CN217426747U - Semiconductor packaging device - Google Patents

Abstract

An embodiment of the present application provides a semiconductor package device, including: a carrier; an optical element disposed on the carrier; a transparent protective layer covering the optical element; and the light filtering film is arranged on the transparent protective layer. The filter film filters wavelengths except the detection light signal to reduce detection abnormality caused by interference of external noise.

Description

Semiconductor packaging device

Technical Field

The application relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging device.

Background

With the rise of wearable mobile devices, In addition to the increasing demand for various Bio-sensing and sensing devices, it is also required to achieve light weight and small volume to meet the market demand, so that a Bio sensor (Bio sensor) is integrated into a single System In a Package (SiP) to achieve the demand. In the current practical application, the Bio sensor emits light from a light-emitting Diode (LED), and is likely to cause abnormal detection due to external noise interference in the process of reflecting the light to a receiving Photodiode (PD) after reaching a measured object.

SUMMERY OF THE UTILITY MODEL

The present application provides a semiconductor package device, which is helpful for reducing the interference of external noise to optical detection.

In a first aspect, an embodiment of the present application provides a semiconductor package device, including: a carrier; an optical element disposed on the carrier; a transparent protective layer covering the optical element; and the light filtering film is arranged on the transparent protective layer.

In some alternative embodiments, the optical element comprises a light emitting element and a light receiving element;

the transparent protective layer includes a first transparent protective structure covering the light emitting element and a second transparent protective structure covering the light receiving element.

In some optional embodiments, the apparatus further comprises:

a first light blocking structure disposed on the carrier and between the first transparent protective structure and the second transparent protective structure, the first light blocking structure capable of blocking light transmission between the first transparent protective structure and the second transparent protective structure.

In some alternative embodiments, one end of the first light obstructing structure proximal to the carrier has a larger cross-sectional area than the other end distal to the carrier.

In some alternative embodiments, the transparent protective layer covers at least a portion of the first light blocking structure.

In some optional embodiments, the apparatus further comprises:

the second light blocking structure is arranged on the carrier, a first accommodating cavity and a second accommodating cavity are formed between the second light blocking structure and the first light blocking structure, the first transparent protection structure is arranged in the first accommodating cavity, and the second transparent protection structure is arranged in the second accommodating cavity.

In some optional embodiments, the filter film is at least partially disposed on the first and second light blocking structures.

In some optional embodiments, the apparatus further comprises:

and the optical element is electrically connected with the carrier through the routing, and the transparent protective layer coats the routing.

In some alternative embodiments, the carrier comprises a flexible substrate.

In some alternative embodiments, the light emitting element includes a first light emitting unit and a second light emitting unit, and a light emitting band of the first light emitting unit is different from a light emitting band of the second light emitting unit.

In the semiconductor package device provided by the present application, the semiconductor package device includes by design: a carrier; an optical element disposed on the carrier; a transparent protective layer covering the optical element; the light filtering film is arranged on the transparent protective layer; the filter film filters the wavelength except the detection light signal to reduce the detection abnormality caused by the interference of external noise.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic longitudinal cross-sectional structure of one embodiment of a semiconductor package device according to the present application;

FIGS. 2A, 2B, 2Ca, 2Da, and 2E are schematic longitudinal cross-sectional structural views of a semiconductor package device fabricated at various stages according to an embodiment of the present application;

FIG. 2Cb and FIG. 2Db are schematic top views of FIG. 2Ca and FIG. 2Da respectively.

Description of the symbols:

11-a carrier; 12-an optical element; 121-a light receiving element; 122 — a light emitting element; 1221-a first light emitting unit; 1222-a second light emitting unit; 13-a transparent protective layer; 131-a first transparent protective structure; 132-a second transparent protective structure; 14-a light filter film; 15-a first light blocking structure; 16-a second light blocking structure; 161-a first receiving chamber; 162-a second receiving chamber; 17-routing.

Detailed Description

The following description of the embodiments of the present application will be provided in conjunction with the accompanying drawings and examples, and those skilled in the art can easily understand the technical problems and effects that the present application solves and provides by the contents of the present specification. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. In addition, for convenience of description, only portions related to the related invention are shown in the drawings.

It should be readily understood that the meaning of "in.. on," "over,", and "above" in this application should be interpreted in the broadest sense such that "in.. on" not only means "directly on something," but also means "on something" including an intermediate member or layer between the two.

Furthermore, spatially relative terms, such as "below," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or component's relationship to another element or component as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 ° or at other orientations) and the spatially relative descriptors used herein interpreted accordingly as such.

The term "layer" as used herein refers to a portion of material that includes a region having a thickness. The layer may extend over the entire underlying or overlying structure, or may have a lesser extent than the extent of the underlying or overlying structure. Furthermore, a layer may be a region of a homogeneous or heterogeneous continuous structure having a thickness less than the thickness of the continuous structure. For example, a layer may be located between any pair of horizontal planes between the top and bottom surfaces of a continuous structure or therebetween. The layers may extend horizontally, vertically, and/or along a tapered surface. The substrate may be a layer, may include one or more layers therein, and/or may have one or more layers thereon, above, and/or below. One layer may comprise multiple layers. For example, the semiconductor layer may include one or more doped or undoped semiconductor layers, and may be of the same or different materials.

It should be noted that the structures, proportions, sizes, and other elements shown in the drawings are only used for understanding and reading the contents of the specification, and are not used for limiting the conditions under which the present application can be implemented, so they do not have the technical significance, and any structural modifications, changes in proportion, or adjustments of sizes, which do not affect the efficacy and achievement of the purposes of the present application, shall still fall within the scope of the technical content disclosed in the present application. In addition, the terms "above", "first", "second" and "a" as used herein are for the sake of clarity only, and are not intended to limit the scope of the present application, and changes or modifications of the relative relationship may be made without substantial technical changes.

It should be further noted that, in the embodiments of the present application, the corresponding longitudinal section may be a front view direction section, the transverse section may be a right view direction section, and the horizontal section may be a top view direction section.

In addition, the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Referring to fig. 1, fig. 1 is a schematic longitudinal cross-sectional structure of a semiconductor package device 100 according to an embodiment of the present application. As shown in fig. 1, the semiconductor package device 100 of the present application may include: a carrier 11; an optical element 12 disposed on the carrier 11; a transparent protective layer 13 covering the optical element 12; the filter film 14 is disposed on the transparent protection layer 13.

The type of the carrier 11 is not specifically limited in the embodiment of the present application, the carrier 11 may provide a carrying function, and the type of the carrier 11 does not affect the detection effect of the embodiment of the present application. The carrier 11 may comprise, for example, a substrate, a flexible substrate, a wiring layer, a redistribution layer, an electronic component, or the like.

In the embodiment of the present application, the optical element 12 is at least capable of providing an optical signal receiving function, and the optical element 12 is capable of receiving an optical detection signal.

The transparent protective layer 13 may be molded from various light-transmissive molding materials (clear mold). For example, the light transmissive molding material may include polymethyl methacrylate (PMMA), Polystyrene (PS), Polycarbonate (PC), polydiallyl diglycol carbonate (CR-39), styrene acrylonitrile copolymer, poly 4-methylpentene-1, light transmissive polyamide, Epoxy resin (Epoxy resin), Catalyst (Catalyst), Release Agent (Release Agent), Flame Retardant (Flame Retardant), Coupling Agent (Coupling Agent), Hardener (hardner), Low Stress absorbent (Low Stress absorbent), Adhesion Promoter (Adhesion Promoter), Ion trap (Ion Trapping Agent), transparent silica gel, and the like. When the carrier 11 is a flexible substrate, the transparent protection layer 13 can be a softer transparent molding material, so that the semiconductor package device 100 of the present embodiment is flexible. The transparent protective layer 13 provides fixing and protecting functions for the optical element 12, and the transparent protective layer 13 can transmit light between the outside and the optical element 12 through the transparent protective layer 13 due to its light-transmitting optical characteristics.

In the embodiment of the present application, the material of the filter 14 is not particularly limited, and may be a PET (polyethylene terephthalate) filter, a PE (polyethylene) filter, or the like. The filter 14 can provide a filtering function, and specifically, the filter 14 can filter wavelengths other than the detection light signal of the optical device 12, so as to reduce the influence of the external noise interference on the optical device 12 and reduce the detection abnormality caused by the external noise interference. Moreover, since the filter film 14 is directly disposed on the transparent passivation layer 13, the glass surface structure of the conventional Bio sensor is not required, so that the thickness of the encapsulation device can be reduced.

In some alternative embodiments, as shown in fig. 1, the optical element 12 includes a light emitting element 122 and a light receiving element 121.

Here, the light emitting element 122 may be a light emitting electronic device, for example, an LED (light-emitting diode) or the like.

The light receiving element 121 may include, for example, a die (die), an ASIC (Application Specific Integrated Circuit) chip, an HBM (High Bandwidth Memory) chip or a PIC (photonic Integrated Circuit) chip, a PD (Photo-Diode), and the like.

The transparent protective layer 13 includes a first transparent protective structure 131 and a second transparent protective structure 132, the first transparent protective structure 131 covering the light emitting element 122, and the second transparent protective structure 132 covering the light receiving element 121.

The first and second transparent protective structures 131 and 132 are composed of the same material as the transparent protective layer 13. The first transparent protection structure 131 and the second transparent protection structure 132 correspondingly protect the light emitting device 122 and the light receiving device 121, so that light emitted from the light emitting device 122 can be transmitted outwards through the first transparent protection structure 131, external light can be transmitted to the light receiving device 121 through the second transparent protection structure 132 after being filtered by the filter film 14, and a light transmission path is shown as a dotted line in fig. 1.

In some alternative embodiments, as shown in fig. 1, the semiconductor package device 100 may further include:

a first light blocking structure 15 disposed on the carrier 11 and between the first transparent protective structure 131 and the second transparent protective structure 132, the first light blocking structure 15 being capable of blocking light transmission between the first transparent protective structure 131 and the second transparent protective structure 132. To avoid light interference between the light emitting element 122 and the light receiving element 121.

Here, the first light blocking structure 15 may be molded of various light-tight Molding materials (Molding Compound). For example, the opaque mold sealing material may include Epoxy resin (Epoxy resin), Filler (Filler), Catalyst (Catalyst), Pigment (Pigment), Release Agent (Release Agent), Flame Retardant (Flame Retardant), Coupling Agent (Coupling Agent), Hardener (hardner), Low Stress absorbent (Low Stress Absorber), Adhesion Promoter (Adhesion Promoter), Ion capturing Agent (Ion Trapping Agent), opaque silicone, and the like.

In some alternative embodiments, one end of the first light blocking structure 15 close to the carrier 11 has a larger cross-sectional area than the other end remote from the carrier 11. To improve the stability of the first light blocking structure 15.

In some alternative embodiments, a transparent protective layer 13 covers at least a part of the first light blocking structure 15. It will be appreciated that the transparent protective layer 13 covers at least the sides of the first light blocking structure 15 to provide protection to the first light blocking structure 15.

In some optional embodiments, the semiconductor package device 100 further includes:

and a second light blocking structure 16 disposed on the carrier 11 and having a first accommodating chamber 161 and a second accommodating chamber 162 with the first light blocking structure 15, wherein the first transparent protection structure 131 is disposed in the first accommodating chamber 161, and the second transparent protection structure 132 is disposed in the second accommodating chamber 162. The second light blocking structure 16 can block light transmission between the outside and the sides of the first and second transparent protective structures 131 and 132 against the second light blocking structure 16 to prevent interference caused by the transmission of the outside light at the sides.

The second light blocking structure 16 is made of the same material as the first light blocking structure 15. The transparent protection layer 13 is filled in the first receiving cavity 161 and the second receiving cavity 162 to form the first transparent protection structure 131 and the second transparent protection structure 132. The materials used for the transparent protection layer 13 and the first and second light blocking structures 15 and 16 will affect the adhesion of the filter 14, and in some alternative embodiments, for example, a silicone material can be used to improve the adhesion of the filter 14.

In some alternative embodiments, when the carrier 11 is a flexible substrate, the transparent protective layer 13 may be a softer light-transmissive encapsulating material, and the transparent protective layer 13 is softer than the material of the first and second light-blocking structures 15 and 16.

In some alternative embodiments, as shown in fig. 1, the filter film 14 is at least partially disposed on the first light blocking structure 15 and the second light blocking structure 16. The upper surfaces of the first and second light blocking structures 15 and 16 and the upper surfaces of the first and second transparent protection structures 131 and 132 are coplanar, and the filter film 14 can cover the upper surfaces of the first and second light blocking structures 15 and 16 and the upper surfaces of the first and second transparent protection structures 131 and 132 to provide a complete filtering function, thereby avoiding external noise interference caused by incomplete covering.

In some alternative embodiments, the filter 14 may cover only the transparent protection layer 13, that is, the filter 14 covers only the first and second transparent protection structures 131 and 132, and the upper surfaces of the first and second transparent protection structures 131 and 132 may be slightly lower than the upper surfaces of the first and second light blocking structures 15 and 16, so that the filter 14 above the first and second transparent protection structures 131 and 132 is coplanar with the upper surfaces of the first and second light blocking structures 15 and 16.

In some optional embodiments, the semiconductor package device 100 further includes:

the wire bonding 17, the optical element 12 is electrically connected to the carrier 11 through the wire bonding 17, and the transparent protection layer 13 covers the wire bonding 17.

In some alternative embodiments, the light emitting element 122 includes a first light emitting unit 1221 and a second light emitting unit 1222, and the light emitting wavelength band of the first light emitting unit 1221 and the light emitting wavelength band of the second light emitting unit 1222 may be the same or different to provide light emitting requirements of different application scenarios. Correspondingly, the filter film 14 can filter out wavelengths other than the returned detection light signals corresponding to the light wave bands emitted by the first light emitting unit 1221 and the second light emitting unit 1222.

Fig. 2A, 2B, 2Ca, 2Da, and 2E are schematic longitudinal cross-sectional structural views of semiconductor package devices 200A, 200B, 200C, 200D, and 200E fabricated at various stages according to an embodiment of the present application; FIGS. 2Cb and 2Db are schematic top views of FIGS. 2Ca and 2Da, respectively.

Referring to fig. 2A, first, a carrier 11 and an optical element 12 are provided.

Here, the optical element 12 may include a light receiving element 121 and a light emitting element 122, and the light emitting element 122 may include a first light emitting element 1221 and a second light emitting element 1222.

Then, the optical element 12 is disposed on the carrier 11.

Here, the light receiving element 121 and the light emitting element 122 are adjacently disposed on the carrier 11, and the first light emitting element 1221 and the second light emitting element 1222 are adjacently disposed.

The optical element 12 and the carrier 11 are then electrically connected by means of a wire bond 17.

Referring to fig. 2B, a first light blocking structure 15 is provided on the carrier 11. Wherein the first light blocking structure 15 is located between the light receiving element 121 and the light emitting element 122.

Here, the first light blocking structure 15 may be formed by molding. The molding process may be at least one of the following: free-transfer molding (transfer molding), injection molding (injection molding), compression molding (compression molding), liquid molding (liquid molding), and spray injection molding (spray molding).

Referring to fig. 2Ca and 2Cb, a second light blocking structure 16 is disposed on the carrier 11. Wherein the second light blocking structure 16 is at least partially located on both sides on the carrier 11, a first accommodating cavity 161 and a second accommodating cavity 162 are formed between the first light blocking structure 15 and the second light blocking structure 16, wherein the light receiving element 121 is located in the first accommodating cavity 161 and the light emitting element 122 is located in the second accommodating cavity 162.

Here, the second light blocking structure 16 may be formed by molding.

Since the encapsulating material may flow downward under the influence of gravity when the first and second light blocking structures 15 and 16 are disposed, the first and second light blocking structures 15 and 16 assume a narrow-top-and-wide-bottom form in a longitudinal sectional structure.

Referring to fig. 2Da and 2Db, a transparent molding material is injected into the first receiving chamber 161 and the second receiving chamber 162 to form the first transparent protective structure 131 and the second transparent protective structure 132, i.e., to form the transparent protective layer 13.

In the embodiment of the present application, since the material flowability of the transparent protection layer 13 is higher than that of the first light blocking structure 15 and the second light blocking structure 16, the first light blocking structure 15 and the second light blocking structure 16 need to be fabricated to form the first accommodating cavity 161 and the second accommodating cavity 162, and then the transparent encapsulation material is filled in.

Since the first and second light blocking structures 15 and 16 are narrow on top and wide on bottom, the transparent encapsulation material may cover at least a portion of the upper surfaces of the first and second light blocking structures 15 and 16 and may cover a portion of the lateral lower ends of the first and second light blocking structures 15 and 16 when injecting the first and second receiving cavities 161 and 162, i.e., a portion of the bottom of the first and second light blocking structures 15 and 16 is under the transparent protection layer 13.

Here, the upper surfaces of the transparent protective layer 13, the first light blocking structure 15, and the second light blocking structure 16 may be subjected to a polishing process by mechanical grinding or the like so that the upper surfaces of the transparent protective layer 13, the first light blocking structure 15, and the second light blocking structure 16 are substantially coplanar. The flatness of the upper surface of the transparent protective layer 13 will affect the light penetration, the flatter the better the light penetration.

Referring to fig. 2E, a filter film 14 is disposed on the transparent protective layer 13 and the first and second light blocking structures 15 and 16.

The method for manufacturing the semiconductor structure provided by the present disclosure can achieve similar technical effects to the aforementioned semiconductor structure, and is not described herein again.

While the present disclosure has been described and illustrated with reference to particular embodiments thereof, such description and illustration are not intended to limit the present disclosure. It will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the true spirit and scope of the disclosure as defined by the appended claims. The illustrations may not be drawn to scale. There may be a difference between the technical reproduction and the actual implementation in the present disclosure due to variables in the manufacturing process, and the like. There may be other embodiments of the disclosure that are not specifically illustrated. The specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form equivalent methods without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the present disclosure.

Claims (10)

1. A semiconductor package device, comprising:

a carrier;

an optical element disposed on the carrier;

a transparent protective layer covering the optical element;

and the light filtering film is arranged on the transparent protective layer.

2. The device of claim 1, wherein the optical element comprises a light emitting element and a light receiving element;

the transparent protective layer comprises a first transparent protective structure and a second transparent protective structure, the first transparent protective structure covers the light emitting element, and the second transparent protective structure covers the light receiving element.

3. The apparatus of claim 2, further comprising:

a first light blocking structure disposed on the carrier and between the first transparent protective structure and the second transparent protective structure, the first light blocking structure capable of blocking light transmission between the first transparent protective structure and the second transparent protective structure.

4. The apparatus of claim 3, wherein one end of the first light obstructing structure proximal to the carrier has a larger cross-sectional area than the other end distal to the carrier.

5. The apparatus of claim 3, wherein the transparent protective layer covers at least a portion of the first light blocking structure.

6. The apparatus of claim 3, further comprising:

the second light blocking structure is arranged on the carrier, a first accommodating cavity and a second accommodating cavity are formed between the second light blocking structure and the first light blocking structure, the first transparent protection structure is arranged in the first accommodating cavity, and the second transparent protection structure is arranged in the second accommodating cavity.

7. The apparatus of claim 6, wherein the filter is at least partially disposed over the first and second light blocking structures.

8. The apparatus of claim 1, further comprising:

and the optical element is electrically connected with the carrier through the routing, and the transparent protective layer coats the routing.

9. The apparatus of claim 1, wherein the carrier comprises a flexible substrate.

10. The apparatus according to claim 2, wherein the light emitting element comprises a first light emitting unit and a second light emitting unit, and a light emitting band of the first light emitting unit is different from a light emitting band of the second light emitting unit.

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