TW202043034A - 積層體 - Google Patents

積層體 Download PDF

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Publication number
TW202043034A
TW202043034A TW109109836A TW109109836A TW202043034A TW 202043034 A TW202043034 A TW 202043034A TW 109109836 A TW109109836 A TW 109109836A TW 109109836 A TW109109836 A TW 109109836A TW 202043034 A TW202043034 A TW 202043034A
Authority
TW
Taiwan
Prior art keywords
copper
laminate
copper member
less
laminated
Prior art date
Application number
TW109109836A
Other languages
English (en)
Chinese (zh)
Inventor
小畠直貴
佐藤牧子
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202043034A publication Critical patent/TW202043034A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2371/00—Polyethers, e.g. PEEK, i.e. polyether-etherketone; PEK, i.e. polyetherketone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW109109836A 2019-05-09 2020-03-24 積層體 TW202043034A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019089122A JP7328671B2 (ja) 2019-05-09 2019-05-09 積層体
JP2019-089122 2019-05-09

Publications (1)

Publication Number Publication Date
TW202043034A true TW202043034A (zh) 2020-12-01

Family

ID=73044462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109109836A TW202043034A (zh) 2019-05-09 2020-03-24 積層體

Country Status (5)

Country Link
JP (1) JP7328671B2 (ja)
KR (1) KR20220007038A (ja)
CN (1) CN113677519A (ja)
TW (1) TW202043034A (ja)
WO (1) WO2020226162A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144944A (ja) * 1996-09-12 1998-05-29 Canon Inc 光起電力素子
JP4528204B2 (ja) * 2005-05-31 2010-08-18 日立ビアメカニクス株式会社 プリント配線板の製造方法
JP2008173967A (ja) * 2006-12-18 2008-07-31 Taisei Plas Co Ltd 金属と樹脂の複合体とその製造方法
JP4965649B2 (ja) * 2007-04-06 2012-07-04 大成プラス株式会社 銅合金複合体とその製造方法
JP5178064B2 (ja) * 2007-06-27 2013-04-10 富士フイルム株式会社 金属表面粗化層を有する金属層積層体及びその製造方法
WO2013168761A1 (ja) * 2012-05-10 2013-11-14 日立化成株式会社 多層配線基板
US8942006B2 (en) * 2013-01-19 2015-01-27 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types
TWI613940B (zh) * 2014-03-31 2018-02-01 Jx Nippon Mining & Metals Corp 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法
KR102490491B1 (ko) * 2015-07-29 2023-01-19 나믹스 코포레이션 조면화 처리 구리박, 동장 적층판 및 프린트 배선판
KR102245529B1 (ko) * 2016-03-30 2021-04-30 아사히 가세이 가부시키가이샤 셀룰로오스 미세 섬유층을 포함하는 수지 복합 필름

Also Published As

Publication number Publication date
JP7328671B2 (ja) 2023-08-17
KR20220007038A (ko) 2022-01-18
WO2020226162A1 (ja) 2020-11-12
JP2020183085A (ja) 2020-11-12
CN113677519A (zh) 2021-11-19

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