TW202015158A - Transfer system of mask and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a mask-transfer system and a method for manufacturing a mask having an integrated frame. The mask-transfer system, according to the present invention, is a system that transfers a mask for the formation of OLED pixels, by which, in a step for integrally forming a mask and a frame that supports the mask, the mask is loaded and transferred, the system being characterized by comprising: a mask loading part which can adsorb one surface of the mask, thereby loading same; and a transfer unit which moves and flips the mask loading part.

Description

Mask transfer system and manufacturing method of frame-integrated mask

The invention relates to a mask transfer system and a method for manufacturing a frame-integrated mask. In more detail, it relates to a mask transfer system capable of integrating a mask with a frame, improving the adhesion between the mask and the frame, and aligning each mask with precision, and a frame-integrated mask Hood manufacturing method.

Recently, research on electroforming methods in thin plate manufacturing is underway. The electroforming method is to impregnate the anode and cathode in the electrolyte, and apply power to make the metal thin plate electroplated on the surface of the cathode, so it is a method capable of manufacturing the electrode thin plate and expected to be mass-produced.

On the other hand, as the technology for forming pixels in the OLED manufacturing process, the FMM (Fine Metal Mask) method is mainly used, which closely fits the shadow mask in the form of a thin film to the substrate and is in a desired position Organic matter is deposited on it.

In the existing OLED manufacturing process, after the mask is manufactured into a strip shape, a plate shape, etc., the mask is welded and fixed to the OLED pixel deposition frame and used. Multiple units corresponding to one display may be provided on one mask. In addition, in order to manufacture a large-area OLED, a plurality of masks can be fixed to the OLED pixel deposition frame. During the process of fixing to the frame, each mask is stretched to make it flat. It is very difficult to adjust the stretching force to flatten the entire part of the mask. In particular, in order to flatten all the cells and align the mask pattern with a size of only a few μm to several tens of μm, it is necessary to fine-tune the tensile force applied to each side of the mask and confirm the height of the alignment state in real time. .

Nevertheless, in the process of fixing multiple masks to one frame, there is still a problem of poor alignment between the masks and between the mask units. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the area is large, so there is a problem that the mask sags or twists due to load, and wrinkles and burrs that occur in the welded part during the welding process (Burr), etc. problems such as misalignment of the mask unit.

In ultra-high-definition OLED, the existing QHD (Quarter High Definition) image quality is 500-600PPI (pixel per inch), the pixel size reaches about 30-50μm, and 4K UHD (Ultra High Definition), 8K UHD HD has a comparison The higher resolution is ~860PPI, ~1600PPI, etc. In this way, considering the pixel size of the ultra-high-definition OLED, the alignment error between the units needs to be reduced to a degree of several μm. Exceeding this error will result in defective products, so the yield may be extremely low. Therefore, it is necessary to develop a technique capable of preventing deformation such as sagging or twisting of the mask and accurately aligning it, and a technique of fixing the mask to the frame and the like.

Problems to be solved by invention Therefore, the present invention is proposed to solve the above-mentioned problems in the prior art, and its object is to provide a method for not only preventing deformation of the mask but also improving the adhesion between the mask and the frame when the mask is adhered to the frame Mask transfer system.

Moreover, the objective of this invention is to provide the mask transfer system which spreads a mask flatly and can be stably transferred.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the mask and the frame can form an integrated structure.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask that can prevent deformation such as sagging or twisting of the mask and can be accurately aligned.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask that significantly reduces manufacturing time and significantly improves productivity.

Ways to solve the problem The above object of the present invention is achieved by a mask transfer system that is a mask transfer system that loads and moves a mask for forming an OLED pixel of a mask in a process of integrally forming a mask and a frame for supporting the mask The system includes a mask loading part that attracts one side of the mask and can be loaded; and a transfer part that moves and flips the mask loading part.

The mask loading portion has a flat plate shape, and a plurality of vacuum holes may be formed on a surface corresponding to the mask.

A recessed portion is formed at a corner of the mask loading portion, and the area of the mask loading portion is larger than the area of the mask. If the mask is loaded on the mask loading portion, at least the corner of the mask may protrude outside the recessed portion.

The mask loading part may include a heating part.

A laser penetrating hole may be formed in a portion of the mask mounting portion corresponding to the welding portion of the mask.

The transfer part is connected to the other side of the mask loading part that is in contact with the mask, and the transfer part moves the mask loading part toward the X, Y, Z, and θ axes, and reverses the mask loading part so that the mask faces downward.

In addition, the above object of the present invention is achieved by a method of manufacturing a frame-integrated mask, which is a method of manufacturing a frame-integrated mask in which at least one mask is integrated with a frame for supporting the mask, the The method includes: (a) providing a frame with at least one mask unit area; (b) attaching one side of the mask to the mask loading portion and loading it; (c) loading the mask loading portion on the frame, and Make the mask correspond to the mask unit area of the frame; and (d) irradiate laser to the welding part of the mask to make the mask adhere to the frame.

The mask loading part has a flat plate shape, and a plurality of vacuum holes are formed on the side corresponding to the mask. In step (b), applying suction pressure to the side of the mask in the plurality of vacuum holes can make The mask is attracted to the mask loading part.

Step (b) may include the following steps: (b1) the vacuum transfer part adsorbs at least two sides of the mask; and (b2) moves the vacuum transfer part so that one side of the mask is adsorbed on the mask loading part and loaded.

In step (b1) or step (b2), the vacuum transfer unit pulls the attracted mask outward so that the mask can be spread out flatly.

Step (c) may include the following steps: (c1) flip the mask loading part so that the mask faces downward; (c2) the transfer part controls the position of the mask loading part so that the mask is aligned on the unit area of the frame ; And (c3) Mount the mask loading part on the frame so that the mask corresponds to the mask unit area of the frame

Before or after the mask corresponds to the mask unit area, the temperature of the process area containing the frame is raised to the first temperature, and after the mask is adhered to the frame, the temperature of the process area containing the frame can be reduced to The second temperature.

The first temperature is equal to or higher than the temperature of the OLED pixel deposition process, the second temperature is a temperature at least lower than the first temperature, the first temperature is any temperature from 25°C to 60°C, and the second temperature is lower than the first temperature In addition, the temperature of the OLED pixel deposition process may be any temperature from 25°C to 45°C at any temperature from 20°C to 30°C.

The mask loading section includes a heating section, and between step (b) and step (c), the mask can be maintained at a temperature 3°C to 10°C higher than the first temperature.

Invention effect According to the present invention configured as above, when the mask is adhered to the frame, not only can the deformation of the mask be prevented, but also the adhesion between the mask and the frame can be improved.

In addition, according to the present invention, the mask can be spread flatly and stably transferred.

Furthermore, according to the present invention, the cover and the frame can form an integrated structure.

In addition, according to the present invention, deformation such as sagging or twisting of the mask can be prevented, and alignment can be accurately performed.

In addition, according to the present invention, the manufacturing time can be significantly shortened, and the yield can be significantly increased.

The detailed description of the present invention described later will refer to the accompanying drawings, which show specific embodiments capable of implementing the present invention as examples. These embodiments are described in sufficient detail to enable those skilled in the art to implement the present invention. It should be understood that although the various embodiments of the present invention are different from each other, they are not mutually exclusive. For example, the specific shapes, structures, and characteristics described herein are related to one embodiment, and can be implemented as other embodiments without departing from the spirit and scope of the present invention. In addition, it should be understood that the position or arrangement of individual constituent elements in each disclosed embodiment can be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description should not be regarded as limiting, and as long as it is properly described, the scope of the present invention is limited only by the scope of the attached patent application and all ranges equivalent thereto. Similar symbols in the drawings represent the same or similar functions in many ways. For convenience, the length, area, thickness, and shape can be exaggerated.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present invention.

FIG. 1 is a schematic diagram showing a conventional mask for OLED pixel deposition.

Referring to FIG. 1, the existing mask 10 may be manufactured in stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 serves as a strip mask, and both sides of the strip can be welded and fixed to the OLED pixel deposition frame and used. The mask 100 shown in (b) of FIG. 1 can be used as a plate-type (Plate-Type) mask in a large-area pixel formation process.

The body (Body, or mask film 11) of the mask 10 is provided with a plurality of display units C. One unit C corresponds to one display such as a smartphone. A pixel pattern P is formed in the cell C so as to correspond to each pixel of the display. When the unit C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. As an example, a pixel pattern P is formed in the cell C so as to have a resolution of 70×140. That is, a large number of pixel patterns P form a set to constitute one unit C, and a plurality of units C may be formed on the mask 10.

FIG. 2 is a schematic diagram showing a conventional process of bonding the mask 10 to the frame 20. FIG. 3 is a schematic diagram showing that an alignment error between cells occurs during the conventional stretching of the F1 to F2 mask 10. The strip mask 10 including six units C (C1 to C6) shown in (a) of FIG. 1 will be described as an example.

Referring to (a) of FIG. 2, first, the strip mask 10 should be spread out flat. Tensile forces F1 to F2 are applied along the long axis direction of the strip mask 10, and the strip mask 10 is unfolded as it is stretched. In this state, the strip mask 10 is mounted on the frame 20 in a frame shape. The units C1 to C6 of the strip mask 10 will be located in the blank area inside the frame of the frame 20. The size of the frame 20 may be enough to make the units C1 to C6 of one strip mask 10 located in the blank area inside the frame, or may be enough to make the units C1 to C6 of multiple strip masks 10 located in the blank area inside the frame.

Referring to (b) of FIG. 2, finely adjust the tensile forces F1 to F2 applied to each side of the strip mask 10, and at the same time, after alignment, as the part of the side surface of the strip mask 10 is welded, the strip mask 10 and the frame 20 are connected to each other. (C) of FIG. 2 shows a side section of the strip cover 10 and the frame connected to each other.

Referring to FIG. 3, although fine adjustments of the stretching forces F1 to F2 applied to the sides of the strip mask 10, the problem is that the mask units C1 to C3 are not well aligned with each other. For example, the distances D1~D1", D2~D2" between the patterns P of the cells C1~C3 are different from each other, or the pattern P is skewed. Since the strip mask 10 has a large area including a plurality (6 cells as an example) of cells C1 to C6 and has a very thin thickness of several tens of μm, it is easy to sag or twist due to load. In addition, it is very difficult to adjust the tensile forces F1 to F2 so that all the cells C1 to C6 are flat, and confirming the alignment state between the cells C1 to C6 with a microscope.

Therefore, a slight error in the stretching forces F1 to F2 may cause an error in the degree of stretching or unfolding of the cells C1 to C3 of the strip mask 10, thereby causing the distance D1 to D1'' between the mask patterns P, D2~D2'' are different. Although it is very difficult to perfectly align so that the error is 0, in order to avoid the mask pattern P having a size of several μm to several tens of μm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error is preferably not more than 3 μm. The alignment error between such adjacent units is called pixel position accuracy (PPA).

In addition, approximately 6-20 strip masks 10 are respectively connected to one frame 20, and the alignment between the plurality of strip masks 10 and the plurality of cells C-C6 of the strip mask 10 are simultaneously aligned Precise state is a very difficult task, and can only increase the process time based on alignment, which becomes an important reason for reducing productivity.

On the other hand, after the strip mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the strip mask 10 can act on the frame 20 in the reverse direction. That is, after the strip mask 10 stretched and stretched due to the tensile forces F1 to F2 is connected to the frame 20, it is possible to apply tension to the frame 20. Generally, this tension is not large, and it does not have a great influence on the frame 20, but when the size of the frame 20 is miniaturized and the rigidity becomes low, such tension may slightly deform the frame 20. In this way, a problem may occur that the alignment state between the plurality of cells C to C6 is broken.

In view of this, the present invention proposes a frame 200 and a frame-integrated mask capable of forming the mask 100 and the frame 200 into an integrated structure. The mask 100 integrated with the frame 200 not only prevents deformation such as sagging or twisting, but also can be accurately aligned with the frame 200. When the mask 100 is connected to the frame 200, no tensile force is applied to the mask 100, and therefore, after the mask 100 is connected to the frame 200, no tension may be applied to the mask 200 to cause deformation. Also, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly shortened, and the productivity can be significantly improved.

4 is a front view (FIG. 4(a)) and a side cross-sectional view (FIG. 4(b)) showing a frame-integrated mask according to an embodiment of the present invention, and FIG. 5 is a diagram showing the present invention. A front view ((a) of FIG. 5) and a side cross-sectional view (b of FIG. 5) of the frame according to an embodiment.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and a frame 200. In other words, each mask 100 is bonded to the frame 200. In the following, for convenience of explanation, a quadrangular mask 100 is taken as an example for description, but before the mask 100 is adhered to the frame 200, it may be a strip mask shape with a protrusion for clamping on both sides, the mask After 100 is bonded to the frame 200, the protrusion can be removed.

A plurality of mask patterns P are formed on each mask 100, and one unit C may be formed in one mask 100. One mask unit C may correspond to one display of a smartphone or the like. The mask 100 may be formed in an electroforming manner so as to be able to be formed in a thin thickness. The mask 100 may be an invar with a thermal expansion coefficient of about 1.0×10 ⁻⁶ /°C or a super invar material with a thermal expansion of about 1.0×10 ⁻⁷ /°C. Since the thermal expansion coefficient of the mask 100 of this material is very low, the pattern shape of the mask is less likely to be deformed by thermal energy, and it can be used as a FMM (Fine Metal Mask) or shadow mask in the manufacture of high-resolution OLEDs. Shadow Mask). In addition, considering the recently developed technology for implementing the pixel deposition process within a range where the temperature change value is not large, the mask 100 may also be a material such as nickel (Ni), nickel-cobalt (Ni-Co) with a slightly larger thermal expansion coefficient . The thickness of the mask may be 2 μm to 50 μm.

The frame 200 is formed in a form capable of bonding a plurality of masks 100. Including the most peripheral edge, the frame 200 may include a plurality of corners formed along the first direction (eg, lateral direction) and the second direction (eg, vertical direction). Such multiple corners may define an area on the frame 200 for bonding the mask 100.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape or a square shape. The inside of the edge frame part 210 may have a hollow shape. That is, the edge frame part 210 may include the hollow region R. The frame 200 may be formed of metal materials such as constant steel, super constant steel, aluminum, titanium, etc. In consideration of thermal deformation, it is preferably made of constant steel, super constant steel, nickel, nickel-cobalt with the same thermal expansion coefficient as the mask These materials can be applied to all of the edge frame portion 210 and the mask unit sheet portion 220 that are constituent elements of the frame 200.

In addition, the frame 200 is provided with a plurality of mask unit regions CR, and may include the mask unit sheet portion 220 connected to the edge frame portion 210. The mask unit sheet portion 220 is the same as the mask 100, and can be formed by electroforming or by using another film forming process. In addition, the mask unit sheet portion 220 can be connected to the edge frame portion 210 after forming a plurality of mask unit regions CR on a planar sheet by laser scribing, etching, or the like. Alternatively, the mask unit sheet portion 220 may form a plurality of mask unit regions CR by laser scribing, etching, or the like after connecting a planar sheet to the edge frame portion 210. In this specification, the case where the plurality of mask unit regions CR are first formed in the mask unit sheet portion 220 and then connected to the edge frame portion 210 will be described.

The mask unit sheet portion 220 may include at least one of an edge sheet portion 221, a first grid sheet portion 223, and a second grid sheet portion 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 refer to portions divided on the same sheet, and they are formed integrally with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have a substantially square shape or a square shape corresponding to the edge frame portion 210.

In addition, the first grid sheet portion 223 may be formed to extend along the first direction (lateral direction). The first grid sheet portion 223 is formed in a straight line shape, and both ends thereof may be connected to the edge sheet portion 221. When the mask unit sheet portion 220 includes a plurality of first grid sheet portions 223, each first grid sheet portion 223 preferably has the same pitch.

In addition, further, the second grid sheet portion 225 may be formed to extend along the second direction (vertical direction), the second grid sheet portion 225 is formed in a linear form, and both ends thereof may be connected to the edge sheet portion 221 . The first grid sheet portion 223 and the second grid sheet portion 225 may cross each other perpendicularly. When the mask unit sheet portion 220 includes a plurality of second grid sheet portions 225, each second grid sheet portion 225 preferably has the same pitch.

On the other hand, according to the size of the mask unit C, the pitch between the first grid sheet portions 223 and the pitch between the second grid sheet portions 225 may be the same or different.

Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, the shape of the cross section perpendicular to the longitudinal direction may be such as a rectangular shape, a quadrangular shape of a parallelogram, a triangular shape, etc. Part of the sides and corners can be rounded. The cross-sectional shape can be adjusted during laser scribing, etching, etc.

The thickness of the edge frame part 210 may be greater than the thickness of the mask unit sheet part 220. Since the edge frame part 210 is responsible for the overall rigidity of the frame 200, it may be formed with a thickness of several mm to several tens of cm.

For the mask unit sheet portion 220, the process of manufacturing a thick sheet is substantially difficult. If it is too thick, the organic matter source 600 (see FIG. 14) may block the path through the mask 100 in the OLED pixel deposition process . On the contrary, if it is too thin, it may be difficult to ensure sufficient rigidity to support the mask 100. Thus, the mask unit sheet portion 220 is preferably thinner than the thickness of the edge frame portion 210, but thicker than the mask 100. The thickness of the mask unit sheet portion 220 may be about 0.1 mm to 1 mm. In addition, the width of the first grid sheet portion 223 and the second grid sheet portion 225 may be approximately 1 to 5 mm.

In the planar sheet, in addition to the area occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225, a plurality of mask unit regions CR (CR11 to CR56) may be provided . From another perspective, the mask unit region CR may refer to the hollow region R of the edge frame portion 210 except for the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 A blank area outside the occupied area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be substantially used as a channel for depositing pixels of the OLED through the mask pattern P. As described above, one mask unit C corresponds to one display such as a smartphone. A mask pattern P for constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 includes a plurality of cells C and each cell C can correspond to each cell region CR of the frame 200, but in order to accurately align the mask 100, it is necessary to avoid a large-area mask 100, preferably one unit C's small area mask 100. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the mask 200. At this time, for accurate alignment, it may be considered that the mask 100 having 2-3 minority cells C corresponds to one cell region CR of the mask 200.

The mask 200 includes a plurality of mask unit regions CR, and each mask 100 can be bonded in such a manner that each mask unit C corresponds to each mask unit region CR. Each mask 100 may include a mask unit C in which a plurality of mask patterns P are formed, and a virtual portion around the mask unit C (equivalent to a portion of the mask film 110 other than the unit C). The dummy part may include only the mask film 110, or may include the mask film 110 formed with a prescribed dummy pattern in a form similar to the mask pattern P. The mask unit C corresponds to the mask unit region CR of the frame 200, and part or all of the virtual part may be adhered to the frame 200 (mask unit sheet part 220). Thus, the cover 100 and the frame 200 can form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured by adhering the mask unit sheet portion 220 to the edge frame portion 210, but may be formed directly in the hollow region R portion of the edge frame portion 210 with the edge frame The part 210 becomes a frame of an integrated grid frame (corresponding to the grid sheet parts 223, 225). The frame of this form also includes at least one mask unit region CR, and the mask 100 can be made to correspond to the mask unit region CR to manufacture a frame-integrated mask.

Hereinafter, the manufacturing process of the frame-integrated mask will be described.

First, the frame 200 described in FIGS. 4 and 5 may be provided. FIG. 6 is a schematic diagram showing the manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, an edge frame portion 210 is provided. The edge frame part 210 may have a box shape including a hollow region R.

Next, referring to (b) of FIG. 6, the mask unit sheet portion 220 is manufactured. The mask unit sheet portion 220 is manufactured by using electroforming or other film-forming processes to manufacture a planar sheet, and then removing the mask unit region CR by laser scribing, etching, or the like. In this specification, the description will be made by forming a 6×5 mask cell region CR (CR11 to CR56) as an example. There may be five first grid sheet portions 223 and four second grid sheet portions 225.

Second, the mask unit sheet portion 220 may correspond to the edge frame portion 210. In the corresponding process, the edge sheet portion 221 and the edge frame portion 210 may be made in a state where all the side portions of the mask unit sheet portion 220 of F1 to F4 are stretched so that the mask unit sheet portion 220 extends flatly correspond. The mask unit sheet portion 220 may be sandwiched and stretched at a plurality of points (1 to 3 points in the example of (b) in FIG. 6) on one side. On the other hand, the unit sheet portion 220 may be stretched by stretching F1 and F2 along a part of the side direction instead of all the sides.

Then, when the mask unit sheet portion 220 corresponds to the edge frame portion 210, the edge sheet portion 221 of the mask unit sheet portion 220 may be bonded by welding. Preferably, all sides are welded so that the mask unit sheet portion 220 is firmly adhered to the edge frame portion 210. Welding W should be made as close as possible to the corner side of the frame portion 210 to minimize the warping space between the edge frame portion 210 and the mask unit sheet portion 220 and improve the adhesion. The welded W part may be formed in a line or spot shape, have the same material as the mask unit sheet portion 220, and may become an integral unit that connects the edge frame portion 210 and the mask unit sheet portion 220 medium.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of FIG. 6 first manufactures the mask unit sheet portion 220 having the mask unit area CR, and then adheres to the edge frame portion 210, while the embodiment of FIG. 7 adheres the planar sheet to the edge frame portion 210 To form the CR area of the mask unit area.

First, the edge frame portion 210 including the hollow region R is provided in the same manner as in (a) of FIG. 6.

Then, referring to (a) of FIG. 7, a planar sheet (planar mask unit sheet portion 220 ′) may correspond to the edge frame portion 210. The mask unit sheet portion 220' is a planar state where the mask unit region CR has not yet been formed. In the corresponding process, all the side portions of the mask unit sheet portion 220' of F1 to F4 may be stretched to correspond to the edge frame section 210 in a state where the mask unit sheet portion 220' is extended flatly. On one side, the unit sheet portion 220' can be sandwiched and stretched at a plurality of points (1 to 3 points as an example in (a) of FIG. 7). On the other hand, the unit sheet portion 220' may be stretched by extending F1 and F2 along a part of the side direction instead of all sides.

Then, when the mask unit sheet portion 220' corresponds to the edge frame portion 210, the edge portion of the mask unit sheet portion 220' may be bonded by welding W. Preferably, all sides are welded so that the mask unit sheet portion 220' is firmly adhered to the edge frame portion 220. Welding W should be performed as close as possible to the corner side of the edge frame portion 210 to minimize the warping space between the edge frame portion 210 and the mask unit sheet portion 220', and to improve adhesion. The welded W part may be formed in a line or spot shape, and has the same material as the mask unit sheet portion 220', and may be formed by connecting the edge frame portion 210 and the mask unit sheet portion 220' together Medium.

Then, referring to (b) of FIG. 7, a mask unit region CR is formed on a planar sheet (planar mask unit sheet portion 220'). The mask unit region CR can be formed by removing a sheet of the mask unit region CR by laser scribing, etching, or the like. In this specification, the description will be made by forming a 6×5 mask cell region CR (CR11 to CR56) as an example. When the mask unit region CR is formed, the mask unit sheet portion 220 may be constituted, in which the portion W welded to the edge frame portion 210 becomes the edge sheet portion 221 and includes five first grid sheet portions 223 and Four second grid sheet sections 225.

FIG. 8 is a schematic diagram showing the components of the transfer system of the mask 100 according to an embodiment of the present invention. 8( a) is a plan view and a side cross-sectional view of the mask 100, and FIG. 8( b) is a plan view and a side cross-sectional view of the mask mounting portion 90. The mask loading part 90 as the transfer system of the mask 100 may refer to a system that transfers the mask 100 to the frame 200 before the mask 100 corresponds to and adheres to the frame 200.

Referring to (a) of FIG. 8, a mask 100 formed with a plurality of mask patterns P may be provided. The mask 100 may include a mask unit C formed with a plurality of mask patterns P and a dummy part DM around the mask unit C. The dummy part DM partially corresponds to the mask film 110 except the cell C, and may include only the mask film 110 or may include the mask film 110 formed with a predetermined dummy part pattern similar to the shape of the mask pattern P. Corresponding to the edge of the mask 100, part or all of the virtual part DM may be adhered to the frame 200 [mask unit sheet part 220]. The mask 100 of Hengfan Steel and Ultra Hengfan Steel materials can be manufactured by electroforming.

In electroforming, a conductive material is used for the mother plate used as a cathode. As a conductive material, metal can generate metal oxides on the surface, impurities can flow into the metal manufacturing process, polysilicon substrates can contain inclusions or grain boundaries (Grain Boundary), conductive polymer substrates may contain impurities High performance, and may be weak in strength and acid resistance. Elements such as metal oxides, impurities, inclusions, and grain boundaries that hinder the uniform formation of an electric field on the surface of the motherboard (or cathode) are called "defects." Due to defects, a uniform electric field cannot be applied to the cathode of the above-mentioned material, which may result in uneven formation of a part of the plating film (mask 100).

In ultra-high-quality pixels that achieve UHD level or higher, the unevenness of the coating and the coating pattern (mask pattern P) may adversely affect the formation of pixels. For example, the current QHD image quality is 500~600 PPI (pixel per inch), the pixel size reaches about 30~50㎛, 4K UHD, 8K UHD high image quality has higher than the former ~860 PPI, ~1600 PPI Resolution. Directly applicable to micro-displays on VR machines or micro-displays used when plugged into VR machines, the ultra-high image quality of about 2000 PPI or higher is targeted, and the pixel size is about 5~10㎛. The pattern width of the FMM and the shadow mask can be formed to a size of several μm to several tens of μm, preferably a size smaller than 30 μm. Therefore, defects with a size of several μm also occupy a large proportion of the pattern size of the mask. In addition, in order to remove the defects of the cathode of the above-mentioned material, an additional process for removing metal oxides, impurities, etc. may be performed, and in this process, other defects such as etching of the cathode material may be caused.

Therefore, the present invention can use a mother substrate (or cathode) of single crystal material. In particular, it is preferably a single crystal silicon material. The mother board of single crystal silicon material can be doped with a high concentration of 10 ¹⁹ /cm ³ or more in order to have conductivity. The doping may be performed on the entire mother board or only on the surface part of the mother board.

In addition, single crystal materials can use metals such as Ti, Cu, Ag; GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge and other semiconductors; graphite (graphite), graphene (graphene) and other carbon materials; including CH ₃ superconductor _{NH 3 PbCl 3, CH 3 NH} 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. perovskite (Transition of perovskite) single crystal ceramic structure; aircraft parts and the like with the single crystal superalloy. Metal and carbon materials are basically conductive materials. In the case of semiconductor materials, in order to have conductivity, a high concentration doping of 10 ¹⁹ or more can be performed. Other materials can form conductivity by performing doping or forming oxygen vacancy. The doping may be performed on the entire motherboard or only on the surface portion of the motherboard.

Since the single crystal material has no defects, a uniform electric field is formed on the entire surface during electroforming, so a uniform plating film (mask 100) is generated. The frame-integrated masks 100 and 200 manufactured by uniform coating can further improve the image quality of OLED pixels. Moreover, since there is no need to perform additional processes for removing and eliminating defects, it is possible to reduce process costs and improve productivity.

In addition, if it is a single crystal material that can form an insulating film on the surface by silicon material or by oxidation (Oxidation), nitridation (Nitridation), it can be formed only by the surface oxidation and nitridation process of the motherboard as needed Advantages of insulation. The insulating portion may be formed using photoresist. In the portion where the insulating portion is formed, electrodeposition of the plating film (mask 100) is prevented, and a pattern (mask pattern P) is formed on the plating film.

In addition, as long as the material of the mother board of the present invention is within the range of reducing the defects of the cathode, it is not necessarily limited to the above single crystal material, and it is specifically stated.

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 2-50 μm. Since the frame 200 includes a plurality of mask unit regions CR (CR11 to CR56), a plurality of masks having mask units C (C11 to 56) corresponding to the respective mask unit regions CR (CR11 to CR56) may be formed. Hood 100.

Referring to (b) of FIG. 8, the present invention can provide a mask loading portion 90. The mask loading part 90 may provide a space for loading the mask 100 so that the manufactured mask 100 is unfolded flat and loaded into the space before moving toward the frame 200. The mask loading part 90 is preferably in the shape of a flat plate, so that the mask 100 is flatly loaded inside. The mask loading part 90 may have a large flat plate shape with a size larger than that of the mask 100 so that the mask 100 as a whole is loaded flat.

In order to maintain the flat state without wrinkles on the mask 100 when the mask 100 is mounted or after the mask 100 is mounted, the mask mounting portion 90 may attract one side of the mask 100. A plurality of vacuum holes VH (vacuum holes) may be formed on one surface of the mask mounting portion 90 corresponding to the mask 100 so that the mask mounting portion 90 attracts the side of the mask 100. The mask loading part 90 is connected to an external extraction means (not shown), whereby the air inside the mask loading part 90 can be extracted and the suction pressure can be transmitted to the vacuum hole VH. Based on the suction pressure of the plurality of vacuum holes VH, the mask 100 can be completely attracted to the mask loading portion 90.

The corner portion of the mask loading portion 90 may be formed with a concave portion 91. Considering the quadrangular mask mounting portion 90, the four corners may be formed with recessed portions 91, respectively. When the mask 100 is mounted on the mask mounting portion 90, a part of the mask 100 protrudes and is exposed to the outside of the recessed portion 91. Thereby, the protruding and exposed portion can be used to spread the mask 100 flat or clamped by clamping means (not shown).

In addition, the mask mount 90 may be opaque to laser L light. Accordingly, the mask mounting portion 90 of the present invention is characterized in that the laser through hole 93 is formed thereon, so that the laser light irradiated from the upper portion of the mask mounting portion 90 can reach the welding portion of the mask 100.

Referring again to FIG. 8( b ), the laser through hole 93 may be formed in the mask mounting portion 90 according to the position and the number of welded portions. A plurality of welded portions may be arranged on the edge of the mask 100 or a portion of the dummy portion DM at a predetermined interval. Therefore, a plurality of laser through holes 93 may be formed at a predetermined interval corresponding thereto. As an example, the welding part is arranged at predetermined intervals on the virtual parts DM on both sides (left/right) of the mask 100, so the laser through holes 93 may be on both sides (left/right) of the mask mounting part 90 A plurality is formed at predetermined intervals.

The laser through holes 93 do not necessarily correspond to the position and number of welded parts. For example, only a part of the laser penetration hole 93 may be irradiated with laser L to perform welding. In addition, a part of the laser through holes 93 that do not correspond to the welded portion may be used instead of a vacuum hole as a passage through which vacuum suction pressure is applied to the mask 100 in contact with one side of the mask mounting portion 90. In addition, a part of the laser through hole 93 that does not correspond to the welded portion may be used instead of the alignment mark (ALIGN MARK) when the mask 100 and the mask mounting portion 90 are aligned. If the material of the mask mount 90 is transparent to laser L light, the laser through hole 93 may not be formed.

The mask loading unit 90 may be connected to the transfer unit 92. The transfer portion 92 may be connected to the other surface of the mask loading portion 90 that is in contact with the mask 100 and is opposite to the other surface. In FIG. 8( b ), in order to stably support the mask loading part 90, the transfer part 92 is preferably connected to the lower surface of the mask loading part 90.

The transfer unit 92 may be connected to a moving means (not shown) such as a guide rail and a conveyor belt to move to the X, Y, Z, and θ axes. In addition, a rotation shaft for flipping the mask mount 90 is also connected to the transfer unit 92. Alternatively, the housing of the mask loading part 90 communicates with the transfer part 92, and the transfer part 92 is connected to an external suction means (not shown) to apply suction pressure to the inside of the mask loading part 90 and transfer it to Vacuum hole VH.

The following describes a series of processes for processing the mask 100 in the mask transfer system.

9 is a schematic diagram showing a state in which the vacuum transfer unit 60 according to an embodiment of the present invention sucks the mask 100.

Referring to FIG. 9, the vacuum transfer unit 60 can attract the mask 100 side. After the vacuum transfer unit 60 sucks the mask 100, the mask 100 is pulled outward, so that the mask 100 can be spread out flatly.

The manufactured mask 100 can be mounted on the frame 200 in a flat and unfolded state and bonded. At this time, during the movement of the mask 100, since the mask 100 is a thin film with a thickness of about 2㎛~50㎛, wrinkles may be generated when a slight force is applied, so special care should be taken during storage. In addition, since a plurality of fine mask patterns P are formed on the mask 100, in order not to disturb the alignment of the mask patterns P, the mask 100 should be spread out flat without wrinkles. In order to move the mask 100 in an unfolded state, if the two sides of the mask 100 are clamped with a jig, the mask 100 is damaged, and it is difficult to load the frame 200 by clamping the two sides of the mask 100. In addition, it is also very difficult to hold the mask 100 with a jig to align the mask pattern P without error, and to move the mask 100 flat and load it on the frame 200.

With this, the vacuum transfer unit 60 can perform suction by the vacuum V on the side of the mask 100. At this time, the suction based on the vacuum V does not mean that the surrounding environment of the mask 100 is turned into a vacuum and is suctioned, but it should be understood that the air is drawn outward along the internal air flow channel 63 of the vacuum transfer part 60 to generate a suction force, so that The mask 100 is attracted to the vacuum transfer unit 60.

The vacuum transfer part 60 includes a housing 61, and an air flow path 63 may be provided inside the housing 61. One end of the housing 61 is in contact with the side of the cover 100, and the other end can be connected to an external extraction means (not shown). An extraction means (not shown) such as a pump extracts air from the airflow passage 63 inside the casing 61, thereby turning the inside of the casing 61 into a vacuum atmosphere. With this, the mask 100 in contact with one end of the housing 61 can be attracted by the vacuum transfer unit 60.

A porous portion 65 may be arranged at one end of the housing 61. The porous portion 65 may be composed of a porous material including extremely small pores. If the vacuum transfer part 60 absorbs the mask 100 through a hole or a slit, the size of the hole and the slit is large and the adsorption force on the formation area of the hole and the slit is not uniform, which may give a part of the mask 100 Bring pressure. Therefore, if a vacuum is applied between the pores of the porous portion 65, a uniform adsorption force is generated on the surface of the porous portion 65, whereby the mask 100 can be stably adsorbed and moved.

The vacuum transfer part 60 can attract at least two sides of the mask 100. For example, the left side and the right side of the mask 100 can be attracted, and the top, bottom, left, and right sides of the mask 100 can also be attracted. As an example, FIG. 9( a) shows an example in which the two vacuum transfer sections 60 attract the left and right sides of the mask 100 to pull the mask 100 in the left and right directions. As another example, FIG. 9( b) shows an example in which the four vacuum transfer parts 60 ′ suck the four corners of the mask 100 to pull the mask 100 in the left, right, upper, and lower directions. However, it is not limited to this, and the number of vacuum transfer parts 60 may be determined based on the pulling direction, movement, and the like of the mask 100. The vacuum transfer unit 60 may be connected to a moving means (not shown) such as a guide rail or a conveyor belt that moves the X, Y, Z, and θ axes to pull the mask 100 or attract the mask 100 and move it. The following description assumes the form of (b) of FIG. 8.

FIG. 10 is a schematic diagram showing an operation procedure of a mask transfer system according to an embodiment of the present invention.

Referring to (a) of FIG. 10, the vacuum transfer unit 60 can attract the mask 100 and move it to the mask loading unit 90. The four corners of the mask 100 are sucked by the vacuum transfer section 60 and loaded on the mask loading section 90 in a flatly spread state. Alternatively, the vacuum transfer unit 60 may flatten the mask 100 while the mask 100 is mounted on the mask mounting unit 90.

Next, the vacuum hole VH in the mask mount 90 applies suction pressure to the mask 100 to attract the mask 100 to the mask mount 90. Alternatively, the vacuum transfer unit 60 may apply suction pressure to the mask 100 through the vacuum hole VH while the mask 100 is moved to the mask mounting unit 90.

In addition, when the vacuum transfer unit 60 is not used, for example, the corner of the mask 100 may be clamped with a jig (not shown) and moved to the mask mounting unit 90, and then the mask 100 may be unfolded at the same time. The suction pressure is applied to the vacuum hole VH of the mask mounting part 90, thereby attracting the mask 100. Since the corner portion of the mask mounting portion 90 is formed with a recessed portion 91, even if the jig clamps both sides of the corner portion of the mask 100, the mask mounting portion 90 will not be disturbed.

The mask mounting portion 90 may be mounted in a state where the welding portion of the mask 100 corresponds to the laser through hole 93 of the mask mounting portion 90. When the mask 100 is mounted on the mask mounting portion 90, at least the corners of the mask 100 will protrude out of the recessed portion 91 and be exposed.

Then, referring to (b) of FIG. 10, the mask 100 can be flipped. The transfer section 92 moves the mask loading section 90 onto the frame 200 and reverses the mask loading section 90. Therefore, the mask 100 attracted to the mask mount 90 is also reversed. Alternatively, the transfer unit 92 may move the mask loading unit 90 onto the frame 200 with the mask loading unit 90 turned over. The suction pressure applied to the mask 100 by the vacuum hole VH of the mask mount 90 can be maintained, so that even if the mask 100 is turned over, the alignment state on the mask mount 90 is not disturbed and can be in close contact.

Then, the mask 100 can be transferred to the frame 200 area while being sucked and supported by the mask loading portion 90.

Hereinafter, a series of processes in which the mask 100 corresponds to the frame 200 and is aligned and bonded will be described.

FIG. 11 is a schematic diagram showing a state in which the mask loading unit 90 is mounted on the frame so that the mask 100 corresponds to the unit region CR of the frame 200 according to an embodiment of the present invention.

Then, referring to (a) and (b) of FIG. 11, the mask 100 may correspond to one mask unit region CR of the frame 200. The mask mounting portion 90 that adsorbs and supports the mask 100 can be mounted on the frame 200 [or the mask unit sheet portion 220 ], so that the mask 100 corresponds to the mask unit area CR. Before the mask loading unit 90 is mounted on the frame 200, the position of the mask loading unit 90 and the mask 100 is controlled by the transfer unit 92, thereby aligning the mask 100 in the mask unit region CR. Since the mask loading part 90 is turned so that the mask 100 faces downward, if the mask loading part 90 is loaded on the frame 200 [or the mask unit sheet part 220], the mask 100 will be arranged to the mask loading part Between the frame 90 and the frame 200 [or the mask unit sheet part 220], the mask loading part 90 is pressed at the same time.

On the other hand, the lower support 70 may also be arranged below the frame 200. The lower support 70 has a size that can enter the inside of the hollow region R of the frame edge portion 210 and has a flat shape. Furthermore, a predetermined support groove (not shown) corresponding to the shape of the mask unit sheet portion 220 may be formed on the upper surface of the lower support 70. At this time, the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 are inserted into the support grooves, so that the mask unit sheet portion 220 is better fixed.

The lower support 70 may press the opposite surface of the mask unit region CR that is in contact with the mask 100. That is, the lower support 70 supports the mask unit sheet portion 220 in the upper direction, thereby preventing the mask unit sheet portion 220 from sagging downward when the mask 100 is bonded. At the same time, the lower support 70 and the mask mounting portion 90 press the edge portion of the mask 100 and the frame 200 [or the mask unit sheet portion 220] in opposite directions, so the alignment state of the mask 100 is not destroyed And keep it aligned.

In this way, only by attaching the mask 100 to the mask loading part 90 and loading the mask loading part 90 on the frame 200 can the process of matching the mask 100 and the mask unit region CR of the frame 200 be completed. The mask 100 does not apply any stretching force.

Next, the mask 100 is irradiated with laser light L, so that the mask 100 is bonded to the frame 200 by laser welding. The laser L can be irradiated to the welding portion of the mask 100 through the laser through hole 93 of the mask mounting portion 90. The welding portion of the mask 100 may refer to a target area where the laser L is irradiated to form a welding bead WB. The welded portion may correspond to an edge of the mask 100 or at least a part of the DM portion of the dummy portion. The welding portion of the mask welded by the laser generates a welding bead WB. The welding bead WB may have the same material as the mask 100/frame 200 and be integrated with the mask 100/frame 200.

Referring again to FIG. 11, since the mask unit sheet portion 220 of the frame 200 has a thin thickness, when the mask unit 100 is adhered to the mask unit sheet portion 220 with a tensile force applied thereto, the mask 100 remains in the mask 100 Of tensile force acts on the mask unit sheet portion 220 and the mask unit region CR, and they may be deformed. Therefore, the mask 100 should be adhered to the mask unit sheet portion 220 in a state where no stretching force is applied to the mask 100. Thereby, it is possible to prevent the frame 200 (or the mask unit sheet portion 220) from being deformed due to the tensile force applied to the mask 100 acting on the frame 200 as a tension in reverse.

However, the mask 100 is adhered to the frame 200 (or the mask unit sheet portion 220) in a state where no tensile force is applied to manufacture a frame-integrated mask, and the frame-integrated mask is applied During the pixel deposition process, a problem may occur. In the pixel deposition process performed at a temperature of about 25 to 45° C., the mask 100 thermally expands by a predetermined length. Even for the mask 100 of Hengfan steel material, as the temperature for forming the pixel deposition process environment is increased by about 10°C, a length change of about 1 to 3 ppm will occur. For example, when the total length of the mask 100 is 500 mm, the length will increase by about 5-15 μm. In this way, the mask 100 sags due to its own weight or is pulled down while being fixed to the frame 200 to cause distortion such as twisting, and at the same time, the alignment error of the pattern P becomes large.

Therefore, the present invention is characterized in that, at a temperature higher than normal temperature rather than normal temperature, the mask 100 corresponds to and adheres to the mask unit region CR of the frame 200 in a state where no tensile force is applied to the mask 100. In this specification, it is expressed that after raising the temperature of the process area to the first temperature ET, the mask 100 corresponds to the frame 200.

The “process area” refers to a space in which components such as the mask 100 and the frame 200 are arranged and the bonding process of the mask 100 is performed. The process area can be a space in a closed chamber or an open space. It may also refer to only the peripheral space of the workbench portion (not shown) that performs the process of bonding the mask 100 to the frame 200. In addition, the “first temperature” may refer to a temperature higher than or equal to the temperature of the pixel deposition process when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the temperature of the pixel deposition process is about 25~45°C, the first temperature may be about 25°C to 60°C. The temperature of the process area can be increased by installing a heating device in the chamber or a heating device around the process area.

Referring again to FIG. 11, after raising the temperature of the process area including the frame 200 to the first temperature ET, the mask 100 may correspond to the mask unit area CR. Alternatively, after the mask 100 corresponds to the mask unit area CR, the temperature of the process area including the frame 200 is raised to the first temperature ET. Alternatively, although only one mask 100 and one mask unit region CR are shown in the drawing, it is also possible to make each mask 100 correspond to each mask unit region CR, and then raise the temperature of the process area to the first One temperature ET.

The existing mask 10 of FIG. 1 includes six cells C1 to C6, and thus has a long length, and the mask 100 of the present invention includes one cell C, and thus has a short length, so PPA (pixel position accuracy) is distorted The degree will become smaller. Assuming that the length of the mask 10 including a plurality of cells C1 to C6, is 1 m, and a PPA error of 10 μm occurs in the total length of 1 m, the mask 100 of the present invention can be reduced with the relative length (equivalent to a cell The number of C decreases) and the above error range is 1/n. For example, the length of the mask 100 of the present invention is 100 mm, it has a length reduced from 1 m of the existing mask 10 to 1/10, so a PPA error of 1 μm occurs in the total length of 100 mm, which significantly reduces the alignment error .

On the other hand, the mask 100 includes a plurality of cells C, and even if each cell C corresponds to each cell region CR of the frame 200, the alignment error is still within a minimum range, the mask 100 may also be The mask unit area CR corresponds. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. In this case, considering the process time and productivity based on the alignment, the mask 100 is preferably provided with as few cells C as possible.

In the present invention, since it is only necessary to match one unit C of the mask 100 and confirm the alignment state, compared with the existing method of simultaneously matching a plurality of units C (C1 to C6) and needing to confirm all alignment states, Can significantly reduce manufacturing time.

That is, the manufacturing method of the frame-integrated mask of the present invention can significantly shorten the time compared with the conventional method. In the conventional method, the cells C11 to C16 included in the six masks 100 are respectively connected to one cell region CR11 to CR16 6 processes corresponding to and confirming each alignment state, matching 6 cells C1~C6 at the same time, and it is necessary to confirm the alignment state of 6 cells C1~C6 at the same time.

In addition, in the manufacturing method of the frame-integrated mask of the present invention, the product yield in the process of making 30 masks 100 corresponding to and aligning 30 unit regions CR (CR11 to CR56) with 30 times respectively, will It is significantly higher than the yield of the existing product in the process of five times of aligning and aligning the five masks 10 (refer to (a) of FIG. 2) including the six cells C1 to C6 with the frame 20 respectively. Since the existing method of aligning 6 cells C1 to C6 in the area corresponding to 6 cells C at a time is obviously cumbersome and difficult work, the product yield is low.

On the other hand, after matching the mask 100 to the frame 200, the mask 100 may be temporarily fixed to the frame 200 with a predetermined adhesive. Then, the bonding step of the mask 100 may be performed.

Moreover, according to an embodiment, before the mask 100 corresponds to the frame 200, the mask 100 may be preheated to make its temperature higher than the first temperature. Referring again to FIG. 8( b ), the mask loading part 90 may further include a heating part 95. In step (a) of FIG. 10, when the mask 100 is mounted on the mask mounting part 90, the heating part 95 of the mask mounting part 90 preheats the mask 100 to a temperature higher than the first temperature, for example, The mask 100 is preheated to a temperature about 3°C to 10°C higher than the first temperature.

Immediately raising the mask 100 to the first temperature and corresponding it to the frame 200, the flat mask 100 is stretched and its surface has minute wrinkles, bends, etc. of nm or ㎛ level, so the mask It is difficult to perform alignment before the 100 is adhered to the frame 200. Even if the mask 100 is adhered to the frame 200 after the alignment, there may be an alignment error between the mask pattern P and the unit C.

With this, if the operation of the heating unit 95 is stopped before the mask mounting unit 90 warms up the mask 100 and before the mask 100 contacts the frame 200, the mask 100 is contacted with the mask mounting unit 90 while being adsorbed and supported When the frame 200, or when entering the process area of the first temperature, the mask 100 is lowered by about 3°C to 10°C to become the first temperature, and the mask 100 is subjected to contraction tension due to a predetermined contraction.

Due to this, the mask 100 is kept flat and unfolded without wrinkles, bends, or the like. Since the temperature drops slightly by about 3°C to about 10°C, the degree of deformation of the mask 100 does not affect the alignment of the mask pattern P and the cell C, and only contraction that only spreads the mask 100 flatly occurs.

Then, the flat spread mask 100 and the frame 200 can be completely aligned. Next, at least a part of the edge of the mask 100 may be adhered to the frame 200. The bonding can preferably be performed by laser welding. Laser welding should be performed as close as possible to the corner side of the frame 200 in order to minimize the warping space between the frame 200 and the cover 100 and improve the adhesion. The welding part of the mask that has been laser-welded generates welding beads WB, and the welding beads WB have the same material as the mask 100/frame 200 and can be integrally connected with the mask 100/frame 200.

The present invention can weld the mask unit sheet portion 220 without applying tensile force to the mask 100, so the mask unit sheet portion 220 [or the edge sheet portion 221, the first grid The sheet portion 223 and the second grid sheet portion 225] apply tension.

FIG. 12 is a schematic diagram showing a process of sequentially bonding the mask 100 to the cell region CR according to an embodiment of the present invention.

After one mask 100 is adhered to the frame 200, the process of making the remaining mask 100 correspond to the remaining mask units C in sequence and adhere to the frame 200 may be repeated. In the process of making the remaining masks 100 correspond to the remaining mask units C in sequence and bonding, the temperature of the process area can be controlled at the first temperature and the second temperature. Since the mask 100 that has been bonded to the frame 200 can provide a reference position, it is possible to significantly shorten the time in the process of sequentially associating the remaining masks 100 with the cell regions CR and confirming the alignment state. Moreover, the PPA (pixel position accuracy) between the mask 100 adhered to one mask unit area and the mask 100 adhered to the adjacent mask unit area does not exceed 3 μm, so it can provide ultra-high-definition OLEDs with accurate alignment A mask for pixel formation.

FIG. 13 is a schematic diagram showing a process of lowering the temperature LT of the process area after bonding the mask 100 to the unit area CR of the frame 200 according to an embodiment of the present invention.

Then referring to FIG. 13, the temperature of the process area may be reduced to the second temperature LT. "Second temperature" refers to a temperature lower than the first temperature. Considering that the first temperature is about 25°C to 60°C, and on the premise of being lower than the first temperature, the second temperature may be about 20°C to 30°C, preferably, the second temperature may be normal temperature. The temperature of the process area can be reduced by installing a cooling device in the chamber, a cooling device around the process area, or a natural cooling method at room temperature.

When the temperature of the process area is reduced to the second temperature LT, the mask 100 may be thermally contracted by a prescribed length. The mask 100 can be thermally contracted isotropically along all lateral directions. However, since the mask 100 is fixedly connected to the frame 200 [or the mask unit sheet portion 220] by welding, the thermal shrinkage of the mask 100 spontaneously applies tension TS to the surrounding mask unit sheet portion 220. Since the mask 100 spontaneously applies tension, the mask 100 can be more closely adhered to the frame 200.

In addition, after all the masks 100 are all bonded to the corresponding mask unit area CR, the temperature of the process area is reduced to the second temperature LT, so that all the masks 100 are thermally contracted at the same time, thereby preventing the frame 200 from being deformed or the pattern P The alignment error becomes larger. More specifically, even if the tension TS is applied to the mask unit sheet portion 220, the plurality of masks 100 apply the tension TS in the opposite direction, so that the force is offset, and the mask unit sheet portion 220 is not deformed. For example, in the first grid sheet portion 223 between the mask 100 attached to the CR11 unit area and the mask 100 attached to the CR12 unit area, the first grid sheet portion 223 acts on the right side of the mask 100 attached to the CR11 unit area The tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell area cancel each other. Thereby, the deformation of the frame 200 [or the mask unit sheet portion 220] based on the tension TS is minimized, and the alignment error of the mask 100 [or mask pattern P] can be minimized.

FIG. 14 is a schematic diagram showing an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 14, the OLED pixel deposition apparatus 1000 includes: a magnetic plate 300 which houses a magnet 310 and cooling water pipes 350 are arranged; and a deposition source supply part 500 which supplies an organic matter source 600 from the lower part of the magnetic plate 300.

A target substrate 900 such as glass for depositing the organic matter source 600 may be interposed between the magnetic plate 300 and the deposition source supply part 500. The target substrate 900 may be provided with frame-integrated masks 100, 200 [or FMM] for depositing the organic matter source 600 in different pixels in a close or very close manner. The magnet 310 can generate a magnetic field and adhere to the target substrate 900 by the magnetic field.

The deposition source supply part 500 can travel back and forth and supply the organic matter source 600, and the organic source 600 supplied by the deposition source supply part 500 can be deposited on one side of the target substrate 900 through the pattern P formed on the frame-integrated masks 100, 200 . The organic matter source 600 deposited after the pattern P of the frame-integrated masks 100 and 200 can be used as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixel 700 due to the shadow effect, the pattern of the frame-integrated masks 100, 200 may be formed obliquely [or formed in a tapered S]. The organic matter source 600 passing the pattern in the diagonal direction along the inclined surface can also contribute to the formation of the pixel 700, and therefore, the pixel 700 can be deposited with a uniform thickness as a whole.

At a first temperature that is higher than the temperature of the pixel deposition process, the mask 100 is adhered and fixed to the frame 200, so even if it is raised to the temperature used for the pixel deposition process, it hardly affects the position of the mask pattern P. The mask 100 The PPA with the adjacent mask 100 can be maintained to not exceed 3 μm.

As described above, the present invention lists preferred embodiments for illustration and description, but it is not limited to the above-mentioned embodiments, and various modifications and changes can be made by those having ordinary knowledge in the technical field without departing from the spirit of the present invention. Such modifications and changes fall within the scope of the present invention and the attached patent application.

10: Mask 11: Mask film 20: Frame 60, 60’: Vacuum transfer section 61: Shell 63: Airflow channel 65: porous part 70: lower support 90: mask loading section 91: Depression 92: Transfer Department 93: Laser through hole 95: Heating Department 100: mask 110: mask film 200: frame 210: Edge frame part 220, 220’: Sheet unit of mask unit 221: Edge sheet section 223: First grid sheet section 225: Second grid sheet section 300: magnetic board 310: magnet 350: cooling water pipe 500: deposition source supply department 600: Organic source 700: pixels 900: target substrate 1000: OLED pixel deposition device C, C1~C6, C11~56: unit, mask unit CR, CR11~CR56: mask unit area D1~D1'', D2~D2'': distance DM: Dummy Department, Mask Dummy Department ET: Raise the temperature of the process area to the first temperature F1~F2: Stretch L: Laser LT: Reduce the temperature of the process area to the second temperature R: Hollow area of the edge frame P: Mask pattern TS: Tension V: Vacuum VH: vacuum hole W: welding WB: Welding welding beads

FIG. 1 is a schematic diagram showing a conventional mask for OLED pixel deposition.

FIG. 2 is a schematic diagram showing a process of bonding a conventional mask to a frame.

FIG. 3 is a schematic diagram showing that an alignment error between cells occurs during a conventional stretching mask.

4 is a front view and a side sectional view showing a frame-integrated mask according to an embodiment of the present invention.

5 is a front view and a side sectional view showing a frame according to an embodiment of the present invention.

6 is a schematic diagram showing a frame manufacturing process according to an embodiment of the present invention.

7 is a schematic diagram showing a frame manufacturing process according to another embodiment of the present invention.

FIG. 8 is a schematic diagram showing components of a mask transfer system according to an embodiment of the present invention.

9 is a schematic diagram showing a state in which a vacuum transfer part according to an embodiment of the present invention sucks a mask.

FIG. 10 is a schematic diagram showing an operation procedure of a mask transfer system according to an embodiment of the present invention.

FIG. 11 is a schematic diagram showing a state in which the mask mounting portion is mounted on the frame and the mask corresponds to the unit area of the frame according to an embodiment of the present invention.

12 is a schematic diagram showing a process of sequentially bonding a mask to a cell area according to an embodiment of the present invention.

13 is a schematic diagram showing a process of reducing the temperature of a process area after bonding a mask to a unit area of a frame according to an embodiment of the present invention.

14 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

60: Vacuum transfer section

90: mask loading section

91: Depression

92: Transfer Department

93: Laser through hole

95: Heating Department

100: mask

C: Unit, mask unit

DM: Dummy Department, Mask Dummy Department

V: Vacuum

VH: vacuum hole

Claims (14)

A mask transfer system is a mask transfer system for loading and moving a mask for forming an OLED pixel of a mask in a process of integrally forming a mask and a frame for supporting the mask, wherein the mask transfer system includes: The mask loading part, which absorbs one side of the mask and can be loaded; and The transfer section moves the mask loading section and flips it. The mask transfer system according to claim 1, wherein the mask loading portion has a flat plate shape, and a plurality of vacuum holes are formed on a surface corresponding to the mask. The mask transfer system according to claim 1, wherein the corner of the mask loading portion is formed with a recessed portion, the area of the mask loading portion is larger than the area of the mask, and if the mask is loaded on the mask loading portion, at least The corner of the mask protrudes to the outside of the recess. The mask transfer system according to claim 1, wherein the mask loading part includes a heating part. The mask transfer system according to claim 1, wherein a laser through hole is formed in a portion of the mask loading portion corresponding to the welding portion of the mask. The mask transfer system according to claim 1, wherein the transfer section is connected to the other side of the mask loading section that is in contact with the mask, and the transfer section moves the mask loading section toward the X, Y, Z, and θ axes , And flip the mask loading part so that the mask faces downward. A method for manufacturing a frame-integrated mask, in which at least one mask is integrated with a frame for supporting the mask, wherein the method includes the following steps: (A) Provide a frame with at least one mask unit area; (B) Attach one side of the mask to the mask loading part and load it; (C) Mount the mask loading part on the frame so that the mask corresponds to the mask unit area of the frame; and (D) Irradiate laser to the welding part of the mask to make the mask stick to the frame. The method for manufacturing a frame-integrated mask according to claim 7, wherein the mask mounting portion has a flat plate shape, and a plurality of vacuum holes (vacuum holes) are formed on a surface corresponding to the mask. In step (b), many A vacuum hole applies suction pressure to one side of the mask to attract the mask to the mask mounting portion. The method for manufacturing a frame-integrated mask according to claim 8, wherein step (b) includes the following steps: (B1) At least two sides of the vacuum suction part suction mask; and (B2) The vacuum transfer unit is moved so that one side of the mask is attracted to the mask loading unit and mounted. The method for manufacturing a frame-integrated mask according to claim 9, wherein in step (b1) or step (b2), the vacuum transfer unit pulls the attracted mask outward to spread the mask flatly. The method for manufacturing a frame-integrated mask according to claim 7, wherein step (c) includes the following steps: (C1) Turn over the mask loading part so that the mask faces downward; (C2) The transfer section controls the position of the mask loading section so that the mask is aligned on the unit area of the frame; and (C3) Mount the mask mounting portion on the frame so that the mask corresponds to the mask unit area of the frame. The method for manufacturing a frame-integrated mask according to claim 7, wherein the temperature of the process area including the frame is raised to the first temperature before or after making the mask correspond to the mask unit area, After the mask is adhered to the frame, the temperature of the process area containing the frame is reduced to the second temperature. The method for manufacturing a frame-integrated mask according to claim 12, wherein the first temperature is equal to or higher than the temperature of the OLED pixel deposition process, the second temperature is at least a temperature lower than the first temperature, and the first temperature is 25°C Any temperature between 60°C and 60°C, the second temperature is lower than the first temperature and between 20°C and 30°C, and the temperature of the OLED pixel deposition process is between 25°C and 45°C. The method for manufacturing a frame-integrated mask according to claim 12, wherein the mask loading section includes a heating section, and between step (b) and step (c), the mask is kept 3°C higher than the first temperature to 10 ℃ temperature.

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