TW202136062A - 感光性轉印材料及電路配線的製造方法 - Google Patents

感光性轉印材料及電路配線的製造方法 Download PDF

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Publication number
TW202136062A
TW202136062A TW110100688A TW110100688A TW202136062A TW 202136062 A TW202136062 A TW 202136062A TW 110100688 A TW110100688 A TW 110100688A TW 110100688 A TW110100688 A TW 110100688A TW 202136062 A TW202136062 A TW 202136062A
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TW
Taiwan
Prior art keywords
resin layer
photosensitive resin
mass
photosensitive
transfer material
Prior art date
Application number
TW110100688A
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English (en)
Chinese (zh)
Inventor
松田知樹
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202136062A publication Critical patent/TW202136062A/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW110100688A 2020-03-02 2021-01-08 感光性轉印材料及電路配線的製造方法 TW202136062A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020034792 2020-03-02
JP2020-034792 2020-03-02

Publications (1)

Publication Number Publication Date
TW202136062A true TW202136062A (zh) 2021-10-01

Family

ID=77613195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110100688A TW202136062A (zh) 2020-03-02 2021-01-08 感光性轉印材料及電路配線的製造方法

Country Status (3)

Country Link
JP (1) JP7455955B2 (https=)
TW (1) TW202136062A (https=)
WO (1) WO2021176812A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093796A (ja) * 2005-09-27 2007-04-12 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
MY152732A (en) * 2008-04-28 2014-11-28 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
US8460853B2 (en) * 2008-06-02 2013-06-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method

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Publication number Publication date
WO2021176812A1 (ja) 2021-09-10
JPWO2021176812A1 (https=) 2021-09-10
JP7455955B2 (ja) 2024-03-26

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