CN211578752U - Single crystal grain structure with plane extension part and capable of emitting light from bottom surface - Google Patents
Single crystal grain structure with plane extension part and capable of emitting light from bottom surface Download PDFInfo
- Publication number
- CN211578752U CN211578752U CN201922094777.XU CN201922094777U CN211578752U CN 211578752 U CN211578752 U CN 211578752U CN 201922094777 U CN201922094777 U CN 201922094777U CN 211578752 U CN211578752 U CN 211578752U
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- light
- insulating layer
- light emitter
- single crystal
- crystal grain
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- 239000013078 crystal Substances 0.000 title claims abstract description 24
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- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 26
- 230000005540 biological transmission Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
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- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011799 hole material Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The utility model relates to a single crystal grain structure with plane extension part and emitting light from the bottom surface, which at least comprises an insulating layer and a light emitter, wherein the insulating layer is provided with a light-transmitting region which enables light to pass through the top surface of the insulating layer and to be projected from the bottom surface of the insulating layer, the light emitter is positioned on the top surface of the insulating layer, the light emitted from the bottom surface can pass through the corresponding light-transmitting region, and the area of the light emitter is smaller than that of the insulating layer, the single die structure is characterized in that at least one planar extension is formed on the top surface of the insulating layer, one side surface of the flat extension part is abutted against the side surface of the light emitter, the height of each flat extension part is equivalent to the height of the light emitter, and the other side of the light emitter is flush with the side of the insulating layer to form the single-die structure.
Description
Technical Field
The present invention relates to a single crystal structure, and more particularly to a single crystal structure, in which a light emitter is fixed to a side surface of an insulating layer, and a planar extension portion is added to a periphery of the light emitter, so that the single crystal structure corresponds to an area of the light emitter, and can form a single crystal structure with a flat surface.
Background
Generally, an Optical Coupler (or optoelectronic Coupler, an Optical isolator, and an Optical isolator) is a photoelectric conversion device that transmits electrical signals through light (such as visible light and infrared light), and is formed by commonly packaging an Optical receiver and an Optical emitter, and there is no electrical or physical connection between the Optical receiver and the Optical emitter except for light.
Currently, the optical coupler is generally divided into a left-right structure and an up-down structure, and it is briefly described hereinafter that the left-right structure refers to a light emitter and a light receiver, which are respectively located at left and right opposite positions in the optical coupler, wherein the light emitter and the light receiver are respectively disposed on different brackets, and the two brackets are separated from each other by a distance and do not touch each other, so that the light emitter can project light toward the light receiver. In addition, the "vertical structure" refers to that the light emitter and the light receiver are respectively located at the vertical opposite positions in the optical coupler, wherein the light emitter and the light receiver are also respectively arranged on different brackets, and the two brackets are separated from each other by a distance without touching each other, so that the light emitter can project light towards the light receiver. However, the optical coupler of either the "left-right structure" or the "top-bottom structure" generally suffers from the problems of too long distance between the light emitter and the light receiver, difficult alignment, and poor yield due to package alignment.
In addition, in the conventional optical coupler, after the light emitter and the light receiver are respectively fixed to the corresponding brackets, transparent resin is poured to cover the light emitter and the light receiver, so that if the light emitter and the light receiver are not aligned correctly due to carelessness in the pouring process, the transparent resin is limited to be solidified, the positions of the light emitter and the light receiver cannot be readjusted, and a worker can only discard the failed optical coupler, thereby causing waste of materials and reducing the production yield. In view of the above, the applicant has devised a stacked optical coupler structure, as shown in fig. 1, the stacked optical coupler structure a1 is composed of a light emitter a11, an insulating layer a12 and a light receiver a13, wherein the insulating layer a12 is located between the light emitter a11 and the light receiver a13, and the insulating layer a12 is capable of allowing light from the light emitter a11 to pass through and project onto the light receiver a13, so that the light emitter a11, the insulating layer a12 and the light receiver a13 are separate elements, and the light receiver a13 and the light receiver a11 are separated by the insulating layer a12, so that the overall size of the optical coupler can be effectively reduced by controlling the thickness of the insulating layer a12, and the alignment of the light receiver a13 and the light emitter a11 is easier and more accurate than the suspension alignment of the optical coupler of the "up-down structure".
However, the applicant has found that the light emitter a11 (such as an LED die) is small in size during the actual production process, so that the fixing and positioning difficulty is easily caused during the production process of an optical coupler or the like, and please refer to fig. 1, and it is clear that the difference between the areas of the light emitter a11 and the insulating layer a12 is very large, which causes the inconvenience of stacking and picking up the device for the manufacturer, and therefore, how to improve the aforementioned drawbacks becomes an important issue to be solved by the present invention.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned elements of the laminated optocoupler structure, there is still an improvement in production, and therefore, the applicant has developed and designed a single crystal grain structure with a planar extension for emitting light from the bottom surface, so as to hopefully solve the above-mentioned problems effectively.
An object of the present invention is to provide a single crystal grain structure with plane extension and emitting light from the bottom surface, comprising an insulating layer, a light emitter and at least one plane extension, wherein the insulating layer is provided with a light transmission region, the light transmission region enables light to pass through the top surface of the insulating layer and to be projected from the bottom surface of the insulating layer, the light emitter is located on the top surface of the insulating layer and can transmit the corresponding light transmission region to project light, the area of the light emitter is smaller than that of the insulating layer, the present invention is characterized in that each plane extension is disposed on the top surface of the insulating layer, one side surface of the plane extension is attached to the side surface of the light emitter, the height of each plane extension is equal to that of the light emitter, and the other side surface away from the light emitter is kept flush with or close to the side surface of the insulating layer, so as to form the single crystal grain structure, thus, the single-die structure can be conveniently applied to the subsequent process of optical coupler or light-emitting product.
Another objective of the present invention is to provide a light emitter that can be bonded to the top surface of the insulating layer by a transparent adhesive, so that the single crystal grain structure is more stable and integrated.
Another object of the present invention is to provide a light emitter having at least one contact on the top surface thereof for being welded to a transmission line or serving as a joint of an SMT process.
For the purpose of further understanding and appreciation of the objects, technical features and effects of the invention, the embodiments will now be described in detail with reference to the accompanying drawings, in which:
drawings
FIG. 1 is a schematic diagram of a prior art laminated optocoupler structure;
FIG. 2 is a schematic diagram of a single die structure of the present invention; and
fig. 3 is a schematic diagram of a single die structure of the present invention as an optical coupler.
[ description of reference numerals ]
[ Prior Art ]
Laminated light coupling structure … … A1
Light emitter … … A11
Insulating layer … … A12
Light receiver … … A13
[ the utility model ]
Single crystal grain structure … … 1
Insulating layer … … 11
Light transmitting region … … 111
Light emitter … … 13
Heights … … 13H, 15H
Contact … … 131
Planar extension … … 15
Light-transmitting glue … … 17
Light receiver … … 2
Base panel … … 31
Transmission line … … B1
Detailed Description
The present invention relates to a single crystal grain structure 1 having a plane extension part and emitting light from the bottom surface, in an embodiment, please refer to fig. 2 and fig. 3, the single crystal grain structure 1 can be composed of an insulating layer 11, a light emitter 13 and at least one plane extension part 15, wherein the insulating layer 11 is provided with a light transmission region 111, when the single crystal grain structure 1 is applied to an optical coupler, the bottom surface of the insulating layer 11 can be fixed to the top surface of an optical receiver 2, which is described herein in particular, the claimed top surface and bottom surface of the present invention are determined by the element position of fig. 2, which is described in advance. The insulating layer 11 may be made of a light-transmitting material (e.g., glass, plastic, MICA (MICA), silicon carbide (SiC), or silicon nitride (Si)3N4) .., etc.), or the insulating layer 11 can be made of opaque material, but the position corresponding to the transparent region 111 is a hollow hole or transparent material, so that light can be projected from the bottom surface of the insulating layer 11 after passing through the transparent region 111 from the top surface of the insulating layer 11.
Referring to fig. 2 and 3, the light emitter 13 (e.g., LED die) is located on the top surface of the insulating layer 11, and the bottom surface thereof can emit light (i.e., light emitting position)), and the area of the light emitter 13 is smaller than that of the insulating layer 11, but the light emitting position of the bottom surface thereof at least partially corresponds to the light transmitting region 111, so that the light emitted from the light emitter 13 can be projected through the corresponding light transmitting region 111 and received by the light receiver 2, in this embodiment, the light emitter 13 is bonded to the top surface of the insulating layer 11 through a light transmitting adhesive 17 (fig. 3 is omitted because the thickness of the light transmitting adhesive 17 is relatively thin), but in other embodiments of the present invention, manufacturers can adopt other fixing methods according to actual requirements of products, rather than limiting to the light transmitting adhesive 17.
Referring to fig. 3 and 3 again, in this embodiment, two planar extensions 15 are disposed on the top surface of the insulating layer 11, one side surface of each planar extension 15 abuts against a corresponding side surface of the light emitter 13 (as shown in fig. 2), the height 15H of each planar extension 15 is equal to the height 13H of the light emitter 13, and the other side surface of each planar extension 15 away from the light emitter 13 is kept flush with or nearly flush with the side surface of the insulating layer 11 (due to production tolerance), so as to form the single die structure 1 integrally, so that the tiny light emitter 13 can be extended in a planar manner by adding the planar extensions 15 on the periphery of the light emitter 13, so that the single die structure 1 is relatively complete, and the area of the single die structure 1 corresponding to the light emitter 13 has a flat surface, so as to facilitate the subsequent process of optical coupler or similar light emitting product, for example, in the optical coupler structure of fig. 3, the single crystal grain structure 1 can be fabricated by the manufacturer, and then the single crystal grain structure 1 is disposed on the top surface of the optical receiver 2, at this time, no matter the fixing or alignment procedure is performed, it is easier than the single illuminator (LED crystal grain) of the prior art, and the stacking after production is more convenient because the single crystal grain structure 1 can maintain a flat surface.
Specifically, referring to fig. 2 and fig. 3, although two planar extensions 15 are illustrated in the embodiment, in terms of implementation, a practitioner can only have one planar extension 15 or three or more planar extensions 15 according to the relative position of the light emitter 13 and the insulating layer 11 (especially, the light-transmitting region 111), even form a square (or O-shape), wherein the empty region can accommodate the light emitter 13, that is, as long as the top surface of the planar extension 15 and the top surface of the light emitter 13 form a flat surface, which is described in advance. Also, the plane extension 15 can be made of a plastic material, such as Polyvinyl acetate (pvnyl acetate), epoxy (epoxy) …, etc., and it can be adhered to the top surface of the insulating layer 11 by the light-transmitting glue 17, but not limited thereto. In addition, the top surface of the light emitter 13 is provided with at least one contact 131, when the single die structure 1 is applied to the optical coupler structure, the contact 131 allows a user to solder and fix one end of a transmission line B1 to the light emitter 13, and the other end of the transmission line B1 can be bonded to a substrate 31; when the single-die structure 1 is applied to other light-emitting products, the contact 131 can be provided with a solder ball as a joint of a Surface-mount technology (SMT) process to be directly soldered and fixed to a circuit board; therefore, the single crystal grain structure 1 of the present invention has high industrial applicability and can be adapted to various products requiring light source action.
The above description is only a preferred embodiment of the present invention, but the scope of the claims of the present invention is not limited thereto, and those skilled in the art can easily conceive equivalent changes according to the technical content of the present invention, without departing from the scope of the present invention.
Claims (7)
1. A single die structure having planar extensions and emitting light from a bottom surface, comprising:
an insulating layer, which is provided with a light-transmitting area, wherein the light-transmitting area can enable light to pass through the top surface of the insulating layer and be projected out from the bottom surface of the insulating layer; and
a light emitter on the top of the insulating layer, the bottom of the light emitter can emit light and can project out through the light-transmitting area, the area of the light emitter is smaller than that of the insulating layer;
the single-die structure is characterized in that at least one plane extension part is arranged on the top surface of the insulating layer, one side surface of the plane extension part is abutted against the side surface of the light emitter, the height of each plane extension part is equivalent to the height of the light emitter, and the other side surface of the plane extension part, which is far away from the light emitter, is flush with the side surface of the insulating layer, so that the single-die structure can be integrally formed.
2. The single die structure of claim 1, wherein the planar extension is made of a plastic material.
3. The single die structure of claim 1 or 2, wherein the light emitter is bonded to the top surface of the insulating layer by a light transmissive adhesive.
4. The single crystal grain structure of claim 3 wherein the planar extension is also bonded to the top surface of the insulating layer by the light transmissive glue.
5. A single crystal grain structure as claimed in claim 4 wherein the top surface of the light emitter is provided with at least one contact.
6. The single crystal grain structure of claim 5 wherein the insulating layer is entirely made of a light transmissive material.
7. The single crystal grain structure of claim 5 wherein the portion of the insulating layer not being the light transmitting region is made of a non-light transmitting material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108205281U TWM584439U (en) | 2019-04-29 | 2019-04-29 | Single crystal grain structure with planar extension part and light-emitting bottom surface |
| TW108205281 | 2019-04-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211578752U true CN211578752U (en) | 2020-09-25 |
Family
ID=69052998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922094777.XU Active CN211578752U (en) | 2019-04-29 | 2019-11-28 | Single crystal grain structure with plane extension part and capable of emitting light from bottom surface |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN211578752U (en) |
| TW (1) | TWM584439U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI745868B (en) * | 2020-02-18 | 2021-11-11 | 喆光照明光電股份有限公司 | Laminated optocoupler structure capable of eliminating or reducing parasitic capacitance |
-
2019
- 2019-04-29 TW TW108205281U patent/TWM584439U/en unknown
- 2019-11-28 CN CN201922094777.XU patent/CN211578752U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM584439U (en) | 2019-10-01 |
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