CN103151419A - An optical coupler - Google Patents
An optical coupler Download PDFInfo
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- CN103151419A CN103151419A CN2012105237828A CN201210523782A CN103151419A CN 103151419 A CN103151419 A CN 103151419A CN 2012105237828 A CN2012105237828 A CN 2012105237828A CN 201210523782 A CN201210523782 A CN 201210523782A CN 103151419 A CN103151419 A CN 103151419A
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- nude film
- optical
- photoconduction
- launcher
- limiting element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
The invention discloses an optical coupler comprising an optical emitter bare chip, an optical receiver bare chip, a light guide, a limiting element and a body. The light guide is limited to the upper part of the body by the limiting element. In one embodiment, the limiting element is a dielectric tape. In another embodiment, the limiting element is a premolded plastic element attached to a lead frame through non-conducting epoxy resin. The use of the limiting element enables the shapes of the light guides to be consistent.
Description
Related application case cross reference
The application's case is at the part that the sequence number that on November 12nd, 2010 filed an application is 12/945,474 the U. S. application case application case that continues.Sequence number is that 12/945,474 U. S. application case is again that described U. S. application case all is incorporated herein by reference at the part that the sequence number that on March 23rd, 2010 filed an application is 12/729,943 the U. S. application case application case that continues.
Technical field
The present invention relates to a kind of encapsulation for electrooptical device.
Background technology
Galvanic separation is provided for when two circuit are must be otherwise electrically isolated from one, signal being moved to from a circuit member of another circuit.Usually, described two circuit voltage-operated and therefore necessary electricity isolation with difference.For instance, consider wherein to utilize 5V battery-operated type controller board to control the application of the motor circuit that operates with 240V.In this example, the 5V controller circuitry being permitted in the isolation of 240V motor circuit and 5V controller circuitry electricity simultaneously is necessary from 240V motor circuit transmitt or receive signal.In the application of this type, can provide voltage and noise isolation with galvanic separation, permit simultaneously two information exchanges between Circuits System.Electric system for having with two voltage-operated above circuit of difference can use the multi channel currents isolator.
There is the galvanic separation of three kinds of main Types.The first type is rf receiver and transmitter, wherein via wireless signal, signal is sent to another circuit from a circuit.The second type is the magnetic isolator, wherein by magnetic field with signal from a circuit transmission to another circuit.The third type is optical coupler, wherein transmits signal between circuit by light wave.Galvanic separation can be used for relating in the application of the voltage that operates with kilovolt.Magnetic isolator and RF isolator can have restriction from a Circuits System in shielding aspect the noise of another Circuits System, but this is because the whole circuit in described isolator can be subject to high-intensity magnetic field or the rf wave impact of induced voltage or electric current.Yet, respond to noise by the optical coupler of light wave coupled signal in the mode that is different from magnetic isolator or radio-frequency (RF) transceiver induction noise.
In general, optical coupler comprises optical launcher nude film and optical receiver nude film.Described optical launcher nude film and described optical receiver nude film can accommodate in single package.Multi-channel optocoupler can have a pair of above optical launcher or receiver nude film.Usually signal is transferred to the optical receiver nude film from the optical launcher nude film.In order to prevent light loss, usually adopt photoconduction.In most cases, join by executing the transparent encapsulant formation photoconduction that is liquid form above optical launcher and receiver nude film.Then make described transparent encapsulant harden into photoconduction via curing process.The shape of photoconduction can be depending on the viscosity of encapsulant, and therefore can be difficult to control the shape of photoconduction.This problem of controlling the photoconduction shape can be even more serious for the optical coupler with large nude film or for multi-channel optocoupler.
Summary of the invention
One embodiment of the present of invention relate to a kind of encapsulation for electrooptical device.Described encapsulation for electrooptical device comprises: the first optical launcher nude film, and it is configured to utilizing emitted light; The first optical receiver nude film, it is configured to receive the part by the described light of described the first optical launcher nude film emission; A plurality of conductors, described the first optical launcher nude film and described the first optical receiver nude film are installed at least one in described a plurality of conductor; Limiting element, it is attached to described a plurality of conductor, makes described at least one in described a plurality of conductor be clipped between one in described limiting element and described the first optical launcher nude film and described the first optical receiver nude film; The first photoconduction, it is formed on described limiting element, described the first photoconduction is the roughly transparent encapsulant that is encapsulated described the first optical launcher nude film and described the first optical receiver nude film, and wherein said the first photoconduction is configured to light is transferred to described the first optical receiver nude film from described the first optical launcher nude film; And opaque encapsulant, it is encapsulated described the first photoconduction and described limiting element.
Another embodiment of the present invention relates to a kind of optical coupler.Described optical coupler comprises: the first optical launcher nude film, and it is configured to utilizing emitted light, and described the first optical launcher nude film is configured to draw electric power from the first external power source; The first optical receiver nude film, it is configured to receive the light by described the first optical launcher nude film emission, and described the first optical receiver nude film is configured to draw electric power from the second external power source; A plurality of conductive lead wires, wherein said the first optical launcher nude film and described the first optical receiver nude film are installed at least one in described conductive lead wire; Limiting element, its be attached in described a plurality of conductive lead wire be clipped between one in described limiting element and described the first optical launcher nude film and described the first optical receiver nude film described at least one; Photoconduction, it is encapsulated described the first optical launcher nude film and described the first optical receiver nude film that is formed on described limiting element, and wherein the first photoconduction is configured to light is transferred to described the first optical receiver nude film from described the first optical launcher nude film; And opaque encapsulant, it is encapsulated described the first photoconduction and described limiting element.
Description of drawings
In graphic with way of example but not illustrate graphic extension embodiment with ways to restrain.Run through description and graphic, can identify like with the like symbol.
Fig. 1 graphic extension is the cross-sectional view of the optical coupler of lead-frame packages;
Fig. 2 graphic extension has the cross-sectional view of the optical coupler that is lead-frame packages that is attached to the optical launcher nude film that shares conductive pad and receiver nude film;
Fig. 3 is not in the situation that have line and engage and do not have an embodiment that encapsulant is illustrated in the multi-channel optocoupler that the part that has two optical launchers being encapsulated by transparent encapsulant and an optical receiver on printed circuit board (PCB) completes;
Fig. 4 graphic extension is the cross-sectional view that photoconduction defines the optical coupler of element that has of lead-frame packages;
Fig. 5 graphic extension is the cross-sectional view that photoconduction defines the optical coupler of element and adhesive tape that has of lead-frame packages;
Fig. 6 graphic extension comprises that photoconduction defines the cross-sectional view that having of element is attached to the optical coupler of the optical launcher nude film that shares conductive pad and receiver nude film;
Fig. 7 graphic extension has the cross-sectional view that the photoconduction that is attached to printed circuit board (PCB) defines the optical coupler of element;
Fig. 8 A graphic extension photoconduction defines the perspective view of element;
Fig. 8 B graphic extension photoconduction defines the cross-sectional view of element 3-3 along the line;
Fig. 8 C graphic extension photoconduction defines the vertical view of element;
Fig. 9 graphic extension comprises the vertical view of the multi-channel optocoupler of the photocon with two chambeies;
The photoconduction that Figure 10 graphic extension has a multi-channel optocoupler of light resolution element defines the vertical view of element;
Figure 11 graphic extension comprises that the photoconduction with single chamber defines the vertical view of the multi-channel optocoupler of element;
Figure 12 graphic extension has the perspective view that photoconduction that another photoconduction that is suitable for being cascaded to the adjacent light coupler defines the passage of element defines element;
Figure 13 graphic extension is for the manufacture of the method that has photoconduction and define the optical coupler of member;
Figure 14 graphic extension has the cross-sectional view of the optical coupler of the limiting element that glues together lead-frame packages, and wherein optical launcher and receiver nude film are positioned at the difference lead-in wire place of lead frame;
Figure 15 graphic extension has uses epoxy resin to be attached to the cross-sectional view of optical coupler of the limiting element of lead-frame packages, and wherein optical launcher and receiver nude film are positioned at the different conductor place of lead frame;
Figure 16 A graphic extension has the cross-sectional view of the optical coupler of the limiting element that glues together lead-frame packages, and wherein optical launcher and receiver nude film are positioned on a conductive pad;
Figure 16 B is in the situation that the perspective view of the optical coupler that the part of showing in not having the line joint and not having opaque encapsulant graphic extension Figure 16 A is completed;
Figure 17 graphic extension has the vertical view of the multi-channel optocoupler in two chambeies of using two limiting elements;
Figure 18 A is not in the situation that have the line joint and do not have the vertical view that opaque encapsulant graphic extension has the multi-channel optocoupler in single chamber;
The limiting element that Figure 18 B graphic extension has inconsistent shape; And
The surface of the part of the photoconduction that comprises limiting element and a plurality of conductors be used for is admitted in Figure 18 C graphic extension.
Embodiment
Fig. 1 graphic extension is the cross-sectional view of the optical coupler 100 of lead-frame packages.Optical coupler 100 comprises a plurality of conductors 111 to 112, optical launcher nude film 120 and optical receiver nude film 130.A plurality of conductors 111 to 112 are made and can be formed by lead frame by electric conducting material.A plurality of conductors 111 to 112 can be called lead-in wire or conductive trace.Conductor 111 to 112 can through extending to form conductive pad 118 to 119, make conductive pad 118 to 119 can be configured to fixing optical launcher nude film 120 and optical receiver nude film 130.A plurality of conductors 111 to 112 can be configured as nude film 120 and nude film 130 are connected to the external circuit member of (not showing).For instance, a plurality of conductors 111 to 112 may extend into the edge of optical coupler 100 or bottom to serve as the external circuit electric contact of (showing).
Optical launcher nude film 120 can be light-emitting diode (herein hereinafter referred to as LED) or can radiative any light source.Optical launcher nude film 120 can be integrated circuit and the drive circuit with embedded LED.Depend on designing requirement, control circuit can be integrated in optical launcher nude film 120.Optical launcher nude film 120 can be configured to by the first supply of electric power device (not showing) by conductor 111 power supplies.Optical launcher nude film 120 can operate with the logical signal utilizing emitted light according to the external circuit (not showing) that comes the upper operation of comfortable the first supply of electric power device (not showing).For instance, can logical signal " height " be transferred to optical launcher nude film 120 via conductor 111.In response to this, optical launcher nude film 120 will be launched the light output of indication " height " signal.
Optical receiver nude film 130 can comprise photoelectric detector 135, for example photodiode or phototransistor.Optical receiver nude film 130 can be the integrated circuit with embedded photoelectric detector 135, perhaps the amplifier circuit (not showing) in order to amplify the photoelectric current that is produced by photoelectric detector 135.Depend on designing requirement, control circuit can be integrated in optical receiver nude film 130 to provide signal to process.Optical receiver nude film 130 can be configured to by the second supply of electric power device (not showing) via conductor 122 power supplies.Optical receiver nude film 130 can operate to receive the signal from the form that is light of optical launcher nude film 120 emissions.
Optical launcher nude film 120 and optical receiver nude film 130 can be encapsulated by transparent encapsulant (for example, clear epoxy resin thoroughly, silicon or in order to form other similar material of photoconduction 140).Described transparent encapsulant then is encapsulated to form by opaque encapsulant the main body 170 that comprises top part 171 and bottom part 172.Top part 171 and bottom part 172 can use two different instruments to make in molding process.Described opaque encapsulant can be plastics, pottery or in order to any other opaque or black compound roughly of the main body 170 that forms encapsulation.Randomly, described transparent encapsulant can be in being encapsulated in opaque encapsulant before by sealing by catoptrical reflecting material 150 (for example, white epoxy resin, metal material or other similar reflecting material).
Transparent encapsulant is formed for the light from 120 emissions of optical launcher nude film is transferred to the photoconduction 140 of optical receiver nude film 130.Transparent encapsulant can be joined the encapsulant that is liquid form both form to be encapsulated optical launcher nude film 120 and optical receiver nude film 130 by being executed.The liquid-transparent encapsulant then is solidified into solid, thereby forms photoconduction 140.The size of photoconduction 140 is controlled by the amount of controlling the liquid encapsulant of joining of executing, and can depend on to a great extent the viscosity of liquid encapsulant.For little photoconduction 140, the viscosity and the amount that depend on the transparent epoxy resin of joining of executing can be enough in the situation that do not realize roughly consistent size and shape by too many technique change.Yet,, can be significantly in the size of photoconduction 140 and the technique change of vpg connection to 130 or for multi-channel optocoupler for larger nude film 120, thereby produce the photoconduction of inconsistent size and shape.
A kind of is by making optical launcher nude film 120 and the distance of optical receiver nude film 130 close each other, making photoconduction 140 for little in order to the mode that obtains more consistent photoconduction 140.This can realize by nude film 120 to 130 being attached to share on conductive pad 118 to 119, such as in Fig. 2 displaying.Yet, owing to optical launcher nude film 120 and optical receiver nude film 130 can being connected to two different supply of electric power devices, guarantee that therefore suitable electricity and the noise isolation between two nude films 120 to 130 is necessary.
Fig. 2 graphic extension is the cross-sectional view of the optical coupler 200 of leadframe-type encapsulation.The photoconduction 240 that optical coupler 200 comprises a plurality of conductors 211 to 212, optical launcher nude film 220, optical receiver nude film 230, formed by transparent encapsulant and have top part 271 and the main body 270 of bottom part 272.Optical receiver nude film 230 further comprises photoelectric detector 235.Such as in the embodiment of Fig. 2 displaying, the one in conductor 211 to 212 is through extending to form conductive pad 218.Optical launcher nude film 220 and optical receiver nude film 230 are attached to and share conductive pad 218.Optical coupler 200 in Fig. 2 roughly is similar to the optical coupler 100 in Fig. 1, and both all are attached to and share conductive pad 218 but its difference is optical launcher nude film 220 and optical receiver nude film 230 at least.In the embodiment that shows in Fig. 2, optical launcher nude film 220 can be electrically connected to conductor 211 but optical receiver nude film 230 can be connected to conductor 212.
Such as in the embodiment of Fig. 2 displaying, optical launcher nude film 220 is via comprising that three material layers 225 that are clipped in two separators between fixed bed are attached to conductive pad 218.Described separator provides the electricity isolation of optical launcher nude film 220 with conductive pad 218, and conductive pad 218 is electrically connected to optical receiver nude film 230.Described separator can be glass, polyimides or similar electrical insulation material layer.Described separator can or can not have abundant bond property so that optical launcher nude film 220 is secured on conductive pad 218.
Described fixed bed can be silicon dioxide, silicon, nitride, benzocyclobutane (BCB) or any other suitable insulating binder material layer.Described fixed bed can be the epoxide resin material that is suitable for the die attach purposes.This epoxy resin is including (but not limited to) the described epoxy resin of the Tra-con sale of Massachusetts, United States.Described fixed bed has abundant bond property so that optical launcher nude film 220 and separator are secured on conductive pad 218.Three material layers 225 can be electric insulation, and therefore optical launcher nude film 220 and conductive pad 218 voltages and noise isolation can be provided, and conductive pad 218 is electrically connected to optical receiver nude film 230.
Described fixed bed can be liquid form when manufacturing process begins, but can harden in manufacturing process after a while (for instance, via being exposed to heat or UV light) is to form solid layer.Described separator can be when manufacturing process begins (when described fixed bed can be liquid form) prevent optical launcher nude film 220 and conductive pad 218 physical contacts.
In the embodiment that shows in Fig. 2, optical launcher nude film 220 is attached to conductive pad 218 via three material layers 225, and optical receiver nude film 230 directly is attached to conductive pad 218.This design also can be opposite.Selection can consider based on various designs, and for example, relative altitude profile, heat conduction require, the electric power of each nude film 220 to 230 and grounding requirement etc.
Optical coupler with a pair of above reflector nude film 220 and receiver nude film 230 is called multi-channel optocoupler.Fig. 3 is not in the situation that have the multi-channel optocoupler 300 that line engages or opaque encapsulant exposition is completed.Multi-channel optocoupler 300 comprises substrate 310, two optical launcher nude films 320 to 321 and an optical receiver nude film 330.Nude film 320 to 321 and 330 is encapsulated by the transparent encapsulant that forms photoconduction 340.Substrate 310 can be printed circuit board (PCB) (herein hereinafter referred to as PCB).Substrate 310 further comprises a plurality of conductors 311 to 316.In the situation of PCB, conductor 311 to 316 also can be called conductive trace.One in conductor 311 to 316 can be through extending to form conductive pad 318.Optical launcher nude film 320 to 321 and optical receiver nude film 330 can be attached to conductive pad 318.One in nude film 320 to 321 and 330 can directly be attached to conductive pad 318, and other nude film 320 to 321 and 330 can be attached to conductive pad 318 by three insulation material layers 225 showing in Fig. 2.
Although make a plurality of nude films 320,321 and 330 be attached to the size that same conductive pad 318 can reduce photoconduction 340, make photoconduction 340 be consistent large I and still have a challenge, this is because the number of nude film 320 to 321 and 330 increases.In order to be encapsulated all nude films in nude film 320 to 321 and 330, the large young pathbreaker of photoconduction 340 inevitably increases.A kind of use is so that photoconduction 340 has the effective means of consistent size and shape is to use photoconduction to define element 460, such as in the embodiment in Fig. 4 displaying.
Such as in Fig. 4 displaying, photoconduction defines element 460 can have the chamber that comprises reflecting surface 450, reflecting surface 450 defines the photoconduction 440 that is formed by transparent encapsulant.Photoconduction defines element 460 can define any suitable shape.Yet the suitable shape of photoconduction 440 can be defined in described chamber, and described suitable shape is generally the general dome shape.Photoconduction defines element 460 and can be formed by Merlon, high index of refraction plastics, acrylic plastics or any other similar material.In order to control better the adjusting of light by reflecting surface 450, randomly can form micro optical element at reflecting surface 450 places.Photoconduction defines element 460 can be attached to a plurality of conductors 411 to 412 via non-conductive epoxy resin 480.This non-conductive epoxy resin 480 can be including (but not limited to) the described epoxy resin of being sold by Henkel (Henkel) company, mine Co., Ltd of Sumitomo Metal Industries (Sumitomo Metal MiningCo.Ltd.), metal mine Co., Ltd (METAL MINING Co., Ltd) and epoxy resin technology company (EpoxyTechnology Inc).Also can adopt other adherence method (for example, non-conductive bonding die attach method or melt process) that photoconduction is defined element 460 and be attached to a plurality of conductors 411 to 412.
The possible method of the optical coupler 400 of showing in a kind of embodiment in order to construction drawing 4 is by at first nude film 420 to 430 being attached to a side of conductive pad 418 to 419.Next step can be the line joint technology, wherein nude film 420 to 430 can be joined to its respective conductors 411 to 412 and be electrically connected to set up.It should be noted that and to have the conductor 411 to 412 of Duoing than showing in figure.After online the joint, can photoconduction be defined element 460 via non-conductive epoxy resin 480 and be attached to conductor 411 to 412, make nude film 420 to 430 be positioned near the chamber of being defined by reflecting surface 450.The transparent epoxy resin that then will be liquid form is injected in described chamber to form photoconduction 440.
Defining element 460 by photoconduction delimits the top part 441 of photoconduction 440.In order to increase reliability performance and to be encapsulated nude film 420 to 430 fully, the amount of the transparent encapsulant that injects can surpass the volume that chamber that photoconduction defines element 460 is defined.Such as in the embodiment of Fig. 4 displaying, photoconduction 440 further comprises and is positioned at the bottom part 442 that photoconduction defines the outside, described chamber of element 460.The shape of bottom part 442 and size have less impact to optical property, and this is because bottom part 442 is positioned on the opposite side of optics nude film 420 to 430.For cost consideration, can strictly not control size and the shape of bottom part 442.
Next, can then make the liquid-transparent encapsulant be solidified into solid form.Can then be encapsulated by opaque encapsulant the part that photoconduction defines element 460 and conductor 411 to 412, thereby form the bottom part 472 of main body 470 via the first molding process.The bottom part 472 of main body 470 can be described as substrate.The bottom part 472 of main body 470 can then experience the second molding process to form the top part 471 of main body 470.At last, conductor 411 to 412 can be separated and bends to required shape with lead frame (not showing).
Such as in the embodiment of Fig. 4 displaying, the shape of the top part 441 of photoconduction 440 can be follows the general dome shape that photoconduction defines the shape of element 460.Technically, the bottom part 442 of photoconduction 440 can be made other convenient, cost-effective shape general flat or any.Yet, in order to improve reliability performance and to prevent from curving arch or layering, can be similar to top part 421 bottom part 442 is made less, general dome shape.Perhaps, the adhesive tape 590 (referring to Fig. 5) of being made by mylar film (Mylar), polyimides, polyester film (Melinex) or any other similar material can be adhered to for or is attached to the bottom part 442 of photoconduction 440 to increase reliability performance.This is showed in Fig. 5, and wherein adhesive tape 590 roughly substitutes some parts or all parts in bottom part 442.
Fig. 5 shows the embodiment of the optical coupler 500 that roughly is similar to optical coupler 400, but its difference is to adopt adhesive tape 590 to increase reliability performance at least.Optical coupler 500 comprises that a plurality of conductors 511 to 512, optical launcher nude film 520, the optical receiver nude film 530 with at least one photoelectric detector 535, photoconduction 540, photoconduction define element 560 and have top part 571 and the main body 570 of bottom part 572.Photoconduction defines element 560 and is attached to conductor 511 to 512 via non-conductive epoxy resin 580.Randomly, the photoconduction reflecting surface 550 that defines element 560 can have and is configured to be directed to from the light of optical launcher nude film 520 emissions the micro optical element of optical receiver nude film 630.Be different from optical coupler 400 with roughly large base section 442 (such as in Fig. 4 displaying), the photoconduction 540 in optical coupler 500 defines the half dome shape that has hardly the bottom part 442 of showing in Fig. 4.Compare, strengthen the structure of photoconduction 540 with adhesive tape 590.Adhesive tape 590 can be through being made for fusible and can being attached to photoconduction 540 after transparent encapsulant solidifies.Use another one in the advantage of adhesive tape 590 to make as adhesive tape 590 that bottom part 442 (referring to Fig. 4) can be as general flat, to increase the efficient of photoconduction 540.Because adhesive tape 590 can be general flat on bottom part 442, so the height of optical coupler 500 also can reduce.In another embodiment, the optical coupler 500 of showing in Fig. 5 can not comprise photoconduction and define element 560.The shape of photoconduction 540 depends on the viscosity of encapsulant.Yet adhesive tape 590 can reduce technique change about shape and the size of photoconduction 540.
Fig. 6 shows another embodiment of the optical coupler 600 that is similar to the optical coupler 400 of showing in Fig. 4.Optical coupler 600 can comprise: a plurality of conductors 611 to 612, and wherein the one in conductor 611 to 612 shares conductive pad 618 through extending to form; Optical launcher nude film 620; Optical receiver nude film 630, it has at least one photoelectric detector 635; Photoconduction 640, it is formed by transparent encapsulant; Photoconduction defines element 660; And main body 670, it has top part 671 and bottom part 672.Randomly, micro optical element can be positioned at reflecting surface 650 places that photoconduction defines element 660.Photoconduction 640 can comprise top part 641 and bottom part 642, and this is similar to the optical coupler 400 of showing in Fig. 4.
A difference of the optical coupler 400 of showing in optical coupler 600 and Fig. 4 be optical launcher nude film 620 and optical receiver nude film 630 both all be attached to and share conductive pad 618.Optical launcher 620 can share conductive pad 618 via comprising that three material layers 625 that are clipped in two separators between fixed bed are attached to.Making optical launcher nude film 620 and optical receiver nude film 630 be attached to shared pad 618 makes by the light of optical launcher nude film 620 emissions and can advance than short distance before arriving optical receiver nude film 630.In addition, photoconduction defines element 660 and guarantees that photoconduction 640 will form consistent size and shape.The efficient of the photoconduction 640 of therefore, showing in Fig. 6 can be in theory greater than the embodiment that shows in Fig. 4.
Fig. 7 shows the embodiment of the optical coupler 700 that uses PCB.Photoconduction 740, photoconduction that optical coupler 700 comprises substrate 710, optical launcher nude film 720, have the optical receiver nude film 730 of at least one photoelectric detector 735, have a reflecting surface 750 define element 760 and opaque encapsulant 770.Substrate 710 can be the PCB of a plurality of conductors 711 to 712 with the place, both sides that is positioned at substrate 710.Be different from optical coupler 400,500 and 600, the photoconduction in optical coupler 700 define element 760 can by non-conductive epoxy resin 780 be attached on substrate 710 Anywhere rather than be limited to and only be attached to conductor 711 to 712.Photoconduction defines element 760 can have for the transparent encapsulant of liquid form is executed and be fitted on one or more optional apertures 765 that photoconduction defines the chamber of element 760.Randomly, can define element 760 places at photoconduction and form more aperture 761 with as in order to prevent the air escape hole of air trapping in described chamber.
Fig. 8 A shows that to 8C photoconduction defines the various views of element 860.8A shows that photoconduction defines the perspective view of element 860.Fig. 8 B shows the cross-sectional view that defines element 860 along the photoconduction of the line 3-3 intercepting of showing in Fig. 8 A.Fig. 8 C shows that photoconduction defines the vertical view of element 860.Photoconduction defines the essentially rectangular shape that element 860 can define the chamber 861 with general dome shape.Photoconduction defines element 860 can define any shape that is suitable for being attached to conductor 411 to 412 (referring to Fig. 4) or substrate 710 (referring to Fig. 7).Chamber 861 can be defined and be suitable for showing in Fig. 1 to 7 from the light of the optical launcher nude film 720 any shape towards 730 reflections of optical receiver nude film.Randomly, the surface of defining chamber 861 can comprise that reflecting material, semi-reflective material or micro optical element are to control the distribution of light.Usually, define at photoconduction and can have a chamber 861 in element 860.Yet, for multi-channel optocoupler, can have one with epicoele 861, such as in Fig. 9 displaying.
Fig. 9 is in the situation that do not have the embodiment that line engaged and do not have the vertical view of opaque encapsulant displaying multi-channel optocoupler 900.Optical coupler 900 comprises that a plurality of conductors 911 to 916, a plurality of optical launcher nude film 920 to 921, a plurality of optical receiver nude film 930 to 931 and photoconduction define element 960.Photoconduction defines element 960 and comprises a plurality of chambeies 961 to 962, and photoconduction 940 is defined in each chamber, each photoconduction 940 coupling optical reflector nude film 920 to 921 and optical receiver nude film 930 to 931.The first pair of optical launcher nude film 920 and optical receiver nude film 930 can be positioned at the first chamber 961 or near, and the second pair of optical launcher nude film 921 and optical receiver nude film 931 can be positioned at the second chamber 962 or near.Arrange by this, can minimize crosstalking between first pair and the second pair of reflector nude film 920 to 921 and receiver nude film 930 to 931.
For two chambeies 960 to 961 of further optics isolation, can utilize the optical fractionation element 1068 of showing in Figure 10.The photoconduction that Figure 10 graphic extension has a plurality of chambeies 1061 to 1062 defines the vertical view 1000 of element 1060.Optical fractionation element 1068 can only define the interior space of main body of element 1060 for being defined in photoconduction, making can be via the total internal reflection reverberation.Perhaps, optical fractionation element 1068 can be defined in the space in the main body that photoconduction defines element 1060 and forms by filling with opaque encapsulant material (for example, in order to form the material of the main body 470 of optical coupler 400 as show in Figure 4) roughly.
In some situations, optical launcher nude film 920 to 921 and optical receiver nude film 930 to 931 can not be located away from different cavity 961 to 962 (such as in Fig. 9 displaying), this is because can be by any one reception in two receiver nude films 930 to 931 from the signal of optical launcher nude film 920.In this situation, can use only chamber 960.Show this situation in illustrated embodiment in Figure 11.Figure 11 is not in the situation that have the line joint and do not have opaque encapsulant graphic extension multi-channel optocoupler 1100.Multi-channel optocoupler 1100 comprises that a plurality of conductors 1111 to 1116, optical launcher nude film 1120 to 1121, optical receiver nude film 1130 to 1131, photoconduction define element 1160 and photoconduction 1140.All optical launcher nude films 1120 to 1121 and receiver nude film 1130 to 1131 can be encapsulated in photoconduction 1140 in single chamber 1161, such as in Figure 11 displaying.
Figure 13 is the flow chart 1300 of the possible manufacturing process of the optical coupler 400 described in graphic extension Fig. 4.In step 1310, provide a plurality of conductors.Described a plurality of conductor can be the form of the lead-in wire of lead frame.In step 1320, can be with optical launcher nude film and optical receiver die attach one or more in the conductor of lead frame.For instance, the epoxide resin material that is used for die attach can be applied to the back of the body surface of nude film, follow-up then with the suitable part of die attach to lead frame.Method 1300 can then proceed to step 1330, wherein optical launcher and receiver nude film line is joined to the respective conductors of lead frame, makes and can set up electrical connection.For instance, the optical launcher nude film can be connected to the first supply of electric power device, and the optical receiver nude film can be connected to the second supply of electric power device of isolating with described the first supply of electric power device.
Next, method 1300 can proceed to step 1340, wherein photoconduction can be defined conductor or the PCB substrate that element is attached to lead frame, make optical launcher and receiver nude film be positioned at photoconduction define element the chamber or near.In step 1350, the transparent encapsulant that will be liquid form is injected in the chamber that photoconduction defines element to be encapsulated optical launcher and receiver nude film.Described transparent encapsulant also can be encapsulated and protect all closing lines that nude film joined to conductor.
Next, method 1300 can proceed to step 1360, wherein can make transparent encapsulant be solidified into solid to form photoconduction.Randomly, before step 1360, what adhesive tape can be applied to lead frame defines the side of elements relative with photoconduction, make described photoconduction by described photoconduction define element and described adhesive tape ring around.
Next, method 1300 can proceed to step 1370, and step 1370 is to begin in order to the bottom part that forms main body the first molding process with the part that is encapsulated conductor.Photoconduction defines element, conductor reaches another molding process of all nude films subsequently thereby this can follow-uply then be encapsulated in order to the top part that forms main body.Other order that can wherein at first form the top part and secondly form the bottom part forms top and the bottom part of main body.At last, method 1300 can proceed to step 1380, wherein can cut conductor and conductor be bent to the lead-in wire of special package from lead frame.
With reference to figure 4, the size of photoconduction 440 and shape can be depending on to make the viscosity of the material of photoconduction 440.Yet being limited to the liquid form encapsulant only, top part 471 can be created in size and the consistent photoconduction 440 of vpg connection.By photoconduction 440 being limited to the only top part 471 of main body 470, the amount that produces the required encapsulant of photoconduction 440 reduces.The volume of photoconduction 440 also roughly reduces.Even in the situation that do not use photoconduction to define element 460, this also can produce consistent photoconduction 440.In addition, photoconduction 440 is only limited to top part 441 and have other advantage.For instance, the height of optical coupler 400 can reduce.Another advantage is that reliability performance can improve.When the size of population of photoconduction 440 roughly reduced, the interlocking gear between main body 470 and photoconduction 440 increased.A kind of is by the adhesive tape 590 of showing in Fig. 5 in order to the mode that photoconduction 440 is confined to top part 471.Yet, exist in order to photoconduction 440 being confined to other means of the top part 471 of main body 470, such as in the various embodiment that hereinafter disclose herein displaying.
Figure 14 shows the embodiment of the optical coupler 1400 roughly be similar to optical coupler 400, but its difference is that at least optical coupler 1400 does not have photoconduction and defines element 460 but have limiting element 1490 in order to the top part 471 (being showed in Fig. 4) that photoconduction 440 is confined to main body 470.Optical coupler 1400 comprises a plurality of conductors 1411 to 1412, optical launcher nude film 1420, the optical receiver nude film 1430 with at least one photoelectric detector 1435, photoconduction 1440, limiting element 1490 and has top part 1471 and the main body 1470 of bottom part 1472.In the embodiment that shows in Figure 14, both in conductor 1411 to 1412 are extensible to define the conductive pad 1418 to 1419 that is suitable for admitting optical launcher nude film 1420 and optical receiver nude film 1430.Yet in another embodiment, the only one in conductor 1411 to 1412 is extensible to define to admit both conductive pads 1418 of optical launcher nude film 1420 and optical receiver nude film 1430.
Limiting element 1490 is configured to guarantee that photoconduction 1440 is limited to the top part 1471 of main body 1470.Compare with the photoconduction 440 of showing in Fig. 4, the light transmissioning efficiency of photoconduction 1440 increases, and this is because because the light loss due to the bottom part 442 of the photoconduction 440 of showing in Fig. 4 is roughly eliminated.In addition, photoconduction 1440 can further comprise preventing the reflecting surface 1450 of light loss.
Limiting element 1490 can be for by mylar film, polyimides, polyester film or be similar to the dielectric adhesive tape that any other similar material of the adhesive tape 590 of showing in Fig. 5 is made.Limiting element 1490 can be glued to conductor 1411 to 1412.Perhaps, limiting element 1490 can be by using epoxide resin material or glue to be attached to the surperficial plastics of the pre-molded flat of warp of a plurality of conductors 1411 to 1412.For instance, photoconduction 1440 can liquid encapsulant form be dispensed on limiting element 1490 to be encapsulated optical launcher nude film 1420 and optical receiver nude film 1430 before being solidified into solid form.Therefore, the conductive pad 1418 and 1419 that is suitable for fixing optical launcher nude film 1420 and optical receiver nude film 1430 is clipped in respectively between nude film 1420 to 1430 and limiting element 1490.The size of limiting element 1490 is usually greater than photoconduction 1440.In some scenes, the comparable photoconduction 1440 of limiting element 1490 greatly at least 50%.
Figure 15 shows the embodiment of optical coupler 1500, and optical coupler 1500 comprises a plurality of conductors 1511 to 1512, optical launcher nude film 1520, the optical receiver nude film 1530 with at least one photoelectric detector 1535, photoconduction 1540, limiting element 1590 and has top part 1571 and the main body 1570 of bottom part 1572.Photoconduction 1540 can comprise reflecting surface 1550.Optical launcher nude film 1520 and optical receiver nude film 1530 are attached to conductive pad 1518 to 1519.Optical coupler 1500 is at least that with the difference of optical coupler 1400 limiting element 1590 is attached to a plurality of conductors 1511 to 1512 via epoxy resin layer 1595.The example of epoxy resin 1595 is from the F202 epoxy resin of Tracon, from the OP-4-20632 epoxy resin of wearing Maas (Dymax) or the epoxy resin of any other similar type.Limiting element 1590 can be the dielectric adhesive tape of the limiting element 1490 that is similar to optical coupler 1400 or polymer film, through molded plastics film or any other material.
Figure 16 A-16B shows the embodiment of optical coupler 1600, and optical coupler 1600 comprises a plurality of conductors 1611 to 1616, optical launcher nude film 1620, the optical absorber nude film 1630 with at least one photoelectric detector 1635, the photoconduction 1640 with reflecting surface 1650, limiting element 1690 and has top part 1671 and the main body 1670 of bottom part 1672.Figure 16 B shows the perspective view of optical coupler 1600, but in the situation that does not have that line engages and the top part 1671 that do not have a main body 1670 is showed.Figure 16 A is the cross-sectional view along the optical coupler 1600 of the line 4-4 intercepting of showing in Figure 16 B.One in conductor 1611 is extensible and define and be configured to admit both conductive pads 1618 of optical launcher nude film 1620 and optical receiver nude film 1630.Conductive pad 1618 can be clipped in limiting element 1690 and optical launcher nude film 1620 and optical receiver nude film 1630 between the two, and perhaps in another embodiment, conductive pad 1618 can be clipped between one in limiting element 1690 and nude film 1620 or 1630.Such as in Figure 16 A and 16B displaying, both all are attached to optical launcher nude film 1620 and optical receiver nude film 1630 and share conductive pad 1618 but adhere to by different way.Optical launcher nude film 1620 shares conductive pad 1618 via comprising that three material layers 1625 that are clipped in two separators between fixed bed are attached to.Optical receiver nude film 1630 directly is attached to conductive pad 1618.Yet this layout can be interchangeable in another embodiment.
Making optical launcher nude film 1620 and optical receiver nude film 1630 be attached to shared pad 1618 makes optical launcher nude film 1620 can be positioned near optical receiver nude film 630 places.Therefore, compare with the optical coupler 1400 and 1500 of showing in Figure 14 and 15, the photoconduction 1640 of optical coupler 1600 can be less.Less photoconduction 1640 can be realized consistent size and shape in a large amount of production.In addition, also can produce the high light efficiency of transmission of photoconduction 1640 than short distance.
Such as in Figure 16 B displaying, in order to hold whole photoconduction 1640, limiting element 1690 can be greater than photoconduction 1640.In another embodiment, limiting element 1690 can be greater than photoconduction 1640.For for guaranteeing the chain reliability consideration between limiting element 1690 and main body 1670, usually limiting element 1690 is encapsulated in main body 1670.Therefore, limiting element 1690 is usually less than main body 1670.
Figure 17 is in the situation that do not have that line engages and the top part that do not have a main body is showed the embodiment of the vertical view of multi-channel optocoupler 1700.The main body 1770 that optical coupler 1700 comprises a plurality of conductors 1711 to 1716, a plurality of optical launcher nude film 1720 to 1721, a plurality of optical receiver nude film 1730 to 1731, a plurality of limiting element 1790 to 1791, a plurality of photoconduction 1740 to 1741 and has top part (not showing) and bottom part 1772.Each in limiting element 1790 to 1791 can be configured to hold respectively each in photoconduction 1740 to 1741.In another embodiment, optical coupler 1700 can comprise the single limiting element 1790 that is configured to hold two photoconductions 1740 to 1741.
Figure 18 A is in the situation that do not have the embodiment that the top part of line joint and main body 1870 is showed the vertical view of multi-channel optocoupler 1800.The main body 1870 that optical coupler 1800 comprises a plurality of conductors 1811 to 1816, a plurality of optical launcher nude film 1820 to 1821, a plurality of optical receiver nude film 1830 to 1831, limiting element 1890, photoconduction 1840 and has top part (not showing) and bottom part 1872.All optical launcher nude films 1820 to 1821 and optical receiver nude film 1830 to 1831 are encapsulated in single shared photoconduction 1840.Photoconduction 1840 is formed on a limiting element 1890.Owing to using single photoconduction 1840, therefore can be by any one reception in optical receiver nude film 1830 to 1831 from any one the light in optical launcher nude film 1820 to 1821.
Although limiting element 1890 is thin flattened rectangular object usually, limiting element 1890 can define any shape, comprises any inconsistent shape.For instance, limiting element 1890 has the shape of showing as in Figure 18 B, and described shape defines the inconsistent shape that can not hold photoconduction 1840.With conductor 1811 to 1816 coupling, the flat surface 1895 that limiting element 1890 is being attached to conductor 1811 and shows in defining as Figure 18 C after 1816.Flat surface 1895 is configurable with the photoconduction 1840 on the top part 1871 of holding main body 1870.
Although described and illustrated specific embodiment of the present invention, the invention is not restricted to describe and particular form or the layout of the parts of graphic extension.Should be understood that and do not answer the narrow sense ground described graphic extension of explanation and description.For instance, optical launcher nude film 220 can be LED, but also can be the nude film with integrated LED and circuit or the light source that uses WeiLai Technology.Similarly, although graphic extension optical coupler in all embodiments those skilled in the art will appreciate that the present invention is applicable to the encapsulation with any other Optical devices that are encapsulated in the nude film of optical launcher at least that shares in photoconduction and optical receiver nude film.Scope of the present invention will be by appended claims and equivalent definition thereof.
Claims (20)
1. encapsulation that is used for electrooptical device, it comprises:
The first optical launcher nude film, it is configured to utilizing emitted light;
The first optical receiver nude film, it is configured to receive the part by the described light of described the first optical launcher nude film emission;
A plurality of conductors, described the first optical launcher nude film and described the first optical receiver nude film are installed at least one in described a plurality of conductor;
Limiting element, it is attached to described a plurality of conductor, makes described at least one in described a plurality of conductor be clipped between one in described limiting element and described the first optical launcher nude film and described the first optical receiver nude film;
The first photoconduction, it is formed on described limiting element, described the first photoconduction is the roughly transparent encapsulant that is encapsulated described the first optical launcher nude film and described the first optical receiver nude film, and wherein said the first photoconduction is configured to light is transferred to described the first optical receiver nude film from described the first optical launcher nude film; And
Opaque encapsulant, it is encapsulated described the first photoconduction and described limiting element.
2. encapsulation according to claim 1, wherein said limiting element are the dielectric adhesive tape.
3. encapsulation according to claim 1, wherein said limiting element are glued to described a plurality of conductor.
4. encapsulation according to claim 1, wherein said limiting element is attached to described a plurality of conductor by epoxy resin.
5. encapsulation according to claim 1, wherein said limiting element are roughly reflection.
6. encapsulation according to claim 1, wherein said limiting element is greater than described the first photoconduction.
7. encapsulation according to claim 1, wherein the described limiting element with the coupling of the part of described a plurality of conductors defines the surface that is suitable for holding described the first photoconduction.
8. encapsulation according to claim 1, one in wherein said the first optical launcher nude film and described the first optical receiver nude film directly be attached in described a plurality of conductor described at least one, another one in described the first optical launcher nude film and described the first optical receiver nude film is attached at least one in described a plurality of conductor via three material layers, and described three material layers comprise and are clipped in two separators between fixed bed.
9. encapsulation according to claim 1, it comprises the second optical launcher nude film and the second optical receiver nude film.
10. encapsulation according to claim 9, wherein said the second optical launcher nude film and described the second optical receiver nude film are encapsulated in described the first photoconduction.
11. encapsulation according to claim 9, it further comprises the second photoconduction that is encapsulated described the second optical launcher nude film and described the second optical receiver nude film.
12. encapsulation according to claim 11, wherein said the first photoconduction and described the second photoconduction optics isolation.
13. encapsulation according to claim 11, it comprises the second limiting element, makes described a plurality of conductor be clipped between described the second photoconduction and described the second optical launcher nude film and described the second optical receiver nude film.
14. encapsulation according to claim 1, wherein said the first optical launcher nude film and described the first optical receiver nude film are attached to respectively both in described a plurality of conductor.
15. encapsulation according to claim 1, wherein said encapsulation forms the part of optical coupler.
16. an optical coupler, it comprises:
The first optical launcher nude film, it is configured to utilizing emitted light, and described the first optical launcher nude film is configured to draw electric power from the first external power source;
The first optical receiver nude film, it is configured to receive the light by described the first optical launcher nude film emission, and described the first optical receiver nude film is configured to draw electric power from the second external power source;
A plurality of conductive lead wires, wherein said the first optical launcher nude film and described the first optical receiver nude film are installed at least one in described conductive lead wire;
Limiting element, its be attached in described a plurality of conductive lead wire be clipped between one in described limiting element and described the first optical launcher nude film and described the first optical receiver nude film described at least one;
Photoconduction, it is encapsulated described the first optical launcher nude film and described the first optical receiver nude film that is formed on described limiting element, and wherein the first photoconduction is configured to light is transferred to described the first optical receiver nude film from described the first optical launcher nude film; And
Opaque encapsulant, it is encapsulated described the first photoconduction and described limiting element.
17. optical coupler according to claim 16, wherein said limiting element are dielectric film.
18. optical coupler according to claim 16, wherein said limiting element are roughly reflection.
19. optical coupler according to claim 16, one in wherein said a plurality of conductive lead wire defines conductive pad, and the one in wherein said the first optical launcher nude film and described the first optical receiver nude film directly is attached to described conductive pad, another one in described the first optical launcher nude film and described the first optical receiver nude film is attached to described conductive pad via three material layers, and described three material layers comprise and are clipped in two separators between fixed bed.
20. an electrooptical device, it comprises:
The first optical launcher nude film, it is configured to utilizing emitted light;
The first optical receiver nude film, it is configured to receive the light by described the first optical launcher nude film emission;
A plurality of conductive lead wires, wherein said the first optical launcher nude film and described the first optical receiver nude film are installed at least one in described conductive lead wire;
Limiting element, its be attached in a plurality of conductive lead wires described at least one, make described at least one in described a plurality of conductive lead wire be clipped between one and described limiting element in described the first optical launcher nude film and described the first optical receiver nude film;
The first photoconduction, it is formed on described limiting element, described photoconduction is the roughly transparent encapsulant that is encapsulated described the first optical launcher nude film and described the first optical receiver nude film, and wherein said the first photoconduction is configured to light is sent to described the first optical receiver nude film from described the first optical launcher nude film; And
Opaque encapsulant, it is encapsulated described the first photoconduction and is encapsulated at least in part described a plurality of conductive lead wire and described limiting element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/314,023 | 2011-12-07 | ||
| US13/314,023 US8577190B2 (en) | 2010-03-23 | 2011-12-07 | Optocoupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103151419A true CN103151419A (en) | 2013-06-12 |
Family
ID=48549382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105237828A Pending CN103151419A (en) | 2011-12-07 | 2012-12-07 | An optical coupler |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2013120940A (en) |
| CN (1) | CN103151419A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106501905A (en) * | 2015-09-04 | 2017-03-15 | 株式会社东芝 | Optically coupled device |
| CN108091613A (en) * | 2017-12-25 | 2018-05-29 | 无锡少小科技有限公司 | The method for adjusting photoelectrical coupler amplifying power |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN108736979A (en) * | 2017-04-25 | 2018-11-02 | 安华高科技通用Ip(新加坡)公司 | Isolating device and shielding system |
| CN109952657A (en) * | 2016-12-30 | 2019-06-28 | 德州仪器公司 | Isolator integrated circuit and manufacturing method with encapsulating structure cavity |
| CN112514180A (en) * | 2018-07-31 | 2021-03-16 | ams传感器亚洲私人有限公司 | Package comprising portions of a leadframe as conductive leads |
| CN114141887A (en) * | 2021-11-22 | 2022-03-04 | 纽威仕微电子（无锡）有限公司 | Photoelectric conversion circuit packaging process |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799512A (en) * | 2017-11-28 | 2018-03-13 | 无锡豪帮高科股份有限公司 | A kind of three-dimensional encapsulation integrates the structure and its method of photoelectric coupled circuit |
-
2012
- 2012-12-03 JP JP2012264236A patent/JP2013120940A/en not_active Withdrawn
- 2012-12-07 CN CN2012105237828A patent/CN103151419A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106501905A (en) * | 2015-09-04 | 2017-03-15 | 株式会社东芝 | Optically coupled device |
| US10008626B2 (en) | 2015-09-04 | 2018-06-26 | Kabushiki Kaisha Toshiba | Optical coupling device |
| CN106501905B (en) * | 2015-09-04 | 2018-11-09 | 株式会社东芝 | Optically coupled device |
| CN109952657A (en) * | 2016-12-30 | 2019-06-28 | 德州仪器公司 | Isolator integrated circuit and manufacturing method with encapsulating structure cavity |
| CN109952657B (en) * | 2016-12-30 | 2023-01-13 | 德州仪器公司 | Isolator integrated circuit with package structure cavity and method of manufacture |
| CN108736979A (en) * | 2017-04-25 | 2018-11-02 | 安华高科技通用Ip(新加坡)公司 | Isolating device and shielding system |
| CN108736979B (en) * | 2017-04-25 | 2021-09-03 | 安华高科技股份有限公司 | Isolation device and isolation system |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN108091613A (en) * | 2017-12-25 | 2018-05-29 | 无锡少小科技有限公司 | The method for adjusting photoelectrical coupler amplifying power |
| CN108091613B (en) * | 2017-12-25 | 2020-01-24 | 无锡少小科技有限公司 | Method for adjusting amplification power of photoelectric coupler |
| CN112514180A (en) * | 2018-07-31 | 2021-03-16 | ams传感器亚洲私人有限公司 | Package comprising portions of a leadframe as conductive leads |
| CN114141887A (en) * | 2021-11-22 | 2022-03-04 | 纽威仕微电子（无锡）有限公司 | Photoelectric conversion circuit packaging process |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013120940A (en) | 2013-06-17 |
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Application publication date: 20130612 |