TW202027187A - 晶圓平整度的評價方法及評價裝置 - Google Patents

晶圓平整度的評價方法及評價裝置 Download PDF

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Publication number
TW202027187A
TW202027187A TW108143891A TW108143891A TW202027187A TW 202027187 A TW202027187 A TW 202027187A TW 108143891 A TW108143891 A TW 108143891A TW 108143891 A TW108143891 A TW 108143891A TW 202027187 A TW202027187 A TW 202027187A
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TW
Taiwan
Prior art keywords
wafer
measurement
data grid
flatness
data
Prior art date
Application number
TW108143891A
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English (en)
Chinese (zh)
Inventor
上野淳一
佐藤三千登
Original Assignee
日商信越半導體股份有限公司
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Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW202027187A publication Critical patent/TW202027187A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/34—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces
    • G01B7/345—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW108143891A 2018-12-21 2019-12-02 晶圓平整度的評價方法及評價裝置 TW202027187A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018239636A JP6973368B2 (ja) 2018-12-21 2018-12-21 ウェーハの平坦度の評価方法及び評価装置
JP2018-239636 2018-12-21

Publications (1)

Publication Number Publication Date
TW202027187A true TW202027187A (zh) 2020-07-16

Family

ID=71102113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108143891A TW202027187A (zh) 2018-12-21 2019-12-02 晶圓平整度的評價方法及評價裝置

Country Status (3)

Country Link
JP (1) JP6973368B2 (ja)
TW (1) TW202027187A (ja)
WO (1) WO2020129453A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7496168B1 (ja) 2023-10-23 2024-06-06 株式会社多聞 膜厚分布測定装置及び膜厚分布測定方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3849547B2 (ja) * 2002-02-28 2006-11-22 信越半導体株式会社 半導体エピタキシャルウェーハの測定方法、半導体エピタキシャルウェーハの測定装置、半導体エピタキシャルウェーハの製造方法及びコンピュータプログラム
JP3769262B2 (ja) * 2002-12-20 2006-04-19 株式会社東芝 ウェーハ平坦度評価方法、その評価方法を実行するウェーハ平坦度評価装置、その評価方法を用いたウェーハの製造方法、その評価方法を用いたウェーハ品質保証方法、その評価方法を用いた半導体デバイスの製造方法、およびその評価方法によって評価されたウェーハを用いた半導体デバイスの製造方法
NL2017881B1 (en) * 2015-12-18 2017-10-17 Ultratech Inc Full-wafer inspection methods having selectable pixel density

Also Published As

Publication number Publication date
JP6973368B2 (ja) 2021-11-24
WO2020129453A1 (ja) 2020-06-25
JP2020102526A (ja) 2020-07-02

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