TW202028534A - 蝕刻液組成物及蝕刻方法 - Google Patents

蝕刻液組成物及蝕刻方法 Download PDF

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Publication number
TW202028534A
TW202028534A TW108137306A TW108137306A TW202028534A TW 202028534 A TW202028534 A TW 202028534A TW 108137306 A TW108137306 A TW 108137306A TW 108137306 A TW108137306 A TW 108137306A TW 202028534 A TW202028534 A TW 202028534A
Authority
TW
Taiwan
Prior art keywords
etching
silver
acid
solution composition
etching solution
Prior art date
Application number
TW108137306A
Other languages
English (en)
Chinese (zh)
Inventor
齋尾佳秀
大宮大輔
青木珠美
Original Assignee
日商Ａｄｅｋａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ａｄｅｋａ股份有限公司 filed Critical 日商Ａｄｅｋａ股份有限公司
Publication of TW202028534A publication Critical patent/TW202028534A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
TW108137306A 2018-10-17 2019-10-16 蝕刻液組成物及蝕刻方法 TW202028534A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-195565 2018-10-17
JP2018195565 2018-10-17

Publications (1)

Publication Number Publication Date
TW202028534A true TW202028534A (zh) 2020-08-01

Family

ID=70283974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108137306A TW202028534A (zh) 2018-10-17 2019-10-16 蝕刻液組成物及蝕刻方法

Country Status (5)

Country Link
JP (1) JP7377212B2 (ja)
KR (1) KR20210075150A (ja)
CN (1) CN112867812A (ja)
TW (1) TW202028534A (ja)
WO (1) WO2020080178A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022130991A1 (ja) * 2020-12-15 2022-06-23 Dic株式会社 銀用エッチング液、及びそれを用いたプリント配線板の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS488704B1 (ja) * 1969-04-17 1973-03-16
JPS5278632A (en) * 1975-12-12 1977-07-02 Tokyo Shibaura Electric Co Peeling solution for silver plating
JPS55164075A (en) * 1979-06-06 1980-12-20 Nippon Columbia Co Ltd Removal of silver from plastic base material
JP2553574B2 (ja) * 1987-07-24 1996-11-13 エヌ・イーケムキャット株式会社 銀剥離液
JPH1060671A (ja) 1996-08-16 1998-03-03 Asahi Denka Kogyo Kk 銀薄膜用エッチング液および銀薄膜エッチング方法
JP2003213460A (ja) 2002-01-16 2003-07-30 The Inctec Inc 銀系薄膜用エッチング液
US20030168431A1 (en) * 2002-02-25 2003-09-11 Ritdisplay Corporation Etchant composition for silver alloy
KR100440343B1 (ko) * 2002-04-03 2004-07-15 동우 화인켐 주식회사 고 선택성 은 식각용액-1
JP4161691B2 (ja) * 2002-11-21 2008-10-08 ソニー株式会社 エッチング工程を有する液晶ディスプレイの製造方法
JP4478383B2 (ja) 2002-11-26 2010-06-09 関東化学株式会社 銀を主成分とする金属薄膜のエッチング液組成物
CN101098989A (zh) * 2005-03-29 2008-01-02 三菱化学株式会社 铜的蚀刻液以及蚀刻方法
JP2009076601A (ja) * 2007-09-19 2009-04-09 Nagase Chemtex Corp エッチング溶液
KR101518055B1 (ko) * 2008-10-30 2015-05-06 동우 화인켐 주식회사 금속막 에칭액 조성물
JP2012194024A (ja) 2011-03-16 2012-10-11 Sumiko Techno-Research Co Ltd 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法
JP5621671B2 (ja) * 2011-03-17 2014-11-12 株式会社村田製作所 電子部品の製造方法
JP6207248B2 (ja) * 2013-06-17 2017-10-04 株式会社Adeka エッチング液組成物及びエッチング方法
CN105603425A (zh) * 2016-01-25 2016-05-25 熙腾电子科技（上海）有限公司 铜选择性蚀刻液和钛选择性蚀刻液

Also Published As

Publication number Publication date
CN112867812A (zh) 2021-05-28
WO2020080178A1 (ja) 2020-04-23
KR20210075150A (ko) 2021-06-22
JP7377212B2 (ja) 2023-11-09

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