TW202012988A - Optical coupler structure formed on wafer in laminated state for allowing the manufacturer to test semi-finished optical couplers on the wafer so as to avoid making a defective semi-finished optical coupler into an optical coupler - Google Patents

Abstract

The present invention provides an optical coupler structure formed on a wafer in a laminated state, which includes a wafer, a plurality of insulation layers and a plurality of light emitters. The wafer is provided with a plurality of light receivers, and each of the light receivers has a side surface formed thereon with a light receiving area. In addition, each of the insulation layers covers one side surface of each light receiver, and a light transmitting area on the side surface thereof may at least correspond to the light receiving area locally. Furthermore, each light emitter is located on each of the insulation layers so as to project light toward the corresponding light receiving area through the corresponding light transmitting area. As a result, after only fabricating a plurality of semi-finished optical couplers formed by the light receivers, insulation layers and light emitters, the manufacturer may directly perform test on each of the semi-finished optical couplers on the wafer so as to avoid making a defective semi-finished optical coupler into an optical coupler.

Description

Forming a stacked photocoupler structure on a wafer

The invention relates to a pre-structure of an optical coupler, in particular to an optical coupler structure capable of directly forming an optical coupler semi-finished product on a wafer for a manufacturer to directly perform good and bad tests.

Generally speaking, an optical coupler (or optical coupler, optical isolator, and optical isolator) is a photoelectric conversion element that uses light (such as visible light and infrared light) as a medium to transmit electrical signals, which is generally received by light. The light receiver and the light emitter are packaged together, and there is no electrical or physical connection between the light receiver and the light emitter except for light.

According to the above, the current optical couplers are generally divided into "left and right structure" and "up and down structure", here is a brief description, please refer to the "left and right structure" shown in Figure 1, the light emitter 11 and the light receiver 12 It belongs to the left and right relative positions in the optical coupler 1, wherein the light emitter 11 and the light receiver 12 are respectively set on different brackets 13A, 13B, and the two brackets 13A, 13B are separated from each other by a distance without collision In this way, the light emitter 11 can project light toward the light receiver 12.

In addition, please refer to the "upper and lower structure" shown in FIG. 2, the light emitter 21 and the light receiver 22 belong to the up and down relative positions in the optical coupler 2, wherein the light emitter 21 and the light receiver 22 are also provided in On the different brackets 23A, 23B, and the two brackets 23A, 23B are spaced apart from each other without touching, so that the light emitter 21 can project light toward the light receiver 22. However, whether it is a "left and right structure" or "up and down structure" optocouplers 1, 2, generally face the distance between the light emitter 11, 21 and the light receiver 12, 22 is too far, difficult to align and packaging Bit affects yield... and so on.

In addition to the aforementioned problems, since the main actuating elements of the optical coupler are the light emitter and the light receiver, and the coupling effect between the light emitter and the light receiver will be affected by the relative position error, but the coupling effect is good The inferiority must be determined after the photocoupler is completed. Therefore, most of the existing photocouplers can only be tested after the packaging is completed as an independent product. At this time, if the coupling effect is not good, it will It is a pity that the packaging cost is wasted.

Based on the above, it can be seen that the existing "left and right structure" and "up and down structure" optical couplers still have their defects in structure, and can only be tested after being produced as an independent product. Therefore, how to design a The new structure to effectively solve the aforementioned problems has become an important issue to be solved by the present invention.

In view of the fact that the conventional optical coupler is still imperfect in production and structure, the inventor has finally developed and designed a photocoupler of the present invention that forms a stack on the wafer after long-term research and experiment The structure is expected to effectively solve the aforementioned problems by the present invention.

An object of the present invention is to provide an optical coupling structure formed on a wafer with a plurality of light receivers, a plurality of light receivers, a plurality of insulating layers, and a plurality of light emitters, wherein each of the light receivers Each side of the device is provided with a light receiving area, and each of the insulating layers will cover a side of each light receiver, and a light transmitting area is provided on each of the light transmitting areas, and each light transmitting area can correspond to at least a local The light-receiving area, and each of the light emitters will be located on each of the insulating layers, and pass through the corresponding light-transmitting area, and project light toward the corresponding light-receiving area to form a photocoupler semi-finished product. The optocoupler semi-finished product is directly placed on the wafer, so the manufacturer can test the optocoupler semi-finished product before cutting the wafer to eliminate the bad optocoupler semi-finished product, thereby improving the subsequent manufacturing of the optocoupler semi-finished product The production yield of the optical coupler.

In order for your reviewing committee to have a better understanding and understanding of the purpose, technical features and efficacy of the present invention, the following examples are used in conjunction with the drawings, which are described in detail as follows:

〔Knowledge〕

1, 2‧‧‧Optocoupler

11, 21‧‧‧ Illuminator

12, 22‧‧‧ optical receiver

13A, 13B, 23A, 23B ‧‧‧ bracket

〔this invention〕

3‧‧‧ Wafer

3A‧‧‧Optocoupler semi-finished products

31‧‧‧ optical receiver

313A, 313B‧‧‧ photosensitive unit

311‧‧‧Light receiving area

312‧‧‧Second connection pin

33‧‧‧Insulation

35‧‧‧Light

351‧‧‧First connection pin

37‧‧‧Cutting Road

38A, 38B‧‧‧Bracket

Figure 1 is a schematic diagram of a conventional photocoupler with a left-right structure; Figure 2 is a schematic diagram of a conventional photocoupler with a top-down structure; Figure 3 is a schematic diagram of a wafer of the invention; Figure 4 is a photocoupler of the invention A schematic diagram of a semi-finished product; FIG. 5 is a schematic diagram of an optical coupler of the present invention; and FIG. 6 is a schematic diagram of a second photosensitive element of the present invention.

The present invention is a photocoupler structure formed on a wafer in a stacked state. Please refer to FIG. 3, in an embodiment, a wafer 3 has a plurality of light receivers 31, and a special mention is made here. It is a conventional technique to fabricate multi-layer circuits and components on a silicon wafer, so it will not be described in detail here, as long as the relevant circuits of the light receiver 31 can be formed on the wafer 3. In addition, the wafer 3 referred to in the present invention also includes a partial wafer shape that has not been completely singulated, that is, as long as a plurality of light receivers 31 can be formed on the silicon wafer, this is the wafer 3 of the present invention.

As mentioned above, please refer to FIG. 3, one side of each light receiver 31 is provided with a light receiving area 311 to receive light from the outside, and a plurality of insulating layers 33 can be coated to One side of each of the light receivers 31, and each of the insulating layers 33 is respectively provided with a light-transmitting area, and each of the light-transmitting areas can correspond to a local light-receiving area 311. The insulating layer 33 of the present invention is briefly described Form: (1) The entire insulating layer 33 is made of light-transmitting materials (such as glass, plastic, insulating oil, mica (MICA), silicon carbide (SiC), silicon nitride (Si3N4), etc.). The light-transmitting area is naturally formed; (2) The insulating layer 33 is entirely made of opaque material, and corresponding to the position of all or part of the light-receiving area 311, a hollow hole is formed to form the light-transmitting area; ( 3) The insulating layer 33 is entirely made of a light-transmitting material, and corresponds to all or part of the light-receiving area 311, and is covered with an opaque film layer; (4) The insulating layer 33 is made of an opaque material and The two light-transmitting materials are combined, and the light-transmitting materials are located at positions corresponding to all or part of the light-receiving area 311 to form the light-transmitting area.

Please refer to FIG. 3 again, a plurality of light-emitting devices 35 (such as LEDs) are located on the insulating layers 33 respectively. In order to achieve a good insulating effect, the area of the light-emitting devices 35 is not greater than the area of the insulating layer 33 In addition, in this embodiment, the light-emitting device 35 can be fixed to the insulating layer 33 through a light-transmitting adhesive, but in other embodiments of the present invention, it is not limited to this, the manufacturer can according to product requirements , Using other fixing methods. The light-emitting device 35 can pass through the corresponding light-transmitting area and project light toward the corresponding light-receiving area 311, that is, as long as the light generated by the light-emitting device 35 can penetrate the insulating layer 33 and be transmitted by the corresponding light-receiving area 31 can be received, and the light-receiving area 311, the light-transmitting area, and the light-emitting range of the light-emitting device 35 can be adjusted according to actual product requirements, which will be described first. In addition, when the light-emitting device 35 is fixed to the insulating layer 33 with a light-transmitting adhesive, the refractive index of the light-transmitting adhesive will be between the refractive index of the substrate of the light-emitting device 35 (such as an LED substrate) and the insulating layer 33 Between the two refractive indexes, the photoreceiver 31, the insulating layer 33 and the light-emitting device 35 can form a photocoupler semi-finished product 3A. Please refer to FIG. 4 and FIG. After cutting, a plurality of semi-finished optocouplers 3A (as shown in FIG. 4) can be obtained, and then each semi-finished optocoupler 3A is further processed to form an optical coupler (as shown in FIG. 5).

Please refer to FIG. 3 again. In this embodiment, a scribe line 37 is provided between two adjacent optical receivers 31 on the wafer 3, and the manufacturer only needs to scribe each scribe line 37, namely The damage to the light receiver 31 can be avoided. However, in other embodiments of the present invention, the wafer 3 may not be provided with a scribe line 37, as long as after the wafer 3 is cut, the formed photocoupler semi-finished product 3A can have the expected Efficacy is sufficient. In addition, the light-emitting device 35 can be provided with at least one first connecting pin 351, which can be used to electrically connect the light-emitting device 35 to a corresponding circuit on a bracket 38A when the optical coupler is subsequently produced. (As shown in FIG. 5) In addition, the optical receiver 31 can also be provided with at least one second connection pin 312, which can be used for subsequent production of the optical coupler 31 is electrically connected to a corresponding circuit on another bracket 38B (as shown in FIG. 5).

Furthermore, please refer to FIG. 3 and FIG. 6, in this embodiment, the light receiver 31 can have two light receiving units 313A, 313B, and the light receiving units 313A, 313B can form the light receiving area 311, wherein The photosensitive unit 313A can be used as a receiving element, that is, the photosensitive unit 313A is mainly used to receive light from the light emitter 35, and the other photosensitive unit 313B is used as a reference element, and the reference element is arranged around the receiving element (such as Figure 6) to improve the accuracy and sensitivity of the optocoupler in operation. In addition, in order to improve the light receiving efficiency of the light receiver 31, the insulating layer 33 can be provided with a scattering structure, for example, the insulating layer 33 is provided with grooves, slopes, etc., or particles are embedded in the insulating layer 33 Or, a reflective layer is provided at a position of the insulating layer 33 or the light receiver 31 that does not correspond to the light-transmitting area, so as to reflect or refract the light emitted by the light emitter 35.

In summary, with the overall structure of the present invention, the manufacturer can directly form the semi-finished optocoupler 3A on the wafer 3 and directly test each semi-finished optocoupler 3A before the wafer 3 is cut. In order to check whether the light receiver 31 and the light emitter 35 can function normally, this not only improves the convenience of testing, but also the defective semi-finished optocoupler 3A will be eliminated without the subsequent packaging process of the optocoupler In order to avoid wasting other materials required for producing the optical coupler, compared with the conventional optical coupler which can only be tested after being packaged as an independent product, the present invention can obviously reduce the production cost. In addition, since the light receiver 31 and the light emitter 35 in this case are separated by an insulating layer 33, this design is suitable for the optical couplers of the conventional "left and right structure" or "up and down structure" The manufacturer only needs to control the thickness of the insulating layer 33 to effectively reduce the overall volume of the optical coupler, and the alignment of the optical receiver 31 and the light emitter 35 is also more suspended than the "upper and lower structure" optical coupler. The alignment is easier and more precise, so that the semi-finished optical coupler 3A of the present invention has a better production yield when it is subsequently manufactured as an optical coupler.

According to the above, it is only the preferred embodiment of the present invention. However, the scope of the claimed rights of the present invention is not limited to this. According to the technical content disclosed by the present invention, anyone who is familiar with this skill can Equivalent changes that can be easily considered should fall within the protection scope of the present invention.

3‧‧‧ Wafer

3A‧‧‧Optocoupler semi-finished products

31‧‧‧ optical receiver

311‧‧‧Light receiving area

312‧‧‧Second connection pin

33‧‧‧Insulation

35‧‧‧Light

351‧‧‧First connection pin

37‧‧‧Cutting Road

Claims (10)

An optical coupling structure formed on a wafer in a stacked state includes: a wafer having a plurality of light receivers on each side of the light receiver, and a light receiving area provided on one side of each light receiver; Respectively covering one side of each of the light receivers, and respectively provided with a light-transmitting area, each of the light-transmitting areas can correspond to at least a local light-receiving area of each light receiver; and a plurality of light-emitting devices are respectively It is located on each of the insulating layers and can pass through the corresponding light-transmitting area, and project light toward the corresponding light-receiving area. The optocoupler structure according to claim 1, wherein the insulating layer is entirely made of a light-transmitting material. The optocoupler structure according to claim 1, wherein the insulating layer is entirely made of an opaque material, and a hollow hole is formed on the insulating layer, and the hollow hole is used as a light-transmitting area of the insulating layer. The optical coupling structure according to claim 1, wherein the insulating layer is entirely made of a light-transmitting material, and a non-light-transmitting film layer is coated on the position of the non-light-transmitting area. The optocoupler structure according to claim 1, wherein the insulating layer is formed by combining an opaque material and a transparent material, and the transparent material is used as a transparent region of the insulating layer. The optocoupler structure according to any one of claims 1 to 5, wherein the light emitter is provided with at least one first connection pin. The optical coupling structure according to claim 6, wherein the light emitter is fixed to the insulating layer through a light-transmitting adhesive, and the refractive index of the light-transmitting adhesive is between the refractive index of the substrate of the light emitter and the The refractive index of the insulating layer is between the two. The optical coupling structure according to claim 7, wherein a scribe line is provided between two adjacent optical receivers on the wafer. The photocoupler structure according to claim 8, wherein the light receiver has two photosensitive units, one of which is a receiving unit and the other is a reference unit, and the reference unit is disposed around the receiving unit. The photocoupler structure according to claim 2 or 4, wherein a reflective layer is provided at a position of the insulating layer that does not correspond to the light-transmitting region.

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