TW202042406A - Stacked optical coupler formed with twice encapsulation and packaging method thereof capable of simplifying the manufacturing process and maintaining the integrity of the required elements - Google Patents
Stacked optical coupler formed with twice encapsulation and packaging method thereof capable of simplifying the manufacturing process and maintaining the integrity of the required elements Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Abstract
Description
本發明係關於光耦合器的封裝方法,尤指一種會採用二次封膠,以能形成層疊光耦合器的封裝方法。 The present invention relates to a packaging method of an optical coupler, and particularly refers to a packaging method that uses secondary encapsulation to form a laminated optical coupler.
一般言,光耦合器(optical coupler,或稱光電耦合器、光隔離器及光電隔離器)是以光(如:可見光、紅外線)作為媒介來傳輸電訊號的光電轉換元件,其大致由光接收器與發光器共同封裝而成,且該光接收器與發光器兩者間除了光線之外,不會有任何電氣或實體連接。 Generally speaking, optical coupler (optical coupler, or photoelectric coupler, optical isolator and opto-isolator) is a photoelectric conversion element that transmits electrical signals as a medium of light (such as visible light, infrared), which is roughly received by light The light emitter and the light emitter are packaged together, and there is no electrical or physical connection between the light receiver and the light emitter except light.
承上,目前光耦合器普遍分為「左右式結構」與「上下式結構」,茲簡單說明如後,所謂的「左右式結構」是指發光器與光接收器兩者,分別處於光耦合器內的左右相對位置,其中,發光器與光接收器會分別設在不同支架上,且該二支架彼此相隔一間距,而不會相碰觸,如此,發光器即能朝光接收器的方向投射出光線。另外,所謂的「上下式結構」則是指發光器與光接收器兩者,分別處於光耦合器內的上下相對位置,其中,發光器與光接收器亦分別設在不同支架上,且該二支架彼此相隔一間距,而不會相碰觸,如此,發光器即能朝光接收器的方向投射出光線。然而,無論是「左右式結構」或「上下式結構」的光耦合器,普遍會面臨發光器與光接收器兩者距離過遠、對位不易及封裝對位影響良率...等困擾。 In conclusion, at present, optical couplers are generally divided into "left and right structure" and "up and down structure". I will briefly explain as follows. The so-called "left and right structure" refers to both the light emitter and the light receiver, which are in optical coupling. The left and right relative positions in the light-emitting device, where the light-emitting device and the light receiver are respectively arranged on different supports, and the two supports are separated from each other by a distance without touching each other, so that the light-emitting device can face the light receiver The direction casts light. In addition, the so-called "up and down structure" means that both the light emitter and the light receiver are located in the upper and lower relative positions of the optical coupler. The light emitter and the light receiver are also respectively arranged on different supports, and the The two supports are separated by a distance from each other without touching each other, so that the light emitter can project light toward the light receiver. However, whether it is a "left-right structure" or "up-and-down structure" optocouplers, they generally face problems such as too long distance between the emitter and the optical receiver, difficult alignment, and package alignment affecting the yield... .
有鑑於此,發明人曾設計出一種層疊光耦合器,請參閱第1圖所示,該層疊光耦合器A1係由一發光器A11、一絕緣層A12與一光接收器A13所組成,其中,該絕緣層A12會位於發光器A11與光接收器A13兩者之間,該絕緣層A12能夠供該發光器A11的光線穿過,並投射至該光接收器A13上,如此,由於該發光器A11、絕緣層A12與光接收器A13均為單獨的元件,且光接收器A13與發光器A11兩者是由絕緣層A12相隔開,因此,只要控制絕緣層A12的厚度,便能夠有效縮減光耦合器的整體體積,且光接收器A13與發光器A11兩者對位上,亦較「上下式結構」的光耦合器的懸空對位更為容易與精準。 In view of this, the inventor has designed a laminated optical coupler. Please refer to Figure 1. The laminated optical coupler A1 is composed of a light emitter A11, an insulating layer A12 and a light receiver A13. , The insulating layer A12 will be located between the light emitter A11 and the light receiver A13. The insulating layer A12 can allow the light from the light emitter A11 to pass through and project onto the light receiver A13. The A11, the insulating layer A12, and the light receiver A13 are all separate components, and the light receiver A13 and the light emitter A11 are separated by the insulating layer A12. Therefore, as long as the thickness of the insulating layer A12 is controlled, the reduction can be effectively reduced. The overall volume of the optical coupler, and the alignment of the optical receiver A13 and the light emitter A11, is easier and more precise than the floating alignment of the optical coupler of the "up and down structure".
然而,發明人發現,在實際生產過程中,由於發光器A11、絕緣層A12與光接收器A13均為單獨元件,因此,在組裝固定的過程中,仍有一定難度,故,如何針對前述缺失進行改良,以提供一種更為便利的製程,即成為本發明所欲解決之重要課題。 However, the inventor found that in the actual production process, since the light emitter A11, the insulating layer A12, and the light receiver A13 are all separate components, there are still certain difficulties in the process of assembling and fixing. Making improvements to provide a more convenient manufacturing process has become an important issue to be solved by the present invention.
有鑑於前述層疊光耦合器與生產上仍有改進之處,因此,發明人又開發設計出本發明之一種以二次封膠成型之層疊光耦合器及其封裝方法,以期藉由本發明能提供業者更為簡化的製程,以有效解決前述問題。 In view of the improvement in the foregoing laminated optical coupler and its production, the inventor has developed and designed a laminated optical coupler formed by a secondary encapsulation and its packaging method of the present invention, in order to provide The industry has simplified the manufacturing process to effectively solve the aforementioned problems.
本發明之一目的,係提供一種以二次封膠成型之層疊光耦合器的封裝方法,首先,將一光接收器固定至一第一基板上,該光接收器的一第一接合點能電氣連接至該第一基板的一第一接點,且該光接收器之頂面設有一光接收區域,又,進行第一次封膠程序,並使一透光絕緣膠至少包覆住該光接收器的局部區域,以固化並作為一透光絕緣層,其中,前述 局部區域包含該光接收區域及該第一接合點的位置,之後,將一發光器固定至該透光絕緣層的頂面,且其能透過該透光絕緣層,而朝對應之光接收區域方向投射光線,該發光器的一第二接合點能電氣連接至一第二基板的一第二接點,最後,進行第二次封膠程序,並使一保護絕緣膠包覆住該發光器及其上的該第二接合點與至少局部之該透光絕緣層,以固化並作為一保護層,即形成該層疊光耦合器,如此,業者即可迅速且簡單地在光接收器與發光器二者之間,製作出該透光絕緣層。 One of the objects of the present invention is to provide a method for packaging a laminated optical coupler formed by a secondary molding. First, a light receiver is fixed to a first substrate, and a first joint of the light receiver can be It is electrically connected to a first contact of the first substrate, and a light receiving area is provided on the top surface of the light receiver. Furthermore, the first sealing procedure is performed, and a transparent insulating glue at least covers the The partial area of the light receiver is cured and used as a light-transmitting insulating layer, wherein the aforementioned The local area includes the light-receiving area and the position of the first joint. After that, a light emitter is fixed to the top surface of the light-transmitting insulating layer, and it can penetrate the light-transmitting insulating layer and face the corresponding light-receiving area Project light in the direction, a second joint of the light emitter can be electrically connected to a second contact of a second substrate, and finally, a second sealing process is performed, and a protective insulating glue covers the light emitter And the second junction and at least part of the light-transmitting insulating layer are cured and used as a protective layer to form the laminated optical coupler. In this way, the industry can quickly and simply connect the light receiver and the light-emitting Between the two devices, the transparent insulating layer is made.
本發明之另一目的,係提供一種以二次封膠成型之層疊光耦合器,包括一光接收器、一透光絕緣層、一發光器及一保護層,其中,該光接收器會被固定至一第一基板上,且其頂面設有一光接收區域,該光接收器的一第一接合點能電氣連接至該第一基板的一第一接點,該透光絕緣層是由一透光絕緣膠固化而成,該透光絕緣層會至少包覆住該光接收器的局部區域,且前述局部區域包含該光接收區域及該第一接合點的位置,該發光器能被固定至該透光絕緣層的頂面,其能透過該透光絕緣層,而朝對應之光接收區域方向投射光線,且該發光器的一第二接合點能電氣連接至一第二基板的一第二接點,該保護層則是由一保護絕緣膠固化而成,且該保護層會包覆住該發光器及其上的該第二接合點與至少局部之該透光絕緣層,如此,業者僅需透過兩次的封膠程序,便能夠依序形成透光絕緣層、保護層。 Another object of the present invention is to provide a laminated optical coupler molded by a secondary encapsulant, which includes a light receiver, a light-transmitting insulating layer, a light emitter, and a protective layer, wherein the light receiver is It is fixed to a first substrate and has a light receiving area on its top surface. A first joint of the light receiver can be electrically connected to a first contact of the first substrate. The light-transmitting insulating layer is formed by A light-transmitting insulating glue is cured. The light-transmitting insulating layer covers at least a partial area of the light receiver, and the aforementioned partial area includes the light receiving area and the position of the first junction, the light emitting device can be Fixed to the top surface of the light-transmitting insulating layer, which can pass through the light-transmitting insulating layer and project light toward the corresponding light-receiving area, and a second junction of the light emitter can be electrically connected to a second substrate A second joint, the protective layer is formed by curing a protective insulating glue, and the protective layer covers the light emitter, the second joint thereon, and at least part of the transparent insulating layer, In this way, the industry only needs to go through the sealing process twice to sequentially form the light-transmitting insulating layer and the protective layer.
本發明之再一目的,係該透光絕緣膠能完全包覆住該光接收器,以使該光接收器能更為穩固地定位於該第一基板上。 Another object of the present invention is that the light-transmitting insulating glue can completely cover the light receiver, so that the light receiver can be more stably positioned on the first substrate.
本發明之又一目的,係該保護絕緣膠能完全包覆住該透光絕 緣層,以有效保護該層疊光耦合器於運作時,所需必要元件(如:光接收器、透光絕緣層與發光器)的完整性。 Another object of the present invention is that the protective insulating glue can completely cover the transparent insulating glue. The edge layer effectively protects the integrity of the necessary components (such as the light receiver, the transparent insulating layer and the light emitter) when the laminated optical coupler is in operation.
為便 貴審查委員能對本發明目的、技術特徵及其功效,做更進一步之認識與瞭解,茲舉實施例配合圖式,詳細說明如下: In order to facilitate your reviewers to have a further understanding and understanding of the purpose, technical features and effects of the present invention, the examples and diagrams are described in detail as follows:
A1‧‧‧層疊光耦合器 A1‧‧‧Laminated Optocoupler
A11‧‧‧發光器 A11‧‧‧Light emitter
A12‧‧‧絕緣層 A12‧‧‧Insulation layer
A13‧‧‧光接收器 A13‧‧‧Optical Receiver
1‧‧‧層疊光耦合器 1‧‧‧Laminated Optocoupler
11‧‧‧光接收器 11‧‧‧Optical receiver
111‧‧‧第一接合點 111‧‧‧First junction
113‧‧‧光接收區域 113‧‧‧Light receiving area
13‧‧‧透光絕緣層 13‧‧‧Transparent insulating layer
15‧‧‧發光器 15‧‧‧Light
151‧‧‧第二接合點 151‧‧‧Second junction
17‧‧‧保護層 17‧‧‧Protection layer
19‧‧‧透光黏膠 19‧‧‧Translucent adhesive
21‧‧‧第一基板 21‧‧‧First substrate
211‧‧‧第一接點 211‧‧‧First contact
22‧‧‧第二基板 22‧‧‧Second substrate
221‧‧‧第二接點 221‧‧‧second contact
B1‧‧‧第一傳輸線 B1‧‧‧The first transmission line
B2‧‧‧第二傳輸線 B2‧‧‧Second transmission line
301~304‧‧‧步驟 301~304‧‧‧Step
第1圖係習知層疊光耦合器之示意圖;第2圖係本發明之第一次封膠程序後的結構示意圖;第3圖係本發明之第二次封膠程序後的結構示意圖;及第4圖係本發明之流程圖。 Figure 1 is a schematic diagram of a conventional laminated optical coupler; Figure 2 is a schematic diagram of the structure after the first sealing process of the present invention; Figure 3 is a schematic view of the structure after the second sealing process of the present invention; and Figure 4 is a flowchart of the present invention.
本發明係一種以二次封膠成型之層疊光耦合器及其封裝方法,請參閱第2及3圖所示,在一實施例中,該層疊光耦合器1至少由一光接收器11、一透光絕緣層13、一發光器15(如:LED)、一保護層17、一第一基板21與一第二基板22所構成,其中,該透光絕緣層13會位於該光接收器11及發光器15兩者之間,且至少會包覆住該光接收器11的局部區域,又,該光接收器11能電氣連接至該第一基板21,該發光器15則能電氣連接至該第二基板22,該保護層17至少能包覆住該發光器15及局部透光絕緣層13,如此,該發光器15所發出之光線,即能穿過該透光絕緣層13,並被該光接收器11所接收,以使該層疊光耦合器1能發揮作用。
The present invention is a laminated optical coupler formed by secondary molding and its packaging method. Please refer to Figures 2 and 3. In one embodiment, the laminated optical coupler 1 is composed of at least one
茲就本發明之層疊光耦合器1的封裝方法,說明如後,復請參閱第2圖所示,首先,工作人員能先將一光接收器11固定至一第一基板
21(如:電路板、支架...等)上,其中,該光接收器11固定至第一基板21的方式,能夠為黏貼、焊接、嵌卡...等,只要其能夠定位於第一基板21上即可。又,該光接收器11的一第一接合點111能透過一第一傳輸線B1,電氣連接(如:打線接合(Wire bonding))至該第一基板21的一第一接點211(如第4圖之步驟(301)),且該光接收器11之頂面設有一光接收區域113,以能接收該發光器15所發出之光線。
With regard to the packaging method of the laminated optical coupler 1 of the present invention, the description will be given later. Please refer to Fig. 2. First, the staff can fix an
承上,復請參閱第2圖所示,當該光接收器11已經定位完成後,便能進行第一次封膠程序,在該實施例中,工作人員能將一透光絕緣膠完全包覆住該光接收器11,甚至能包覆住局部的第一基板21,在該透光絕緣膠固化後,其能形成一透光絕緣層13(如第4圖之步驟(302)),此時,該光接收器11即會被穩定地定位於該第一基板21上,而無法輕易地位移與脫離;惟,在本發明之其它實施例中,該透光絕緣膠能夠僅包覆住該光接收器11的局部區域,但前述局部區域包含了該光接收區域113及第一接合點111的位置,主要原因在於,該透光絕緣膠係要作為透光絕緣層13,以能隔絕光接收器11與發光器15兩者直接貼靠,並需供該發光器15的光線通過,以使光線能被光接收區域113所接收。
Continuing, please refer to Figure 2. After the
復請參閱第3圖所示,當透光絕緣膠已經固化形成透光絕緣層13後,工作人員能將一發光器15固定至該透光絕緣層13的頂面,在該實施例中,該發光器15會透過一透光黏膠19固定至該透光絕緣層13上,但在本發明之其它實施例中,並不以此為限,業者能根據產品需求,採用其它固定方式。又,該發光器15能朝對應之光接收區域113方向投射光線,且其投射之光線會穿透該透光絕緣層13,而被該光接收器11之光接收區域113所
接收;當該發光器15是以透光黏膠19固定至透光絕緣層13時,該透光黏膠19之折射率會介於該發光器15之基板(如:LED基板)折射率與該透光絕緣層13折射率兩者之間。該發光器15的一第二接合點151能透過一第二傳輸線B2,電氣連接(如:打線接合(Wire bonding))至該第二基板22的一第二接點221(如第4圖之步驟(303)),以接收外部電力,進而能被驅動而發出光線。
Please refer to Figure 3 again. After the transparent insulating glue has been cured to form the transparent insulating
復請參閱第3圖所示,當該發光器15已經定位完成後,便能進行第二次封膠程序,在該實施例中,工作人員能將一保護絕緣膠完全包覆住該發光器15及其上的第二接合點151與透光絕緣層13,甚至能包覆住局部的第一基板21與第二基板22,在該保護絕緣膠固化後,其能形成一保護層17(如第4圖之步驟(304)),令該發光器15能穩定地定位於該透光絕緣層13上,且不易受到外力或外物碰撞而受損,以形成該層疊光耦合器1,惟,在本發明之其它實施例中,該保護絕緣膠除了能完全包覆住該發光器15與第二接合點151之外,則能夠僅包覆住局部的透光絕緣層13,合先陳明。
Please refer to Figure 3 again. After the light-emitting
綜上所述可知,藉由本發明之封裝方法,業者能夠更為簡單地生產該層疊光耦合器1,且只需控制發光器15的對位,以大幅降低生產難度,進而能提高後續的產品良率。此外,復請參閱第3圖所示,該保護絕緣膠除了作為保護使用之外,業者亦可採用白色反光材質(如:聚醋酸乙烯酯(Polyvinyl acetate)、環氧樹脂(epoxy)...等)的保護絕緣膠,以在該保護絕緣膠固化為保護層17後,該保護層17尚可具有反光特性,令該發光器15所發出的光線,能盡量被該光接收區域113所接收,惟,在本發明之其它實施例中,業者亦能根據產品需求,而採用透光材質或不透光材質所製作的保護絕緣膠,來作為保護層17,合先敘明。
In summary, it can be seen that by the packaging method of the present invention, the industry can more simply produce the laminated optical coupler 1, and only need to control the alignment of the
按,以上所述,僅係本發明之較佳實施例,惟,本發明所主張之權利範圍,並不侷限於此,按凡熟悉該項技藝人士,依據本發明所揭露之技術內容,可輕易思及之等效變化,均應屬不脫離本發明之保護範疇。 According to, the above are only the preferred embodiments of the present invention. However, the scope of rights claimed by the present invention is not limited to this. Anyone familiar with the art can use the technical content disclosed in the present invention. The equivalent changes that are easily considered should all belong to the protection scope of the present invention.
301~304‧‧‧步驟 301~304‧‧‧Step
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US7736070B2 (en) * | 2005-08-31 | 2010-06-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Double mold optocoupler |
US8265487B2 (en) * | 2009-07-29 | 2012-09-11 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Half-duplex, single-fiber (S-F) optical transceiver module and method |
US9236521B2 (en) * | 2012-10-30 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optocoupler having lens layer |
US10043924B1 (en) * | 2012-12-04 | 2018-08-07 | Maxim Integrated Products, Inc. | Low cost optical sensor package |
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