JP7455955B2 - 感光性転写材料、及び回路配線の製造方法 - Google Patents

感光性転写材料、及び回路配線の製造方法 Download PDF

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Publication number
JP7455955B2
JP7455955B2 JP2022504984A JP2022504984A JP7455955B2 JP 7455955 B2 JP7455955 B2 JP 7455955B2 JP 2022504984 A JP2022504984 A JP 2022504984A JP 2022504984 A JP2022504984 A JP 2022504984A JP 7455955 B2 JP7455955 B2 JP 7455955B2
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Prior art keywords
resin layer
photosensitive resin
mass
meth
photosensitive
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JP2022504984A
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Japanese (ja)
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JPWO2021176812A1 (https=
Inventor
知樹 松田
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Fujifilm Corp
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2022504984A 2020-03-02 2020-12-22 感光性転写材料、及び回路配線の製造方法 Active JP7455955B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020034792 2020-03-02
JP2020034792 2020-03-02
PCT/JP2020/048055 WO2021176812A1 (ja) 2020-03-02 2020-12-22 感光性転写材料、及び回路配線の製造方法

Publications (2)

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JPWO2021176812A1 JPWO2021176812A1 (https=) 2021-09-10
JP7455955B2 true JP7455955B2 (ja) 2024-03-26

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JP2022504984A Active JP7455955B2 (ja) 2020-03-02 2020-12-22 感光性転写材料、及び回路配線の製造方法

Country Status (3)

Country Link
JP (1) JP7455955B2 (https=)
TW (1) TW202136062A (https=)
WO (1) WO2021176812A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093796A (ja) 2005-09-27 2007-04-12 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
WO2009133817A1 (ja) 2008-04-28 2009-11-05 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
WO2009147913A1 (ja) 2008-06-02 2009-12-10 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093796A (ja) 2005-09-27 2007-04-12 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
WO2009133817A1 (ja) 2008-04-28 2009-11-05 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
WO2009147913A1 (ja) 2008-06-02 2009-12-10 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法

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Publication number Publication date
WO2021176812A1 (ja) 2021-09-10
TW202136062A (zh) 2021-10-01
JPWO2021176812A1 (https=) 2021-09-10

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