TW202124636A - 裝置用黏著片 - Google Patents

裝置用黏著片 Download PDF

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Publication number
TW202124636A
TW202124636A TW109134106A TW109134106A TW202124636A TW 202124636 A TW202124636 A TW 202124636A TW 109134106 A TW109134106 A TW 109134106A TW 109134106 A TW109134106 A TW 109134106A TW 202124636 A TW202124636 A TW 202124636A
Authority
TW
Taiwan
Prior art keywords
adhesive layer
curable
compound
component
resin
Prior art date
Application number
TW109134106A
Other languages
English (en)
Chinese (zh)
Inventor
西嶋健太
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=75716215&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW202124636(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202124636A publication Critical patent/TW202124636A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW109134106A 2019-10-30 2020-09-30 裝置用黏著片 TW202124636A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019196917 2019-10-30
JP2019-196917 2019-10-30
JP2020-043698 2020-03-13
JP2020043698 2020-03-13

Publications (1)

Publication Number Publication Date
TW202124636A true TW202124636A (zh) 2021-07-01

Family

ID=75716215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109134106A TW202124636A (zh) 2019-10-30 2020-09-30 裝置用黏著片

Country Status (5)

Country Link
JP (2) JP6980153B2 (ja)
KR (1) KR20220091463A (ja)
CN (1) CN114555737B (ja)
TW (1) TW202124636A (ja)
WO (1) WO2021085008A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117616097A (zh) * 2021-07-20 2024-02-27 琳得科株式会社 固化性粘接剂组合物和固化性粘接片
JP2023127822A (ja) 2022-03-02 2023-09-14 株式会社リコー 液体吐出ヘッド、ヘッドユニット、液体吐出装置
TW202346527A (zh) * 2022-03-03 2023-12-01 日商東洋紡Mc股份有限公司 黏接劑組成物、以及含有其之黏接片、疊層體及印刷配線板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3083307B2 (ja) * 1990-01-12 2000-09-04 旭電化工業株式会社 光学的造形用樹脂組成物
JPH05309785A (ja) * 1992-05-12 1993-11-22 Asahi Chem Ind Co Ltd 耐熱性積層体
JPH06122737A (ja) * 1992-10-09 1994-05-06 Toagosei Chem Ind Co Ltd 硬化性樹脂組成物
JP2001342450A (ja) * 2000-05-30 2001-12-14 Kyocera Corp 接着材およびこれを用いた電子部品
JP4569109B2 (ja) * 2004-01-08 2010-10-27 住友ベークライト株式会社 金属含有ペーストおよび半導体装置
WO2009096342A1 (ja) * 2008-01-28 2009-08-06 Asahi Glass Company, Limited 硬化性組成物、含フッ素硬化物、それらを用いた光学材料および発光素子
TWI482784B (zh) * 2009-02-13 2015-05-01 Solvay Solexis Spa 全氟彈性體
JP5577107B2 (ja) * 2010-01-22 2014-08-20 パナソニック株式会社 樹脂組成物、樹脂組成物の製造方法、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP6172520B2 (ja) * 2013-10-31 2017-08-02 パナソニックIpマネジメント株式会社 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
WO2016147984A1 (ja) * 2015-03-13 2016-09-22 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP6635415B2 (ja) * 2015-06-30 2020-01-22 パナソニックIpマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板
CN106916262B (zh) * 2015-12-25 2020-03-13 太阳油墨(苏州)有限公司 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板
TWI721236B (zh) * 2017-03-28 2021-03-11 日商京瓷股份有限公司 附接著劑之銅箔、銅箔積層板及配線基板
JP2019023263A (ja) * 2017-07-25 2019-02-14 パナソニックIpマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP7090428B2 (ja) 2018-02-05 2022-06-24 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
JP7117498B2 (ja) * 2018-06-26 2022-08-15 パナソニックIpマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
JP7255060B2 (ja) * 2019-04-10 2023-04-11 四国化成工業株式会社 樹脂組成物及びその用途

Also Published As

Publication number Publication date
CN114555737A (zh) 2022-05-27
KR20220091463A (ko) 2022-06-30
JP2022031739A (ja) 2022-02-22
WO2021085008A1 (ja) 2021-05-06
JPWO2021085008A1 (ja) 2021-11-25
CN114555737B (zh) 2024-03-01
JP6980153B2 (ja) 2021-12-15

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