TWM497854U - Package structure of optical module - Google Patents

Description

Optical module packaging structure

This creation is related to optical modules, and in particular to the packaging structure of an optical module.

In the current handheld electronic device (such as a smart phone), in order to avoid the touch panel being accidentally touched or in response to the need for power saving, an optical module is usually disposed in the structure when the handheld electronic device is close to an object. On the surface (such as the cheek), the optical sensing module emits light through the light-emitting chip, and the light is received by the light-receiving chip of the optical sensing module after being reflected by the surface of the object, and finally the received light is received. Convert to electronic signal for subsequent processing.

However, in order to avoid crosstalk of the signal, the conventional optical module first encapsulates the light emitting chip and the light receiving chip with the encapsulant, and then snaps a metal frame to the foregoing package structure, so that the metal frame forms light. Isolated barrier structure, but due to the customary package structure, a snap-fit structure is required to assemble the metal frame, so the complexity of the process and structure will be higher, and the metal frame is fixed by the conventional system by gluing. There will be a problem that too much glue will cause the glue to overflow, or if the amount of glue is too small, the metal frame will easily fall off or shift, so that the effect of light isolation is not good.

The main purpose of the present invention is to provide a package structure of an optical module, comprising a substrate, a cover, a light emitting chip, a light receiving chip, and two encapsulants. The substrate has a light emitting region, a light receiving region and a recess between the light emitting region and the light receiving region; the cover is disposed on the substrate and forms a first chamber and a substrate a second chamber, the cover has a light emitting hole, a light receiving hole and a retaining wall, wherein the light emitting hole communicates with the first chamber, and the light receiving hole communicates with the second chamber, the retaining wall Provided in the recessed portion for partitioning the first chamber and the second chamber; the light emitting wafer is disposed in the light emitting region and located in the first chamber; the light receiving wafer is disposed in the light receiving region Located in the second chamber; each of the encapsulants is disposed in the first chamber and the second chamber and respectively covers the light emitting chip and the light receiving wafer.

Preferably, the encapsulant has a light guiding portion protruding from the encapsulant on the other side of the substrate.

Preferably, the light guiding portion is a convex lens.

Preferably, a surface of the cover is provided with a conductive layer.

Preferably, the light emitting hole or the peripheral wall of the light receiving hole has a reflective layer which gradually expands from the inside to the outside.

Preferably, the encapsulant system is a light transmissive resin.

Preferably, the closure is a resin that is opaque to light.

Therefore, the package structure of the optical module of the present invention is formed by forming a concave recess on the substrate, and a retaining wall of the cover is embedded in the recess, so that the joint between the substrate and the cover is lower than the substrate Therefore, the light emitted by the light-emitting chip cannot be transmitted laterally to the light-receiving chip (ie, avoiding the crosstalk effect of the optical signal), and the cover is made of a resin material, so that the package structure is easy to use. The need to adjust to improve efficiency and application, but also greatly reduce the cost of the process and the ease of production.

In order to enable the review committee to further understand the composition, characteristics and purpose of the creation, the following are some examples of the creation, and the detailed description of the creation is as follows, and at the same time, those skilled in the art can implement the following, but the following The above is only for the purpose of explaining the technical content and features of the present invention. Those who have general knowledge in the field of creation, after understanding the technical content and features of the creation, do not violate this creation. In the spirit of the present, all kinds of simple modifications, substitutions, or reductions in components should fall within the scope of this creative intent.

In order to explain in detail the structure, features and functions of the present invention, a preferred embodiment will be described with reference to the following drawings, wherein:

Please refer to FIG. 1 to FIG. 1F for the manufacturing method of the package structure 10 of the optical module according to the first preferred embodiment, which comprises the following steps:

Step (a), as in FIG. 1 to FIG. 1B, first, a light-emitting wafer 20 and a light-receiving wafer 30 are disposed on a substrate 40 by a Die Bonding process, and wire bonding is performed. The process electrically connects the light emitting chip 20 and the light receiving tab 30 to the substrate 40.

Step (b), as shown in FIG. 1C, forming a packaged paste 50 on the substrate 40 by a molding process, and coating the light-emitting wafer 20 and the light-receiving wafer 30, wherein the package adhesive system is The light-transmissive resin forms a light guiding portion 51 on the encapsulant while molding the encapsulant, thereby not only simplifying the process, but also improving the efficiency of light-emitting and receiving of the optical signal.

Step (c), as shown in FIG. 1D, is cut on the substrate 40 between the light-emitting wafer 20 and the light-receiving wafer 30, so that the substrate 40 is formed with a recess 41 recessed in the substrate 40. At the same time, the encapsulant 50 will also be divided into two by the foregoing cutting process, half on the light-emitting wafer 20 and the other half on the light-receiving wafer 30.

Step (d), as shown in FIG. 1A, a cover 60 is disposed on the substrate 40, and the light-emitting wafer 20 is received between the cover 60 and the substrate 40 to form a first chamber 61. The first chamber 61 communicates with one of the light emitting apertures 63 of the cover 60, and the light receiving wafer 30 is received in a second chamber 65 formed between the cover 60 and the substrate 40. The second chamber 65 is in communication with one of the light receiving holes 67 of the cover 60.

Step (e), as shown in FIG. 1F, the package structure 10 of the optical module of the present invention is subjected to sputtering (Sputtering Deposition) on the outer surface of the cover 60 in order to achieve electromagnetic interference (ElectroMagnetic Interference (EMI)). A conductive layer 69 is formed by coating, coating or spraying. It should be emphasized that the conductive layer 69 is formed on the outer surface of the cover 60 as a preferred embodiment of the present invention, but is not intended to limit the creation. The conductive layer 69 is formed on the cover 60. The inner surface is also the scope of the creation of the creation.

Please refer to FIG. 2 to FIG. 2F for the manufacturing method of the package structure 10' of the optical module according to the second preferred embodiment, wherein the second preferred embodiment and the first The difference between the preferred embodiment is that, as shown in FIG. 2C, the second preferred embodiment can form two independent encapsulants 50 immediately after performing the molding process of step (b), and each of the encapsulants 50 is separately provided. On the substrate 40, the light-emitting wafer 20 and the light-receiving wafer 30 are respectively coated, and thus, when the substrate 40 is formed to have a recess 41 recessed in the substrate 40 in the step (c), the cutting is performed. Since the cutter does not have to cut the encapsulant 50, the cutting process is less prone to problems such as offset, error or broken knife, which contributes to the improvement of accuracy and yield.

Please refer to FIG. 3 to FIG. 3F for the manufacturing method of the package structure 10 ′ of the optical module according to the third preferred embodiment, wherein the third preferred embodiment and the third The difference between a preferred embodiment and the second preferred embodiment is that, as shown in FIG. 3E, the cover 60 in the step (d) is an opaque resin and is molded by molding. The method is formed on the substrate 40, and the cover 60 is formed by molding. Therefore, the cover 60 can be disposed in the light emitting hole 63 and the light receiving hole 67 or both according to the requirements of use. One of the peripheral walls forms a reflective layer 631, 671 to enhance the applicability of the optical module and increase its optical effect.

Referring to FIG. 1F, FIG. 1G, and FIG. 2F, the package structure 10, 10' of the optical module of the first and second preferred embodiments provided by the present invention is respectively provided, wherein The first preferred embodiment is identical to the package structure of the second preferred embodiment, and each of the package structures 10, 10' includes the substrate 40, the cover 60, the light-emitting wafer 20, and the light-receiving wafer 30. And the encapsulant 50.

The substrate 40 has a light emitting region 43 on the same reference line D, a light receiving region 45, and a recess 41 between the light emitting region 43 and the light receiving region 45 and below the reference line, in other words The recess 41 is recessed in the substrate 40 as described above.

The cover 60 is disposed on the substrate 40, and a first chamber 61 and a second chamber 65 are formed between the cover 60. The cover 60 has a light emitting hole 63, a light receiving hole 67 and a a retaining wall 68, the light emitting hole 63 is connected to the first chamber 61, and the light receiving hole 67 is connected to the second chamber 65. The retaining wall 68 is correspondingly disposed on the recess 41 and is used to separate the first The chamber 61 and the second chamber 65. Therefore, since the retaining wall 68 of the cover 60 is embedded in the substrate 40 (that is, the recess 41), the joint between the substrate 40 and the cover 60 is lower than the substrate 40, and thus the light-emitting wafer The light emitted by 20 cannot be transmitted laterally to the light receiving wafer 30 (i.e., the crosstalk effect). In addition, in order to overcome the defects that the plastic material cannot effectively suppress EMI, the present invention can form a conductive layer 69 of a metal material on the outer surface of the cover 60, so that the conductive layer 69 can be used as a shield to avoid Electromagnetic interference with each of the wafers 20, 30 within the cover 60.

The light emitting chip 20 and the light receiving chip 30 are respectively disposed in the light emitting region 43 and in the light receiving region 45, and are located in the first chamber 61 and in the second chamber 65, respectively.

Each of the encapsulants 50 is disposed in the first chamber 61 and the second chamber 65 and respectively covers the light-emitting wafer 20 and the light-receiving wafer 30, wherein each of the encapsulants 50 is opposite to the substrate 40. The other side has a light guiding portion 51 protruding from each of the encapsulating members 50. In the preferred embodiment of the present invention, the light guiding portion 51 is a convex lens, and the light guiding portion 51 can also be used according to the requirements of use. Only one of each of the encapsulants 50 is formed. It is worth mentioning that each of the encapsulants 50 is a light transmissive resin and is directly formed on the substrate 40 by molding.

Please refer to FIG. 3F and FIG. 3G, which are the package structure 10'' of the optical module according to the third preferred embodiment of the present invention. The package structure 10 of the third preferred embodiment The difference from the package structures 10, 10' of the first and second preferred embodiments is that the third preferred embodiment forms the cover 60 by molding the opaque resin. The cover 60 is formed by molding, so that the reflective layers 631 and 671 can be respectively formed on the peripheral walls of the light-emitting hole 63 and the light-receiving hole 67, and the reflective layers 631 and 671 gradually extend from the inside to the outside. Expansion, in order to improve the efficiency of light emission and light reception.

It should be noted that the recess 41 of the substrate 40 can be as shown in FIG. 1G. The recess 41 of the substrate 40 is elongated, and the opposite sides of the recess 41 do not extend beyond the side of the substrate 40. Or as shown in FIG. 3G, the opposite sides of the recess 41 extend out of the side edge of the substrate 40, and the structural design of the recess 41 is changed according to process or cost considerations, thereby The packaging structure of the creation is more diverse in production to reduce costs and reduce process difficulty.

In summary, the package structure 10, 10', 10" of the optical module of the present invention is formed by forming a concave recess 41 on the substrate 40, and the retaining wall of the cover 60 is embedded in the recess 41. The junction of the substrate 40 and the cover 60 is lower than the substrate 40, so that the light emitted by the light-emitting wafer 20 cannot be transmitted laterally to the light-receiving wafer 30 (ie, avoiding the crosstalk effect of the optical signal). Because the cover 60 is made of resin material, the package structure is easy to adjust according to the needs of its use, in order to improve efficiency and application, and greatly reduce the cost of the process and the ease of manufacture.

The exemplified elements disclosed in the above embodiments are merely illustrative and are not intended to limit the scope of the present invention. The alternatives or variations of other equivalent elements are also covered by the scope of the patent application.

110, 10', 10''‧‧‧ package structure
20‧‧‧Light emitting chip
30‧‧‧Light receiving chip
40‧‧‧Substrate
41‧‧‧ recess
43‧‧‧Light emitting area
45‧‧‧Light receiving area
50‧‧‧Package colloid
51‧‧‧Light Guide
60‧‧‧ Cover
61‧‧‧First chamber
63‧‧‧Light emitting aperture
631‧‧‧reflective layer
65‧‧‧Second chamber
67‧‧‧Light receiving hole
671‧‧‧reflective layer
68‧‧‧Retaining wall
69‧‧‧ Conductive layer
D‧‧‧ baseline

1A-F are schematic views showing a package structure of an optical module according to a first preferred embodiment, wherein FIG. 1F is also a cross-sectional view of the package structure of the optical module of the first preferred embodiment. FIG. 1G is a plan view showing the package structure of the optical module of the first preferred embodiment. 2A-F are schematic views showing a package structure of an optical module according to a second preferred embodiment, wherein FIG. 2F is also a cross-sectional view of the package structure of the optical module of the second preferred embodiment. 3A is a schematic view showing a package structure of an optical module according to a third preferred embodiment of the present invention, wherein FIG. 3F is also a cross-sectional view of the package structure of the optical module of the third preferred embodiment. FIG. 3G is a plan view showing the package structure of the optical module of the third preferred embodiment.

10"‧‧‧ package structure

20‧‧‧Light emitting chip

30‧‧‧Light receiving chip

40‧‧‧Substrate

41‧‧‧ recess

43‧‧‧Light emitting area

45‧‧‧Light receiving area

50‧‧‧Package colloid

51‧‧‧Light Guide

60‧‧‧ Cover

61‧‧‧First chamber

63‧‧‧Light emitting aperture

631‧‧‧reflective layer

65‧‧‧Second chamber

67‧‧‧Light receiving hole

671‧‧‧reflective layer

68‧‧‧Retaining wall

69‧‧‧ Conductive layer

Claims (7)

A package structure of an optical module includes: a substrate having a light emitting region, a light receiving region, and a light receiving region between the light emitting region and the light receiving region and below the reference line a recess, a cover disposed on the substrate and forming a first chamber and a second chamber with the substrate, the cover having a light emitting hole, a light receiving hole and a retaining wall, the light The emission hole communicates with the first chamber, the light receiving hole communicates with the second chamber, the retaining wall is correspondingly disposed in the recess and is used for separating the first chamber and the second chamber; a chip disposed in the light emitting region and located in the first cavity; a light receiving chip disposed in the light receiving region and located in the second cavity; and two encapsulants respectively disposed in the first chamber and the The light emitting wafer and the light receiving wafer are respectively coated in the second chamber. The package structure of the optical module of claim 1, wherein the encapsulant has a light guiding portion protruding from the encapsulant on the other side of the substrate. The package structure of the optical module according to claim 2, wherein the light guiding portion is a convex lens. The package structure of the optical module of claim 1, wherein the outer surface of the cover is provided with a conductive layer. The package structure of the optical module of claim 1, wherein the light emitting hole or the peripheral wall of the light receiving hole has a reflective layer, and the reflective layer gradually expands from the inside to the outside. The package structure of the optical module according to claim 1, wherein the encapsulant system is a light transmissive resin. The package structure of the optical module of claim 1, wherein the cover is an opaque resin.