various directions.
為此,需要使可動台更多樣地位移或傾斜,但專利文獻1及專利文獻2所揭示之裝置,皆無法進行使可動台從刻劃線之延伸方向傾斜之動作。Therefore, it is necessary to displace or incline the movable table in various ways, but the apparatuses disclosed in Patent Document 1 and Patent Document 2 cannot perform the operation of inclining the movable table from the extending direction of the scribe line.
本發明係鑒於上述課題而完成者,以實現與先前相比分斷自由度更高的脆性材料基板之分斷機構為目的。 [解決問題之手段]The present invention has been made in view of the above-mentioned problems, and aims to realize a breaking mechanism of a brittle material substrate with a higher degree of freedom of breaking than before. [means to solve the problem]
為解決上述課題,請求項1之發明,係一種脆性材料基板之分斷機構,係將脆性材料基板分斷,其具備:固定部,具有水平的第1上面;以及可動部,在水平面内與前述固定部分隔配置;前述可動部具有:頂板,具有平坦的第2上面,與前述固定部一起載置固定脆性材料基板;以及4個升降機構,在鉛直方向上立設於在俯視時成為矩形之各頂點之位置,各個升降機構被設為一邊從下方支承前述頂板,一邊獨立地在鉛直方向上進退自如;藉由組合前述4個升降機構之各個的升降動作,可改變前述頂板之姿勢。In order to solve the above-mentioned problems, the invention of claim 1 is a breaking mechanism for a brittle material substrate, which splits the brittle material substrate, comprising: a fixed portion having a horizontal first upper surface; and a movable portion in a horizontal plane. The fixed parts are arranged at intervals; the movable part has: a top plate having a flat second upper surface on which a brittle material substrate is mounted and fixed together with the fixed part; At the position of each vertex, each elevating mechanism is set to independently move forward and backward in the vertical direction while supporting the top plate from below; the posture of the top plate can be changed by combining the elevating actions of each of the four elevating mechanisms.
請求項2之發明,係如請求項1所述之脆性材料基板之分斷機構,其中,將前述第2上面位於與前述第1上面同一水平面内時的前述可動部之姿勢定義為基準姿勢;前述可動部處於前述基準姿勢時的前述第1上面與前述第2上面,成為前述脆性材料基板的載置固定面;在前述脆性材料基板,以預先決定為直線狀之分斷預定位置,位於前述固定部與前述可動部之間之方式,被載置固定於前述載置固定面之狀態下,前述升降機構進行升降動作,藉此來分斷前述脆性材料基板。The invention of claim 2 is the breaking mechanism for a brittle material substrate according to claim 1, wherein the posture of the movable portion when the second upper surface is located in the same horizontal plane as the first upper surface is defined as the reference posture; The first upper surface and the second upper surface when the movable part is in the reference posture serve as the mounting and fixing surface of the brittle material substrate; the brittle material substrate is located at the predetermined linear dividing position on the brittle material substrate. In the form between the fixed part and the movable part, in a state of being placed and fixed on the placing and fixing surface, the elevating mechanism performs an ascending and descending motion, thereby dividing the brittle material substrate.
請求項3之發明,係如請求項2所述之脆性材料基板之分斷機構,其中,在前述脆性材料基板被載置固定於前述載置固定面之狀態下,在將前述分斷預定位置延伸之水平面内的方向設為第1方向,將在水平面内與前述第1方向正交之方向設為第2方向時,前述4個升降機構,係在前述可動部之前述第1方向之兩端部之每一端部分別配置2個,在前述兩端部之各個,前述升降機構在前述第2方向上分隔配置。The invention of claim 3 is the breaking mechanism for a brittle material substrate according to claim 2, wherein in a state where the brittle material substrate is placed and fixed on the placing fixing surface, the predetermined breaking position is The direction in the extending horizontal plane is defined as the first direction, and the direction perpendicular to the first direction in the horizontal plane is defined as the second direction, and the four lifting mechanisms are connected to two of the first directions of the movable portion. Two of the end portions are respectively arranged, and at each of the end portions, the lift mechanisms are arranged to be separated in the second direction.
請求項4之發明,係如請求項3所述之脆性材料基板之分斷機構,其進而具備:軸枕,與前述4個升降機構之各個的上端部連結;前述軸枕與前述頂板直接或間接地連結。The invention of claim 4 is the breaking mechanism for a brittle material substrate according to claim 3, further comprising: a shaft rest connected to the upper end of each of the four lifting mechanisms; the shaft rest and the top plate directly or linked indirectly.
請求項5之發明,係如請求項4所述之脆性材料基板之分斷機構,其進而具備:第1線性導件,設於在前述4個升降機構之中、在前述第2方向上遠離前述固定部之2個前述升降機構或靠近前述固定部之2個前述升降機構之上端部所具備之前述軸枕,與前述頂板之間;配合前述頂板之傾斜,前述軸枕沿著前述第1線性導件被導引。The invention of claim 5 is the breaking mechanism for a brittle material substrate according to claim 4, further comprising: a first linear guide provided in the four elevating mechanisms and away from the second direction Between the two lifting mechanisms of the fixed part or the above-mentioned pillows provided at the upper ends of the two lifting mechanisms near the fixed part, and the top plate; in accordance with the inclination of the top plate, the pillows follow the first Linear guides are guided.
請求項6、7之發明,係如請求項4或5所述之脆性材料基板之分斷機構,其進而具備:連結板,在前述第2方向延伸;在前述4個升降機構之中、在前述第1方向之一方的端部所具備之2個前述升降機構之上端部所具備之前述軸枕,與前述連結板直接或間接地連結;在前述連結板與前述頂板之間、前述2個前述升降機構之各個的上方的位置,設置第2線性導件;配合前述頂板之傾斜,前述連結板沿著前述第2線性導件被導引。The inventions of
請求項8之發明,係如請求項3所述之脆性材料基板之分斷機構,其中,在前述第1方向的兩端部之每一端部,前述4個升降機構中的2個,與在前述第2方向延伸之連結板連結;各個前述連結板,與設為於導軌被導引自如之滑件連結,該導軌係在前述第2方向延伸;配合前述頂板之傾斜,前述滑件沿著前述導軌被導引。The invention of claim 8 is the breaking mechanism for a brittle material substrate as set forth in claim 3, wherein, at each of the two end portions in the first direction, two of the four lifting mechanisms and the The connecting plates extending in the second direction are connected; each of the connecting plates is connected with a slider set to be freely guided by the guide rail, and the guide rail is extended in the second direction; in accordance with the inclination of the top plate, the slider along the The aforementioned guide rails are guided.
請求項9之發明,係如請求項1至8中任一項所述之脆性材料基板之分斷機構,其進而具備:夾持構件,可在前述固定部及前述頂板之間夾持前述脆性材料基板。 [發明效果]The invention of claim 9 is the breaking mechanism for a brittle material substrate according to any one of claims 1 to 8, further comprising: a holding member capable of holding the brittle material between the fixing portion and the top plate material substrate. [Inventive effect]
根據請求項1至請求項9之發明,可使可動部以與先前相比更高的自由度來動作。例如,可單獨地進行傾斜動作、偏移動作、以及三維動作,或任意組合上述各動作。藉此,可對脆性材料基板以先前無法獲得之複雜且靈活的態樣來施加力,可進行更高精度的分斷。According to the invention of Claim 1 to Claim 9, the movable portion can be moved with a higher degree of freedom than before. For example, the tilt motion, the offset motion, and the three-dimensional motion may be performed individually, or any combination of the above motions may be performed. Thereby, a force can be applied to the brittle material substrate in a complex and flexible form that was not available before, and higher-precision breaking can be performed.
尤其是,根據請求項8之發明,亦能使在水平面内旋動可動部之力起作用。In particular, according to the invention of claim 8, the force for rotating the movable portion in the horizontal plane can also act.
<第1實施形態>
<分斷機構之概要>
圖1及圖2係概略地(概括地)表示本發明之第1實施形態之分斷機構100之構成之圖。更具體而言,圖1係從上方觀察(俯瞰)分斷機構100之情形的概略立體圖,圖2係從下方觀察分斷機構100之情形的概略立體圖。<First Embodiment>
<Outline of Breaking Mechanism>
FIG. 1 and FIG. 2 are diagrams schematically (generally) showing the configuration of the
分斷機構100,係用以將脆性材料基板W沿著預先決定為直線狀之分斷預定位置L分斷之機構。較佳為,在分斷之前,在脆性材料基板W之至少一方的主面,沿著分斷預定位置L形成刻劃線。The
分斷機構100主要具備固定部10與可動部20。固定部10係固定地設於未圖示之架台之部位,具有水平的上面10a。另一方面,雖可動部20在設於未圖示之架台之方面上與固定部10相同,但具有平坦的上面21a之頂板(可動台)21被設置為伴隨於後述之機構的動作而以各種態樣可動。這些固定部10與可動部20,係在水平面内以既定間隔分隔配置。The
於圖1及圖2所示之情形中,可動部20之頂板21之上面21a與固定部10之上面10a成為同一水平面。換言之,兩者位於一個水平面内。於本實施形態中,將如此情形之可動部20之姿勢稱為基準姿勢。In the situation shown in FIGS. 1 and 2 , the
於分斷機構100中,將可動部20處於該基準姿勢,且作為分斷對象之脆性材料基板W以橫跨固定部10之上面10a與可動部20之頂板21之上面21a之態樣被載置固定之狀態,定義為分斷動作之初期狀態。更詳細地,脆性材料基板W以分斷預定位置L沿著固定部10與可動部20分隔之部分延伸之姿勢被載置固定。較佳為,被載置固定為,分斷預定位置L位於固定部10與可動部20之分隔部分之正中央。In the
於圖1及圖2以及之後的圖式中,附加右手系之xyz坐標,係將脆性材料基板W被如所述般載置固定之狀態中之分斷預定位置L之延伸方向設為x軸方向,將固定部10與可動部20之分隔方向設為y軸方向,將鉛直方向設為z軸方向。In FIGS. 1 and 2 and the subsequent drawings, the xyz coordinates of the right-handed system are added, and the extending direction of the predetermined breaking position L in the state where the brittle material substrate W is placed and fixed as described above is set as the x-axis. The direction of separation between the
此外,脆性材料基板W係相對於固定部10之上面10a與頂板21之上面21a之各個固定。該固定中可適用各種公知的手法。例如,亦可為在上面10a與上面21a設置未圖示之吸附槽,從而進行吸附固定之態樣,亦可為利用未圖示之示教手段來夾持固定脆性材料基板W之端緣部之態樣。Further, the brittle material substrate W is fixed to each of the
可動部20具備4個升降機構22(22a~22d)作為用以使頂板21可動之構成。升降機構22係藉由例如滾珠螺桿與AC伺服馬達之組合來實現。The
升降機構22,係藉由其下端部固設在未圖示之架台上而立設於鉛直方向,且,各個上部被設為獨立地在z軸方向上進退自如(升降自如)。The
惟,各個升降機構22(22a~22d)之上端部,係與軸枕(軸承)23(23a~23d)連結。除此之外,各個軸枕23(23a~23d),係在後述之態樣中,間接地與頂板21連結。藉此,頂板21可根據各個升降機構22之升降動作之組合,往各種方向傾斜。However, the upper ends of the respective lifting mechanisms 22 ( 22 a to 22 d ) are connected to the bolsters (bearings) 23 ( 23 a to 23 d ). In addition, each of the bolsters 23 ( 23 a to 23 d ) is indirectly connected to the
更詳細而言,在圖1及圖2、以及之後的圖式中,設為在可動部20之x軸方向正側之端部20a配置升降機構22a及22b,在x軸方向負側之端部20b配置升降機構22c及22d,且設為各個上端部依序與軸枕23a、23b、23c、23d連結。又,設為在各個端部20a、20b中,升降機構22a及22c配置在靠近固定部10之y軸方向負側,升降機構22b及22d配置在遠離固定部10之y軸方向正側。In more detail, in FIGS. 1 and 2 and the following drawings, it is assumed that the
換言之,4個升降機構22,設於在俯視時成為矩形之各頂點之位置,在各個位置上從下方支承頂板21。因此,x軸方向上的升降機構22a與升降機構22c之距離、和升降機構22b與升降機構22d之距離,係相等且恆定,y軸方向上的升降機構22a與升降機構22b之距離、和升降機構22c與升降機構22d之距離,亦相等且恆定。In other words, the four elevating
軸枕23a與軸枕23b,在頂板21之下方之x軸方向正側之端部,與在y軸方向延伸之連結板24a連結。更詳細而言,軸枕23a固設在連結板24a,而軸枕23b與附設在連結板24a之下面之y軸線性導件25a連結。y軸線性導件25a設為可在y軸方向上引導軸枕23b,藉此,軸枕23b可在y軸方向上位移。The bolster 23a and the bolster 23b are connected to the connecting
同樣地,軸枕23c與軸枕23d,在頂板21之下方之x軸方向負側之端部,與在y軸方向延伸之連結板24b連結。更詳細而言,軸枕23c固設在連結板24b,而軸枕23d與附設在連結板24b之下面之y軸線性導件25b連結。y軸線性導件25b設為可在y軸方向上引導軸枕23d,藉此,軸枕23d亦可在y軸方向上位移。Similarly, the bolster 23c and the bolster 23d are connected to the connecting
y軸線性導件25a及25b,係以確保頂板21在yz平面内傾斜時之傾斜角之目的而設置。基於各個升降機構22之水平面内的配置位置固定之狀況,欲使升降機構22升降而使頂板21在yz平面内傾斜,僅藉由在傾斜角較小的範圍内,軸枕23根據頂板21之傾斜而相對於升降機構22傾斜亦可實現。然而,為了欲使傾斜角超過軸枕23之傾斜界限而變大,需要使升降機構22b及22d從下方支承頂板21之部位在y軸方向上相對偏移。在分斷機構100中,藉由設置y軸線性導件25a及25b,可使軸枕23b及軸枕23d之位置,換言之,升降機構22b及22d從下方支承頂板21之位置在y軸方向上相對偏移,藉此,使得頂板21之yz平面内的傾斜在寬廣的傾斜角範圍内被自如地設定。The y-axis
又,雖連結板24b直接固設於頂板21,但連結板24a係與附設在頂板21之下面之x軸方向正側之端部的x軸線性導件26a及26b連結。x軸線性導件26a及26b,在可動部20處於基準姿勢時,設於成為升降機構22a及22b之鉛直上方之位置。藉此,連結板24a可在x軸方向上位移。Moreover, although the connecting
x軸線性導件26a及26b,係以確保頂板21在zx平面内傾斜時之傾斜角之目的而設置。其理由及作用與y軸線性導件25a及25b相同。The x-axis
藉由具有如以上那樣的構成,在分斷機構100中,4個升降機構22(22a~22d)之各個的與頂板21之連結態樣成為彼此不同者。By having the above-mentioned configuration, in the
具體而言,升降機構22a與頂板21,係透過軸枕23a、連結板24a、以及x軸線性導件26a連結。Specifically, the elevating
又,升降機構22b與頂板21,係透過軸枕23b、y軸線性導件25a、連結板24a、以及x軸線性導件26b連結。Moreover, the
又,升降機構22c與頂板21,係透過軸枕23c及連結板24b連結。In addition, the elevating
又,升降機構22d與頂板21,係透過軸枕23d、y軸線性導件25b、以及連結板24b連結。Moreover, the
在分斷機構100中,藉由在如上述彼此不同的態樣中與頂板21連結之各個升降機構22a~22d之、獨立的升降動作之組合,可任意改變頂板21之姿勢。In the
<分斷動作>
在分斷機構100中,利用藉由如上述各個升降機構22a~22d之獨立的升降動作之組合而可任意改變頂板21之姿勢之特點,可進行各種分斷動作。以下,對其等依次進行說明。<Breaking action>
In the
(基準姿勢及面内動作)
圖3係表示以與後述之各種分斷動作時的情況比較之目的所示之、分斷機構100處於分斷動作的初期狀態時的情況的圖。圖3(a)係與圖1不同朝向的概略立體圖,圖3(b)係yz平面圖。(Basic pose and in-plane motion)
FIG. 3 is a diagram showing a situation when the
此外,以下,將可動部20成為基準姿勢時的升降機構22的進退狀態稱為基準狀態。In addition, hereinafter, the advancing and retreating state of the elevating
又,圖4~圖9係表示一邊將頂板21保持為與x軸方向平行(在x軸方向上不產生傾斜),一邊使可動部20動作之各種動作狀態之圖。在這些動作中,由於頂板21僅在yz平面内位移(傾斜),因此將該動作統稱為面内動作。面内動作中存在有後述之正傾斜動作、反傾斜動作、以及偏移動作。此外在圖4~圖9中亦與圖3相同,附有編號(a)的圖為立體圖,附有編號(b)的圖為yz平面圖。4 to 9 are diagrams showing various operating states in which the
又,於各個立體圖,將頂板21伴隨於可動部20的動作而傾斜時的、以水平面為基準的表示傾斜方向之向量(傾斜向量),以坐標形式來表示。此外,由於該頂板21之傾斜,脆性材料基板W之中、載置於該頂板21上之部分亦以相同的傾斜向量進行傾斜。惟,以下,為了簡單起見,將該情況僅稱為脆性材料基板W傾斜。In addition, in each perspective view, a vector (inclination vector) indicating the inclination direction with reference to the horizontal plane when the
圖4係表示以將頂板21之y軸方向正側之端部提升之方式可動部20進行了動作時的情況。該情形的頂板21之傾斜向量係表示為(0、+y、+z)。FIG. 4 shows a state in which the
這是藉由下述來實現,亦即如圖4(b)所示,關於升降機構22a及圖4(b)中未圖示之升降機構22c,使其維持以基準狀態靜止,另一方面使升降機構22b及圖4(b)中未圖示之升降機構22d,如以箭頭標記AR1a所示往z軸正方向上升。This is achieved by maintaining the elevating
此外,伴隨於升降機構22b及22d之上升,軸枕23b及在圖4(b)中未圖示之軸枕23d,如以箭頭標記AR1b所示,往y軸負方向引導。In addition, the
另一方面,圖5係表示以將頂板21之y軸方向正側之端部下降之方式可動部20進行了動作時的情況。該情形的頂板21之傾斜向量係表示為(0、+y、-z)。On the other hand, FIG. 5 shows the case where the
這是藉由下述來實現,亦即如圖5(b)所示,關於升降機構22a及圖5(b)中未圖示之升降機構22c,使其維持以基準狀態靜止,另一方面使升降機構22b及圖5(b)中未圖示之升降機構22d,如以箭頭標記AR2a所示往z軸負方向下降。This is achieved by maintaining the elevating
此外,伴隨於升降機構22b及22d之下降,軸枕23b及在圖5(b)中未圖示之軸枕23d,如以箭頭標記AR2b所示,往y軸正方向引導。Further, with the descending of the
以下,將圖4及圖5所示之可動部20之動作統稱為正傾斜動作,亦將前者的動作稱為上升正傾斜動作,將後者的動作稱為下降正傾斜動作。Hereinafter, the operation of the
正傾斜動作係將脆性材料基板W分斷時的基本動作。若可動部20以上升正傾斜動作與下降正傾斜動作中之任一個來進行動作,則在脆性材料基板W中,在分斷預定位置L之周圍產生彎曲應力。在沿著分斷預定位置L形成有刻劃線之情形,由於該彎曲應力進行作用,裂紋從刻劃線伸展,脆性材料基板W沿著分斷預定位置L分斷。亦可為兩方的正傾斜動作交替重複之態樣。The positive tilt operation is a basic operation when the brittle material substrate W is broken. When the
圖6係表示以將頂板21之y軸方向負側之端部提升之方式可動部20進行了動作時的情況。該情形的頂板21之傾斜向量係表示為(0、-y、+z)。此外,在圖6中(圖7~圖10亦相同),表示脆性材料基板W分斷為固定於固定部10上之第1部分W1、與固定於可動部20之第2部分W2後之情況。FIG. 6 shows a state in which the
這是藉由下述來實現,亦即如圖6(b)所示,關於升降機構22b及圖6(b)中未圖示之升降機構22d,使其維持以基準狀態靜止,另一方面使升降機構22a及圖6(b)中未圖示之升降機構22c,如以箭頭標記AR3a所示往z軸正方向上升。This is achieved by maintaining the elevating
此外,伴隨於升降機構22a及22c之上升,軸枕23b及在圖6(b)中未圖示之軸枕23d如以箭頭標記AR3b所示,往y軸正方向引導。In addition, the
另一方面,圖7係表示以將頂板21之y軸方向負側之端部下降之方式可動部20進行了動作時的情況。該情形的頂板21之傾斜向量係表示為(0、-y、-z)。On the other hand, FIG. 7 shows the case where the
這是藉由下述來實現,亦即如圖7(b)所示,關於升降機構22b及圖7(b)中未圖示之升降機構22d,使其維持以基準狀態靜止,另一方面使升降機構22a及圖7(b)中未圖示之升降機構22c如以箭頭標記AR4a所示往z軸負方向下降。This is achieved by maintaining the elevating
此外,伴隨於升降機構22a及22c之下降,軸枕23b及在圖7(b)中未圖示之軸枕23d如以箭頭標記AR4b所示,往y軸負方向引導。In addition, with the descending of the
以下,將圖6及圖7所示之可動部20之動作統稱為反傾斜動作,亦將前者的動作稱為上升反傾斜動作,將後者的動作稱為下降反傾斜動作。Hereinafter, the operation of the
根據脆性材料基板W之性質及狀態,亦有相較於僅重複正傾斜動作,藉由採用接續於正傾斜動作而進行反傾斜動作之順序,來更迅速地且以優異的品質實現分斷之情形。例如,可例示在執行圖4所示之上升正傾斜動作之後,進行圖7所示之下降反傾斜動作之態樣、或在執行圖5所示之下降正傾斜動作之後,進行圖6所示之上升反傾斜動作之態樣等。Depending on the nature and state of the brittle material substrate W, it is also possible to realize the severing process more quickly and with excellent quality by adopting the sequence of performing the reverse tilting action following the forward tilting action, rather than merely repeating the forward tilting action. situation. For example, it is possible to exemplify a state in which the downward inclination operation shown in FIG. 7 is performed after the upward forward inclination operation shown in FIG. 4 is performed, or after the downward forward inclination operation shown in FIG. 5 is performed, the operation shown in FIG. 6 is performed. The state of the rising and anti-tilting action, etc.
此外,亦可為與分斷之開始一起進行反傾斜動作之態樣。於該情形,在分斷預定位置L作用剪應力。In addition, it is also possible to perform a reverse tilt operation together with the start of the split. In this case, shear stress acts on the predetermined breaking position L.
圖8係表示以將頂板21之整體提升之方式可動部20進行了動作時的情況。該情形的頂板21之傾斜向量係表示為(0、0、+z)。FIG. 8 shows a state in which the
這是藉由下述來實現,亦即,使升降機構22a及圖8(b)中未圖示之升降機構22c如以箭頭標記AR5a所示往z軸正方向上升,並且亦使升降機構22b及圖8(b)中未圖示之升降機構22d,如以箭頭標記AR5b所示往z軸正方向上升。This is achieved by raising the elevating
尤其是,在4個升降機構22之全部以相同之方式上升之情形,頂板21係在將其上面21a保持為水平之狀態下上升。In particular, when all the four elevating
另一方面,圖9係表示以將頂板21之整體下降之方式可動部20進行了動作時的情況。該情形的頂板21之傾斜向量係表示為(0、0、-z)。On the other hand, FIG. 9 shows the case where the
這是藉由下述來實現,亦即如圖9(b)所示,使升降機構22a及圖9(b)中未圖示之升降機構22c如以箭頭標記AR6a所示往z軸負方向下降,並且亦使升降機構22b及圖9(b)中未圖示之升降機構22d,如以箭頭標記AR6b所示往z軸負方向下降。This is achieved by making the
尤其是,在4個升降機構22之全部以相同之方式下降之情形,頂板21係在將其上面21a保持為水平之狀態下下降。In particular, when all the four
以下,將圖8及圖9所示之可動部20之動作統稱為偏移動作,亦將前者的動作稱為上升偏移動作,將後者的動作稱為下降偏移動作。Hereinafter, the operations of the
存在有藉由接續於正傾斜動作之後,與反傾斜動作相同地,亦進行偏移動作,來發揮更迅速地且以優異的品質實現分斷的效果之情形。例如,可例示在執行圖4所示之上升正傾斜動作之後,進行圖8所示之上升偏移動作之態樣、或在執行圖5所示之下降正傾斜動作之後,進行圖9所示之下降偏移動作之態樣等。There are cases in which the effect of realizing the splitting more quickly and with excellent quality is exhibited by performing the offset operation in the same manner as the reverse tilt operation after the forward tilt operation. For example, it is possible to exemplify a state in which the upward biasing operation shown in FIG. 8 is performed after the upward positive tilting operation shown in FIG. 4 is performed, or the downward positive tilting operation shown in FIG. The state of the falling offset action, etc.
此外,亦可為與分斷之開始一起進行偏移動作之態樣。於該情形,在分斷預定位置L作用剪應力。In addition, it is also possible to carry out the offset operation together with the start of the division. In this case, shear stress acts on the predetermined breaking position L.
(三維動作)
圖10~圖13,係表示以頂板21不僅在yz平面内且也在x軸方向上位移(傾斜)之態樣使可動部20動作之、各種動作態樣之圖。將該動作統稱為三維動作。此外,在圖10~圖13中亦與圖3~圖9相同,附有編號(a)的圖為立體圖,附有編號(b)的圖為yz平面圖。又,與圖3~圖9相同,亦在圖10~圖13中,示出頂板21伴隨於可動部20的動作而傾斜時的傾斜向量。(3D action)
FIGS. 10 to 13 are diagrams showing various operation states in which the
圖10係表示以將頂板21之x軸方向負側且y軸方向正側之端部下降之態樣,可動部20進行了三維動作時的情況。該情形的頂板21之傾斜向量係表示為(-x、+y、-z)。FIG. 10 shows a state in which the
這是藉由下述來實現,亦即如圖10(b)所示,關於升降機構22a,使其維持以基準狀態靜止,另一方面使升降機構22b~22d,如以箭頭標記AR7a、AR7b、以及AR7c所示,分別以升降機構22d之下降程度成為最大之態樣,往z軸負方向下降。This is achieved by, as shown in FIG. 10( b ), the elevating
此時,伴隨於升降機構22b及22d之下降,軸枕23b及軸枕23d分別如以箭頭標記AR7d及AR7e所示,往y軸正方向引導,並且在圖10(a)中如以箭頭標記AR7f所示,連結板24a由x軸線性導件26a及26b(惟在圖10(a)中未圖示)引導往x軸負方向。At this time, along with the descending of the
另一方面,圖11係表示以將頂板21之x軸方向正側且y軸方向正側之端部下降之態樣,可動部20進行了三維動作時的情況。該情形的頂板21之傾斜向量係表示為(+x、+y、-z)。On the other hand, FIG. 11 shows the case where the
這是藉由下述來實現,亦即如圖11(b)所示,關於升降機構22c,使其維持以基準狀態靜止,另一方面使升降機構22a、22b及22d,如以箭頭標記AR8a、AR8b、以及AR8c所示,分別以升降機構22b之下降程度成為最大之態樣,往z軸負方向下降。This is achieved by, as shown in FIG. 11( b ), the elevating
此時,伴隨於升降機構22b及22d之下降,軸枕23b及軸枕23d如以箭頭標記AR8d所示,往y軸正方向引導,並且在圖11(a)中如以箭頭標記AR8e所示,連結板24a由x軸線性導件26a及26b(惟在圖11(a)中未圖示)引導往x軸正方向。At this time, with the descending of the
又,圖12係表示以將頂板21之x軸方向正側且y軸方向正側之端部提升之態樣,可動部20進行了三維動作時的情況。該情形的頂板21之傾斜向量係表示為(+x、+y、+z)。In addition, FIG. 12 shows the case where the
這是藉由下述來實現,亦即如圖12(b)所示,關於升降機構22c,使其維持以基準狀態靜止,另一方面使升降機構22a、22b及22d,如以箭頭標記AR9a、AR9b、以及AR9c所示,分別以升降機構22b之上升程度成為最大之態樣,往z軸正方向上升。This is achieved by, as shown in FIG. 12( b ), maintaining the elevating
此時,伴隨於升降機構22b及22d之上升,軸枕23b及軸枕23d分別如以箭頭標記AR9d及AR9e所示,往y軸負方向引導。並且,在圖12(a)中,如以箭頭標記AR9f所示,連結板24a由省略圖示之x軸線性導件26a及26b引導往x軸負方向。At this time, the
另一方面,圖13係表示以將頂板21之x軸方向負側且y軸方向正側之端部提升之態樣,可動部20進行了三維動作時的情況。該情形的頂板21之傾斜向量係表示為(-x、+y、+z)。On the other hand, FIG. 13 shows a state in which the
這是藉由下述來實現,亦即如圖13(b)所示,關於升降機構22a,使其維持以基準狀態靜止,另一方面使升降機構22b~22d,如以箭頭標記AR10a、AR10b、以及AR10c所示,分別以升降機構22b之上升程度成為最大之態樣,往z軸正方向上升。This is achieved by, as shown in FIG. 13( b ), the elevating
此時,伴隨於升降機構22b及22d之上升,軸枕23b及軸枕23d如以箭頭標記AR10d所示,往y軸負方向引導,並且如在圖13(a)中以箭頭標記AR10e所示,連結板24a由省略圖示之x軸線性導件26a及26b引導往x軸正方向。At this time, as the
圖10至圖13所示之4種三維動作皆在以下方面共通,亦即,將於在俯視時處於矩形的各頂點之位置從下方支承可動部20之頂板21之4個升降機構22a~22d,藉由設為獨立地升降自如來實現。根據該三維動作,可使沿著刻劃線之延伸方向的垂直面内的力作用於脆性材料基板W。The four three-dimensional motions shown in FIGS. 10 to 13 are common in that the four elevating
這樣的動作,在如專利文獻1及專利文獻2中所揭示的先前的分斷機構中,是絕對無法進行的。Such an operation is absolutely impossible in the conventional breaking mechanisms disclosed in Patent Document 1 and Patent Document 2.
於在沿著分斷預定位置L形成有刻劃線之脆性材料基板W的分斷之際,將此等三維動作組合於正傾斜動作之情形,可使從刻劃線起的裂紋的伸展,不僅在脆性材料基板W的厚度方向亦即z軸方向,亦在分斷預定位置L之延伸方向亦即x軸方向上產生。根據脆性材料基板W之性質與狀態,亦有藉由採用這些動作的組合,來更迅速地且以優異的品質實現分斷之情形。When the brittle material substrate W with the scribe line formed along the planned cleavage position L is divided, these three-dimensional actions are combined with the positive tilt action, so that the crack from the scribe line can be extended, It occurs not only in the thickness direction of the brittle material substrate W, that is, the z-axis direction, but also in the extending direction of the predetermined split position L, that is, the x-axis direction. Depending on the nature and state of the brittle material substrate W, there are cases in which breaking can be achieved more quickly and with excellent quality by adopting a combination of these operations.
進一步而言,在分斷機構100中,藉由適當地組合4個升降機構22a~22d之升降,不限於至此為止例示出之組合,可進行正傾斜動作、反傾斜動作、偏移動作、以及三維動作之任意的組合,因此,可使可動部20以極高的自由度進行動作。藉此,可對脆性材料基板W如人類以手進行分斷時那樣般複雜地且靈活地施加力,而可進行更高精度的分斷。Further, in the
如以上說明,根據本實施形態,對分斷脆性材料之分斷機構採用以下構成,亦即被設為彼此獨立地升降自如的4個升降機構,於在俯視時矩形的各頂點之位置,從下方支承與固定部一起載置固定脆性材料基板之可動部之頂板的構成,據此,可藉由將該等4個升降機構之升降動作適當地組合,來以較先前高的自由度使可動部進行動作。例如,可單獨地進行傾斜動作、偏移動作、以及三維動作,或將它們任意組合。藉此,可對脆性材料基板以先前無法獲得的複雜且靈活的態樣來施加力,而可進行更高精度的分斷。As described above, according to the present embodiment, the breaking mechanism for breaking the brittle material is configured as follows. That is, four lifting mechanisms are provided which are independently movable up and down, and the positions of the vertices of the rectangle in plan view are arranged from The structure of the top plate of the movable part of the brittle material substrate is mounted and fixed by the lower support and the fixed part. According to this, it is possible to make the movable part with a higher degree of freedom than before by appropriately combining the elevating actions of these four elevating mechanisms. Department action. For example, tilt motions, offset motions, and three-dimensional motions may be performed individually, or in any combination. As a result, a force can be applied to the brittle material substrate in a complex and flexible form that was not available before, and higher-precision breaking can be performed.
<第1實施形態之變形例>
在上述實施形態中,雖基於確保頂板21傾斜時的傾斜角之目的,設置y軸線性導件25a及25b、與x軸線性導件26a及26b,但在頂板21之傾斜範圍亦可小的情形中,亦可省略這些線性導件,進而省略連結板24a、24b,而將與各個升降機構22(22a~22d)之上端部連結之軸枕23(23a~23d),直接附設於頂板21之下面。<Variation of the first embodiment>
In the above-described embodiment, the y-axis
或者,亦可為僅省略y軸線性導件25a及25b之態樣、或僅省略x軸線性導件26a及26b之態樣。Alternatively, only the y-axis
又,在上述實施形態中,雖在升降機構22b與頂板21之間、以及升降機構22d與頂板21之間設置y軸線性導件25a及25b,但亦可代替此,採用在升降機構22a與頂板21之間、以及升降機構22c與頂板21之間設置y軸線性導件25a及25b之態樣。Furthermore, in the above-described embodiment, the y-axis
又,在上述實施形態中,雖在升降機構22a與頂板21之間、以及升降機構22b與頂板21之間設置x軸線性導件26a及26b,但亦可代替此,採用在升降機構22c與頂板21之間、以及升降機構22d與頂板21之間設置x軸線性導件26a及26b之態樣。Furthermore, in the above-described embodiment, the x-axis
<第2實施形態>
<分斷機構之概要>
圖14係概略地(概括地)表示本發明之第2實施形態之分斷機構200之構成之圖。更具體而言,圖14係從上方觀察(俯瞰)分斷機構200之情形的概略立體圖。<Second Embodiment>
<Outline of Breaking Mechanism>
FIG. 14 is a diagram schematically (generally) showing the configuration of the
由於分斷機構200之構成要素的大部分與第1實施形態之分斷機構100共通,因此針對它們標記相同符號,並且關於與第1實施形態共通之事項則省略詳細說明。以下,以與第1實施形態的不同點為中心進行說明。Since most of the constituent elements of the
分斷機構200具備固定部10與可動部30。可動部30,係與分斷機構100之可動部20相同,具備頂板31、立設於鉛直方向且分別為獨立地升降自如的4個升降機構32(32a~32d)、以及與該等4個升降機構32之各個的上端部連結之軸枕33(33a~33d)。The
在圖14及接下來的圖式中,設為在可動部30之x軸方向正側之端部30a配置升降機構32a及32b,在x軸方向負側之端部30b配置升降機構32c及32d,且設為各個上端部依序與軸枕33a、33b、33c、33d連結。又,在各個端部30a、30b中,設為升降機構32a及32c係配置在y軸方向負側,升降機構32b及32d係配置在y軸方向正側。In FIG. 14 and the following drawings, it is assumed that the elevating
更詳細而言,軸枕33係與上述第1實施形態之變形例相同,固設於頂板31。More specifically, the
又,升降機構32a及32b係在鉛直方向上固設於在端部30a側沿著y軸方向延伸之連結板34a之上,升降機構32c及32d係在鉛直方向上固設於在端部30b側沿著y軸方向延伸之連結板34b之上。該等連結板34a及34b分別與y軸滑件35a及35b連結,y軸滑件35a及35b分別被設為沿著以在y軸方向延伸態樣固設於在圖14~圖19中未圖示之架台之導軌36a及36b引導自如。Further, the lifting
y軸滑件35a及35b係基於確保在三維動作時頂板31一邊傾斜一邊旋轉時的傾斜角及旋轉角之目的而設。如同後述,藉由使y軸滑件35a及35b伴隨於升降機構32(32a~32d)之升降動作而沿著導軌36a及36b水平移動,來實現頂板31之傾斜及旋轉。The y-
在具有如以上那樣的構成之分斷機構200中,與分斷機構100不同,可動部30之構成相對於yz平面對稱。In the
<分斷動作>
在具有如上述那樣的構成之分斷機構200中,亦與分斷機構100相同,藉由與頂板31連結之各個升降機構32a~32d之獨立的升降動作之組合,可進行各種分斷動作。<Breaking action>
Also in the
關於在x軸方向上無位移之面内動作亦即正傾斜動作、反傾斜動作、以及偏移動作,由於其等皆係藉由使升降機構32a~32d之各個,與分斷機構100之升降機構22a~22d之各個相同地升降而實現,因此省略詳情。惟,由於軸枕33直接固設於頂板31,因此,由各個面内動作所導致的頂板31之傾斜範圍,係成為該軸枕33之傾斜範圍内者。Regarding the in-plane motion without displacement in the x-axis direction, that is, the forward tilt motion, the reverse tilt motion, and the offset motion, since they are all caused by raising and lowering each of the lifting
其次,針對在分斷機構200中實現的可動部30的三維動作進行說明。圖15~圖18係表示在分斷機構200中實現的可動部30的三維動作的各種動作態樣之圖。此外,在圖15及圖16中,與圖3~圖13相同,附有編號(a)的圖為立體圖,附有編號(b)的圖為yz平面圖。又,與圖4~圖13相同,在圖15及圖16中,亦表示頂板31伴隨於可動部30之動作而傾斜時的傾斜向量。另一方面,在圖17及圖18中,僅表示出yz平面圖。Next, the three-dimensional operation of the
圖15係表示以將頂板31之x軸方向正側且y軸方向正側之端部下降之態樣,可動部30進行了三維動作時的情況。該情形的頂板31之傾斜向量係表示為(+x、+y、-z)。FIG. 15 shows a state in which the
這是藉由下述來實現,亦即如圖15(b)所示,關於升降機構32c,使其維持以基準狀態靜止,另一方面使升降機構32a、32b、以及32d,如以箭頭標記AR11a、AR11b、以及AR11c所示,分別以升降機構32b之下降程度成為最大之態樣,往z軸負方向下降。This is achieved by, as shown in FIG. 15( b ), the elevating
此時,對固設有下降程度最大之升降機構32b之連結板34a、及連結該連結板34a之y軸滑件35a,作用往以箭頭標記AR11e所示之y軸正方向的力,y軸滑件35a沿著導軌36a往y軸正方向引導。除此之外,伴隨於該y軸滑件35a之移動,對可動部30作用欲使其在水平面内旋動之繞逆時針之力。At this time, a force in the positive direction of the y-axis indicated by the arrow mark AR11e acts on the connecting
因此,根據分斷預定位置L中的裂紋伸展的程度,伴隨於可動部30之旋動,以脆性材料基板W之x軸方向正側之端部為起點,固定於可動部30之頂板31的第2部分W2,從固定於固定部10的脆性材料基板W的第1部分W1分離,最終,如圖15(a)所示,第2部分W2除了其自身傾斜之外,還成為相對於第1部分W1在水平面内以某一角度+θ
傾斜之狀態。Therefore, depending on the degree of crack extension at the planned breaking position L, along with the rotation of the
另一方面,圖16係表示以將頂板31之x軸方向負側且y軸方向正側之端部下降之態樣,可動部30進行了三維動作時的情況。該情形的頂板31之傾斜向量係表示為(-x、+y、-z)。On the other hand, FIG. 16 shows a case where the
這是藉由下述來實現,亦即如圖16(b)所示,關於升降機構32a,使其維持以基準狀態靜止,另一方面使升降機構32b、32c、以及32d,如以箭頭標記AR12a、AR12b、以及AR12c所示,分別以升降機構32d之下降程度成為最大之態樣,往z軸負方向下降。This is achieved by, as shown in FIG. 16( b ), the elevating
此時,對固設有下降程度最大之升降機構32d之連結板34b、及連結該連結板34b之y軸滑件35b,作用往以箭頭標記AR12d所示之y軸正方向的力,y軸滑件35b沿著導軌36b往y軸正方向引導。除此之外,伴隨於該y軸滑件35b之移動,對可動部30作用在水平面内繞順時針之力。At this time, a force in the positive direction of the y-axis indicated by the arrow mark AR12d acts on the connecting
因此,根據分斷預定位置L中的裂紋伸展的程度,伴隨於可動部30之旋動,以脆性材料基板W之x軸方向負側之端部為起點,從脆性材料基板W之x軸方向負側之端部起,固定於可動部30之頂板31的第2部分W2,從固定於固定部10的脆性材料基板W的第1部分W1分離,最終,如圖16(a)所示,第2部分W2除了其自身傾斜之外,還成為相對於第1部分W1於水平面内以某一角度-θ
傾斜之狀態。Therefore, depending on the degree of crack extension in the planned breaking position L, along with the rotation of the
又,圖17係表示以將頂板31之x軸方向正側且y軸方向正側之端部提升之態樣,可動部30進行了三維動作時的情況。該情形的頂板31之傾斜向量係表示為(+x、+y、+z)。17 shows a state in which the
這是藉由下述來實現,亦即如圖17所示,關於升降機構32c,使其維持以基準狀態靜止,另一方面使升降機構32a、32b、以及32d,如以箭頭標記AR13a、AR13b、以及AR13c所示,分別以升降機構32b之上升程度成為最大之態樣,往z軸正方向上升。This is achieved by, as shown in FIG. 17 , the elevating
此時,對固設有上升程度最大之升降機構32b之連結板34a、及連結該連結板34a之y軸滑件35a,作用往以箭頭標記AR13d所示之y軸正方向的力,y軸滑件35a沿著導軌36a往y軸正方向引導。除此之外,伴隨於該y軸滑件35a之移動,對可動部30作用在水平面内繞逆時針之力。At this time, a force in the positive direction of the y-axis indicated by the arrow mark AR13d acts on the connecting
因此,該情形亦與圖15所示之情形相同,根據分斷預定位置L中的裂紋伸展的程度,伴隨於可動部30之旋動,以脆性材料基板W之x軸方向正側之端部為起點,從脆性材料基板W之x軸方向正側之端部起,固定於可動部30之頂板31的第2部分W2,從固定於固定部10的脆性材料基板W的第1部分W1分離,最終,第2部分W2除了其自身傾斜之外,還成為相對於第1部分W1於水平面内以某一角度+θ
傾斜之狀態。Therefore, in this case, as in the case shown in FIG. 15 , according to the degree of crack extension in the predetermined breaking position L, the end portion on the positive side in the x-axis direction of the brittle material substrate W is accompanied by the rotation of the
進而,圖18係表示以將頂板31之x軸方向負側且y軸方向正側之端部提升之態樣,可動部30進行了三維動作時的情況。該情形的頂板31之傾斜向量係表示為(-x、+y、+z)。Furthermore, FIG. 18 shows a state in which the
這是藉由下述來實現,亦即如圖18所示,關於升降機構32a,使其維持以基準狀態靜止,另一方面使升降機構32b、32c、以及32d,如以箭頭標記AR14a、AR14b、以及AR14c所示,分別以升降機構32d之上升程度成為最大之態樣,往z軸正方向上升。This is achieved by, as shown in FIG. 18 , the elevating
此時,對固設有上升程度最大之升降機構32d之連結板34b、及連結該連結板34b之y軸滑件35b,作用往以箭頭標記AR14d所示之y軸正方向的力,y軸滑件35b沿著導軌36b往y軸正方向引導。除此之外,伴隨於該y軸滑件35b之移動,對可動部30作用在水平面内繞逆時針之力。At this time, a force in the positive direction of the y-axis indicated by the arrow mark AR14d acts on the connecting
因此,該情形亦與圖16所示之情形相同,根據分斷預定位置L中的裂紋伸展的程度,伴隨於可動部30之旋動,以脆性材料基板W之x軸方向正側之端部為起點,從脆性材料基板W之x軸方向負側之端部起,固定於可動部30之頂板31的第2部分W2,從固定於固定部10的脆性材料基板W的第1部分W1分離,最終,第2部分W2除了其自身傾斜之外,還成為相對於第1部分W1於水平面内以某一角度-θ
傾斜之狀態。Therefore, in this case, as in the case shown in FIG. 16 , according to the degree of crack extension in the predetermined breaking position L, the end portion on the positive side in the x-axis direction of the brittle material substrate W is accompanied by the rotation of the
關於如圖15~圖18所示之、在分斷機構200中實現的三維動作,亦與第1實施形態中的三維動作相同,在如專利文獻1及專利文獻2中所揭示的先前的分斷機構中,是絕對無法進行的。The three-dimensional operation realized in the
因此,在使用本實施形態之分斷機構200,將沿著分斷預定位置L形成有刻劃線之脆性材料基板W分斷之情形中,亦可藉由將三維動作組合於正傾斜動作,來使從刻劃線起的裂紋的伸展,不僅在脆性材料基板W的厚度方向亦即z軸方向,亦在分斷預定位置L之延伸方向亦即x軸方向上產生。根據脆性材料基板W之性質與狀態,亦有藉由採用這些動作的組合,來更迅速地且以優異的品質實現分斷之情形。Therefore, in the case of using the
當然,在本實施形態之分斷機構200中,亦與第1實施形態之分斷機構100相同,藉由將4個升降機構32a~32d之升降適當地組合,而可得到正傾斜動作、反傾斜動作、偏移動作、以及三維動作之任意的組合,因此,可使可動部30以極高的自由度來進行動作。藉此,可對脆性材料基板W如人類以手進行分斷時那樣般複雜地且靈活地施加力,而可進行更高精度的分斷。Of course, in the
尤其是,在進行三維動作之際,作用欲使可動部30在水平面内旋動之力,藉此,與第1實施形態相比,可更迅速地實現沿著分斷預定位置L之延伸方向的裂紋的伸展。In particular, when a three-dimensional operation is performed, a force to rotate the
如以上所說明,在本實施形態中,亦在將脆性材料分斷之分斷機構中,可藉由將於在俯視時矩形的各頂點之位置,從下方支承可動部之頂板之4個升降機構的升降動作適當地組合,來以較先前高的自由度使可動部進行動作。此時,亦可作用欲使可動部在水平面内旋動之力。藉此,可對脆性材料基板,以先前無法獲得的複雜且靈活的態樣來施加力,而可進行更高精度的分斷。As described above, in the present embodiment, also in the breaking mechanism for breaking the brittle material, the four top plates that support the movable portion can be raised and lowered from below at the positions of the vertices of the rectangle in plan view. The lifting and lowering operations of the mechanism are appropriately combined to operate the movable portion with a higher degree of freedom than before. At this time, a force to rotate the movable portion in the horizontal plane may also act. As a result, a force can be applied to the brittle material substrate in a complex and flexible form that has not been possible before, so that higher-precision breaking can be performed.
<具備面板抑制件之構成>
圖19係表示分斷機構200之固定部10與可動部30分別具備面板抑制件(夾持構件)11a及11b時的情況之圖。<Construction with panel suppressor>
FIG. 19 is a diagram showing a case where the fixed
面板抑制件11a及11b,為了作為在進行分斷之際更加確保固定部10及可動部30中的脆性材料基板W之固定者,其被設置為,藉由抵接於脆性材料基板W之上面,而可在與固定部10或可動部30之間,夾持脆性材料基板W之第1部分W1及第2部分W2之各個。尤其是在補強脆性材料基板W相對於在進行分斷之際有時會傾斜的可動部30之固定狀態的方面上很有效。鑒於該目的,亦可為僅在可動部30設置面板抑制件之態樣。The
若為圖19所示之情形,則面板抑制件11a及11b皆呈在水平面内在x軸方向上延伸為較脆性材料基板W之尺寸更長的長條棒狀,且設置為在z軸方向上升降自如。In the case shown in FIG. 19 , the
此外,亦可為在第1實施形態之分斷機構100,設置面板抑制件11a及11b之態樣。In addition, the
又,面板抑制件11a及11b之形態不限於圖19所例示者。例如,亦可設置為,僅在脆性材料基板W之x軸方向之兩端部附近,與脆性材料基板W抵接。In addition, the form of the
<基板分斷裝置之概要>
最後,針對具備分斷機構之基板分斷裝置,說明其概要。圖20係表示具備第2實施形態之分斷機構200的基板分斷裝置1000之概略構成之立體圖,圖21係表示該基板分斷裝置1000之主要部分之立體圖。其中,在圖20及圖21中,關於分斷機構200,例示了更詳細的構成。<Outline of substrate cutting device>
Finally, the outline of the substrate cutting device provided with the cutting mechanism will be described. FIG. 20 is a perspective view showing a schematic configuration of a
此外,在圖20及圖21所示之基板分斷裝置1000中,y軸正方向成為脆性材料基板W之搬送方向。將藉由未圖示之搬送手段從(為y軸方向負側之)上游側搬送而來之脆性材料基板W,在以橫跨固定部10與可動部30之方式被載置固定之狀態下執行分斷。而且,藉由該分斷所得之脆性材料基板W之第2部分W2,藉由複數個基板支承搬送機構300而往下游側搬送,被提供至後步驟之處理。In addition, in the
在基板分斷裝置1000中,在架台1001上具備分斷機構200與複數個基板支承搬送機構300。惟,在圖20中,省略基板支承搬送機構300與面板抑制件11a及11b之圖示。In the
分斷機構200之主要構成要素係如同在上述第2實施形態所示。惟,在圖20及圖21中,在固定部10之上面10a及可動部30之頂板31之上面31a,分別示出在圖14~圖18中省略之吸附槽10b及31b。吸附槽10b及31b,係在固定部10之上面10a及頂板31之上面31a設置為格子狀。The main components of the
複數個基板支承搬送機構300係設於在該搬送方向上較可動部30更下游側,換言之係更為y軸方向正側。更詳細而言,各個基板支承搬送機構300,係將在包含基板搬送方向之鉛直面内旋轉自如且以上端部支承基板之各個複數個輥(從動輥),沿著搬送方向排成複數列而成之構成之傳送帶。各個基板支承搬送機構300,係與導軌36a、36b平行地在x軸方向上以既定間隔分隔且設置。The plurality of substrate supporting and conveying
基板分斷裝置1000中,將藉由分斷機構200中的分斷動作而得之脆性材料基板W之第2部分W2,藉由複數個基板支承搬送機構300而往y軸正方向搬送。In the
此外,雖在圖20及圖21中,例示了具備分斷機構200之基板分斷裝置1000,但不具備分斷機構200而具備分斷機構100之基板分斷裝置亦相同地構成。20 and 21 , the
10:固定部
10a:(固定部10之)上面
10b、31b:吸附槽
11a、11b:面板抑制件
20、30:可動部
20a、20b:端部
21、31:頂板
21a:(頂板21之)上面
21b:(頂板21之)下面
22(22a~22d)、32(32a~32d):升降機構
23(23a~23d)、33(33a~33d):軸枕
24a、24b、34c、34d:連結板
25a、25b:y軸線性導件
26a、26b:x軸線性導件
31a:(頂板31之)上面
35a、35b:y軸滑件
36a、36b:導軌
100、200:分斷機構
300:基板支承搬送機構
1000:基板分斷裝置
1001:架台
L:分斷預定位置
W:脆性材料基板
W1:(脆性材料基板之)第1部分
W2:(脆性材料基板之)第2部分10:
[圖1]係從上方觀察分斷機構100之情形的概略立體圖。
[圖2]係從下方觀察分斷機構100之情形的概略立體圖。
[圖3]係表示分斷機構100處於分斷動作之初期狀態時的情況之圖。
[圖4]係表示可動部20進行上升正傾斜動作時的情況之圖。
[圖5]係表示可動部20進行下降正傾斜動作時的情況之圖。
[圖6]係表示可動部20進行上升反傾斜動作時的情況之圖。
[圖7]係表示可動部20進行下降反傾斜動作時的情況之圖。
[圖8]係表示可動部20進行上升偏移動作時的情況之圖。
[圖9]係表示可動部20進行下降偏移動作時的情況之圖。
[圖10]係表示可動部20之三維動作的一態樣之圖。
[圖11]係表示可動部20之三維動作的一態樣之圖。
[圖12]係表示可動部20之三維動作的一態樣之圖。
[圖13]係表示可動部20之三維動作的一態樣之圖。
[圖14]係從上方觀察分斷機構200之情形的概略立體圖。
[圖15]係表示可動部30之三維動作的一態樣之圖。
[圖16]係表示可動部30之三維動作的一態樣之圖。
[圖17]係表示可動部30之三維動作的一態樣之圖。
[圖18]係表示可動部30之三維動作的一態樣之圖。
[圖19]係表示分斷機構200之固定部10與可動部30分別具備面板抑制件11a及11b時的情況之圖。
[圖20]係表示具備分斷機構200之基板分斷裝置1000之概略構成之立體圖。
[圖21]係表示基板分斷裝置1000之主要部分之立體圖。FIG. 1 is a schematic perspective view of a state in which the
10:固定部 10: Fixed part
20:可動部 20: Movable part
20a、20b:端部 20a, 20b: end
21:頂板 21: Top plate
21b:(頂板21之)下面 21b: (of top plate 21) below
22(22a~22d):升降機構 22(22a~22d): Lifting mechanism
23(23a~23d):軸枕 23(23a~23d): Axle pillow
24a、24b:連結板 24a, 24b: connecting plate
25a、25b:y軸線性導件 25a, 25b: y-axis linear guide
26a、26b:x軸線性導件 26a, 26b: x-axis linear guide
100:分斷機構 100: Breaking mechanism
L:分斷預定位置 L: Break the predetermined position
W:脆性材料基板 W: Brittle material substrate
Claims (9)
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JP2020021441A JP7098173B2 (en) | 2020-02-12 | 2020-02-12 | Brittle material Substrate splitting mechanism |
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TW110101915A TW202206383A (en) | 2020-02-12 | 2021-01-19 | Dividing mechanism of brittle material substrate |
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JP (1) | JP7098173B2 (en) |
KR (1) | KR20210102858A (en) |
CN (1) | CN113321410A (en) |
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Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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IT1218088B (en) * | 1988-06-16 | 1990-04-12 | Aisa Spa | EQUIPMENT FOR AUTOMATIC SEPARATION ALONG THE FLEXURAL FRACTURE LINES PREPARED IN BASIC CERAMIC TILES OF HYBRID ELECTRONIC CIRCUITS |
NL9100658A (en) * | 1991-04-15 | 1992-11-02 | Europ Patentverwertung | ARRANGEMENT OF SEPARATION DEVICES. |
KR100835622B1 (en) * | 2001-06-28 | 2008-06-09 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | A brake apparatus of the substrate made of brittle materials and method therefor |
JP2005325004A (en) * | 2004-05-17 | 2005-11-24 | Central Glass Co Ltd | Method and apparatus for cutting wired glass plate |
CN101068666B (en) * | 2004-10-13 | 2011-05-04 | 三星钻石工业株式会社 | Method and apparatus for scribing brittle material board and system for breaking brittle material board |
JP5187421B2 (en) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
JP5935698B2 (en) * | 2011-02-09 | 2016-06-15 | 旭硝子株式会社 | Glass plate cutting method and glass plate cutting device |
JP5796774B2 (en) * | 2011-08-24 | 2015-10-21 | 日本電気硝子株式会社 | Cleaving method and apparatus for brittle plate |
JP2017177453A (en) | 2016-03-29 | 2017-10-05 | 三星ダイヤモンド工業株式会社 | Substrate dividing device |
JP2019196281A (en) * | 2018-05-09 | 2019-11-14 | 三星ダイヤモンド工業株式会社 | Substrate dividing device |
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KR20210102858A (en) | 2021-08-20 |
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