TW202120628A - 附絕緣被膜之電磁鋼板 - Google Patents

附絕緣被膜之電磁鋼板 Download PDF

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TW202120628A
TW202120628A TW109136076A TW109136076A TW202120628A TW 202120628 A TW202120628 A TW 202120628A TW 109136076 A TW109136076 A TW 109136076A TW 109136076 A TW109136076 A TW 109136076A TW 202120628 A TW202120628 A TW 202120628A
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Taiwan
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aforementioned
steel sheet
mass
surface treatment
treatment agent
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TW109136076A
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TWI771772B (zh
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中川暢子
多田千代子
村松樹
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日商Ｊｆｅ鋼鐵股份有限公司
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/50—Treatment of iron or alloys based thereon
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Abstract

本發明提供對於厭氧性丙烯酸系接著劑的接著強度、耐腐蝕性及耐張力墊性均優異之附絕緣被膜之電磁鋼板。本揭示之附絕緣被膜之電磁鋼板具有絕緣被膜，該絕緣被膜係將滿足以下條件(1)~(3)之方式含有特定之三烷氧基矽烷及/或二烷氧基矽烷(A)、於構造中不含聚合性不飽和基之矽烷偶合劑(B)、板狀氧化矽(C)、含聚合性不飽和基之化合物(D)及水的表面處理劑塗佈於電磁鋼板之至少一面並乾燥而成。(1)前述(A)與前述(B)之質量比(A/B)為0.05~1.00。(2)前述(C)之含量相對於前述表面處理劑之(A)~(D)的總質量為2~30質量%。(3)前述(D)之含量相對於前述表面處理劑之(A)~(D)的總質量為2~18質量%。

Description

附絕緣被膜之電磁鋼板
本發明有關附絕緣被膜之電磁鋼板，尤其有關適用於汽車用馬達或電氣機器類之鐵心材料，適用於藉由厭氧性丙烯酸系接著劑使電磁鋼板貼合而形成芯之用途，且接著性適合性優異之附絕緣被膜之電磁鋼板。
汽車用馬達或電氣機器類之鐵心等所使用之積層電磁鋼板，過去以來，係將具備絕緣被膜之電磁鋼板複數片重疊後，藉由釘扣或熔接等之方法一體化而製造。近幾年來，為了省能源而對電氣機器之高效率化要求增加。伴隨此，為了減低渦電流損失而有使積層電磁鋼板所使用之電磁鋼板的板厚減薄之傾向。然而，電磁鋼板較薄之情況，不僅難以釘扣或熔接，而且積層電磁鋼板之端面變得容易敞開，而難以保持作為鐵心之形狀。
為了解決該問題，提案以下2種技術以替代以釘扣或熔接將電磁鋼板一體化之技術。前者係將表面形成有接著性絕緣被膜之複數片電磁鋼板熱壓接，形成積層電磁鋼板之技術。後者係於附絕緣被膜之電磁鋼板上塗佈接著劑，將複數片電磁鋼板貼合，形成積層電磁鋼板之技術。作為應用於後者技術之接著劑，已知大多使用厭氧性丙烯酸系接著劑。
專利文獻1中，記載「一種附絕緣被膜之電磁鋼板，其特徵係具有於電磁鋼板之至少單面塗佈表面處理劑並乾燥而成之絕緣被膜，該表面處理劑包含鍵結於Si之烷氧基以外之取代基僅由選自氫、烷氧基及苯基之至少1種非反應性取代基所成之三烷氧基矽烷及/或二烷氧基矽烷(A)、矽烷偶合劑(B)，其質量比(A/B)：0.05~1.0以下，進而以相對於全固形分為2~30質量%包含平均粒徑為0.08~0.9μm且長寬比為10~100之板狀氧化矽(C)」。該絕緣被膜由於不具有接著機能，故有可應用於後者技術之可能性。 [先前技術文獻] [專利文獻]
專利文獻1：日本特開2013-64195號公報
[發明欲解決之課題]
專利文獻1之附絕緣被膜之電磁鋼板，即使於絕緣被膜中不含鉻化合物，對近幾年之電磁鋼板所要求之耐腐蝕性或耐張力墊性仍優異。又，此處所稱之「耐張力墊性」係為了進行線圈之切縫等，而以用以按壓電磁鋼板所用之毯狀之張力墊使絕緣被膜表面鼓起之際的絕緣被膜難以剝落。
然而，依據本發明人等之檢討，專利文獻1之附絕緣被膜之電磁鋼板無法充分獲得對於厭氧性丙烯酸系接著劑之接著強度，得知該方面尚有改良餘地。
因此，本發明係鑑於上述課題，目的在於提供對於厭氧性丙烯酸系接著劑的接著強度、耐腐蝕性及耐張力墊性均優異之附絕緣被膜之電磁鋼板。 [用以解決課題之手段]
為了解決上述課題本發明人等進行積極檢討之結果，獲得如下見解：作為用以在電磁鋼板形成絕緣被膜之表面處理劑成分，含有除了以矽烷偶合劑為主成分之三烷氧基矽烷及/或二烷氧基矽烷與板狀氧化矽以外，進而含有特定量之含聚合性不飽和基之化合物，可達成上述目的。
基於上述見解而完成之本發明要旨構成如以下。 [1] 一種附絕緣被膜之電磁鋼板，其係具有絕緣被膜，該絕緣被膜係將滿足以下條件(1)~(3)之方式含有下述成分： 鍵結至Si之烷氧基以外的取代基僅由選自氫、烷基及苯基之至少1種非反應性取代基而成之三烷氧基矽烷及/或二烷氧基矽烷(A)， 於構造中不含聚合性不飽和基之矽烷偶合劑(B)， 平均粒徑為0.08~0.9μm且長寬比為10~100之板狀氧化矽(C)， 含聚合性不飽和基之化合物(D)，及 水， 之表面處理劑塗佈於電磁鋼板之至少一面並乾燥而成， (1)前述三烷氧基矽烷及/或二烷氧基矽烷(A)與前述矽烷偶合劑(B)之質量比(A/B)為0.05~1.00， (2)前述板狀氧化矽(C)之含量相對於前述表面處理劑之(A)~(D)的總質量為2~30質量%， (3)前述含聚合性不飽和基之化合物(D)之含量相對於前述表面處理劑之(A)~(D)的總質量為2~18質量%。
[2] 一種附絕緣被膜之電磁鋼板，其係具有絕緣被膜，該絕緣被膜係將滿足以下條件(1)~(4)之方式含有下述成分： 鍵結至Si之烷氧基以外的取代基僅由選自氫、烷基及苯基之至少1種非反應性取代基而成之三烷氧基矽烷及/或二烷氧基矽烷(A)， 於構造中不含聚合性不飽和基之矽烷偶合劑(B)， 平均粒徑為0.08~0.9μm且長寬比為10~100之板狀氧化矽(C)， 含聚合性不飽和基之化合物(D)， 潤滑劑(E)，及 水， 之表面處理劑塗佈於電磁鋼板之至少一面並乾燥而成， (1)前述三烷氧基矽烷及/或二烷氧基矽烷(A)與前述矽烷偶合劑(B)之質量比(A/B)為0.05~1.00， (2)前述板狀氧化矽(C)之含量相對於前述表面處理劑之(A)~(E)的總質量為2~30質量%， (3)前述含聚合性不飽和基之化合物(D)之含量相對於前述表面處理劑之(A)~(E)的總質量為2~18質量%， (4)前述潤滑劑(E)之含量相對於前述表面處理劑之(A)~(E)的總質量為0.5~20質量%。 [發明效果]
本發明之附絕緣被膜之電磁鋼板對於厭氧丙烯酸系接著劑的接著強度、耐腐蝕性及耐張力墊性均優異。
以下，針對本發明之實施形態之附絕緣被膜之電磁鋼板加以說明。
(電磁鋼板) 本實施形態中，作為材料之電磁鋼板並未特別限制，過去以來之習知者均適用。亦即，磁通密度高的所謂軟鐵板(電氣鐵板)或SPCC等之一般冷軋鋼板、且為了提高比電阻而含有Si或Al之無方向性電磁鋼板等均能有利地適用。
(表面處理劑) 本實施形態所用之表面處理劑(電磁鋼板用表面處理劑)含有：鍵結至Si之烷氧基以外的取代基僅由選自氫、烷基及苯基之至少1種非反應性取代基而成之三烷氧基矽烷及/或二烷氧基矽烷(A)、於構造中不含聚合性不飽和基之矽烷偶合劑(B)、平均粒徑為0.08~0.9μm且長寬比為10~100之板狀氧化矽(C)、含聚合性不飽和基之化合物(D)及水，且任意含有潤滑劑(E)。
[三烷氧基矽烷及/或二烷氧基矽烷(A)] 本實施形態所用之表面處理劑含有三烷氧基矽烷及/或二烷氧基矽烷(A)。
三烷氧基矽烷之種類並未特別限定，可以通式R1Si(OR’)3 表示，可使用該等之1種以上。R1係選自氫、烷基及苯基之非反應性取代基。R1為烷基之情況，較佳為碳數1~6之直鏈或分支的烷基，更佳為碳數1~3之直鏈或分支的烷基。R’為烷基，較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。可使用例如甲基三甲氧基矽烷、乙基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三乙氧基矽烷、苯基三乙氧基矽烷、苯基三甲氧基矽烷及該等之水解物等。其中，基於電磁鋼板之耐腐蝕性更優異之觀點，較佳係R1為烷基之三烷氧基矽烷。
二烷氧基矽烷之種類並未特別限定，但可以通式R2R3Si(OR”)2 表示，可使用該等之1種以上。此處，R2及R3係選自氫、烷基及苯基之非反應性取代基。R2及R3為烷基之情況，較佳為碳數1~6之直鏈或分支的烷基，更佳為碳數1~3之直鏈或分支的烷基。R”為烷基，較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。可使用例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、二苯基二甲氧基矽烷及該等之水解物等。其中，基於電磁鋼板之耐腐蝕性更優異之觀點，較佳係R2及R3為烷基之二烷氧基矽烷。
[矽烷偶合劑(B)] 本實施形態所用之表面處理劑含有於構造中不含聚合性不飽和基之矽烷偶合劑(B)。矽烷偶合劑(B)之種類只要於構造中不含聚合性不飽和基，則未特別限定，可以通式XSi(R4)n (OR)3-n (其中n為0、1或2)表示，可同時使用該等之1種以上。X係具有選自含活性氫之胺基、環氧基及巰基之至少1種反應性官能基之分子鏈。R4為烷基，較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。OR為任意之水解性基，R為例如烷基，較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。且R為例如醯基(-COR5)，R5較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。作為矽烷偶合劑(B)可使用例如N-(胺基乙基)3-胺基丙基三甲氧基矽烷、3-胺基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二甲氧基矽烷、2-(3,4-環氧基環己基)乙基三乙氧基矽烷、3-巰基丙基三甲氧基矽烷及該等之水解物等。其中，基於電磁鋼板之耐腐蝕性更優異之觀點，較佳為具有胺基或環氧基之矽烷偶合劑。
[成分(A)與成分(B)之含量比] 本實施形態中，三烷氧基矽烷及/或二烷氧基矽烷(A)與矽烷偶合劑(B)之質量比(A/B)設為0.05~1.00之範圍。質量比超過1.00之情況，矽烷偶合劑(B)之量不充分，無法充分獲得絕緣被膜之強韌性。其結果，容易產生耐張力墊性劣化或處理時之傷痕或被膜剝離等。本揭示中，藉由相較於三烷氧基矽烷及/或二烷氧基矽烷(A)，矽烷偶合劑(B)含有較多，而可顯著提高耐張力墊性。基於該觀點，質量比(A/B)設為1.00以下，較佳為0.50以下。另一方面，質量比(A/B)若過低，則TIG熔接性降低。基於該觀點，質量比(A/B)設為0.05以上，較佳為0.10以上。
[板狀氧化矽(C)] 本實施形態所用之表面處理劑含有板狀氧化矽(C)。該板狀氧化矽(C)係亦稱為葉狀氧化矽或鱗片狀氧化矽者，具有SiO2 之薄層多數層積層而成之層狀矽酸構造。因此，作為該板狀氧化矽，較佳為具有非結晶性或微結晶性者。板狀氧化矽可藉由製作薄層之一次粒子積層而成之凝集粒子，將該凝集粒子粉碎而獲得。此等板狀氧化矽由於設為層狀形態，故與一般氧化矽粒子例如膠體氧化矽等比較，腐蝕物質透過抑制性優異，進而由於羥基較多，故密接性優異，且為軟質故而平滑性優異。且塗佈含有板狀氧化矽之表面處理劑之情況，表面處理劑亦會殘留於塗佈量往往較少之銅板表面凸部，而可塗佈沿著鋼板表面凹凸之均一表面處理劑，故耐腐蝕性不會差。
板狀氧化矽(C)較佳係平均粒徑為0.08~ 0.9μm且長寬比為10~100之範圍，更佳係平均粒徑為0.1~ 0.5μm左右、長寬比為20~90。平均粒徑為0.08μm以上且長寬比為10以上之情況，對被膜形態具有效果，被膜變得充分均一化。且平均粒徑為0.9μm以下且長寬比為100以下之情況，三烷氧基矽烷及/或二烷氧基矽烷(A)與矽烷偶合劑(B)被納入絕緣被膜中變得充分，耐張力墊性變得充分。
板狀氧化矽(C)若平均粒徑為0.1~0.3μm且長寬比為10~50，則衝打性優異進而更佳。平均粒徑若為0.1μm以上，則因衝打而使板狀氧化矽粉碎所致之粉發生不多，而不會汙染模具，故衝打性優異。且，板狀氧化矽之平均粒徑越大，有衝打時模具磨耗變多之傾向，但因平均粒徑為0.3μm以下，故模具磨耗不成為問題，衝打性優異。再者，長寬比若為10~50，則如前述衝打時容易變形，尤其是衝打性優異。且長寬比若為50以下，則由於更可沿著鋼板表面之凹凸形成均一被膜，故耐腐蝕性亦優異。
又，本說明書中板狀氧化矽之「平均粒徑」意指以掃描型電子顯微鏡(SEM)以倍率2萬倍觀察絕緣被膜剖面時，針對板狀氧化矽之垂直於厚度之面的長徑，以視野中所有粒子予以平均之長度。又，本說明書中板狀氧化矽之「長寬比」意指以SEM以倍率2萬倍觀察絕緣被膜剖面時，針對各粒子將板狀氧化矽之垂直於厚度之面的長徑/最大厚度比之值，針對視野中所有粒子予以平均之值。
板狀氧化矽(C)之含量，相對於表面處理劑之(A)~(E)的總質量為2~30質量%之範圍，較佳為5質量%以上，較佳為20質量%以下。亦即該含量於表面處理劑不含潤滑劑(E)之情況，意指相對於(A)~(D)的總質量之含量。含量若為2質量%以上，則獲得均一塗佈性優異之電磁鋼板，含量若為30質量%以下，則耐腐蝕性及耐張力墊性不會降低。
[含聚合性不飽和基之化合物(D)] 本實施形態所用之表面處理劑重要的是含有含聚合性不飽和基之化合物(D)。作為含聚合性不飽和基之化合物(D)舉例為例如具有選自乙烯基、伸乙烯基及亞乙烯基之至少1種聚合性不飽和基之化合物。含聚合性不飽和基之化合物(D)可為單體，亦可為聚合物(包含寡聚物)。
作為含聚合性不飽和基之化合物(D)之例，舉例為具有選自乙烯基、伸乙烯基及亞乙烯基之至少1種聚合性不飽和基之聚酯樹脂、聚醚樹脂、丙烯酸樹脂、環氧樹脂、胺基甲酸酯樹脂等。該等聚合物之重量平均分子量較佳為5000~750000之範圍內。又，本說明書中，前述聚合物之重量平均分子量係以凝膠滲透層析(GPC)法，具體為以下方法而算出者。GPC法中之測量機器係使用高速GPC裝置(TOSOH股份有限公司製HLC-8320GPC)。預先求出利用標準試料而已知之重量平均分子量與溶出時間之關係，作成自溶出時間求出重量平均分子量之校正線。藉以下裝置及操作條件測量前述聚合物之溶出時間，參考前述校正線，算出重量平均分子量(聚苯乙烯換算)。 ＜裝置及操作條件＞ 分離管柱：TOSOH股份有限公司製TSKgelSuperAWM-H (2根串聯連接使用) 檢測器：示差折射計 管柱溫度：40℃ 移動相：關東化學股份有限公司製N,N-二甲基甲醯胺(10mmol/L LiBr) 標準試料：標準聚苯乙烯套組(TOSOH股份有限公司製PStQuick B) 試料濃度：0.1質量% 試料注入量：30μL(微升) 流速：0.5mL/min
作為單體之含聚合性不飽和基之化合物(D)之例，舉例為具有選自乙烯基、伸乙烯基及亞乙烯基之至少1種聚合性不飽和基之矽烷偶合劑。亦即作為含聚合性不飽和基之化合物(D)之矽烷偶合劑係以通式YSi(R6)m (OR’”)3-m (其中，m為0、1或2)表示，可同時使用該等之1種以上。Y係具有選自乙烯基、伸乙烯基及亞乙烯基之至少1種聚合性不飽和基之分子鏈。R6為烷基，較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。OR’”為任意之水解性基，R’”為例如烷基，較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。且R’” 為例如醯基(-COR7)，R7較佳為碳數1~4之直鏈或分支的烷基，更佳為碳數1~2之直鏈或分支的烷基。作為此等矽烷偶合劑可使用例如乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷及該等之水解物等。
又，作為具有乙烯基之單體，可舉例為丙烯酸、丙烯酸甲酯，作為具有伸乙烯基之單體舉例為富馬酸、苯二甲酸、馬來酸等，作為具有亞乙烯基之單體舉例為甲基丙烯酸、甲基丙烯酸甲酯等。
本實施形態中，自該等含聚合性不飽和基之化合物中，可選擇1種或2種以上。
含聚合性不飽和基之化合物(D)之含量，重要的是相對於表面處理劑之(A)~(E)的總質量為2~18質量%，較佳為15質量%以下。亦即該含量於表面處理劑不含潤滑劑(E)之情況，意指相對於(A)~(D)的總質量之含量。含量若為2質量%以上，則獲得對厭氧性丙烯酸系接著劑之充分接著強度，含量若為18質量%以下，則於嚴苛條件下之耐張力墊性不會降低。
[潤滑劑(E)] 本實施形態所用之表面處理劑，為了提高衝打性及耐張力墊性，可任意含有潤滑劑(E)。作為潤滑劑(E)，舉例為聚乙烯蠟、氧化聚乙烯蠟、氧化聚丙烯蠟、巴西棕櫚蠟、石蠟、褐煤蠟、米糠蠟、鐵氟龍(註冊商標)蠟、二硫化碳、石墨等。又作為潤滑劑(E)，亦可使用非離子性丙烯酸樹脂。作為非離子性丙烯酸樹脂舉例為例如將丙烯酸、甲基丙烯酸、丙烯酸酯、甲基丙烯酸酯、苯乙烯等之乙烯基系單體在構造上具有聚氧化乙烯或聚氧化丙烯之非離子系界面活性劑(乳化劑)存在下，於水中乳化聚合之水系乳液等、以非離子性乳化劑乳化之丙烯酸樹脂。自該等潤滑劑中，可使用1種或2種以上。
表面處理劑含潤滑劑(E)之情況，其含量相對於表面處理劑之(A)~(E)的總質量較佳為0.5~20質量%，更佳為2~15質量%。含量為0.5質量%以上之情況，充分獲得耐張力墊性之提高，含量為20質量%以下之情況，對厭氧性丙烯酸系接著劑之接著特性不會降低。
本實施形態所用之表面處理劑較佳為水以外之成分係由上述(A)~(D)或上述(A)~(E)而成，但根據需要，亦可以相對於表面處理劑之(A)~(E)的總質量為5質量%以下含有其他成分。該含量於表面處理劑不含潤滑劑(E)之情況，意指相對於(A)~(D)的總質量之含量。作為其他成分舉例為醇、酮、溶纖素系之水溶性溶劑、界面活性劑、消泡劑、調平劑、pH調整劑、防菌防黴劑等。藉由添加該等成分，可提高表面處理劑之乾燥性、塗佈外觀、作業性、設計性。
本實施形態所用之表面處理劑係藉由將上述各成分於去離子水、蒸餾水等之水中混合而獲得。表面處理劑之(A)~(E)的總質量之比例只要適當選擇即可，但較佳為2~16質量%之範圍。
(附絕緣被膜之電磁鋼板之製造方法) 本實施形態係藉由於電磁鋼板之至少單面塗佈表面處理劑並加熱乾燥而形成絕緣被膜。作為將表面處理劑塗佈於電磁鋼板之方法，舉例為輥塗佈法、棒塗佈法、浸漬法、噴霧塗佈法等，係根據被處理之電磁鋼板之形狀等選擇最適宜方法。更具體而言，例如電磁鋼板若為薄片狀，則可選擇輥塗佈法、棒塗佈法或噴霧塗佈法。噴霧塗佈法係將表面處理劑噴霧於電磁鋼板並藉輥擰絞或以高壓吹出氣體而調整塗佈量之方法。電磁鋼板若為成型品之情況時，浸漬於表面處理劑後取出，再依情況選擇以壓縮空氣吹掉多餘的表面處理劑而調整塗佈量之方法等。
塗佈於電磁鋼板表面之表面處理劑之加熱乾燥時之加熱溫度(最高到達板溫)通常為80~350℃，更佳為100~300℃。加熱溫度若為80℃以上，由於絕緣被膜中不殘存主溶劑的水分，故耐腐蝕性不會劣化。且加熱溫度若為350℃以下，則由於絕緣被膜之龜裂產生受到抑制，故故耐腐蝕性不會劣化。且加熱時間係根據所使用之電磁鋼板種類等而定，選擇最適宜條件。又，基於生產性等之觀點，較佳為0.1~60秒，更佳為1~30秒。
絕緣被膜之附著量並未特別限定，但較佳每單面為0.05~5g/m2 左右。附著量亦即絕緣被膜之總固形分質量可自利用鹼剝離去除被膜後之重量減少而測定。且，附著量少之情況，可自藉由鹼剝離法而測定之附著量已知的標準試料藉由螢光X射線分析測定所得之校正線而測定。附著量若為0.05g/m2 以上，則可同時滿足耐腐蝕性與絕緣性，另一方面若為5g/m2 以下，則不僅被膜密著性提高，塗膜燒結實亦不會發生膨脹，不會導致塗裝性降低。更佳為0.1~3.0g/m2 。較佳於電磁鋼板兩面形成絕緣被膜，但亦可根據目的僅形成於單面，另一面設為其他絕緣被膜亦可。
以下使用實施例進一步詳細說明本發明，但本發明不受以下實施例之任何限定。 [實施例]
(1)材料 使用板厚：0.5mm之電磁鋼板[A230(JIS C 2552 (2000))]作為供試材。
(2)前處理(洗淨) 作為試驗板之製作方法，首先使用Nihon Parkerizing (股)製PARCLEAN N364S處理上述供試材表面，去除表面上之油分或汙垢。其次以自來水進行水洗，確認供試材表面被水100%濡濕後，進而流過純水(去離子水)，於100℃環境之烘箱中乾燥者，使用作為試驗板。
(3)表面處理劑 各成分以表1所示之組成(質量比)於水中混合，獲得表面處理劑。又，成分(A)~(E)的總質量相對於表面處理劑之濃度設為6.3g/L。以下針對表1中使用之化合物加以說明。
[三烷氧基矽烷及/或二烷氧基矽烷(A)] A1：甲基三甲氧基矽烷 A2：二甲基二甲氧基矽烷
[矽烷偶合劑(B)] B1：3-縮水甘油氧基丙基三甲氧基矽烷 B2：3-胺基丙基三甲氧基矽烷 B3：N-(胺基乙基) 3-胺基丙基三甲氧基矽烷
[板狀氧化矽(C)] C1：平均粒徑0.2μm，長寬比20 C2：平均粒徑0.5μm，長寬比50 C3：平均粒徑0.1μm，長寬比10
[含聚合性不飽和基之化合物(D)] D1：丙烯酸酯改質胺基甲酸酯樹脂(重量平均分子量：7500) D2：乙烯基三甲氧基矽烷 D3：3-甲基丙烯醯氧基丙基三甲氧基矽烷 D4：富馬酸 D5：(甲基)丙烯醯基改質胺基甲酸酯樹脂(重量平均分子量：7500) D6：丙烯醯基改質胺基甲酸酯樹脂(重量平均分子量：500000)
[潤滑劑(E)] E1：聚乙烯蠟(CHEMIPEARL 900)
(4)處理方法 於連續燒鈍產線中進行為了獲得特定材質之燒鈍後，於鋼板經冷卻之階段以輥塗佈機塗佈表面處理劑，以烘箱使最高到達板溫為200℃之方式予以乾燥，於兩面形成被膜附著量0.5g/m2 之絕緣被膜。作為輥塗佈機條件，係設為以3根輥全逆轉之方式。又，最高到達板溫表示試驗板表面之最高到達溫度。
(5)評價 [接著特性] 接著強度評價用試驗片之大小設為25mm×100mm，依據DINEN 1465(2009-07)製作剪切拉伸試驗片，實施剪切拉伸試驗。具體而言，經由接著劑將2片試驗片之絕緣被膜彼此接著，對與接著面平行之方向施加拉伸荷重，將接著面被破壞時之最大荷重除以接著面積，求出拉伸剪切強度。作為接著劑使用ASEC(股)製之厭氧性丙烯酸系接著劑AS5334，作為起始劑使用ASEC(股)製之AS8000。藉以下判定基準評價拉伸剪切強度。結果示於表1。又，若為◎或○則為合格。 (判定基準) ◎：8MPa以上 ○：5MPa以上且未達8MPa ×：未達5MPa
[耐腐蝕性] 將衝打成50mm×50mm之供試材2片重疊，放上200g之鉛錘，於50℃、相對濕度80%之恆溫恆濕槽中放置2週。以目視測定重疊之2面的平均生鏽面積率。結果示於表1。又，若為◎或○則為合格。 (判定基準) ◎：0% ○：超過0%且未達5% ×：5%以上
[耐張力墊性] 使用面積為10mm×10mm之張力墊，以太平理化工業(股)製摩擦測試機，施加19.6N(2.0kgf)之荷重於絕緣被膜表面往返摩擦100次。進行摩擦部分與其附近之附著量測定，算出100次往返後之絕緣被膜殘存率。附著量係測定Si之螢光X射線強度，自由附著量已知之標準板獲得之校正線求出。結果示於表1。又，若為◎或○則為合格。 (判定基準) ◎：90%以上 ○：70%以上且未達90% ×：未達70%
[嚴苛條件下之耐張力墊性] 除了將100次往返變更為200次往返以外，以與上述同樣方法及判定基準，評價耐張力墊性。結果示於表1。又，若為◎或○則為合格。
Figure 02_image001
Figure 02_image003
Figure 02_image005
[產業上之可利用性]
本發明之附絕緣被膜之電磁鋼板，由於對於厭氧丙烯酸系接著劑的接著強度、耐腐蝕性及耐張力墊性均優異，故適用於汽車用馬達或電氣機器類之鐵心的材料。

Claims (2)

  1. 一種附絕緣被膜之電磁鋼板，其係具有絕緣被膜，該絕緣被膜係將滿足以下條件(1)~(3)之方式含有下述成分： 鍵結至Si之烷氧基以外的取代基僅由選自氫、烷基及苯基之至少1種非反應性取代基而成之三烷氧基矽烷及/或二烷氧基矽烷(A)， 於構造中不含聚合性不飽和基之矽烷偶合劑(B)， 平均粒徑為0.08~0.9μm且長寬比為10~100之板狀氧化矽(C)， 含聚合性不飽和基之化合物(D)，及 水， 之表面處理劑塗佈於電磁鋼板之至少一面並乾燥而成， (1)前述三烷氧基矽烷及/或二烷氧基矽烷(A)與前述矽烷偶合劑(B)之質量比(A/B)為0.05~1.00， (2)前述板狀氧化矽(C)之含量相對於前述表面處理劑之(A)~(D)的總質量為2~30質量%， (3)前述含聚合性不飽和基之化合物(D)之含量相對於前述表面處理劑之(A)~(D)的總質量為2~18質量%。
  2. 一種附絕緣被膜之電磁鋼板，其係具有絕緣被膜，該絕緣被膜係將滿足以下條件(1)~(4)之方式含有下述成分： 鍵結至Si之烷氧基以外的取代基僅由選自氫、烷基及苯基之至少1種非反應性取代基而成之三烷氧基矽烷及/或二烷氧基矽烷(A)， 於構造中不含聚合性不飽和基之矽烷偶合劑(B)， 平均粒徑為0.08~0.9μm且長寬比為10~100之板狀氧化矽(C)， 含聚合性不飽和基之化合物(D)， 潤滑劑(E)，及 水， 之表面處理劑塗佈於電磁鋼板之至少一面並乾燥而成， (1)前述三烷氧基矽烷及/或二烷氧基矽烷(A)與前述矽烷偶合劑(B)之質量比(A/B)為0.05~1.00， (2)前述板狀氧化矽(C)之含量相對於前述表面處理劑之(A)~(E)的總質量為2~30質量%， (3)前述含聚合性不飽和基之化合物(D)之含量相對於前述表面處理劑之(A)~(E)的總質量為2~18質量%， (4)前述潤滑劑(E)之含量相對於前述表面處理劑之(A)~(E)的總質量為0.5~20質量%。
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Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JP4571838B2 (ja) * 2004-08-10 2010-10-27 新日本製鐵株式会社 耐熱接着性絶縁皮膜付き電磁鋼板及びその製造方法
JP5098327B2 (ja) * 2005-12-28 2012-12-12 Ｊｆｅスチール株式会社 絶縁被膜を有する電磁鋼板
DE102008000499A1 (de) * 2008-03-04 2009-09-10 Evonik Degussa Gmbh Kieselsäure sowie Epoxidharze
US20100015339A1 (en) 2008-03-07 2010-01-21 Evonik Degussa Gmbh Silane-containing corrosion protection coatings
WO2010146821A1 (ja) * 2009-06-17 2010-12-23 新日本製鐵株式会社 絶縁被膜を有する電磁鋼板及びその製造方法
WO2013031200A1 (ja) * 2011-08-31 2013-03-07 Ｊｆｅスチール株式会社 絶縁被膜付き電磁鋼板
JP5729272B2 (ja) * 2011-11-25 2015-06-03 Ｊｆｅスチール株式会社 絶縁被膜付き電磁鋼板
JP5974636B2 (ja) * 2012-05-29 2016-08-23 Ｊｆｅスチール株式会社 絶縁被膜付き電磁鋼板
KR20140008871A (ko) * 2012-07-12 2014-01-22 삼성전기주식회사 빌드업 절연필름용 에폭시 수지 조성물, 이로부터 제조된 절연 필름 및 이를 구비한 다층 인쇄회로기판
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KR101849892B1 (ko) * 2014-03-31 2018-04-17 교리쯔 가가꾸 산교 가부시키가이샤 경화 후 유연성이 우수한 경화성 수지, (메트)아크릴화 경화성 수지 및 액정 밀봉제 조성물
KR101696604B1 (ko) * 2014-10-08 2017-01-17 삼화페인트공업주식회사 도금 강판용 유무기 하이브리드 코팅 조성물
WO2016163116A1 (ja) * 2015-04-07 2016-10-13 Ｊｆｅスチール株式会社 絶縁被膜付き電磁鋼板
CN105505294B (zh) * 2015-12-22 2018-08-07 广东标美硅氟新材料有限公司 一种用于加成型硅橡胶与干式变压器材料粘接的底涂剂
JP6404977B2 (ja) * 2016-03-31 2018-10-17 Ｊｆｅスチール株式会社 耐熱接着性絶縁被膜用組成物および絶縁被膜付き電磁鋼板
WO2018043429A1 (ja) * 2016-09-01 2018-03-08 三菱電機株式会社 積層鉄心、積層鉄心の製造方法、および積層鉄心を用いた電機子
JP2018163744A (ja) * 2017-03-24 2018-10-18 日立化成株式会社 電気絶縁用樹脂組成物とその製造方法及び前記樹脂組成物を用いた電気機器とその製造方法
CN111433303A (zh) * 2017-12-18 2020-07-17 三键有限公司 粘接层叠钢板用自由基聚合性粘接剂组合物、粘接层叠体、电动机及粘接层叠体的制造方法
JP7319760B2 (ja) * 2017-12-20 2023-08-02 出光興産株式会社 金属加工油組成物、及び金属板積層体の製造方法

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