CN218585036U - Semiconductor packaging structure - Google Patents

Abstract

The semiconductor package structure provided by the application can enable light from an optical device to be reduced in light spot size and can be concentrated on a tiny sensing area of an optical sensor through the lens stacked on the package material. The use of the lens can contribute to downsizing of the optical sensor, overall miniaturization, and cost reduction.

Description

Semiconductor packaging structure

Technical Field

The present disclosure relates to the field of semiconductor technology, and more particularly to a semiconductor package structure.

Background

In a Silicon Photonics (SIPH) structure, an optical Fiber of a light Array Unit (FAU) has its size limitation, so that an optical signal area of an optical Sensor (Photo Sensor) that transmits light to a photonic chip (PIC) is large, and light enters the optical Sensor after being emitted from the FAU, which is easily affected by light dissipation or external environment interference. In one case, the size of the optical sensor can be correspondingly matched with the area of the light spot, and the area size of the light receiving area of the optical sensor is only larger than that of the FAU light emitting area, so that the miniaturization of the whole structure is not facilitated.

SUMMERY OF THE UTILITY MODEL

The application provides a semiconductor package structure, including:

the active surface of the photonic chip is provided with an optical sensor;

the packaging material wraps the photonic chip and is provided with an opening for exposing the optical sensor;

a lens stacked on the packaging material and positioned above the opening;

the optical device is arranged above the lens, and light is emitted from the optical device, passes through the lens and then enters the optical sensor.

In some alternative embodiments, the area of the light emitting area of the optical device is larger than the light sensing area of the optical sensor.

In some alternative embodiments, the medium between the lens and the optical sensor is air or vacuum.

In some optional embodiments, the focal length of the lens is equal to or greater than the distance between the lens and the optical sensor.

In some alternative embodiments, the lens is a convex lens.

In some alternative embodiments, the lens is a plano-convex lens.

In some alternative embodiments, the plane of the plano-convex lens is directed towards the optical sensor.

In some optional embodiments, the plane of the plano-convex lens extends and is attached to the upper surface of the packaging material.

In some optional embodiments, the encapsulant encapsulates wires connecting the redistribution layer and the photonic chip.

In some alternative embodiments, the encapsulant is a mold encapsulant.

In some alternative embodiments, the lens is disposed parallel to the photonic chip.

In order to solve the problem that light entering an optical Sensor (Photo Sensor) on a photonic chip (PIC) from a light Array Unit (FAU) is dissipated and disturbed by an external light source, the semiconductor package structure provided by the present application can reduce the size of a light spot from an optical device by a lens stacked on a package material, so that the light spot can be concentrated on a tiny sensing area of the optical Sensor. The use of the lens can contribute to downsizing of the optical sensor, overall miniaturization, and cost reduction. In addition, the shrinking of the optical sensor makes the difference between the sizes of the optical device and the sensing area of the optical sensor hundreds of times, which is beneficial for the optical device to contain more light.

Drawings

Other features, objects and advantages of the disclosure will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 to 10 are first to tenth structural views of a semiconductor package structure according to an embodiment of the present disclosure;

fig. 11 to 24 are schematic structural diagrams in the manufacturing process of the semiconductor package structure according to the embodiment of the present application.

Description of the symbols:

1-photonic chip, 2-optical sensor, 3-packaging material, 31-opening, 4-lens, 5-optical device, 51-optical fiber array, 6-rewiring layer, 7-dielectric layer, 8-wire, 9-electronic chip, 10-first filling material, 11-mold sealing material, 12-second filling material, 13-barrier, 14-first carrier, 15-bottom filling material, 16-second carrier, 17-external connecting member, 18-first adhesive layer, 19-second adhesive layer, 20-interconnection structure.

Detailed Description

The following description of the embodiments of the present application will be provided with reference to the accompanying drawings and examples, and those skilled in the art will readily understand the technical problems and effects that are solved by the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. In addition, for convenience of description, only portions related to the related utility model are shown in the drawings.

It should be noted that the structures, proportions, sizes, and other elements shown in the drawings are only used for understanding and reading the contents of the specification, and are not used for limiting the conditions under which the present application can be implemented, so they do not have the technical significance, and any structural modifications, changes in proportion, or adjustments of sizes, which do not affect the efficacy and achievement of the purposes of the present application, shall still fall within the scope of the technical content disclosed in the present application. In addition, the terms "above", "first", "second" and "a" used in the present specification are used for the sake of clarity only, and are not intended to limit the scope of the present application, and changes and modifications of the relative relationship thereof are also considered to be the scope of the present application without substantial technical changes.

It should be further noted that, in the embodiments of the present application, the corresponding longitudinal section may be a front view direction section, the transverse section may be a right view direction section, and the horizontal section may be a top view direction section.

It should be readily understood that the meaning of "in.," over., "and" above. "in this application should be interpreted in the broadest sense such that" in.. Over "not only means" directly on something, "but also means" on something "including intermediate components or layers between the two.

Furthermore, spatially relative terms, such as "below," "lower," "over," "upper," and the like, may be used herein for ease of description to describe one element or component's relationship to another element or component as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 or at other orientations) and the spatially relative descriptors used in this application interpreted accordingly as such.

In addition, the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Fig. 1 is a first structural schematic diagram of a semiconductor package structure according to an embodiment of the present application. As shown in fig. 1, the semiconductor package structure includes a redistribution layer 6, a photonic chip 1, an optical sensor 2, a package 3, a lens 4, and an optical device 5. Wherein, the photonic chip 1 is arranged above the rewiring layer 6. The optical sensor 2 is arranged on the active surface of the photonic chip 1. The packaging material 3 wraps the photonic chip 1. The package material 3 has an opening 31 for exposing the optical sensor 2. The lens 4 is stacked on the package 3 and located above the opening 31. The optical device 5 is provided above the lens 4. Light is emitted from the optical device 5 and then enters the optical sensor 2 through the lens 4.

In the present embodiment, the optical device 5 may be used for light wave introduction and light wave extraction of an optical communication device, and may be, for example, a Fiber Array Unit (FAU) or a Laser (LD). The optical fiber array unit may include a plurality of optical fiber arrays 51.

In this embodiment, the lens 4 may be a convex lens. The lens 4 may be a plano-convex lens, for example. The lens 4 may be made of a dielectric material (e.g., the refractive index of the lens 4 may be greater than 1).

Further, the plane of the lens 4 (plano-convex lens) may face the optical sensor 2. The plane of the lens 4 (plano-convex lens) may be extended and attached to the upper surface of the encapsulant 3. Specifically, the light rays may enter the lens 4 from a convex curved surface. The imaging (focus) is at a position symmetrical to the light source with the lens 4 as a center, and thus the optical sensor 2 can be placed at the rear side of the lens 4.

In the present embodiment, the lens 4 may be disposed in parallel with the photonic chip 1, and the optical sensor 2 on the active surface of the photonic chip 1 may be directed toward the optical device 5 such that the optical sensor 2 is disposed face-to-face with the light emitting region of the optical device 5. By disposing the lens 4 between the optical sensor 2 and the optical device 5, light emitted from the light emitting region of the optical device 5 is condensed by the lens 4 to reduce the area thereof into a light spot, and then enters the optical sensor 2.

Further, the size of the optical sensor 2 can be matched by reducing the size of the light emitted from the optical device 5 by providing the lens 4 without enlarging the size of the optical sensor 2 so that the optical sensor 2 corresponds to the photoelectric area emitted from the optical device 5, whereby a feature that the area of the light emitting area of the optical device 5 is larger than the light sensing area of the optical sensor 2 can be exhibited, thereby facilitating size miniaturization. In addition, the shrinking of the optical sensor 2 makes the sensing area of the optical device 5 different from that of the optical sensor 2 by hundreds of times, which is beneficial for the optical device 5 to contain a larger amount of light.

Further, the medium between the lens 4 and the optical sensor 2 may be air or vacuum. Since the light has a concentration characteristic after passing through the air medium after passing through the lens 4 and is transmitted to the optical sensor 2, the conversion rate is high and the energy loss is relatively low. Meanwhile, since the optical signal is transmitted under the non-light-tight ambient conditions (such as the non-light-tight packaging material 3), the optical signal is not easily affected by the ambient conditions and is not easily distorted. Because the optical signal is sent out from the optical device 5, the parallel light passes through the medium (air or vacuum), the parallel light is reduced through the plano-convex lens 4 and then reduced to the tiny sensing area of the optical sensor 2, the structure and the principle are simple, and the manufacturing cost is quite low. Therefore, the light path has only one refraction treatment and is short in the area and thickness directions, which is beneficial to the overall miniaturization of the packaging body. From the point of view of the thickness of the medium, the entrance of the lens 4 from the optics 5 is parallel light, so the medium does not need to be very thick. From a media area perspective, no extra space (path) is needed due to the absence of light guide requirements. Thus, the energy loss of light transmission is relatively low due to the advantage of short path, and the received signal of the optical sensor 2 is not easily distorted due to the light concentration effect.

Further, the focal length of the lens 4 may be equal to or greater than the spacing between the lens 4 and the optical sensor 2. Optimally, the focal length of the lens 4 may be equal to the spacing between the lens 4 and the optical sensor 2.

In one embodiment, the semiconductor package structure may further include an electronic chip 9 located above the redistribution layer 6 and adjacent to the photonic chip 1, and a wire 8 connecting the redistribution layer 6 and the photonic chip 1. Furthermore, the package material 3 can cover the electronic chip 9, the photonic chip 1 and the wires 8, thereby protecting against external damage. Meanwhile, the redistribution layer 6 can be supported, and a flat surface is provided to attach the optical device 5 to the redistribution layer, so that the product has high optical alignment yield. In addition, the design of making electrical connections using wire bonding and focusing light using lens 4 may allow for slight tolerances between the surface of photonic chip 1 and redistribution layer 6.

In one embodiment, the optical device 5 may be secured to the dielectric layer 7 by a first adhesive layer 18. Here, the dielectric layer 7 and the lens 4 may be integrally formed. And the dielectric layer 7 is configured to provide a receiving space for the lens 4. And the dielectric layer 7 may also be provided to provide a flat surface for the placement of the optical device 5.

In one embodiment, the encapsulation material 3 may be formed of various Molding compounds (Molding compounds). For example, the mold sealing material may include Epoxy resin (Epoxy resin), filler (Filler), catalyst (Catalyst), pigment (Pigment), release Agent (Release Agent), flame Retardant (Flame Retardant), coupling Agent (Coupling Agent), hardener (hardner), low Stress absorbent (Low Stress Absorber), adhesion Promoter (Adhesion Promoter), ion trap (Ion Trapping Agent), and the like. The encapsulant 3 may have an opening 31 to expose the optical sensor 2, allowing light to pass between the optical sensor 2 and the optical device 5 through the lens 4.

In one embodiment, the size of the electronic components (photonic chip 1& electronic chip 9) may be between 20 μm and 200 μm. The thickness of the first adhesive layer 18 may be 10 μm to 50 μm. The thickness of the second adhesive layer 19 may be between 5 μm and 20 μm. The thickness of the encapsulating material 3 may be between 50 μm and several millimeters. The ratio of the width of the opening 31 to the width of the lens 4 is between 0.01 and 1. The distance between the upper surface of the photonic chip 1 and the upper surface of the packaging material 3 is between 50 μm and several millimeters. The thickness of the dielectric layer 7 may be 5 μm to 50 μm. The dielectric material in the redistribution layer 6 may have a thickness of 5 μm to 20 μm. The diameter of the wire 8 may be between 10 μm and 50 μm. The diameter of the interconnect structure 20 may be between 10 μm and 30 μm. The pitch (pitch) of the interconnect structures 20 may be between 15 μm and 60 μm. The diameter of the external connection 17 may be between 30 μm and 200 μm. The pitch (pitch) of the external connection 17 may be between 50 μm and 400 μm. The radius of curvature of the lens 4 may be between 5 μm and 150 μm.

Fig. 2 is a second structural diagram of a semiconductor package structure according to an embodiment of the present application. Fig. 3 is a third structural schematic diagram of a semiconductor package structure according to an embodiment of the application. Fig. 2 and 3 show two different ways of protecting the fixation optics 5. As shown in fig. 2, the first filler 10 is filled in the bottom of the bottom optical device 5. The first filling material 10 may be, for example, a Capillary Underfill (CUF), a Molded Underfill (MUF), an epoxy resin, a resin, or the like. As shown in fig. 3, the optical device 5 is mold-sealed with a mold sealing material 11. The molding material 11 may be, for example, an Epoxy resin (Epoxy resin), a Filler (Filler), a Catalyst (Catalyst), a Pigment (Pigment), a Release Agent (Release Agent), a Flame Retardant (Flame Retardant), a Coupling Agent (Coupling Agent), a Hardener (hardner), a Low Stress absorbent (Low Stress absorbent), an Adhesion Promoter (Adhesion Promoter), an Ion trap (Ion Trapping Agent), or the like.

Fig. 4 is a fourth structural diagram of a semiconductor package structure according to an embodiment of the present application. In contrast to fig. 1, the electronic chip 9, the photonic chip 1 and the wires 8 are integrally encapsulated and protected by the encapsulant 3, and fig. 4 illustrates a manner in which the electronic chip 9, the photonic chip 1 and the wires 8 are separately encapsulated and protected by the encapsulant 3.

Fig. 5 is a fifth structural diagram of a semiconductor package structure according to an embodiment of the application. In contrast to the structure shown in fig. 1 in which no filling is provided between the optical device 5 and the lens 4, the structure shown in fig. 5 is provided with a first filling material 10 between the optical device 5 and the lens 4. The first filling material 10 may be a transparent material. In the structure shown in fig. 5, the first filler 10 may be filled between the optical device 5 and the lens 4, as compared to fig. 2. The light-transmitting material with known refractive index can be selected to make the light path easier to control, and prevent water, gas and dirt from entering the light path to influence the optical efficiency.

Fig. 6 is a sixth structural schematic diagram of a semiconductor package structure according to an embodiment of the present application. Fig. 7 is a seventh structural schematic diagram of a semiconductor package structure according to an embodiment of the application. In contrast to the way in which no filling occurs between the lens 4 and the opening 31 in which the optical sensor 2 is located in the structure shown in fig. 1, the second filling material 12 is provided between the lens 4 and the opening 31 in which the optical sensor 2 is located in the structure shown in fig. 6. In contrast to the structure shown in fig. 6, the structure shown in fig. 7 is such that the lens 4 is a double-convex lens 4. The light-transmitting material with known refractive index can be selected to make the light path easier to control, and prevent water, gas and dirt from entering the light path to influence the optical efficiency. Furthermore, the optical sensor 2 is further isolated from the environment, avoiding oxidation. The second filling material 12 may also be a transparent filling material with a heat conduction function, so as to facilitate heat dissipation of the photonic chip 1 and the optical sensor 2.

Fig. 8 is an eighth structural schematic diagram of a semiconductor package structure according to an embodiment of the present application. The optical path design from the optics 5 to the lens 4 of fig. 1 differs from that of fig. 8. The structure shown in fig. 1 is such that light from the optical device 5 passes directly through the lens 4 and enters the optical sensor 2. The light emitted from the optical device 5 in the structure shown in fig. 8 passes through the blocking body 13 to change the light path, and then passes through the lens 4 and the optical sensor 2 in sequence.

Fig. 9 is a ninth structural schematic diagram of a semiconductor package structure according to an embodiment of the application. Fig. 10 is a tenth structural schematic diagram of a semiconductor package structure according to an embodiment of the present application. The profile design of the lens 4 differs in the configurations shown in fig. 1, 9 and 10. The configuration shown in fig. 1 has a lens 4 with a single curved profile. And the curved profile is curved in the direction of the lens 4 towards the optical device 5. The configuration shown in figure 9 has a lens 4 with a single curved profile. And the curved profile is curved in the direction of the lens 4 towards the optical sensor 2. The structure shown in fig. 10 has a plurality of curved profiles for the lens 4. And each curved profile is curved in the direction of the lens 4 towards the optical device 5.

The semiconductor package structure provided by the present application can make the light from the optical device 5 reduced in spot size to be focused on the tiny sensing area of the optical sensor 2 through the lens 4 stacked on the package material 3. The use of the lens 4 is advantageous for downsizing the optical sensor 2, and for reducing the overall size and cost. In addition, the shrinking of the optical sensor 2 makes the sensing area of the optical device 5 different from that of the optical sensor 2 by hundreds of times, which is beneficial for the optical device 5 to contain a larger amount of light.

Fig. 11 to 24 are schematic structural diagrams in the manufacturing process of the semiconductor package structure according to the embodiment of the present application.

As shown in fig. 11, the redistribution layer 6 is formed on the first carrier 14.

As shown in fig. 12, the photonic chip 1 is picked up, and the photonic chip 1 having the optical sensor 2 on the active surface is provided on the redistribution layer 6 by the first adhesive layer 18. Wherein the active surface of the photonic chip 1 is arranged facing.

As shown in fig. 13, wire bonding is performed. A first conductor line 8 is formed.

As shown in fig. 14, a plurality of wires 8 connecting the photonic chip 1 and the redistribution layer 6 are sequentially formed, and the electrical connection of the photonic chip 1 and the redistribution layer 6 is achieved.

As shown in fig. 15, the electronic chip 9 is picked up, and the electronic chip 9 is bonded to the rewiring layer 6.

As shown in fig. 16, an underfill material 15 is formed on the bottom of the electronic chip 9.

As shown in fig. 17, a molding process is performed to form the encapsulant 3 covering the photonic chip 1, the electronic chip 9, and the wires 8. The encapsulant 3 may provide a flat surface. An opening 31 is formed in the sealing material 3 to expose the optical sensor 2.

As shown in fig. 18, the lens 4 is formed on the second carrier 16. Then, the lens 4 and the dielectric layer 7 on the second carrier 16 are disposed above the package material 3, and the flat surface of the package material 3 supports the lens 4, thereby completing the fixing of the lens 4.

As shown in fig. 19, the heating causes the second carrier 16 to separate from the lenses 4 and the dielectric layer 7.

As shown in fig. 20, the second carrier 16 is removed.

As shown in fig. 21, the first carrier 14 is removed.

As shown in fig. 22, an external connection 17 is formed on the redistribution layer 6 on the side away from the photonic chip 1.

As shown in fig. 23, the optical device 5 is fixed on the dielectric layer 7 with the first adhesive layer 18. Optics 5 are provided to enable light to pass between the optical sensor 2 and the optics 5 via the lens 4.

As shown in fig. 24, the singulation operation. And forming a semiconductor packaging structure.

The method for manufacturing the semiconductor package structure in this embodiment can achieve similar technical effects to the semiconductor package structure described above, and is not described herein again.

While the present application has been described and illustrated with reference to particular embodiments thereof, such description and illustration are not intended to limit the present application. It will be clearly understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof within the embodiments without departing from the true spirit and scope of the present application as defined by the appended claims. The illustrations may not be drawn to scale. There may be a difference between the technical reproduction in the present application and the actual device due to variables in the manufacturing process and the like. There may be other embodiments of the application that are not specifically illustrated. The specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present application. All such modifications are intended to fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form equivalent methods without departing from the teachings of the present application. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the present application.

Claims (10)

1. A semiconductor package structure, comprising:

the active surface of the photonic chip is provided with an optical sensor;

the packaging material wraps the photonic chip and is provided with an opening for exposing the optical sensor;

a lens stacked on the packaging material and positioned above the opening;

and the optical device is arranged above the lens, and light is emitted from the optical device, passes through the lens and then enters the optical sensor.

2. The semiconductor package structure of claim 1, wherein an area of a light emitting area of the optical device is larger than a light sensing area of the optical sensor.

3. The semiconductor package structure of claim 2, wherein a medium between the lens and the optical sensor is air or vacuum.

4. The semiconductor package structure of claim 1, wherein a focal length of the lens is greater than or equal to a spacing between the lens and the optical sensor.

5. The semiconductor package structure of claim 4, wherein the lens is a convex lens.

6. The semiconductor package structure of claim 5, wherein the lens is a plano-convex lens.

7. The semiconductor package structure of claim 6, wherein the planar extension of the plano-convex lens is attached to the upper surface of the encapsulant.

8. The semiconductor package of claim 1, wherein the encapsulant encapsulates wires connecting the redistribution layer and the photonic chip.

9. The semiconductor package structure of claim 8, wherein the encapsulant is a mold encapsulant.

10. The semiconductor package of claim 8, wherein the lens is disposed parallel to the photonic chip.

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