TW202124636A - 裝置用黏著片 - Google Patents
裝置用黏著片 Download PDFInfo
- Publication number
- TW202124636A TW202124636A TW109134106A TW109134106A TW202124636A TW 202124636 A TW202124636 A TW 202124636A TW 109134106 A TW109134106 A TW 109134106A TW 109134106 A TW109134106 A TW 109134106A TW 202124636 A TW202124636 A TW 202124636A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- curable
- compound
- component
- resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09J171/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019196917 | 2019-10-30 | ||
JP2019-196917 | 2019-10-30 | ||
JP2020-043698 | 2020-03-13 | ||
JP2020043698 | 2020-03-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202124636A true TW202124636A (zh) | 2021-07-01 |
Family
ID=75716215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109134106A TW202124636A (zh) | 2019-10-30 | 2020-09-30 | 裝置用黏著片 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6980153B2 (ja) |
KR (1) | KR20220091463A (ja) |
CN (1) | CN114555737B (ja) |
TW (1) | TW202124636A (ja) |
WO (1) | WO2021085008A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117616097A (zh) * | 2021-07-20 | 2024-02-27 | 琳得科株式会社 | 固化性粘接剂组合物和固化性粘接片 |
JP2023127822A (ja) | 2022-03-02 | 2023-09-14 | 株式会社リコー | 液体吐出ヘッド、ヘッドユニット、液体吐出装置 |
TW202346527A (zh) * | 2022-03-03 | 2023-12-01 | 日商東洋紡Mc股份有限公司 | 黏接劑組成物、以及含有其之黏接片、疊層體及印刷配線板 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3083307B2 (ja) * | 1990-01-12 | 2000-09-04 | 旭電化工業株式会社 | 光学的造形用樹脂組成物 |
JPH05309785A (ja) * | 1992-05-12 | 1993-11-22 | Asahi Chem Ind Co Ltd | 耐熱性積層体 |
JPH06122737A (ja) * | 1992-10-09 | 1994-05-06 | Toagosei Chem Ind Co Ltd | 硬化性樹脂組成物 |
JP2001342450A (ja) * | 2000-05-30 | 2001-12-14 | Kyocera Corp | 接着材およびこれを用いた電子部品 |
JP4569109B2 (ja) * | 2004-01-08 | 2010-10-27 | 住友ベークライト株式会社 | 金属含有ペーストおよび半導体装置 |
WO2009096342A1 (ja) * | 2008-01-28 | 2009-08-06 | Asahi Glass Company, Limited | 硬化性組成物、含フッ素硬化物、それらを用いた光学材料および発光素子 |
TWI482784B (zh) * | 2009-02-13 | 2015-05-01 | Solvay Solexis Spa | 全氟彈性體 |
JP5577107B2 (ja) * | 2010-01-22 | 2014-08-20 | パナソニック株式会社 | 樹脂組成物、樹脂組成物の製造方法、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 |
JP6172520B2 (ja) * | 2013-10-31 | 2017-08-02 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
WO2016147984A1 (ja) * | 2015-03-13 | 2016-09-22 | 京セラ株式会社 | 樹脂組成物、プリプレグ、金属張積層板および配線基板 |
JP6635415B2 (ja) * | 2015-06-30 | 2020-01-22 | パナソニックIpマネジメント株式会社 | 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板 |
CN106916262B (zh) * | 2015-12-25 | 2020-03-13 | 太阳油墨(苏州)有限公司 | 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板 |
TWI721236B (zh) * | 2017-03-28 | 2021-03-11 | 日商京瓷股份有限公司 | 附接著劑之銅箔、銅箔積層板及配線基板 |
JP2019023263A (ja) * | 2017-07-25 | 2019-02-14 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
JP7090428B2 (ja) | 2018-02-05 | 2022-06-24 | デクセリアルズ株式会社 | 接着剤組成物、熱硬化性接着シート及びプリント配線板 |
JP7117498B2 (ja) * | 2018-06-26 | 2022-08-15 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
JP7255060B2 (ja) * | 2019-04-10 | 2023-04-11 | 四国化成工業株式会社 | 樹脂組成物及びその用途 |
-
2020
- 2020-09-29 WO PCT/JP2020/036882 patent/WO2021085008A1/ja active Application Filing
- 2020-09-29 CN CN202080074914.6A patent/CN114555737B/zh active Active
- 2020-09-29 KR KR1020227010720A patent/KR20220091463A/ko unknown
- 2020-09-29 JP JP2021521547A patent/JP6980153B2/ja active Active
- 2020-09-30 TW TW109134106A patent/TW202124636A/zh unknown
-
2021
- 2021-11-16 JP JP2021186512A patent/JP2022031739A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN114555737A (zh) | 2022-05-27 |
KR20220091463A (ko) | 2022-06-30 |
JP2022031739A (ja) | 2022-02-22 |
WO2021085008A1 (ja) | 2021-05-06 |
JPWO2021085008A1 (ja) | 2021-11-25 |
CN114555737B (zh) | 2024-03-01 |
JP6980153B2 (ja) | 2021-12-15 |
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