TW202136355A - 底部填充材料、半導體封裝以及半導體封裝的製造方法 - Google Patents

底部填充材料、半導體封裝以及半導體封裝的製造方法 Download PDF

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Publication number
TW202136355A
TW202136355A TW110102030A TW110102030A TW202136355A TW 202136355 A TW202136355 A TW 202136355A TW 110102030 A TW110102030 A TW 110102030A TW 110102030 A TW110102030 A TW 110102030A TW 202136355 A TW202136355 A TW 202136355A
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TW
Taiwan
Prior art keywords
mass
underfill material
epoxy resin
compound
group
Prior art date
Application number
TW110102030A
Other languages
English (en)
Chinese (zh)
Inventor
増田智也
堀浩士
井上裕紀子
佐藤亮太
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202136355A publication Critical patent/TW202136355A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW110102030A 2020-01-23 2021-01-20 底部填充材料、半導體封裝以及半導體封裝的製造方法 TW202136355A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-009238 2020-01-23
JP2020009238 2020-01-23

Publications (1)

Publication Number Publication Date
TW202136355A true TW202136355A (zh) 2021-10-01

Family

ID=76992393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110102030A TW202136355A (zh) 2020-01-23 2021-01-20 底部填充材料、半導體封裝以及半導體封裝的製造方法

Country Status (3)

Country Link
JP (1) JPWO2021149635A1 (ja)
TW (1) TW202136355A (ja)
WO (1) WO2021149635A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4892164B2 (ja) * 2002-12-27 2012-03-07 日立化成工業株式会社 液状エポキシ樹脂組成物及び電子部品装置
JP5321270B2 (ja) * 2009-06-17 2013-10-23 信越化学工業株式会社 フリップチップ型半導体装置用シリコーンアンダーフィル材およびそれを使用するフリップチップ型半導体装置
JP6370836B2 (ja) * 2015-06-04 2018-08-08 四国化成工業株式会社 表面処理剤、樹脂組成物およびそれらの利用
JP6462539B2 (ja) * 2015-09-04 2019-01-30 四国化成工業株式会社 トリアジン化合物、該化合物の合成方法およびその用途
KR102392225B1 (ko) * 2016-08-30 2022-04-28 린텍 가부시키가이샤 수지 조성물, 수지 시트, 및 반도체 장치

Also Published As

Publication number Publication date
WO2021149635A1 (ja) 2021-07-29
JPWO2021149635A1 (ja) 2021-07-29

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