TWM575871U - Photocoupler - Google Patents

Abstract

An optical coupler comprising: two or more lead frames; an optical channel structure comprising: an illuminating chip, a photographic wafer, and a light transmissive inner package, wherein the illuminating chip and the photographic wafer are disposed on the lead frame and are coplanar, A light-emitting surface of the light-emitting chip and a light-receiving surface of the light-sensitive wafer are disposed in the same direction, the light-transmissive inner package encloses the light-emitting chip and the light-sensitive wafer; and a light-reflecting outer package covers the light-transmitting inner package, and the light is reflected outside The bonding interface of the package and the transparent inner package is an optical reflective surface, wherein the light-reflecting outer package and the light-transmissive inner package are formed by double-molding and sealing, so that the inner package and the light are The reflective outer package is easy to shape.

Description

Optocoupler

This creation relates to an electronic component, particularly to an optocoupler.

An optocoupler is a voltage isolating device that transmits electrical signals between two isolated circuits by optical signals. A conventional photo coupler mainly includes two lead frames electrically isolated from each other, an illuminating chip disposed on the lead frame, and a photosensitive wafer disposed on the other lead frame. The light-emitting chip is driven by the input electrical signal to convert the electrical signal into an optical signal, and the photosensitive chip receives the optical signal and converts the optical signal into an electrical signal for output.

Due to the high voltage resistance requirements of the optocoupler, it is difficult to ensure the alignment accuracy of the light-emitting chip and the photosensitive wafer in the opposite packaging process, and it is often difficult to ensure that the product can meet the high voltage resistance requirements. In the safety requirements of optocoupler products, the product design needs to meet the external creepage distance and internal metal penetration distance, so that the thin series of optocoupler products have poor production yield or failure products due to high process difficulty. Outflow problem. Opposite package structures also result in high capacitance characteristics of the product. In common mode rejection, more additional designs and costs are often required to avoid interference. In addition, although the optical coupler has been widely used in various electrical products, the inner package and the outer package in the conventional optical coupler are difficult to shape, and the inner package and the outer package are often difficult to be closely adhered to each other. The component characteristics of the optocoupler are affected and cannot meet the application requirements.

Therefore, the purpose of this creation is to provide an optocoupler with a simpler production process, easier shaping of the inner and outer packages, thinner structural design, compliance with safety requirements and optical transmission. Package structure.

The optical device is provided by the technical means for solving the problems of the prior art, and comprises: two or more lead frames; an optical channel structure comprising: a light emitting chip, a light sensing chip and a light transmissive inner package The light-emitting chip is disposed on one of the lead frames, and the light-sensitive chip is disposed on the other lead frame and is coplanar with the light-emitting chip, and a light-emitting surface of the light-emitting chip and a light-receiving surface of the light-emitting chip are in the same direction The light-transmissive inner package is a light-transmitting material having a light transmittance of between 20% and 99%, covering the light-emitting chip and the photosensitive wafer, and two or more of the lead frames are from the light-transmitting inner package. Extending out; and a light-reflecting outer package, the light-reflecting material having a light reflectance of between 70% and 99%, covering and closely fitting the light-transmitting inner package, the light-reflecting outer package and the light-transmitting The bonding interface of the inner package body is an optical reflection surface, and the two or more lead frames extend out of the light reflection outer package body, wherein the light reflection outer package body and the light transmissive inner package body are formed by two materials. (double molding) and The structure of epoxy molding.

In an embodiment of the present invention, an optical coupler is provided, and the two lead frames are bent toward a mounting direction, and the light-emitting surface of the light-emitting chip and the light-receiving surface of the light-sensitive wafer are disposed toward the mounting direction.

In an embodiment of the present invention, an optical coupler is provided, and the material of the light transmissive inner package and the light reflective outer package comprises epoxy.

In an embodiment of the present invention, an optical coupler is provided. The optical channel structure is plural and covered by a light reflecting outer package.

In an embodiment of the present invention, an optical coupler is provided, and a plurality of the light-emitting wafers in the optical channel structure are plural.

In an embodiment of the present invention, an optical coupler is provided, and a plurality of the photosensitive wafers in the optical channel structure are plural.

In an embodiment of the present invention, an optocoupler is provided, further comprising a voltage stabilizing chip, a current limiting chip and/or a driving chip disposed inside the light transmissive inner package or inside the light reflecting outer package.

Through the technical means adopted by the optical coupler of the present invention, the light-reflecting outer package and the light-transmitting inner package are double-molded and sealed. The light-transmissive inner package is easily shaped during manufacture. Depending on the desired optical properties, special processing and surface treatment can be performed on the mold, and the light-transmissive inner package can be molded into a corresponding shape. The light-reflecting outer package encloses the light-transmitting inner package and reflects the light emitted from the light-emitting chip.

In addition, the light-emitting chip and the photosensitive wafer of the present invention are coplanar side-by-side design, which can effectively reduce the parasitic capacitance of the product, and thus have higher common mode interference immunity. In addition, this package structure has lower process difficulty, avoids the production of products with risk of failure due to production control problems, and can greatly improve the high voltage resistance and stability of the optocoupler products. The optical coupler of the present invention not only satisfies the safety specification of the metal penetration distance, but also greatly reduces and reduces the size of the optocoupler product, and meets the market demand for thinning.

Furthermore, in some embodiments, the light-emitting surface of the light-emitting wafer and the light-receiving surface of the light-sensitive wafer are disposed in a mounting direction. Therefore, when the optical coupler of the present invention is mounted on the circuit board, the light-emitting surface of the light-emitting chip and the light-receiving surface of the light-sensitive chip are oriented toward the circuit board, and the light outside the light-reflecting outer package body can be reduced by the shielding of the circuit board. In the light-transmissive inner package, the photosensitive wafer is prevented from being disturbed by external light, and can be used in an environment where high-intensity light sources interfere.

Embodiments of the present creation will be described below based on Figs. 1 to 7 . This description is not intended to limit the implementation of the present invention, but is one of the embodiments of the present invention.

As shown in FIG. 1 to FIG. 4, an optical coupler 100 according to an embodiment of the present invention includes: two lead frames 1; an optical channel structure 2 including: an illuminating chip 21 and a photosensitive wafer 22 And a light-transmissive inner package 23, the light-emitting chip 21 and the light-sensitive wafer 22 are respectively disposed on the two lead frames 1 to be coplanar, and a light-emitting surface of the light-emitting chip 21 and a light-receiving surface of the light-sensitive wafer 22 are disposed in the same direction. The light-incorporating package 23 is a light-transmitting material having a light transmittance of between 20% and 99%, and covers the light-emitting chip 21 and the photosensitive wafer 22, and the two lead frames 1 extend from the light-transmitting inner package 23; The light-reflecting outer package 3 is a light-reflecting material having a light reflectance of 70% to 99%, and is covered and adhered to the light-transmitting inner package 23, and the light-reflecting outer package 3 and the light-transmitting inner package 23 The contact interfaces are all an optical reflective surface 31, and the two lead frames 1 extend out of the light-reflecting outer package 3. The light-reflecting outer package 3 and the transparent inner package 23 are formed by double molding and sealing. structure.

Specifically, the light-transmitting inner package body 23 having an optical structure is first formed by encapsulation molding through an optical structure mold, and the light-transmissive inner package body 23 is placed in another mold and sealed with another material. The glue is molded into a light-reflecting outer package 3. The light-transmissive inner package 23 is easily shaped at the time of manufacture by the two-material molding and the seal molding. The light transmissive inner package 23 can be molded into a corresponding shape depending on the desired optical characteristics. The light-reflecting outer package 3 can also be adapted to the various shapes of the light-transmitting inner package 23 to completely cover the light-transmitting inner package 23, and form a dense gap between the light-transmitting inner package 23 and the light-reflecting outer package 3. The junction of the joint. The broken line shown in the drawing is the junction between the light-transmitting inner package 23 and the light-reflecting outer package 3, that is, the optical reflecting surface 31.

The optical coupler 100 of the present invention is a double-molding coplanar structure, that is, the light-emitting surface of the light-emitting chip 21 and the light-receiving surface of the light-sensitive wafer 22 are coplanar. The illuminating wafer 21 is used to emit a light L, and the photosensitive wafer 22 is used to receive the light L to be converted into an electrical signal. The light ray L is reflected by the optical reflecting surface 31 of the light reflecting outer package 3, so that the photosensitive wafer 22 is actuated. In detail, the light L emitted from the light-emitting chip 21 is infrared light or visible light, and the light-receiving wavelength of the light-sensitive chip 22 covers the spectrum emitted by the light-emitting chip 21.

The main material of the light-transmitting inner package 23 and the light-reflecting outer package 3 is an epoxy resin. In detail, the light-transmitting inner package 23 is a light-transmitting epoxy resin for light penetration. As shown in FIGS. 3 and 4, the light-reflecting outer package 3 is additionally mixed with a light-reflecting material to have a light-reflecting property, so that the light L emitted from the light-emitting chip 21 is reflected on the optical reflecting surface 31 of the outer package 3. The light is reflected and reflected by the light outside the outer package 3 and is hard to be transmitted into the light-transmitting inner package 23. Of course, the light-transmitting inner package 23 may be other light-transmitting materials having similar light transmittance, and the light-reflecting outer package 3 may also be made of other materials having similar light reflectance.

The optical reflecting surface 31 has optical structural surfaces 311 and 312. The light emitting surface of the light emitting chip 21 and the light receiving surface of the photosensitive wafer 22 face the optical structural surface 311 and face away from the other optical structural surface 312. As shown in Fig. 1, in the present embodiment, the optical structural surface 311 is an ellipsoidal surface, so that the light-emitting wafer 21 and the photosensitive wafer 22 have a good optical coupling effect. Preferably, the luminescent wafer 21 and the photosensitive wafer 22 are focal points disposed on the ellipsoidal surface. In other embodiments, the optical structural surface 311 may be a spherical surface, and the optical structural surface 311 may also have a portion that is planar. The optical structural surface 312 is a surface that is formed corresponding to the optical structural surface 311, so that the light that cannot be reflected to the light receiving surface in a single time can reach the light receiving surface by two or more reflections, and the light emitting wafer 21 can be further improved. The light coupling effect of the photosensitive wafer 22. Since the optical reflecting surface 31 of the present embodiment completely covers the light-emitting wafer 21 and the photosensitive wafer 22, the light ray L can be reflected multiple times within the range of the optical reflecting surface 31.

The lead frame 1 is originally a common flat lead frame. After the sealant is formed, the joint is cut to form two or more independent lead frames 1. In the present embodiment, the lead frame 1 is bent in a mounting direction d, and the light-emitting surface of the light-emitting chip and the light-receiving surface of the light-sensitive wafer are disposed toward the mounting direction d. Therefore, when the optical coupler 100 of the present invention is mounted on a circuit board, the light-emitting surface of the light-emitting chip 21 and the light-receiving surface of the light-sensitive chip 22 face the circuit board, and the light-reflecting outer package 3 can be reduced by the shielding of the circuit board. The external light is transmitted into the light-transmitting inner package 23 to prevent the photosensitive wafer 22 from being disturbed by external light. In other embodiments, the light-emitting surface of the light-emitting chip 21 and the light-receiving surface of the light-sensitive wafer 22 may be disposed away from the mounting direction d.

As shown in FIG. 5, the optical coupler 100a according to another embodiment of the present invention is a multi-channel optical coupler having a plurality of optical channel structures 2, and both are covered by the light-reflecting outer package 3. In the present embodiment, the light-transmitting inner package bodies 23 of the plurality of optical channel structures 2 have the same outer shape. In embodiments where the plurality of optical channel structures 2 differ in desired optical characteristics, the plurality of optical channel structures 2 may also have the outer shape of the distinct light transmissive inner package.

As shown in Fig. 6, the optical coupler 100b of another embodiment of the present creation has an optical channel structure 2. The optical channel structure 2 has two light-emitting chips 21 and two light-sensitive wafers 22. When any of the light-emitting chips 21 emits light, both of the light-sensitive wafers receive light. In other embodiments, the number of the light emitting wafer and the photosensitive wafer may also be one-to-many or many-to-one.

As shown in FIG. 7, the optical coupler 100c according to an embodiment of the present invention further includes a functional component 4, which may be a voltage regulator chip, a current limiting chip, a driving chip, a power component, a MOSFET... The electronic components, etc., are disposed inside the outer surface of the light-reflecting outer package 3 and are disposed on the lead frame 1 to integrate various functions in the optical coupler 100. In the present embodiment, the functional element 4 is disposed between the inner surface and the outer surface of the light-reflecting outer package 3, and is covered by the light-reflecting outer package 3. In other embodiments, the functional component 4 may also be disposed in the light transmissive inner package 23 and covered by the light transmissive inner package 23 .

The above description and description are only illustrative of the preferred embodiments of the present invention, and those having ordinary skill in the art may make other modifications in accordance with the scope of the patent application as defined below and the above description, but such modifications are still It is the creative spirit of this creation and is within the scope of this creation.

100‧‧‧Optocoupler

100a‧‧‧Optocoupler

100b‧‧‧Optocoupler

100c‧‧‧Optocoupler

1‧‧‧ lead frame

2‧‧‧ Optical channel structure

21‧‧‧Lighting chip

22‧‧‧Photosensitive wafer

23‧‧‧Light-transmissive inner package

3‧‧‧Light reflective outer package

31‧‧‧Optical reflective surface

311‧‧‧ Optical structural surface

312‧‧‧Optical structural surface

4‧‧‧ functional components

d‧‧‧Installation direction

L‧‧‧Light

1 is a side cross-sectional view showing an optical coupler according to an embodiment of the present invention; [FIG. 2] is a schematic plan view showing an optical coupler according to the embodiment of the present invention; [3] FIG. 4 is a top plan view showing the optical coupler according to the embodiment of the present invention in use; FIG. 4 is a side cross-sectional view showing the optical coupler according to the embodiment of the present invention in use; [Fig. 5] is a schematic plan view showing an optical coupler according to another embodiment of the present creation; [Fig. 6] is a schematic plan view showing an optical coupler according to another embodiment of the present creation; [Fig. 7] ] is a top plan view showing an optical coupler according to another embodiment of the present creation.

Claims (7)

An optical coupler comprising: two or more lead frames; an optical channel structure comprising: an illuminating chip, a photographic wafer, and a light transmissive inner package, wherein the illuminating chip is disposed on one of the lead frames, the photo lithography The light-emitting surface of the light-emitting chip and the light-receiving surface of the light-emitting chip are disposed in the same direction, and the light-transmitting inner package has a light transmittance of 20%. a light transmissive material between about 99%, covering the light emitting chip and the photosensitive wafer, two or more of the lead frames extending from the light transmissive inner package body; and a light reflecting outer package body for light reflectance The light-reflecting material between 70% and 99% is coated and closely adhered to the light-transmitting inner package body, and the bonding interface of the light-reflecting outer package body and the light-transmitting inner package body is an optical reflection surface, More than one of the lead frames extend out of the light-reflecting outer package, wherein the light-reflecting outer package and the light-transmissive inner package are formed by double-molding and sealing. The optical coupler of claim 1, wherein the two or more lead frames are bent toward a mounting direction, and the light emitting surface of the light emitting chip and the light receiving surface of the photosensitive wafer are disposed toward the mounting direction. The optical coupler of claim 1, wherein the material of the light transmissive inner package and the light reflective outer package comprises an epoxy resin. The optical coupler of claim 1, wherein the optical channel structure is plural, and is covered by the light reflecting outer package. The optical coupler of claim 1, wherein one of the light-emitting wafers in the optical channel structure is plural. The optical coupler of claim 1, wherein one of the photosensitive wafers in the optical channel structure is plural. The optical coupler of claim 1, further comprising a voltage stabilizing chip, a current limiting chip and/or a driving chip disposed inside the light transmissive inner package and/or inside the light reflecting outer package.