TW202128584A - 封裝體及其製造方法、以及覆蓋玻璃及其製造方法 - Google Patents

封裝體及其製造方法、以及覆蓋玻璃及其製造方法 Download PDF

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Publication number
TW202128584A
TW202128584A TW109125080A TW109125080A TW202128584A TW 202128584 A TW202128584 A TW 202128584A TW 109125080 A TW109125080 A TW 109125080A TW 109125080 A TW109125080 A TW 109125080A TW 202128584 A TW202128584 A TW 202128584A
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TW
Taiwan
Prior art keywords
cover glass
glass
aforementioned
main surface
flame
Prior art date
Application number
TW109125080A
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English (en)
Chinese (zh)
Inventor
笹井辰夫
大川大介
中堀宏亮
Original Assignee
日商日本電氣硝子股份有限公司
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Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW202128584A publication Critical patent/TW202128584A/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/09—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the vapour phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW109125080A 2019-10-11 2020-07-24 封裝體及其製造方法、以及覆蓋玻璃及其製造方法 TW202128584A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019187732 2019-10-11
JP2019-187732 2019-10-11

Publications (1)

Publication Number Publication Date
TW202128584A true TW202128584A (zh) 2021-08-01

Family

ID=75437089

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109125080A TW202128584A (zh) 2019-10-11 2020-07-24 封裝體及其製造方法、以及覆蓋玻璃及其製造方法

Country Status (3)

Country Link
JP (1) JPWO2021070442A1 (https=)
TW (1) TW202128584A (https=)
WO (1) WO2021070442A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023166786A1 (ja) * 2022-03-03 2023-09-07 日東電工株式会社 脆性材料チップ、脆性材料シート、脆性材料シートの製造方法及び脆性材料チップの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4628667B2 (ja) * 2002-11-15 2011-02-09 日本電気硝子株式会社 固体撮像素子用カバーガラス
JP2005086100A (ja) * 2003-09-10 2005-03-31 Fuji Photo Film Co Ltd 固体撮像装置
JP2006041201A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 封止型電子部品及びその製造方法
WO2006041074A1 (ja) * 2004-10-12 2006-04-20 Nippon Electric Glass Co., Ltd. 固体撮像素子用カバーガラス及びその製造方法
JP5095114B2 (ja) * 2005-03-25 2012-12-12 富士フイルム株式会社 固体撮像装置の製造方法
JP2008227232A (ja) * 2007-03-14 2008-09-25 Matsushita Electric Ind Co Ltd 半導体デバイスの製造方法、半導体デバイスおよび光ピックアップモジュール
JP6270339B2 (ja) * 2013-05-22 2018-01-31 オリンパス株式会社 撮像装置、撮像装置の製造方法、及び内視鏡システム
CN108292661A (zh) * 2015-11-30 2018-07-17 索尼半导体解决方案公司 固态图像拾取装置、其制造方法及电子设备

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Publication number Publication date
WO2021070442A1 (ja) 2021-04-15
JPWO2021070442A1 (https=) 2021-04-15

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