CN114141887A - Photoelectric conversion circuit packaging process - Google Patents
Photoelectric conversion circuit packaging process Download PDFInfo
- Publication number
- CN114141887A CN114141887A CN202111381784.3A CN202111381784A CN114141887A CN 114141887 A CN114141887 A CN 114141887A CN 202111381784 A CN202111381784 A CN 202111381784A CN 114141887 A CN114141887 A CN 114141887A
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- Prior art keywords
- shell
- leads
- follows
- photoelectric conversion
- packaging process
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012858 packaging process Methods 0.000 title claims abstract description 21
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000009434 installation Methods 0.000 claims abstract description 17
- 238000012360 testing method Methods 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005406 washing Methods 0.000 claims abstract description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 9
- 230000004907 flux Effects 0.000 claims description 9
- 238000007654 immersion Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 230000003321 amplification Effects 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 6
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 229920000742 Cotton Polymers 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000011990 functional testing Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 210000003813 thumb Anatomy 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- 210000004247 hand Anatomy 0.000 claims description 2
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a photoelectric conversion circuit packaging process based on a ceramic substrate, which can ensure the stability of the installation of a photosensitive diode and has the advantages of simple operation, less equipment investment and low cost. Which comprises the following steps: SMD, lobe of a leaf, lead wire installation, wicking, washing, well survey, shell installation and finished product function test increase the installation photodiode step between washing and well survey, install the photodiode step as follows: firstly, placing a rubber ring on a diode into a bracket, then placing the diode into the bracket, bonding a photosensitive diode and a shell by using Epotek H20E, placing the bracket on a clamp, placing a substrate on the bracket printed by a screen and clamping the substrate by a clamp; three SIL leads are placed on three bonding pads, welded by a Metal iron, and the SIL leads are welded on the leads of the diode by using a cone core wire and a 62Sn/36Pb/2Ag welding wire, wherein the bonding leads are kept vertical to the substrate and are as short as possible during welding, and the redundant SIL leads are cut off.
Description
Technical Field
The invention relates to the field of thick film integrated circuit packaging, in particular to a photoelectric conversion circuit packaging process.
Background
For a thick film integrated circuit using a ceramic substrate, the conventional packaging process is as follows: the thick film circuit ceramic substrate from the previous process is divided into single circuits (split) according to the preset size after the device is mounted by the SMD process; and then carrying out a series of operations such as lead mounting, tin immersion, circuit cleaning, lead bar cutting and the like, carrying out finished product testing after the operations are finished, generally carrying out the processes such as inspection, packaging and the like, and finally warehousing and delivering the products. Because the rear film integrated circuit needs to be provided with the photosensitive diode, a photoelectric conversion circuit packaging process based on a ceramic substrate is needed to realize the installation of the photosensitive diode and ensure the installation stability of the photosensitive diode.
Disclosure of Invention
The invention provides a photoelectric conversion circuit packaging process based on a ceramic substrate, aiming at the problems that the existing packaging process does not contain a step of mounting a photosensitive diode or is insufficient in mounting stability.
The technical scheme is as follows: a photoelectric conversion circuit packaging process comprises the following steps: SMD, lobe of a leaf, lead wire installation, wicking, washing, well survey, shell installation and finished product function test, its characterized in that increases the installation photosensitive diode step between washing and well survey, the installation photosensitive diode step is as follows: firstly, placing a rubber ring on a diode into a bracket, then placing the diode into the bracket, bonding a photosensitive diode and a shell by using Epotek H20E, placing the bracket on a clamp, placing a substrate on the bracket printed by a screen and clamping the substrate by a clamp; three SIL leads are placed on three bonding pads, welded by a Metal iron, and the SIL leads are welded on the leads of the diode by using a cone core wire and a 62Sn/36Pb/2Ag welding wire, wherein the bonding leads are kept vertical to the substrate and are as short as possible during welding, and the redundant SIL leads are cut off.
It is further characterized in that: the SMD steps are as follows: on an automatic screen printing machine, a lead-containing silver-containing solder paste: KOKI is printed on a pad of the ceramic substrate, then a device is mounted on the pad printed with soldering paste on an automatic mounting machine, and finally the ceramic substrate mounted with the device is sent into a reflow oven to reflow by using a temperature curve of the KOKI soldering paste;
the splitting step is as follows: firstly, splitting the technical edge and then splitting the single sheet, and splitting along a splitting line, wherein the splitting line is upward, and two thumbs respectively press two sides of the splitting line;
the lead wire mounting steps are as follows: lead type: 2020801, cutting the braided lead into proper length, and clamping the lead on the circuit board by using a lead mounting clamp;
the tin immersion steps are as follows: during tin immersion, a tin pot containing lead and silver is used, and the flux is as follows: alpha 615-15; setting the temperature of a tin dipping furnace to 230 +/-10 ℃, melting a soldering tin rod in a tin bath to enable the liquid level of solder to be equal to or slightly lower than a notch, preparing a proper container to inject soldering flux, dipping the circuit board with the external lead installed in the soldering flux, immersing the external lead and a pad part on the circuit board in the molten solder, waiting for 3-5 seconds, slowly lifting the circuit board to enable the redundant solder on the external lead to flow back to the tin bath, and forming electric connection between the circuit board and the external lead after welding is completed;
the cleaning steps are as follows: putting the ceramic substrate welded with the lead into a cleaning machine for ultrasonic cleaning;
the middle measurement steps are as follows: testing output voltage, signal amplification factor, gain factor and the like by using a test fixture and adjusting;
the mounting steps of the shell are as follows: firstly, bending two sides of a shell by using a clamp, then bending the upper part of the shell by using the clamp, bending the upper surface of the shell to the side surface of the shell, enabling a welding point to be clamped at two notches, cleaning the shell by using a cotton swab and alcohol, and adhering an adhesive tape at a folding position on the upper surface inside the shell; placing a gasket between the photosensitive diode and the shell, fixing the photosensitive diode by using a screw, screwing the photosensitive diode by using a hand, folding four pins on the back surface of the shell, assembling the bottom, and folding the four pins in the same way to ensure that the pins contact the bottom of the shell; dispensing with H20E between the two leads and the casing. H20E was not allowed to flow into the housing. The needles were encapsulated with a small amount of EC 2216. Curing temperature: 150 ℃; curing time: 15 minutes;
the finished product function test steps are as follows: the used test fixture is used for performing functional tests of output voltage, signal amplification factor, gain factor and the like.
The invention has the beneficial effects that: the step of installing the photosensitive diode is added between the cleaning and the middle measurement, the stability of installing the photosensitive diode can be ensured, and the packaging process is simple to operate, less in equipment investment and low in cost.
Drawings
FIG. 1 is a schematic diagram of a lead;
fig. 2 is a schematic diagram of the product.
Detailed Description
A photoelectric conversion circuit packaging process comprises the following steps: SMD, lobe of a leaf, lead wire installation, wicking, washing, well survey, shell installation and finished product function test increase the installation photodiode step between washing and well survey, install the photodiode step as follows: firstly, placing a rubber ring on a diode into a bracket, then placing the diode into the bracket, bonding a photosensitive diode and a shell by using Epotek H20E, placing the bracket on a clamp, placing a substrate on the bracket printed by a screen and clamping the substrate by a clamp; three SIL leads are placed on three bonding pads, welded by a Metal iron, and the SIL leads are welded on the leads of the diode by using a cone core wire and a 62Sn/36Pb/2Ag welding wire, wherein the bonding leads are kept vertical to the substrate and are as short as possible during welding, and the redundant SIL leads are cut off.
The SMD steps are as follows: on an automatic screen printing machine, a lead-containing silver-containing solder paste: KOKI is printed on the pad of the ceramic substrate, then the device is mounted on the pad printed with the soldering paste on an automatic mounting machine, and finally the ceramic substrate mounted with the device is sent into a reflow oven to reflow by using the temperature curve of the KOKI soldering paste.
The splitting step is as follows: and splitting the single sheet along the splitting line, wherein the splitting line is upward, and the two thumbs of two hands respectively press the two sides of the splitting line.
The lead wire mounting steps are as follows: lead type: 2020801, using the braided leads, cutting the braided leads to the appropriate length, and using a lead mounting fixture to clamp the leads to the circuit board.
The tin immersion steps are as follows: during tin immersion, a tin pot containing lead and silver is used, and the flux is as follows: alpha 615-15; setting the temperature of a solder dipping furnace to 230 +/-10 ℃, melting a solder stick in a tin bath, enabling the liquid level of solder to be equal to or slightly lower than a notch, preparing a proper container to inject soldering flux, dipping the circuit board with the external lead installed in the soldering flux, immersing the external lead and a pad part on the circuit board in the molten solder, waiting for 3-5 seconds, slowly lifting the circuit board, enabling the redundant solder on the external lead to flow back to the tin bath, and forming electric connection between the circuit board and the external lead after welding.
The cleaning steps are as follows: and putting the ceramic substrate welded with the lead into a cleaning machine for ultrasonic cleaning.
The middle measurement steps are as follows: and testing the output voltage, the signal amplification factor, the gain factor and the like by using a test fixture and adjusting.
The mounting steps of the shell are as follows: firstly, bending two sides of a shell by using a clamp, then bending the upper part of the shell by using the clamp, bending the upper surface of the shell to the side surface of the shell, enabling a welding point to be clamped at two notches, cleaning the shell by using a cotton swab and alcohol, and adhering an adhesive tape at a folding position on the upper surface inside the shell; placing a gasket between the photosensitive diode and the shell, fixing the photosensitive diode by using a screw, screwing the photosensitive diode by using a hand, folding four pins on the back surface of the shell, assembling the bottom, and folding the four pins in the same way to ensure that the pins contact the bottom of the shell; dispensing with H20E between the two leads and the casing. H20E was not allowed to flow into the housing. The needles were encapsulated with a small amount of EC 2216. Curing temperature: 150 ℃; curing time: for 15 minutes.
The finished product function test steps are as follows: the used test fixture is used for performing functional tests of output voltage, signal amplification factor, gain factor and the like.
The invention has the beneficial effects that: the step of installing the photosensitive diode is added between the cleaning and the middle measurement, the stability of installing the photosensitive diode can be ensured, and the packaging process is simple to operate, less in equipment investment and low in cost.
Claims (9)
1. A photoelectric conversion circuit packaging process comprises the following steps: SMD, lobe of a leaf, lead wire installation, wicking, washing, well survey, shell installation and finished product function test, its characterized in that increases the installation photosensitive diode step between washing and well survey, the installation photosensitive diode step is as follows: firstly, placing a rubber ring on a diode into a bracket, then placing the diode into the bracket, bonding a photosensitive diode and a shell by using Epotek H20E, placing the bracket on a clamp, placing a substrate on the bracket printed by a screen and clamping the substrate by a clamp; three SIL leads are placed on three bonding pads, welded by a Metal iron, and the SIL leads are welded on the leads of the diode by using a cone core wire and a 62Sn/36Pb/2Ag welding wire, wherein the bonding leads are kept vertical to the substrate and are as short as possible during welding, and the redundant SIL leads are cut off.
2. The photoelectric conversion circuit packaging process according to claim 1, wherein: the SMD steps are as follows: on an automatic screen printing machine, a lead-containing silver-containing solder paste: KOKI is printed on the pad of the ceramic substrate, then the device is mounted on the pad printed with the soldering paste on an automatic mounting machine, and finally the ceramic substrate mounted with the device is sent into a reflow oven to reflow by using the temperature curve of the KOKI soldering paste.
3. The photoelectric conversion circuit packaging process according to claim 1, wherein: the splitting step is as follows: and splitting the single sheet along the splitting line, wherein the splitting line is upward, and the two thumbs of two hands respectively press the two sides of the splitting line.
4. The photoelectric conversion circuit packaging process according to claim 1, wherein: the lead wire mounting steps are as follows: lead type: 2020801, using the braided leads, cutting the braided leads to the appropriate length, and using a lead mounting fixture to clamp the leads to the circuit board.
5. The photoelectric conversion circuit packaging process according to claim 1, wherein: the tin immersion steps are as follows: during tin immersion, a tin pot containing lead and silver is used, and the flux is as follows: alpha 615-15; setting the temperature of a solder dipping furnace to 230 +/-10 ℃, melting a solder stick in a tin bath, enabling the liquid level of solder to be equal to or slightly lower than a notch, preparing a proper container to inject soldering flux, dipping the circuit board with the external lead installed in the soldering flux, immersing the external lead and a pad part on the circuit board in the molten solder, waiting for 3-5 seconds, slowly lifting the circuit board, enabling the redundant solder on the external lead to flow back to the tin bath, and forming electric connection between the circuit board and the external lead after welding.
6. The photoelectric conversion circuit packaging process according to claim 1, wherein: the cleaning steps are as follows: and putting the ceramic substrate welded with the lead into a cleaning machine for ultrasonic cleaning.
7. The photoelectric conversion circuit packaging process according to claim 1, wherein: the middle measurement steps are as follows: and testing the output voltage, the signal amplification factor, the gain factor and the like by using a test fixture and adjusting.
8. The photoelectric conversion circuit packaging process according to claim 1, wherein: the mounting steps of the shell are as follows: firstly, bending two sides of a shell by using a clamp, then bending the upper part of the shell by using the clamp, bending the upper surface of the shell to the side surface of the shell, enabling a welding point to be clamped at two notches, cleaning the shell by using a cotton swab and alcohol, and adhering an adhesive tape at a folding position on the upper surface inside the shell; placing a gasket between the photosensitive diode and the shell, fixing the photosensitive diode by using a screw, screwing the photosensitive diode by using a hand, folding four pins on the back surface of the shell, assembling the bottom, and folding the four pins in the same way to ensure that the pins contact the bottom of the shell; dispensing with H20E between the two leads and the housing, H20E did not allow flow into the housing, encapsulating the needle with a small amount of EC2216, cure temperature: 150 ℃; curing time: for 15 minutes.
9. The photoelectric conversion circuit packaging process according to claim 1, wherein: the finished product function test steps are as follows: the used test fixture is used for performing functional tests of output voltage, signal amplification factor, gain factor and the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111381784.3A CN114141887A (en) | 2021-11-22 | 2021-11-22 | Photoelectric conversion circuit packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111381784.3A CN114141887A (en) | 2021-11-22 | 2021-11-22 | Photoelectric conversion circuit packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114141887A true CN114141887A (en) | 2022-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111381784.3A Pending CN114141887A (en) | 2021-11-22 | 2021-11-22 | Photoelectric conversion circuit packaging process |
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1144001A (en) * | 1994-03-18 | 1997-02-26 | 艾利森电话股份有限公司 | Encapsulation of optoelectronic components |
| CN1305100A (en) * | 1999-11-01 | 2001-07-25 | 报知机株式会社 | Photoelectric smoke detector and smoke detector parts |
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| CN108321134A (en) * | 2018-04-09 | 2018-07-24 | 黄山宝霓二维新材科技有限公司 | The encapsulating structure and processing technology of the plastic sealed IPM modules of high power density |
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| CN110620047A (en) * | 2019-09-18 | 2019-12-27 | 纽威仕微电子（无锡）有限公司 | Small-size integrated circuit packaging process based on ceramic substrate |
| CN111769163A (en) * | 2020-06-08 | 2020-10-13 | 杭州敏和光电子技术有限公司 | Infrared receiver |
| CN112117200A (en) * | 2020-09-09 | 2020-12-22 | 纽威仕微电子（无锡）有限公司 | In-line direct-insertion thick film integrated circuit packaging process |
| CN212461688U (en) * | 2020-06-09 | 2021-02-02 | 杭州敏和光电子技术有限公司 | Infrared receiving module with signal port |
| CN112654172A (en) * | 2020-11-20 | 2021-04-13 | 广东左向照明有限公司 | Circuit board production process |
-
2021
- 2021-11-22 CN CN202111381784.3A patent/CN114141887A/en active Pending
Patent Citations (15)
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| CN1144001A (en) * | 1994-03-18 | 1997-02-26 | 艾利森电话股份有限公司 | Encapsulation of optoelectronic components |
| CN1305100A (en) * | 1999-11-01 | 2001-07-25 | 报知机株式会社 | Photoelectric smoke detector and smoke detector parts |
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