TW202122540A - 聚烯烴系黏接劑組成物 - Google Patents
聚烯烴系黏接劑組成物 Download PDFInfo
- Publication number
- TW202122540A TW202122540A TW109132997A TW109132997A TW202122540A TW 202122540 A TW202122540 A TW 202122540A TW 109132997 A TW109132997 A TW 109132997A TW 109132997 A TW109132997 A TW 109132997A TW 202122540 A TW202122540 A TW 202122540A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive composition
- acid
- mass
- epoxy resin
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
- C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019185262 | 2019-10-08 | ||
JP2019-185262 | 2019-10-08 | ||
JP2019-190928 | 2019-10-18 | ||
JP2019190928 | 2019-10-18 | ||
JP2019190927 | 2019-10-18 | ||
JP2019-190927 | 2019-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202122540A true TW202122540A (zh) | 2021-06-16 |
Family
ID=75437231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109132997A TW202122540A (zh) | 2019-10-08 | 2020-09-24 | 聚烯烴系黏接劑組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6981571B2 (ko) |
KR (1) | KR20220079852A (ko) |
CN (1) | CN114341301B (ko) |
TW (1) | TW202122540A (ko) |
WO (1) | WO2021070606A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021256416A1 (ko) * | 2020-06-16 | 2021-12-23 | ||
KR20240019757A (ko) * | 2021-06-07 | 2024-02-14 | 후지 코피안 가부시키가이샤 | 내열성 점착 필름 |
JP7409568B2 (ja) | 2021-07-09 | 2024-01-09 | 東洋紡エムシー株式会社 | 接着剤組成物、接着シート、電磁波シールド材、積層体およびプリント配線板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57133055A (en) * | 1981-02-12 | 1982-08-17 | Showa Denko Kk | Manufacture of laminate |
JP4008295B2 (ja) * | 2001-06-25 | 2007-11-14 | 日本ポリオレフィン株式会社 | 接着性樹脂組成物及びそれを用いた多層積層構造体並びに容器 |
WO2015046378A1 (ja) | 2013-09-27 | 2015-04-02 | 東亞合成株式会社 | 接着剤組成物及びそれを用いた熱融着性複合部材 |
WO2016031342A1 (ja) * | 2014-08-27 | 2016-03-03 | 東洋紡株式会社 | 低誘電接着剤組成物 |
KR102376057B1 (ko) | 2014-09-24 | 2022-03-18 | 도아고세이가부시키가이샤 | 접착제 조성물 및 이것을 사용한 접착제층 부착 적층체 |
KR20180037215A (ko) * | 2015-08-28 | 2018-04-11 | 디아이씨 가부시끼가이샤 | 라미네이트용 접착제, 다층 필름, 및 이것을 사용한 이차전지 |
WO2017115784A1 (ja) * | 2015-12-28 | 2017-07-06 | 富士フイルム株式会社 | 偏光板保護フィルム及びその製造方法並びに偏光板及び液晶表示装置 |
WO2018030050A1 (ja) * | 2016-08-10 | 2018-02-15 | 東洋紡株式会社 | ポリオレフィン系接着剤組成物 |
WO2018221037A1 (ja) * | 2017-05-29 | 2018-12-06 | 東洋紡株式会社 | ポリオレフィン系接着剤組成物 |
WO2019069896A1 (ja) * | 2017-10-04 | 2019-04-11 | Dic株式会社 | 接着剤、積層体、電池用部材及び電池 |
JP2019127501A (ja) | 2018-01-22 | 2019-08-01 | 藤森工業株式会社 | 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板 |
-
2020
- 2020-09-23 WO PCT/JP2020/035697 patent/WO2021070606A1/ja active Application Filing
- 2020-09-23 KR KR1020227011730A patent/KR20220079852A/ko active Search and Examination
- 2020-09-23 CN CN202080061352.1A patent/CN114341301B/zh active Active
- 2020-09-23 JP JP2021517737A patent/JP6981571B2/ja active Active
- 2020-09-24 TW TW109132997A patent/TW202122540A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP6981571B2 (ja) | 2021-12-15 |
CN114341301A (zh) | 2022-04-12 |
WO2021070606A1 (ja) | 2021-04-15 |
JPWO2021070606A1 (ja) | 2021-11-11 |
CN114341301B (zh) | 2023-09-29 |
KR20220079852A (ko) | 2022-06-14 |
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