TW202112496A - 研磨裝置、研磨方法、及基板處理裝置 - Google Patents

研磨裝置、研磨方法、及基板處理裝置 Download PDF

Info

Publication number
TW202112496A
TW202112496A TW109123683A TW109123683A TW202112496A TW 202112496 A TW202112496 A TW 202112496A TW 109123683 A TW109123683 A TW 109123683A TW 109123683 A TW109123683 A TW 109123683A TW 202112496 A TW202112496 A TW 202112496A
Authority
TW
Taiwan
Prior art keywords
substrate
polishing
element surface
wafer
cleaning
Prior art date
Application number
TW109123683A
Other languages
English (en)
Chinese (zh)
Inventor
中西正行
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202112496A publication Critical patent/TW202112496A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B24B55/08—Dust extraction equipment on grinding or polishing machines specially designed for belt grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW109123683A 2019-09-03 2020-07-14 研磨裝置、研磨方法、及基板處理裝置 TW202112496A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-160218 2019-09-03
JP2019160218A JP7406943B2 (ja) 2019-09-03 2019-09-03 研磨装置、研磨方法、および基板処理装置

Publications (1)

Publication Number Publication Date
TW202112496A true TW202112496A (zh) 2021-04-01

Family

ID=74847361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109123683A TW202112496A (zh) 2019-09-03 2020-07-14 研磨裝置、研磨方法、及基板處理裝置

Country Status (3)

Country Link
JP (1) JP7406943B2 (enrdf_load_stackoverflow)
TW (1) TW202112496A (enrdf_load_stackoverflow)
WO (1) WO2021044694A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849712B (zh) * 2022-01-31 2024-07-21 日商斯庫林集團股份有限公司 基板處理方法以及基板處理裝置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024090389A (ja) * 2022-12-23 2024-07-04 株式会社荏原製作所 基板処理装置、および基板処理方法
CN117260515B (zh) * 2023-11-22 2024-02-13 北京特思迪半导体设备有限公司 抛光机的动态联动控制方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP4507967B2 (ja) 2005-04-20 2010-07-21 セイコーエプソン株式会社 基板の洗浄装置
JP6210935B2 (ja) 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP2017108113A (ja) 2015-11-27 2017-06-15 株式会社荏原製作所 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム
JP7148349B2 (ja) * 2017-11-14 2022-10-05 株式会社荏原製作所 基板処理装置および基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849712B (zh) * 2022-01-31 2024-07-21 日商斯庫林集團股份有限公司 基板處理方法以及基板處理裝置

Also Published As

Publication number Publication date
JP7406943B2 (ja) 2023-12-28
WO2021044694A1 (ja) 2021-03-11
JP2021040022A (ja) 2021-03-11

Similar Documents

Publication Publication Date Title
KR102322525B1 (ko) 기판의 표면을 처리하는 장치 및 방법
US20240091899A1 (en) Polishing apparatus
TW417194B (en) A cleaner
JP3979750B2 (ja) 基板の研磨装置
TWI774776B (zh) 基板研磨方法及裝置、以及基板處理方法
CN105479324A (zh) 研磨装置及处理方法，抛光处理装置及方法
JP2014167996A (ja) 研磨装置および研磨方法
TW202112496A (zh) 研磨裝置、研磨方法、及基板處理裝置
JP2001018169A (ja) 研磨装置
TWI765125B (zh) 基板處理裝置、基板處理方法、及儲存有程式之儲存媒介
TWI788454B (zh) 基板處理裝置及基板處理方法
JP3560051B2 (ja) 基板の研磨方法及び装置
JP6445298B2 (ja) 研磨装置、及び、処理方法
JP2017174940A (ja) 研磨装置および研磨方法
KR102628175B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP6346541B2 (ja) バフ処理装置、および、基板処理装置
JP2019042923A (ja) 研磨装置、及び、処理方法
JP2023097533A (ja) 研磨装置および研磨方法
WO2024135111A1 (ja) 基板処理装置、および基板処理方法
JP2016078156A (ja) 処理モジュール
TW201842983A (zh) 清洗基板裏面的裝置及方法