TW202136062A - 感光性轉印材料及電路配線的製造方法 - Google Patents
感光性轉印材料及電路配線的製造方法 Download PDFInfo
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- TW202136062A TW202136062A TW110100688A TW110100688A TW202136062A TW 202136062 A TW202136062 A TW 202136062A TW 110100688 A TW110100688 A TW 110100688A TW 110100688 A TW110100688 A TW 110100688A TW 202136062 A TW202136062 A TW 202136062A
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- resin layer
- photosensitive resin
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- 238000001020 plasma etching Methods 0.000 description 1
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- 239000013638 trimer Substances 0.000 description 1
- LZTRCELOJRDYMQ-UHFFFAOYSA-N triphenylmethanol Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C1=CC=CC=C1 LZTRCELOJRDYMQ-UHFFFAOYSA-N 0.000 description 1
- JODJRDDQVZMRIY-UHFFFAOYSA-N trityloxyboronic acid Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(OB(O)O)C1=CC=CC=C1 JODJRDDQVZMRIY-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020034792 | 2020-03-02 | ||
| JP2020-034792 | 2020-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202136062A true TW202136062A (zh) | 2021-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| TW110100688A TW202136062A (zh) | 2020-03-02 | 2021-01-08 | 感光性轉印材料及電路配線的製造方法 |
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| Country | Link |
|---|---|
| JP (1) | JP7455955B2 (https=) |
| TW (1) | TW202136062A (https=) |
| WO (1) | WO2021176812A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007093796A (ja) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
| MY152732A (en) * | 2008-04-28 | 2014-11-28 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board |
| US8460853B2 (en) * | 2008-06-02 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method |
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2020
- 2020-12-22 WO PCT/JP2020/048055 patent/WO2021176812A1/ja not_active Ceased
- 2020-12-22 JP JP2022504984A patent/JP7455955B2/ja active Active
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2021
- 2021-01-08 TW TW110100688A patent/TW202136062A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021176812A1 (ja) | 2021-09-10 |
| JPWO2021176812A1 (https=) | 2021-09-10 |
| JP7455955B2 (ja) | 2024-03-26 |
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