TW202033708A - 半導體用接著劑、半導體裝置的製造方法及半導體裝置 - Google Patents

半導體用接著劑、半導體裝置的製造方法及半導體裝置 Download PDF

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Publication number
TW202033708A
TW202033708A TW108135572A TW108135572A TW202033708A TW 202033708 A TW202033708 A TW 202033708A TW 108135572 A TW108135572 A TW 108135572A TW 108135572 A TW108135572 A TW 108135572A TW 202033708 A TW202033708 A TW 202033708A
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TW
Taiwan
Prior art keywords
adhesive
semiconductor
semiconductor device
semiconductors
resin
Prior art date
Application number
TW108135572A
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English (en)
Chinese (zh)
Inventor
谷口徹弥
佐藤慎
茶花幸一
Original Assignee
日商日立化成股份有限公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=70054548&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW202033708(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW202033708A publication Critical patent/TW202033708A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
TW108135572A 2018-10-02 2019-10-01 半導體用接著劑、半導體裝置的製造方法及半導體裝置 TW202033708A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018187510 2018-10-02
JP2018-187510 2018-10-02

Publications (1)

Publication Number Publication Date
TW202033708A true TW202033708A (zh) 2020-09-16

Family

ID=70054548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108135572A TW202033708A (zh) 2018-10-02 2019-10-01 半導體用接著劑、半導體裝置的製造方法及半導體裝置

Country Status (5)

Country Link
JP (1) JP7363798B2 (ja)
KR (1) KR102629861B1 (ja)
CN (1) CN112771659A (ja)
TW (1) TW202033708A (ja)
WO (1) WO2020071391A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767537B (zh) * 2021-01-26 2022-06-11 隆達電子股份有限公司 發光二極體封裝結構的製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120125491A (ko) * 2010-01-21 2012-11-15 세키스이가가쿠 고교가부시키가이샤 열경화성 수지 조성물, 플립 칩 실장용 접착제, 반도체 장치의 제조 방법, 및 반도체 장치
WO2012043764A1 (ja) * 2010-09-30 2012-04-05 日立化成工業株式会社 接着剤組成物、半導体装置の製造方法及び半導体装置
JP2012089750A (ja) * 2010-10-21 2012-05-10 Hitachi Chem Co Ltd 半導体封止充てん用熱硬化性樹脂組成物及び半導体装置
JP5598343B2 (ja) 2011-01-17 2014-10-01 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び半導体装置
JP5866851B2 (ja) 2011-08-05 2016-02-24 日立化成株式会社 半導体装置の製造方法、フィルム状接着剤及び接着剤シート
JP6047888B2 (ja) 2012-02-24 2016-12-21 日立化成株式会社 半導体用接着剤及び半導体装置の製造方法
JP6407684B2 (ja) 2014-11-28 2018-10-17 日東電工株式会社 シート状樹脂組成物、積層シート及び半導体装置の製造方法
JP6536281B2 (ja) * 2015-08-18 2019-07-03 日立化成株式会社 半導体用接着剤、並びに、半導体装置及びその製造方法
JP2017122193A (ja) 2016-01-08 2017-07-13 日立化成株式会社 半導体用接着剤及び半導体装置の製造方法
JP6717005B2 (ja) 2016-03-31 2020-07-01 日立化成株式会社 樹脂組成物、硬化物、樹脂フィルム、封止材及び封止構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767537B (zh) * 2021-01-26 2022-06-11 隆達電子股份有限公司 發光二極體封裝結構的製造方法

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Publication number Publication date
JP7363798B2 (ja) 2023-10-18
WO2020071391A1 (ja) 2020-04-09
CN112771659A (zh) 2021-05-07
JPWO2020071391A1 (ja) 2021-09-02
KR102629861B1 (ko) 2024-01-29
KR20210068412A (ko) 2021-06-09

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