TWI744987B - Optical sensor package and manufactoring method thereof - Google Patents
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本發明涉及一種光學感測器封裝結構及其製造方法,特別是涉及一種可有效防止漏光問題的光學感測器封裝結構及其製造方法。The invention relates to an optical sensor packaging structure and a manufacturing method thereof, in particular to an optical sensor packaging structure and a manufacturing method thereof that can effectively prevent light leakage.
圖1顯示現有智慧手表的示意圖,如圖1所示,在智慧手錶10的底部設置心率感測器11,當使用者戴上智慧手表時,可以通過心率感測器量測使用者的心跳等生理資訊。除了在智慧手表/手環外,智慧手機或智慧耳機也都開始設置心率感測器,只要將心率感測器接觸使用者的身體任何部位,就可以量測使用者心跳等生理資訊。Figure 1 shows a schematic diagram of an existing smart watch. As shown in Figure 1, a heart rate sensor 11 is provided at the bottom of the
然而,智慧耳機的整體尺寸小於智慧手錶或智慧手環,因此需要更小的心率感測器,才能安裝在智慧耳機中。其中,集成式的心率感測器具有體積小的優勢,非常適合目前市場上快速增長的智慧耳機。如何有效地減小心率感測器的整體尺寸,以快速批量生產過程,來產出比現有競爭產品更窄,更薄的心率感測器,為這個產業的趨勢。However, the overall size of a smart headset is smaller than a smart watch or a smart bracelet, so a smaller heart rate sensor is needed to install it in the smart headset. Among them, the integrated heart rate sensor has the advantage of small size, which is very suitable for the rapidly growing smart earphones in the current market. How to effectively reduce the overall size of the heart rate sensor, and to produce a narrower and thinner heart rate sensor than existing competitive products through a rapid mass production process, is the trend of this industry.
然而,在縮小光感測器的封裝尺寸時,會導致漏光問題,進而影響光感測器的感測效果。一種常見的方法是在封裝的外圍與發射器和接收器之間粘附遮光的材料外殼。另一種方法是在封膠用於保護晶片和金線的透明材料的過程之後,使用鋸切製程在發光元件和光接收器之間產生可填充其他遮光材料的空間。However, when the package size of the photo sensor is reduced, the light leakage problem will be caused, which further affects the sensing effect of the photo sensor. A common method is to glue a light-shielding material shell between the periphery of the package and the transmitter and receiver. Another method is to use a sawing process to create a space that can be filled with other light-shielding materials between the light-emitting element and the light receiver after the process of encapsulating the transparent material used to protect the wafer and the gold wire.
上述方法中最常見的問題是,在發光元件和光接收器之間的光材料層的底部與晶片表面之間的漏光,降低了信號強度以及噪聲比(signal to noise ratio,SNR)。The most common problem in the above methods is that the light leakage between the bottom of the optical material layer between the light emitting element and the light receiver and the surface of the wafer reduces the signal intensity and the signal to noise ratio (SNR).
當前,縮小感測器的尺寸一直是穿戴裝置的趨勢,因此,如何使用封裝技術來製作更窄或更薄的感測器,並可以降低漏光問題,已成為光感測器產業所欲解決的重要課題之一。At present, shrinking the size of sensors has always been the trend of wearable devices. Therefore, how to use packaging technology to make narrower or thinner sensors and reduce the problem of light leakage has become what the optical sensor industry wants to solve One of the important topics.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種是用於縮小尺寸的光學感測器封裝結構的製造方法。The technical problem to be solved by the present invention is to provide a method for manufacturing an optical sensor package structure for reducing the size in view of the shortcomings of the prior art.
為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種光學感測器封裝結構的製造方法,其包括:設置一晶片於電路基板上,晶片包括一光發射區與一光接收區;設置至少一發光元件在晶片的光發射區上,且至少一發光元件電連接電路基板;塗佈一遮光材料於光發射區與光接收區之間;填充一透光材料以覆蓋電路基板、晶片、遮光材料與至少一發光元件;去除部分位於光發射區與光接收區之間的透光材料,以形成一第一凹槽並露出遮光材料;以及填充一防漏光材料在第一凹槽中,通過防漏光材料與遮光材料所相連接形成的一側光間隔結構以阻隔至少一發光元件的光束從側向直接傳遞至光接收區。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a method for manufacturing an optical sensor package structure, which includes: disposing a chip on a circuit substrate, the chip including a light emitting area and a light receiving area Area; at least one light emitting element is arranged on the light emitting area of the chip, and at least one light emitting element is electrically connected to the circuit substrate; coating a light-shielding material between the light emitting area and the light receiving area; filling a light-transmitting material to cover the circuit substrate , The chip, the light-shielding material, and at least one light-emitting element; remove part of the light-transmitting material between the light-emitting area and the light-receiving area to form a first groove and expose the light-shielding material; and fill a light-leakage material in the first recess In the groove, a side light spacing structure formed by connecting the light-leakage material and the light-shielding material is used to block the light beam of the at least one light-emitting element from being directly transmitted to the light-receiving area from the side.
本發明所採用的另一技術方案是提供一種光學感測器封裝結構,其包括一電路基板、一晶片、至少一發光元件、一光接收器、一遮光材料、一透光材料以及一防漏光材料。晶片設置在電路基板上,且包括一光發射區與一光接收區,並電連接電路基板。至少一發光元件位於在所述晶片的所述光發射區上。遮光材料位於所述光發射區與所述光接收區之間,透光材料覆蓋在電路基板、晶片、至少一發光元件以及遮光材料,並具有一第一凹槽露出部分遮光材料。防漏光材料位於透光材料所形成的第一凹槽,其中,遮光材料與防漏光材料堆疊相連接而形成一側光間隔結構, 藉由側光間隔結構以阻隔至少一發光元件的光束從側向直接傳遞至光接收區。Another technical solution adopted by the present invention is to provide an optical sensor package structure, which includes a circuit substrate, a chip, at least one light-emitting element, a light receiver, a light-shielding material, a light-transmitting material, and a light leakage prevention Material. The chip is arranged on the circuit substrate and includes a light emitting area and a light receiving area, and is electrically connected to the circuit substrate. At least one light emitting element is located on the light emitting area of the chip. The light-shielding material is located between the light-emitting area and the light-receiving area. The light-transmitting material covers the circuit substrate, the chip, at least one light-emitting element and the light-shielding material, and has a first groove to expose part of the light-shielding material. The light-leakage material is located in the first groove formed by the light-transmitting material, wherein the light-shielding material and the light-leakage material are stacked to form a side light spacing structure. The side light spacing structure blocks the light beam of at least one light-emitting element from the side Directly to the light receiving area.
本發明的其中一有益效果在於,本發明所提供的光感測器的製作方法,其能通過將遮光材料設置在透光材料的下方以避免漏光問題產生,並可以防止在切割製程時,切割至晶片,除了可以縮小整體光感測器的體積並可以防止漏光問題。One of the beneficial effects of the present invention is that the manufacturing method of the light sensor provided by the present invention can avoid light leakage problems by arranging the light-shielding material under the light-transmitting material, and can prevent the cutting process during the cutting process. To the chip, in addition to reducing the volume of the overall light sensor and preventing light leakage problems.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“光學感測器封裝結構及其製造方法”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following are specific examples to illustrate the implementation of the "optical sensor packaging structure and manufacturing method thereof" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
[本發明製程方法實施例][Embodiments of the process method of the present invention]
圖2顯示本發明第一實施例的光學感測器封裝結構的製造方法的流程圖,如圖2所示,並參考圖3A至圖3F以及圖4A至圖4F所示,本發明的實施例提供一種光學感測器封裝結構的製造方法,其包括下列步驟。FIG. 2 shows a flow chart of the manufacturing method of the optical sensor package structure of the first embodiment of the present invention, as shown in FIG. 2, and referring to FIGS. 3A to 3F and FIGS. 4A to 4F, the embodiment of the present invention A manufacturing method of an optical sensor package structure is provided, which includes the following steps.
在步驟S201中,提供一電路基板31,並設置一晶片32在電路基板31上,在本發明的光學感測器封裝結構的製造方法中,將一晶片32設至在電路基板31上,在晶片32上包括一光發射區321與一光接收區322。其中在晶片32的光接收區322上具有一光接收器33。然後,在步驟S202中,設置至少一發光元件34在晶片32的光發射區322上,發光元件34較佳為發光二極體(Light Emitting Diode,LED),發光元件34較佳是以晶片接合(die attach)的方式設置在電路基板31上,並分別將晶片32以及發光元件34電連接電路基板31,如圖3A與圖3B所示。進一步來說,可以通過打線接合的方式通過導線35將晶片32連接電路基板31,並通過導線35將發光元件34與晶片32連接。In step S201, a
在步驟S203中,以點膠方式塗佈遮光材料36A在光發射區321與光接收區322之間。在本發明的較佳實施例中,遮光材料36A是以點膠方式塗佈在晶片32的光發射區321與光接收區322之間,也就是在發光元件34與光接收器33之間以避免發光元件34的漏光問題,點膠的態樣可以如圖3A與圖3B所示,或者點膠的態樣也可以如圖4A與圖4B所示。In step S203, the light-
進一步來說,以圖3A與圖3B為例,為了防止發光元件34所發出的光直接傳遞至光接收器33,因此在發光元件34與光接收器33的相鄰區域,以點膠方式,先塗佈一遮光材料36A,或者,以圖4A與圖4B為例,在晶片32的光發射區321周圍,也就是在發光元件34的周圍,塗佈一ㄇ型的遮光材料36B。遮光材料36A或36B的厚度大約與發光元件34等高,且其厚度較佳不低於0.5毫米(mm),或者,遮光材料36A或36B的厚度略小於發光元件34的高度,在此並不侷限。遮光材料36A或36B除了可作為遮光外,還可作為後續的切割或蝕刻的參考厚度,也就是做為切割終止層或蝕刻終止層。塗佈遮光材料36A或36B可以防止發光元件34的光束從側向直接傳遞至光接收器33,而遮光材料36B的局部環繞結構除了連接導線35的側邊沒有塗佈遮光材料36B外,其餘三個側邊皆塗上遮光材料36B,所以更可防止發光元件34所發出的光從發光元件34的下方傳遞而導致漏光問題產生。另外,遮光材料36A或36B較佳為不透光或限定波長不通過的液晶聚合物、環氧樹脂或矽樹脂所構成,且顏色較佳為黑色,其材料特性的觸變指數須至少大於或等於2.5以上較佳,以確保材料在點膠後能維持至少1:1.3以下的高寬比。Furthermore, taking FIGS. 3A and 3B as an example, in order to prevent the light emitted by the light-emitting
在步驟S204中,填充一透光材料37以覆蓋電路基板31、晶片32、遮光材料36A或36B以及至少一發光元件34,且進一步覆蓋在光接收器33與導線35上。透光材料37較佳為環氧樹脂或矽膠,且透過模製成型的方式包覆發光元件34、光接收器33、晶片32、電路基板31以及導線35,達到保護發光元件34、光接收器33、晶片32、電路基板31以及導線35的目的,如圖3C與圖4C所示。In step S204, a light-transmitting
接著,在步驟S205中,去除部分位於光發射區321與光接收區322之間的透光材料37,以形成第一凹槽381並露出遮光材料36A或36B。透光材料37主要用途在於保護發光元件34、光接收器33、晶片32、電路基板31以及導線35,發光元件34所發射的光束會在透光材料37中傳遞,因此,為了避免發光元件34的所發射的光束直接橫向傳輸至光接收器33,去除在光發射區321與光接收區322之間部分的透光材料37,以形成圖3D或圖4D中的第一凹槽381。Next, in step S205, part of the light-transmitting
詳細來說,在步驟S205中,可以僅去除位於光發射區321與光接收區322之間的透光材料37,以形成第一凹槽381,或者,在不同實施例中,在步驟S205中,也可以除了去除光發射區321與光接收區322之間的透光材料37而形成第一凹槽381以外,可進一步地,去除在晶片32周圍的透光材料37以形成第二凹槽382,如圖3D或圖4D所示,便於在後續的製程步驟中,在第一凹槽381與第二凹槽382中填充防漏光材料39;或者,如圖4D所示,更可以在光發射區的上下兩側形成一第三凹槽383,第三凹槽383可與第一凹槽381同時形成,第三凹槽383與第二凹槽382連通,且第三凹槽383的深度小於第二凹槽382的深度。另外,在此需要說明的是,於本發明的實施例中,可以僅形成第一凹槽381,或者先形成第一凹槽381,然後再形成第二凹槽382,順序不侷限,且第一凹槽381與第二凹槽382的外觀可以是任何形狀,例如U型凹槽等,在此亦並不侷限。In detail, in step S205, only the light-transmitting
進一步來說,如圖3D與圖4D所示,在步驟S205中,去除在光發射區321與光接收區322之間的透光材料37以及周圍的透光材料37,在透光材料37內定義出光發射區321與光接收區322之間的第一凹槽381與環繞晶片32外圍的第二凹槽382,甚至位於光發射區321上下兩側的第三凹槽383,以便於在後續的製程將第一防漏光材料391與第二防漏光材料392分別對應填充於其中。另外,在去除部分透光材料37的步驟中,在形成第一凹槽381以及第三凹槽383時,可以參考遮光材料36A或36B的厚度,遮光材料36A或36B做為切割終止層或蝕刻終止層,當向下往晶片32的方向切割或蝕刻透光材料37時,是利用一切割工具沿一縱軸方向向下切割以形成第一凹槽381或第三凹槽383,亦即向晶片32方向切割或蝕刻後,直到遮光材料36A或36B露出於第一凹槽381或第三凹槽383內,較佳的切割終止點為晶片32上方至少0.04毫米(mm),表示已經切割或蝕刻的深度夠深了,若再切割或蝕刻下去,可能會損壞晶片32,而此時遮光材料36A或36B的寬度在切割後大約在0.2毫米(mm),切割後的遮光材料36A或36B寬度大小與製程工藝或不透光材料的選擇有關,切割位置不一定要完全切割遮光材料36A或36B的上方,切割位置部分位於遮光材料36A或36B上方即可。如上所述,本發明的遮光材料36A或36B,除了可以阻止漏光外,還可以做為後續的切割或蝕刻的參考位置。Furthermore, as shown in FIGS. 3D and 4D, in step S205, the light-transmitting
詳細來說,請參考圖4A與圖4D,去除環繞晶片32周圍的透光材料37步驟中,亦可多至少一道沿一橫軸方向向下切割以形成半蝕的第三凹槽383於晶片上方至少0.04毫米(mm),也就是說於,部分環繞晶片32外圍的第二凹槽382會與周圍的第三凹槽383相疊加,形成有階梯狀的凹槽結構。更進一步的說,以圖4D為例,亦可以光發射區321上下兩側的橫向延伸遮光材料36B作為蝕刻或切割的終止層,部分遮光材料36B外露於上述的階梯狀的凹槽結構。In detail, please refer to FIGS. 4A and 4D. In the step of removing the light-transmitting
在步驟S206中,填充防漏光材料39在第一凹槽381中。進一步來說,最後,如圖3E與圖3F或圖4E與圖4F所示,在步驟S206中,將第一防漏光材料391填充在去除透光材料37所形成的第一凹槽381中,或甚至可以將第一防漏光材料391與第二防漏光材料392填充在去除透光材料37所形成的第一凹槽381與第二凹槽382和第三凹槽383中,以完成本發明的光感測器的製程。通過以兩種不同的材料堆疊達到所要擋光效果,亦即在光發射區321與光接收區322之間的遮光材料36A或36B與第一防漏光材料391會堆疊而形成一擋牆,有效防止橫向光直接穿透的問題。第二防漏光材料392填充在圖3D的第二凹槽382或圖4D的第二凹槽382與第三凹槽383中,以形成在電路基板31的四個側邊,包圍晶片32周圍的防漏光結構,達到阻隔周遭環境光照射的功效。在第二實施例中,如圖4E所示,在發光元件34外圍的部分第二防漏光材料392也會堆疊在遮光材料36B上,進一步避免光從發光元件34的下方傳遞的問題。In step S206, the light
另外,通過本發明的光學感測器封裝結構的製造方法,可以有效地將光學感測器的表面積縮小大約2.3%~9.3%,且其體積大約4.2mm x 2.6mm x 1mm。遮光材料36為不透光材料或可阻擋特定波長訊號的液晶聚合物、環氧樹脂或矽樹脂所構成,遮光材料36A或36B與的材料特性的觸變指數至少大於或等於2.5以上,防漏光材料39為不透光或限定波長不通過的阻光材料所構成,其材料特性黏度<1k厘泊(cps)。In addition, through the manufacturing method of the optical sensor package structure of the present invention, the surface area of the optical sensor can be effectively reduced by about 2.3% to 9.3%, and its volume is about 4.2mm x 2.6mm x 1mm. The light-shielding material 36 is made of opaque material or liquid crystal polymer, epoxy resin or silicon resin that can block specific wavelength signals. The thixotropic index of the material properties of the light-shielding
[本發明封裝結構實施例][Embodiments of Package Structure of the Invention]
請參閱圖3E與圖3F或圖4E與圖4F,在本發明的較佳實施例中,本發明的光學感測器封裝結構包括一電路基板31、一晶片32、一光接收器33、一發光元件34、多條導線35、一遮光材料36A或36B、一透光材料37與防漏光材料39。Please refer to FIGS. 3E and 3F or FIGS. 4E and 4F. In a preferred embodiment of the present invention, the optical sensor package structure of the present invention includes a
晶片32設置在電路基板31上,而晶片32包括一光發射區321與一光接收區322,在晶片32的光接收區322上具有光接收器33,而發光元件34設置在晶片32的光發射區321,晶片32與發光元件34通過多條導線35電連接電路基板31。遮光材料36A或36B設置在光發射區321與光接收區322之間,遮光材料36A是以點膠方式塗在光發射區321與光接收區322的相鄰區域,會在發光元件34與光接收器32之間形成一下擋牆,如圖3C所示,或者,在不同實施例中,遮光材料36B也可以塗在發光元件34的周圍以形成一ㄇ型結構或壩狀結構的下擋牆,如圖4A與圖4B所示的標號36B,以阻隔發光元件34的光束從側向直接傳遞至光接收器33。遮光材料36A或36B的厚度不大於發光元件34高度,厚度較佳不低於0.5毫米(mm),但在此並不侷限。遮光材料36A或36B除了可作為遮光外,還可作為後續的切割或蝕刻的參考厚度,也就是做為切割終止層或蝕刻終止層。The
透光材料37主要設置在電路基板31、晶片32、光接收器33、發光元件34、導線35以及遮光材料36A或36B上,以覆蓋電路基板31、晶片32、光接收器33、發光元件34、導線35以及遮光材料36A或36B,達到保護電路基板31、晶片32、光接收器33、發光元件34以及導線35的功效。防漏光材料39設置在晶片32的光發射區321的周圍以及光接收區322的周圍,由透光材料37所形成的凹槽38中,進一步來說,在形成透光材料37後,切割或蝕刻透光材料37,在發光元件34與光接收器33之間形成第一凹槽381,並進一步在晶片32的周圍形成圖3D的第二凹槽382或圖4D的第二凹槽382與第三凹槽383,讓第一防漏光材料391與第二防漏光材料392可以分別填充在圖3D的透光材料37所形成的第一凹槽381與第二凹槽382中或圖4D的透光材料37所形成的第一凹槽381與第二凹槽382和第三凹槽383中。另外,在填充完防漏光材料39後,第一防漏光材料391堆疊在遮光材料36A或36B所形成的下擋牆上,再形成一堆疊其上的上擋牆。詳細來說,由遮光材料36A或36B與第一防漏光材料391相連而形成上下相連接的階梯狀擋牆結構,而堆疊構成一側光間隔結構,進而達到良好的遮光效果。在不同實施例中,所移除透光材料37的區域亦可包含形成在晶片32的周圍且部份位於晶片32上,也就是圖4D所示第三凹槽383的位置,進一步來說,上述第三凹槽383的位置與在光發射區321上下兩側延伸的ㄇ型結構或壩狀結構的遮光材料36B所定義的位置要有部分的重疊,或者說遮光材料36B部分外露於光發射區321上下兩側的多個第三凹槽383。因此,當第二防漏光材料392形成在晶片32外圍時,除了一部分的第二防漏光材料392會填充於第三凹槽383,亦即堆疊在發光元件34外圍的部分遮光材料36B上,另一部分的第二防漏光材料392會填充於第二凹槽382上,亦即堆疊在電路基板31上,最終形成階梯狀環繞結構,如圖4E與圖4F所示。The light-transmitting
形成凹槽38的方式可以是先形成透光材料37,然後再以蝕刻或切割製程形成凹槽,或者在不同實施例中,可應用模具放置在光學感測器封裝結構上,然後填充透光材料37,並固化透光材料37,當透光材料37塑形後,即可同時形成凹槽38。The
[實施例的有益效果][Beneficial effects of the embodiment]
本發明的其中一有益效果在於,在本發明所提供的光感測器的製作方法中,其能通過將遮光材料設置在透光材料的下方以避免漏光問題產生,並可以防止在切割製程時,切割至晶片,除了可以縮小整體光感測器的體積並可以防止漏光問題。One of the beneficial effects of the present invention is that, in the manufacturing method of the light sensor provided by the present invention, the light-shielding material can be arranged under the light-transmitting material to avoid light leakage problems, and to prevent the occurrence of light leakage during the cutting process. , Dicing to the wafer, in addition to reducing the volume of the overall light sensor and preventing light leakage.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.
10:智慧手表
11:心率感測器
S201~S206:步驟
31: 電路基板
32:晶片
321:光發射區
322:光接收區
33:光接收器
34:發光元件
35:導線
36A:遮光材料
36B:遮光材料
37:透光材料
38:凹槽
381:第一凹槽
382:第二凹槽
383:第三凹槽
39:防漏光材料
391:第一防漏光材料
392:第二防漏光材料10: Smart watch
11: Heart rate sensor
S201~S206: steps
31: Circuit board
32: chip
321: light emitting area
322: light receiving area
33: Optical receiver
34: Light-emitting element
35:
圖1顯示現有智慧手表的示意圖。Figure 1 shows a schematic diagram of an existing smart watch.
圖2顯示本發明光學感測器封裝結構的製造方法的流程圖。FIG. 2 shows a flow chart of the manufacturing method of the optical sensor package structure of the present invention.
圖3A為本發明一實施例的晶片上塗佈遮光材料的俯視圖。3A is a top view of a light-shielding material coated on a wafer according to an embodiment of the invention.
圖3B為本發明晶片上塗佈遮光材料的剖面圖。Fig. 3B is a cross-sectional view of the light-shielding material coated on the wafer of the present invention.
圖3C為本發明晶片上設置透光材料的剖面圖。Fig. 3C is a cross-sectional view of the transparent material provided on the wafer of the present invention.
圖3D為本發明去除部分透光材料以及部分電路基板的剖面圖。3D is a cross-sectional view of the present invention with part of the light-transmitting material and part of the circuit board removed.
圖3E與圖3F為本發明塗佈防漏光材料的剖面圖與俯視圖。3E and 3F are a cross-sectional view and a top view of the coated anti-leakage material of the present invention.
圖4A為本發明另一實施例的晶片上塗佈遮光材料的俯視圖。4A is a top view of a light-shielding material coated on a wafer according to another embodiment of the invention.
圖4B為圖4A之IVB-IVB線的剖面圖。Fig. 4B is a cross-sectional view taken along the line IVB-IVB of Fig. 4A.
圖4C為本發明的晶片上設置透光材料的剖面圖。4C is a cross-sectional view of the light-transmitting material provided on the wafer of the present invention.
圖4D為本發明去除部分透光材料以及部分電路基板的剖面圖。4D is a cross-sectional view of the present invention with part of the light-transmitting material and part of the circuit board removed.
圖4E與圖4F為本發明塗佈防漏光材料的剖面圖與俯視圖。4E and 4F are a cross-sectional view and a top view of the coated anti-leakage material of the present invention.
S201-S206:步驟 S201-S206: steps
Claims (10)
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