TW202138534A - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
TW202138534A
TW202138534A TW110108839A TW110108839A TW202138534A TW 202138534 A TW202138534 A TW 202138534A TW 110108839 A TW110108839 A TW 110108839A TW 110108839 A TW110108839 A TW 110108839A TW 202138534 A TW202138534 A TW 202138534A
Authority
TW
Taiwan
Prior art keywords
polishing
water
less
polishing composition
weight
Prior art date
Application number
TW110108839A
Other languages
English (en)
Chinese (zh)
Inventor
後藤修
土屋公亮
髙間大輝
山內涼輔
坪內𨺓太郎
後藤彰宏
Original Assignee
日商福吉米股份有限公司
日商東亞合成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司, 日商東亞合成股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202138534A publication Critical patent/TW202138534A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW110108839A 2020-03-13 2021-03-12 研磨用組成物 TW202138534A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020044111 2020-03-13
JP2020-044111 2020-03-13

Publications (1)

Publication Number Publication Date
TW202138534A true TW202138534A (zh) 2021-10-16

Family

ID=77672325

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110108839A TW202138534A (zh) 2020-03-13 2021-03-12 研磨用組成物

Country Status (3)

Country Link
JP (1) JP7752601B2 (https=)
TW (1) TW202138534A (https=)
WO (1) WO2021182276A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119301741A (zh) * 2022-03-31 2025-01-10 福吉米株式会社 研磨用组合物
CN121925986A (zh) * 2023-09-25 2026-04-24 福吉米株式会社 研磨用组合物及研磨方法
CN121909262A (zh) * 2023-09-25 2026-04-21 福吉米株式会社 研磨用组合物及研磨方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014034425A1 (ja) * 2012-08-31 2014-03-06 株式会社 フジミインコーポレーテッド 研磨用組成物及び基板の製造方法
CN105073941B (zh) * 2013-02-21 2018-01-30 福吉米株式会社 研磨用组合物及研磨物制造方法
EP3007213B1 (en) * 2013-06-07 2020-03-18 Fujimi Incorporated Use of a composition for silicon wafer polishing
US10227518B2 (en) * 2013-09-30 2019-03-12 Fujimi Incorporated Polishing composition and method for producing same
WO2015068672A1 (ja) * 2013-11-08 2015-05-14 東亞合成株式会社 半導体用濡れ剤及び研磨用組成物
JP6797796B2 (ja) * 2015-07-01 2020-12-09 東亞合成株式会社 研磨用濡れ剤及び研磨液組成物
KR20190045249A (ko) * 2016-08-31 2019-05-02 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마용 조성물 세트

Also Published As

Publication number Publication date
JP7752601B2 (ja) 2025-10-10
JPWO2021182276A1 (https=) 2021-09-16
WO2021182276A1 (ja) 2021-09-16

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