CN111916436A - Laminated optical coupler formed by secondary sealing glue and packaging method thereof - Google Patents
Laminated optical coupler formed by secondary sealing glue and packaging method thereof Download PDFInfo
- Publication number
- CN111916436A CN111916436A CN201911220310.3A CN201911220310A CN111916436A CN 111916436 A CN111916436 A CN 111916436A CN 201911220310 A CN201911220310 A CN 201911220310A CN 111916436 A CN111916436 A CN 111916436A
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- CN
- China
- Prior art keywords
- light
- insulating layer
- optical coupler
- laminated optical
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000003292 glue Substances 0.000 title claims abstract description 22
- 238000007789 sealing Methods 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000011241 protective layer Substances 0.000 claims abstract description 17
- 230000001681 protective effect Effects 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 238000004382 potting Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Abstract
The invention discloses a laminated optical coupler formed by secondary sealing and a packaging method thereof, wherein a light receiver is fixed on a first substrate, a light receiving area is arranged on the top surface of the light receiver, then, a first sealing procedure is carried out, a light-transmitting insulating glue at least covers the light receiving area of the light receiver and a first joint point to be solidified into a light-transmitting insulating layer, then, a light emitter is fixed on the top surface of the light-transmitting insulating layer, a second joint point of the light emitter can be electrically connected to a second substrate, finally, a second sealing procedure is carried out, a protective insulating glue covers the light emitter and a second joint point and a local insulating layer on the light emitter to be solidified and used as a protective layer, and the laminated optical coupler is formed.
Description
Technical Field
The present invention relates to a packaging method of optical coupler, and more particularly, to a packaging method of laminated optical coupler using secondary sealing compound.
Background
Generally, an optical coupler (or photocoupler, optoisolator, or optoisolator) is a photoelectric conversion element that transmits electrical signals through light (e.g., visible light or infrared light), and is generally formed by packaging a light receiver and a light emitter together, and there is no electrical or physical connection between the light receiver and the light emitter except for light.
Currently, the optical coupler is generally divided into a left-right structure and an up-down structure, and it is briefly described hereinafter that the left-right structure refers to a light emitter and a light receiver, which are respectively located at left and right opposite positions in the optical coupler, wherein the light emitter and the light receiver are respectively disposed on different brackets, and the two brackets are separated from each other by a certain distance and do not touch each other, so that the light emitter can project light toward the light receiver. In addition, the "vertical structure" refers to that the light emitter and the light receiver are respectively located at the vertical opposite positions in the optical coupler, wherein the light emitter and the light receiver are also respectively arranged on different brackets, and the two brackets are separated from each other by a distance without touching each other, so that the light emitter can project light towards the light receiver. However, the optical coupler of either the "left-right structure" or the "top-bottom structure" generally suffers from the problems of too long distance between the light emitter and the light receiver, difficult alignment, and poor yield due to package alignment.
In view of the above, the inventor has devised a laminated optical coupler, as shown in fig. 1, in which the laminated optical coupler a1 is composed of a light emitter a11, an insulating layer a12 and a light receiver a13, wherein the insulating layer a12 is located between the light emitter a11 and the light receiver a13, and the insulating layer a12 is capable of allowing light from the light emitter a11 to pass through and project onto the light receiver a13, so that since the light emitter a11, the insulating layer a12 and the light receiver a13 are all separate elements, and the light receiver a13 and the light receiver a11 are separated by the insulating layer a12, the overall size of the optical coupler can be effectively reduced by controlling the thickness of the insulating layer a12, and the alignment of the light receiver a13 and the light emitter a11 is easier and more precise than the alignment of an optical coupler of a "vertical structure".
However, the inventor found that in the actual production process, since the light emitter a11, the insulating layer a12 and the light receiver a13 are all separate elements, there is still a certain difficulty in assembling and fixing, and therefore, how to improve the above-mentioned defects to provide a more convenient process is an important issue to be solved by the present invention.
Disclosure of Invention
In view of the above-mentioned improvement in the production of the laminated optical coupler, the inventor has developed and designed a laminated optical coupler formed by two-step molding and a packaging method thereof according to the present invention, so that the present invention can provide a simplified process for workers in the field to effectively solve the above-mentioned problems.
The invention provides a packaging method of laminated optical coupler formed by secondary sealing, firstly, fixing a light receiver on a first substrate, a first joint of the light receiver can be electrically connected to a first joint of the first substrate, and the top surface of the light receiver is provided with a light receiving area, then, carrying out a primary sealing procedure, and enabling a transparent insulating glue to at least cover a partial area of the light receiver to be solidified and used as a transparent insulating layer, wherein the partial area comprises the light receiving area and the position of the first joint, then, fixing a light emitter on the top surface of the transparent insulating layer, and the light emitter can project light towards the direction of the corresponding light receiving area through the transparent insulating layer, a second joint of the light emitter can be electrically connected to a second joint of a second substrate, finally, a second sealing procedure is carried out, and a protective insulating glue covers the light emitter and the second bonding point and at least partial transparent insulating layer on the light emitter, so as to be solidified and used as a protective layer, and the laminated optical coupler is formed.
The invention also provides a laminated optical coupler molded by secondary sealing, comprising a light receiver, a transparent insulating layer, a light emitter and a protective layer, wherein the light receiver is fixed on a first substrate, and the top surface of the light receiver is provided with a light receiving area, a first joint of the light receiver can be electrically connected to a first joint of the first substrate, the transparent insulating layer is formed by curing a transparent insulating glue, the transparent insulating layer at least covers a local area of the light receiver, the local area comprises the light receiving area and the position of the first joint, the light emitter can be fixed on the top surface of the transparent insulating layer, and can project light towards the direction of the corresponding light receiving area through the transparent insulating layer, and a second joint of the light emitter can be electrically connected to a second joint of a second substrate, the protective layer is formed by curing a protective insulating glue, and the protective layer covers the light emitter, the second bonding point on the light emitter and at least part of the light-transmitting insulating layer, so that workers in the field can form the light-transmitting insulating layer and the protective layer in sequence only by twice glue sealing procedures.
It is still another object of the present invention that the light-transmissive insulating glue can completely cover the light receiver, so that the light receiver can be more stably fixed on the first substrate.
It is still another object of the present invention that the protective insulating layer completely covers the transparent insulating layer to effectively protect the integrity of the necessary components (e.g., the light receiver, the transparent insulating layer and the light emitter) required for the operation of the laminated optical coupler.
Drawings
FIG. 1 is a schematic diagram of a prior art stacked optocoupler.
FIG. 2 is a schematic structural diagram after a first molding process of the present invention.
FIG. 3 is a schematic structural diagram after a second molding process of the present invention.
FIG. 4 is a flow chart of the present invention.
Description of the symbols
[ Prior Art ]
A1
A11
Insulating layer a12
Light receiver a13
[ invention ]
Laminated optical coupler
Light receiver
111
Light receiving region
Light-transmitting insulating layer 13
Light emitter
151
Light-transmitting adhesive
21. first base plate
211 first contact
22. the second substrate
221 a
First transmission line B1
B2
301-304
Detailed Description
The present invention provides a laminated optocoupler formed by two-step molding and a packaging method thereof, as shown in fig. 2 and 3, in one embodiment, the laminated optical coupler 1 at least comprises a light receiver 11, a transparent insulating layer 13, a light emitter 15 (such as LED), a protective layer 17, a first substrate 21 and a second substrate 22, wherein the light-transmitting insulating layer 13 is located between the light receiver 11 and the light emitter 15, and covers at least a partial area of the light receiver 11, and then, the light receiver 11 can be electrically connected to the first substrate 21, the light emitter 15 can be electrically connected to the second substrate 22, the protective layer 17 covers at least the light emitter 15 and the partially light-transmissive insulating layer 13, so that the light emitted by the light emitter 15, i.e., through the light-transmitting insulating layer 13, and is received by the light receiver 11, so that the laminated optical coupler 1 can function.
Referring to the method for packaging the laminated optical coupler 1 of the present invention, first, as shown in fig. 2, a worker can fix a light receiver 11 to a first substrate 21 (e.g., a circuit board, a bracket, etc.), wherein the light receiver 11 is fixed to the first substrate 21 by means of adhering, welding, embedding, etc., as long as it can be fixed to the first substrate 21. Then, a first joint 111 of the light receiver 11 can be electrically connected (e.g., Wire bonding) to a first joint 211 of the first substrate 21 via a first transmission line B1 (step (301) in fig. 4), and a light receiving region 113 is disposed on the top surface of the light receiver 11 to receive the light emitted from the light emitter 15.
As shown in fig. 2, after the optical receiver 11 is fixed, a first molding process can be performed, in this embodiment, a worker can completely cover the optical receiver 11 with a transparent insulating adhesive, or even cover a part of the first substrate 21, and after the transparent insulating adhesive is cured, a transparent insulating layer 13 can be formed (as shown in step (302) of fig. 4), at this time, the optical receiver 11 is stably fixed on the first substrate 21 and cannot be easily displaced and detached; in other embodiments of the present invention, the transparent insulating glue can cover only a partial area of the light receiver 11, but the partial area includes the light receiving area 113 and the position of the first joint 111, mainly because the transparent insulating glue is used as the transparent insulating layer 13 to isolate the light receiver 11 and the light emitter 15 from directly abutting against each other, and the light of the light emitter 15 needs to pass through, so that the light can be received by the light receiving area 113.
As shown in fig. 3, after the transparent insulating glue has been cured to form the transparent insulating layer 13, a worker can fix a light emitter 15 to the top surface of the transparent insulating layer 13, in this embodiment, the light emitter 15 is fixed to the transparent insulating layer 13 by a transparent adhesive 19, but in other embodiments of the present invention, this is not a limitation, and workers in the art can adopt other fixing manners according to the product requirements. Then, the light emitter 15 can project light towards the corresponding light receiving region 113, and the projected light can penetrate through the light-transmitting insulating layer 13 and be received by the light receiving region 113 of the light receiver 11; when the light emitter 15 is fixed to the transparent insulating layer 13 by the transparent adhesive 19, the refractive index of the transparent adhesive 19 is between the refractive index of the substrate (e.g., LED substrate) of the light emitter 15 and the refractive index of the transparent insulating layer 13. A second junction 151 of the light emitter 15 can be electrically connected (e.g., Wire bonding) to a second contact 221 of the second substrate 22 via a second transmission line B2 (as shown in step 303 of fig. 4) to receive external power, and can be driven to emit light.
As shown in fig. 3, after the light emitter 15 is fixed, a second molding process can be performed, in this embodiment, a worker can completely cover the light emitter 15 and the second joint 151 and the transparent insulating layer 13 thereon, or even can cover part of the first substrate 21 and the second substrate 22 with a protective insulating adhesive, and after the protective insulating adhesive is cured, a protective layer 17 can be formed (as shown in step (304) of fig. 4), so that the light emitter 15 can be stably fixed on the transparent insulating layer 13 and is not easily damaged by external force or external impact, so as to form the laminated optical coupler 1.
In summary, through the packaging method of the present invention, the staff in the field can produce the laminated optocoupler 1 more easily, and only control the alignment of the light emitter 15, so as to greatly reduce the production difficulty, and further improve the yield of the subsequent products. In addition, as shown in fig. 3, besides the protective insulating glue, workers in the field may also use a white reflective material (e.g., Polyvinyl acetate (pvac), epoxy resin (epoxy), etc.) protective insulating glue, so that after the protective insulating glue is cured into the protective layer 17, the protective layer 17 may also have a reflective property, so that the light emitted by the light emitter 15 can be received by the light receiving region 113 as much as possible.
The above description is only a preferred embodiment of the present invention, and the scope of the claims of the present invention is not limited thereto, but those skilled in the art can easily conceive equivalent changes based on the technical content disclosed in the present invention without departing from the scope of the present invention.
Claims (14)
1. A packaging method of a laminated optical coupler formed by secondary sealing glue is characterized by comprising the following steps:
fixing a light receiver on a first substrate, wherein a first joint of the light receiver can be electrically connected to a first joint of the first substrate, and a light receiving area is arranged on the top surface of the light receiver;
performing a first sealing procedure, and enabling a transparent insulating glue to at least cover a local area of the light receiver to be solidified and used as a transparent insulating layer, wherein the local area comprises the light receiving area and the position of the first joint;
fixing a light emitter on the top surface of the light-transmitting insulating layer, wherein the light emitter can transmit through the light-transmitting insulating layer and project light towards the direction of the corresponding light receiving area, and a second joint of the light emitter can be electrically connected to a second joint of a second substrate; and
and performing a second sealing procedure, and enabling a protective insulating glue to cover the light emitter and the second bonding point and at least partial light-transmitting insulating layer on the light emitter so as to be cured and used as a protective layer, thereby forming the laminated optical coupler.
2. The method of claim 1, wherein the protective insulating paste is a white reflective material.
3. The method of claim 1, wherein the protective insulating paste is a light-transmissive material.
4. The method of claim 1, wherein the protective insulating paste is opaque.
5. The method of packaging a laminated optical coupler of any one of claims 1-4, wherein the light emitter is affixed to the light-transmissive insulating layer by a light-transmissive adhesive.
6. The method of claim 5, wherein the light-transmissive insulating glue completely covers the light receiver.
7. The method of claim 6, wherein the protective insulating glue completely covers the light-transmissive insulating layer.
8. A laminated optical coupler molded by secondary potting, comprising:
a light receiver fixed on a first substrate, wherein the top surface of the light receiver is provided with a light receiving area, and a first joint of the light receiver can be electrically connected to a first joint of the first substrate;
a light-transmitting insulating layer formed by curing a light-transmitting insulating adhesive, wherein the light-transmitting insulating layer at least covers a local area of the light receiver, and the local area comprises the light receiving area and the position of the first joint;
a light emitter fixed on the top surface of the light-transmitting insulating layer, capable of transmitting the light-transmitting insulating layer and projecting light toward the corresponding light receiving region, and a second joint of the light emitter electrically connected to a second joint of a second substrate; and
and the protective layer is formed by curing a protective insulating glue and covers the light emitter, the second bonding point on the light emitter and at least partial transparent insulating layer.
9. The laminated optical coupler of claim 8, wherein the protective layer is a white light reflecting material.
10. The laminated optical coupler of claim 8, wherein the protective layer is a light transmissive material.
11. The laminated optical coupler of claim 8, wherein the protective layer is opaque.
12. A laminated optical coupler according to any of claims 8-11, further comprising a light-transmissive adhesive between the light emitter and the light-transmissive insulating layer.
13. The laminated optical coupler of claim 12, wherein the light-transmissive insulating layer completely covers the light receiver.
14. The laminated optical coupler of claim 13, wherein the protective layer completely covers the light-transmissive insulating layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108115737A TWI700838B (en) | 2019-05-07 | 2019-05-07 | Laminated optical coupler formed by secondary sealing glue and packaging method thereof |
| TW108115737 | 2019-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111916436A true CN111916436A (en) | 2020-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911220310.3A Pending CN111916436A (en) | 2019-05-07 | 2019-12-03 | Laminated optical coupler formed by secondary sealing glue and packaging method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111916436A (en) |
| TW (1) | TWI700838B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI773528B (en) * | 2021-09-15 | 2022-08-01 | 友達光電股份有限公司 | Display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070045882A1 (en) * | 2005-08-31 | 2007-03-01 | Ho Soo K | Double mold optocoupler |
| JP2016086098A (en) * | 2014-10-27 | 2016-05-19 | パナソニックＩｐマネジメント株式会社 | Optical coupling device |
| US10043924B1 (en) * | 2012-12-04 | 2018-08-07 | Maxim Integrated Products, Inc. | Low cost optical sensor package |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1302306C (en) * | 2001-09-14 | 2007-02-28 | 因芬尼昂技术股份公司 | Transmitter and/or receiver arrangement for optical signal transmission |
| US8265487B2 (en) * | 2009-07-29 | 2012-09-11 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Half-duplex, single-fiber (S-F) optical transceiver module and method |
| US9236521B2 (en) * | 2012-10-30 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optocoupler having lens layer |
-
2019
- 2019-05-07 TW TW108115737A patent/TWI700838B/en active
- 2019-12-03 CN CN201911220310.3A patent/CN111916436A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070045882A1 (en) * | 2005-08-31 | 2007-03-01 | Ho Soo K | Double mold optocoupler |
| US10043924B1 (en) * | 2012-12-04 | 2018-08-07 | Maxim Integrated Products, Inc. | Low cost optical sensor package |
| JP2016086098A (en) * | 2014-10-27 | 2016-05-19 | パナソニックＩｐマネジメント株式会社 | Optical coupling device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI700838B (en) | 2020-08-01 |
| TW202042406A (en) | 2020-11-16 |
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Application publication date: 20201110 |
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