TW202031606A - 製造晶片及框體中至少任一者之方法 - Google Patents

製造晶片及框體中至少任一者之方法 Download PDF

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Publication number
TW202031606A
TW202031606A TW109105012A TW109105012A TW202031606A TW 202031606 A TW202031606 A TW 202031606A TW 109105012 A TW109105012 A TW 109105012A TW 109105012 A TW109105012 A TW 109105012A TW 202031606 A TW202031606 A TW 202031606A
Authority
TW
Taiwan
Prior art keywords
workpiece
chip
shield
wafer
manufacturing
Prior art date
Application number
TW109105012A
Other languages
English (en)
Chinese (zh)
Inventor
荒川太朗
武田昇
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202031606A publication Critical patent/TW202031606A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW109105012A 2019-02-20 2020-02-17 製造晶片及框體中至少任一者之方法 TW202031606A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019028595A JP7218056B2 (ja) 2019-02-20 2019-02-20 チップ及び枠体の少なくともいずれかを製造する方法
JP2019-028595 2019-02-20

Publications (1)

Publication Number Publication Date
TW202031606A true TW202031606A (zh) 2020-09-01

Family

ID=72183491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109105012A TW202031606A (zh) 2019-02-20 2020-02-17 製造晶片及框體中至少任一者之方法

Country Status (4)

Country Link
JP (1) JP7218056B2 (ko)
KR (1) KR20200101841A (ko)
CN (1) CN111590222A (ko)
TW (1) TW202031606A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114571540B (zh) * 2022-03-08 2024-03-19 海目星激光科技集团股份有限公司 超声波裂片方法
JP2023179101A (ja) * 2022-06-07 2023-12-19 日本電気硝子株式会社 ガラス板及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265508A (en) * 1990-10-31 1993-11-30 General Tire, Inc. Ultrasonic cutting system for stock material
JP2007242787A (ja) * 2006-03-07 2007-09-20 Disco Abrasive Syst Ltd ウエーハの分割方法
CN101571611B (zh) * 2009-06-05 2011-05-18 阮双琛 光子晶体光纤的全光纤耦合实现装置及方法
US9434644B2 (en) 2010-09-30 2016-09-06 Avanstrate Inc. Cover glass and method for producing cover glass
JP6301203B2 (ja) 2014-06-02 2018-03-28 株式会社ディスコ チップの製造方法
CA2994563C (en) * 2016-08-03 2019-11-12 Baker Hughes, A Ge Company, Llc Methods of forming and methods of repairing earth-boring tools
JP6906845B2 (ja) 2017-06-22 2021-07-21 株式会社ディスコ 被加工物の加工方法
JP6858455B2 (ja) 2017-07-24 2021-04-14 株式会社ディスコ チップの製造方法

Also Published As

Publication number Publication date
KR20200101841A (ko) 2020-08-28
JP7218056B2 (ja) 2023-02-06
JP2020132476A (ja) 2020-08-31
CN111590222A (zh) 2020-08-28

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