KR102241770B1 - Producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a method of manufacturing a frame-integrated mask. A method of manufacturing a frame-integrated mask according to the present invention is a method of manufacturing a frame-integrated mask in which at least one mask 100 and a frame 200 supporting the mask 100 are integrally formed, comprising: (a) at least one mask Providing a frame 200 having a cell area CR, (b) a mask cell C in which a plurality of mask patterns P are formed, a dummy DM and a dummy DM around the mask cell C ) Providing a mask 150 including grip units 130 on both sides, (c) adsorbing at least a portion of the grip unit 130 of the mask 100 by the vacuum transfer unit 60, (d) a vacuum transfer unit Step (60) to move the mask 100 to correspond to the mask cell area (CR) of the frame 200, and (e) the mask 100 by irradiating a laser (L) on the welding portion of the mask 100 Including the step of adhering to the frame 200, the vacuum transfer unit 60, so that the vertical height of the adsorbed mask 150 side and the vertical height of the mask 150 adhered to the frame 200 are different, the mask It is characterized by applying an inclination to (150).

Description

Manufacturing method of frame-integrated mask {PRODUCING METHOD OF MASK INTEGRATED FRAME}

The present invention relates to a method of manufacturing a frame-integrated mask. More specifically, in the process of attaching the mask to the frame, the mask part in contact with the frame can be flattened to improve the adhesion between the mask and the frame, and a frame-integrated type capable of clarifying the alignment between each mask. It relates to a method of manufacturing a mask.

In recent years, research on an electroforming method in manufacturing a thin plate is in progress. The electroplating method is a method of immersing an anode body and a cathode body in an electrolyte solution, and applying power to deposit a metal thin plate on the surface of the cathode body, so that an ultra-thin plate can be manufactured and mass production can be expected.

Meanwhile, as a technology for forming pixels in the OLED manufacturing process, a Fine Metal Mask (FMM) method is mainly used in which an organic material is deposited at a desired location by attaching a thin metal mask to a substrate.

In the existing OLED manufacturing process, the mask is manufactured in the form of a stick or plate, and then the mask is welded and fixed to the OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks can be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is stretched so that it is flat. It is a very difficult task to adjust the tensile force so that the entire part of the mask is flat. In particular, in order to align a mask pattern with a size of only a few to tens of μm while making all the cells flat, a high level of work is required to check the alignment status in real time while finely adjusting the tensile force applied to each side of the mask. do.

Nevertheless, in the process of fixing several masks to one frame, there is a problem in that the alignment between the masks and the mask cells is not good. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and large area, so the mask is struck or distorted by the load, and wrinkles and burrs occur in the welding part during the welding process. There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD quality is 500-600 PPI (pixel per inch), and the pixel size reaches about 30-50㎛, and 4K UHD, 8K UHD high-definition is higher than this, ~860 PPI, ~1600 PPI, etc. Will have a resolution of. In this way, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between cells should be reduced to about several µm, and the error beyond this leads to product failure, so the yield may be very low. Therefore, there is a need to develop a technique for preventing deformation, such as being struck or distorted, and for clarifying alignment, a technique for fixing the mask to the frame, and the like.

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and an object thereof is to provide a method of manufacturing a frame-integrated mask in which a mask and a frame can form an integrated structure.

In addition, it is an object of the present invention to provide a method of manufacturing a frame-integrated mask capable of preventing deformation such as being struck or distorted and clarifying alignment.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the manufacturing time is significantly reduced and the yield is significantly increased.

In addition, it is an object of the present invention to provide a method of manufacturing a frame-integrated mask capable of improving adhesion between the mask and the frame and preventing deformation of the mask when the mask is adhered to the frame.

The above object of the present invention is a method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed, comprising the steps of: (a) providing a frame having at least one mask cell region; (b) providing a mask including a mask cell on which a plurality of mask patterns are formed, a dummy around the mask cell, and grip portions on both sides of the dummy; (c) adsorbing at least a portion of the grip portion of the mask by the vacuum transfer unit; (d) moving the vacuum transfer unit to correspond the mask to the mask cell area of the frame; And (e) attaching the mask to the frame by irradiating a laser to the welding portion of the mask, wherein the vacuum transfer unit is applied to the mask so that the vertical height of the adsorbed mask side and the vertical height of the mask adhered to the frame are different from each other. It is achieved by a method of manufacturing a frame-integrated mask by applying an inclination.

The step (a) includes the steps of: (a1) providing a frame unit including a hollow area; (a2) connecting the planar mask cell sheet portion to the frame frame portion; And (a3) manufacturing a frame by forming a plurality of mask cell regions on the mask cell sheet portion.

The step (a) includes the steps of: (a1) providing a frame unit including a hollow area; And (a2) manufacturing a frame by connecting a mask cell sheet portion having a plurality of mask cell regions to an edge frame portion.

One end of the vacuum transfer unit may contact the mask, and the other end may be connected to a pumping means.

A porous part may be disposed at one end of the vacuum transfer part.

Two or four vacuum transfer units can adsorb the mask.

In step (d), the vacuum transfer unit may pull the adsorbed mask outward to unfold the mask flat.

In step (d), at least one end portion of the vacuum transfer unit adsorbing the mask may swing to apply an inclination to the mask.

In step (e), the mask may be adhered to the frame by irradiating a laser to the welding portion located on the pile of the mask.

(f) laser trimming the grip portion by irradiating the cutting laser to at least the outer portion of the portion where the mask is welded may be further included.

The vacuum transfer unit may further include a pressing unit that applies a load to the inside of the adsorbed mask to contact the mask on the frame.

The mask can be adhered to the frame by irradiating a laser to the welding portion at least inside the portion of the mask to which the pressing portion applies a load.

A welding bead is formed on a portion of the welding portion irradiated with the laser, and the welding bead may be mediated so that the mask and the frame are integrally connected.

Before or after the mask is applied to the mask cell area, the temperature of the process area including the frame is increased to a first temperature, and after the mask is adhered to the frame, the temperature of the process area including the frame is increased to a second temperature. Can be lowered to.

The first temperature may be equal to or higher than the OLED pixel deposition process temperature, and the second temperature may be at least lower than the first temperature.

The first temperature is any one of 25°C to 60°C, the second temperature is any one of 20°C to 30°C lower than the first temperature, and the OLED pixel deposition process temperature is any one of 25°C to 45°C. It can be one temperature.

When the mask corresponds to the mask cell region, it is possible not to apply tension to the mask.

When the temperature of the process region is lowered to the second temperature, the mask adhered to the frame is contracted and tension may be applied.

The mask cell sheet portion may include a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction.

The mask cell sheet portion, a frame sheet portion; And at least one first grid sheet portion extending in the first direction and having both ends connected to the edge sheet portion.

The mask cell sheet portion may further include at least one second grid sheet portion extending in a second direction perpendicular to the first direction, crossing the first grid sheet portion, and having both ends connected to the edge sheet portion.

The mask and frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

According to the present invention configured as described above, there is an effect that the mask and the frame can form an integral structure.

In addition, according to the present invention, there is an effect of preventing deformation, such as being struck or distorted, of the mask, and enabling clear alignment.

In addition, according to the present invention, there is an effect of remarkably reducing the manufacturing time and increasing the yield remarkably.

Further, according to the present invention, when the mask is adhered to the frame, there is an effect of preventing deformation of the mask and improving the adhesion between the mask and the frame.

1 is a schematic diagram showing a conventional OLED pixel deposition mask.
2 and 3 are schematic diagrams showing a process of attaching a conventional mask to a frame.
4 is a schematic diagram showing that an alignment error occurs between cells in a process of tensioning a conventional mask.
5 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
6 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
8 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
9 is a schematic diagram showing a state in which a vacuum transfer unit adsorbs a mask according to a comparative example of the present invention.
10 is a schematic diagram showing a state in which a mask is matched to a cell area of a frame by moving a vacuum transfer unit according to a comparative example of the present invention.
11 is a schematic diagram showing a mask according to an embodiment of the present invention.
12 and 13 are schematic diagrams illustrating a process of attaching a mask to a frame using a vacuum transfer unit according to an embodiment of the present invention.
14 and 15 are schematic diagrams illustrating a process of sequentially attaching a mask to a frame after the processes of FIGS. 12 and 13.
16 is a schematic diagram illustrating a process of lowering a temperature of a process area after attaching a mask to a cell area of a frame according to an embodiment of the present invention.
17 and 18 are schematic diagrams illustrating a process of attaching a mask to a frame using a vacuum transfer unit according to another embodiment of the present invention.
19 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description of the present invention described below refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be practiced. These embodiments are described in detail sufficient to enable a person skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different from each other, but need not be mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the present invention in relation to one embodiment. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description to be described below is not intended to be taken in a limiting sense, and the scope of the present invention, if appropriately described, is limited only by the appended claims, along with all ranges equivalent to those claimed by the claims. In the drawings, similar reference numerals refer to the same or similar functions over various aspects, and the length, area, thickness, and the like may be exaggerated and expressed for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily implement the present invention.

1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.

Referring to FIG. 1, a conventional mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is a stick-type mask and can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame. The mask 100 shown in (b) of FIG. 1 is a plate-type mask and may be used in a process of forming a pixel having a large area.

A plurality of display cells C are provided on the body of the mask 10 (or the mask layer 11). One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P are clustered to form one cell C, and a plurality of cells C may be formed on the mask 10.

2 and 3 are schematic diagrams showing a process of bonding the conventional mask 10 to the frame 20. 4 is a schematic diagram showing that an alignment error occurs between cells in the process of stretching the conventional mask 10 (F1 to F2). A stick mask 10 including six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to FIGS. 2A, 3A, and 3B, first, the stick mask 10 must be flattened. A pair of clampers 3 facing each other with the frame 20 interposed therebetween clamps both sides of the stick mask 10 and applies tensile forces (F1 to F2) in the long axis direction of the stick mask 10 As it is pulled, the stick mask 10 is unfolded. Then, the clamper 3 moves to a position corresponding to the frame 20 along the y-axis moving rail 4 occupying the outside of the frame 20.

Next, referring to (c) of FIG. 3, a pair of clampers 3 descend along the z-axis moving rail 5 to stretch the stick mask 10 on the frame 20 in the form of a square frame. The stick mask 10 is loaded on. The cells C1 to C6 of the stick mask 1 are located in a blank area inside the frame of the frame 20. The frame 20 may have a size such that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are It may be large enough to be located in an internal empty area.

Next, referring to Figures 2 (b) and 3 (d), after finely adjusting the tensile force (F1 ~ F2) applied to each side of the stick mask 10, after aligning, the stick mask 10 ) The stick mask 10 and the frame 20 are interconnected by welding (W) a part of the side surface with a laser (L) or the like. Then, the clamper 3 releases the clamping of the stick mask 10. 2C shows a cross-sectional side view of a stick mask 10 and a frame connected to each other.

Referring to FIG. 4, although the tensile forces F1 to F2 applied to each side of the stick mask 10 are finely adjusted, there is a problem in that the mask cells C1 to C3 are not well aligned with each other. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stick mask 10 has a large area including a plurality (for example, 6) of cells C1 to C6 and has a very thin thickness of several tens of µm, it is easily struck or distorted by a load. In addition, it is very difficult to check the alignment between the cells (C1 to C6) in real time through a microscope while adjusting the tensile force (F1 to F2) to flatten all of the cells (C1 to C6).

Therefore, a minute error in the tensile force (F1 to F2) may cause an error in the extent to which each of the cells (C1 to C3) of the stick mask 10 is stretched or unfolded, and accordingly, the distance D1 between the mask patterns (P) ~D1", D2~D2") causes a problem that becomes different. Of course, it is difficult to completely align the error so that it is 0, but in order to prevent the mask pattern (P) having a size of several to tens of µm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error should not exceed 3 µm. It is desirable not to. This alignment error between adjacent cells is referred to as PPA (pixel position accuracy).

In addition, a plurality of stick masks 10 of about 6 to 20 are connected to one frame 20, respectively, between a plurality of stick masks 10, and a plurality of cells C of the stick mask 10 It is also a very difficult task to clarify the alignment state between ~C6), and the process time according to the alignment is inevitably increased, which is a significant reason for reducing productivity.

On the other hand, after the stick mask 10 is connected and fixed to the frame 20, tensile forces F1 to F2 applied to the stick mask 10 may act in reverse to the frame 20. That is, after the stick mask 10, which has been stretched taut by the tensile forces F1 to F2, is connected to the frame 20, a tension may be applied to the frame 20. Usually, this tension is not large and may not have a large effect on the frame 20, but when the size of the frame 20 is reduced in size and the rigidity is lowered, this tension may finely deform the frame 20. As a result, there may be a problem of misalignment between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that enables the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed with the frame 200 is prevented from being struck or twisted, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the frame 200 may not be deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly reduced, and the yield can be remarkably increased.

5 is a front view [Fig. 5 (a)] and a side cross-sectional view [Fig. 5 (b)] showing a frame-integrated mask according to an embodiment of the present invention, and Fig. 6 is It is a front view [FIG. 6(a)] and a side cross-sectional view [FIG. 6(b)] showing the frame.

5 and 6, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are adhered to the frame 200, one by one. Hereinafter, for convenience of explanation, a square-shaped mask 100 is described as an example, but the mask 100 may be in the form of a stick mask having protrusions clamped on both sides before being adhered to the frame 200, and the frame 200 ), the protrusion can be removed after being adhered to.

A plurality of mask patterns P may be formed on each mask 100, and one cell C may be formed on one mask 100. One mask cell C may correspond to one display such as a smartphone. In order to form a thin thickness, the mask 100 may be formed by electroforming. Mask 100 may be a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ of invar (invar), about 1.0 X 10 ^-7 / ℃ Super Invar (super invar) material. Since the mask 100 made of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a Fine Metal Mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, considering the recent development of technologies for performing a pixel deposition process in a range where the temperature change value is not large, the mask 100 is made of nickel (Ni) and nickel-cobalt (Ni-Co) having a slightly larger coefficient of thermal expansion than this. ), etc. The mask may have a thickness of about 2 μm to 50 μm.

The frame 200 is formed to adhere a plurality of masks 100. The frame 200 may include several corners formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may partition a region on the frame 200 to which the mask 100 is to be adhered.

The frame 200 may include a frame portion 210 having a substantially square shape or a square frame shape. The inside of the frame frame 210 may have a hollow shape. That is, the frame frame unit 210 may include a hollow region R. The frame 200 may be made of a metal material such as Invar, Super Invar, aluminum, titanium, etc., and in consideration of thermal deformation, it is composed of materials such as Invar, Super Invar, nickel, nickel-cobalt, etc., which have the same coefficient of thermal expansion as the mask. Preferably, these materials can be applied to both the frame part 210 and the mask cell sheet part 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet part 220 connected to the frame frame part 210. Like the mask 100, the mask cell sheet part 220 may be formed by electroplating, or may be formed using other film forming processes. In addition, the mask cell sheet part 220 may form a plurality of mask cell regions CR on a planar sheet through laser scribing, etching, or the like, and then connect to the frame frame part 210. Alternatively, the mask cell sheet part 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting the planar sheet to the frame frame part 210. In the present specification, it is assumed that a plurality of mask cell regions CR are first formed in the mask cell sheet part 220 and then connected to the frame frame part 210.

The mask cell sheet part 220 may include at least one of an edge sheet part 221 and first and second grid sheet parts 223 and 225. The frame sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, and they are integrally formed with each other.

The frame sheet part 221 may be substantially connected to the frame frame part 210. Accordingly, the frame sheet part 221 may have a substantially square shape and a square frame shape corresponding to the frame frame part 210.

In addition, the first grid sheet portion 223 may be formed to extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a linear shape so that both ends may be connected to the edge sheet part 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 form equal intervals.

In addition, in addition to this, the second grid sheet portion 225 may be formed to extend in a second direction (vertical direction). The second grid sheet portion 225 may be formed in a linear shape so that both ends thereof may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, it is preferable that each of the second grid sheet portions 225 form equal intervals.

Meanwhile, the interval between the first grid sheet portions 223 and the interval between the second grid sheet portions 225 may be the same or different depending on the size of the mask cell C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of a cross section perpendicular to the length direction may be a rectangle, a square shape such as a parallelogram, a triangle shape, etc. , Sides, and corners may be partially rounded. The cross-sectional shape can be adjusted in the process of laser scribing and etching.

The thickness of the frame frame part 210 may be thicker than the thickness of the mask cell sheet part 220. Since the frame frame portion 210 is responsible for the overall rigidity of the frame 200, it may be formed to a thickness of several millimeters to several centimeters.

In the case of the mask cell sheet part 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 19) passes through the mask 100 in the OLED pixel deposition process. It can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure enough rigidity to support the mask 100. Accordingly, the mask cell sheet part 220 is thinner than the thickness of the frame frame part 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet part 220 may be about 0.1 mm to 1 mm. In addition, the first and second grid sheet portions 223 and 225 may have a width of about 1 to 5 mm.

A plurality of mask cell areas CR: CR11 to CR56 may be provided except for the area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the planar sheet. In another aspect, the mask cell area CR is an area occupied by the frame sheet part 221 and the first and second grid sheet parts 223 and 225 in the hollow area R of the frame frame part 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixel of the OLED is deposited substantially through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed on one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but clear alignment of the mask 100 is achieved. In order to do so, it is necessary to avoid the large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell area CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.

The frame 200 includes a plurality of mask cell areas CR, and each mask 100 may be adhered so that one mask cell C corresponds to the mask cell area CR. Each mask 100 may include a mask cell C having a plurality of mask patterns P formed thereon, and a dummy around the mask cell C (corresponding to a portion of the mask layer 110 excluding the cell C). have. The dummy may include only the mask layer 110 or may include the mask layer 110 in which a predetermined dummy pattern similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell area CR of the frame 200, and a part or all of the dummy may be adhered to the frame 200 (mask cell sheet part 220 ). Accordingly, the mask 100 and the frame 200 can form an integral structure.

Meanwhile, according to another embodiment, the frame is not manufactured by attaching the mask cell sheet part 220 to the frame frame part 210, but the frame frame part 210 is formed in the hollow region R part of the frame frame part 210. ) And a frame in which a grid frame (corresponding to the grid seat portions 223 and 225) is formed immediately may be used. This type of frame also includes at least one mask cell area CR, and a frame-integrated mask can be manufactured by matching the mask 100 to the mask cell area CR.

Hereinafter, a process of manufacturing a frame-integrated mask will be described.

First, the frame 200 described above in FIGS. 5 and 6 may be provided. 7 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 7, a frame frame part 210 is provided. The frame frame part 210 may have a rectangular frame shape including a hollow region R.

Next, referring to FIG. 7B, a mask cell sheet part 220 is manufactured. The mask cell sheet part 220 can be manufactured by manufacturing a flat sheet using electroplating or other film forming processes, and then removing the mask cell area CR through laser scribing or etching. have. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.

Next, the mask cell sheet part 220 may correspond to the frame frame part 210. In the process of matching, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 and the frame sheet part 221 is attached to the frame frame part 210. You can respond. On one side, it is possible to hold the mask cell sheet portion 220 at several points (for example, 1 to 3 points in FIG. 7 (b)) and tension. On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) along some side directions instead of all sides.

Next, when the mask cell sheet part 220 corresponds to the frame frame part 210, the frame sheet part 221 of the mask cell sheet part 220 may be welded (W) to be bonded. It is preferable to weld (W) all sides so that the mask cell sheet part 220 can be firmly adhered to the frame frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 as much as possible and increase the adhesion. The welding (W) portion may be generated in a line or spot shape, and the frame frame portion 210 and the mask cell sheet portion 220 are integrally made of the same material as the mask cell sheet portion 220. It can be a medium to connect with.

8 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 7, the mask cell sheet part 220 having the mask cell area CR is first manufactured and adhered to the frame frame part 210. However, in the embodiment of FIG. 8, a flat sheet is attached to the frame frame part ( After bonding to 210), a mask cell area CR is formed.

First, as shown in (a) of FIG. 7, a frame unit 210 including a hollow region R is provided.

Next, referring to FIG. 8A, a planar sheet (a flat mask cell sheet part 220 ′) may correspond to the frame frame part 210. The mask cell sheet part 220 ′ is in a planar state in which the mask cell region CR has not yet been formed. In the matching process, all sides of the mask cell sheet part 220 ′ are stretched (F1 to F4) to correspond to the frame frame part 210 with the mask cell sheet part 220 ′ flattened. One side can also hold the mask cell sheet portion 220 ′ at several points (for example, 1 to 3 points in FIG. 8 (a)) and tension. On the other hand, the mask cell sheet portion 220 ′ may be stretched (F1, F2) along some side directions instead of all sides.

Next, if the mask cell sheet part 220 ′ corresponds to the frame frame part 210, the rim part of the mask cell sheet part 220 ′ may be welded (W) to be bonded. It is preferable to weld (W) all sides so that the mask cell sheet part 220 ′ can be firmly adhered to the frame frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 ′ and increase adhesion. The welding (W) portion may be created in a line or spot shape, and has the same material as the mask cell sheet portion 220 ′, and the frame frame portion 210 and the mask cell sheet portion 220 ′ It can be a medium that connects all together.

Next, referring to FIG. 8B, a mask cell region CR is formed on a planar sheet (a planar mask cell sheet portion 220'). The mask cell area CR may be formed by removing the sheet in the mask cell area CR through laser scribing, etching, or the like. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. When the mask cell area CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids A mask cell sheet portion 220 having a sheet portion 225 may be configured.

9 is a plan view showing the shape of the mask 100 (FIG. 9(a)) and a state in which the vacuum transfer unit 60 adsorbs the mask 100 according to the comparative example of the present invention [FIG. 9(b1), (b2)] and a side cross-sectional view [Fig. 9(c)]. 10 is a plan view showing a state in which the vacuum transfer unit 60 according to the comparative example of the present invention is moved to correspond the mask 100 to the cell area CR of the frame 200 [FIG. 10A] and side It is a sectional view [FIG. 10(b)].

Referring to FIG. 9A, a mask 100 in which a plurality of mask patterns P is formed may be provided. The mask 100 may include a mask cell C in which a plurality of mask patterns P are formed and a dummy DM surrounding the mask cell C. The dummy DM corresponds to a portion of the mask layer 110 excluding the cell C, and includes only the mask layer 110, or the mask layer 110 in which a predetermined dummy pattern similar to the mask pattern P is formed. It may include. In the dummy DM, a part or all of the dummy DM may be adhered to the frame 200 (mask cell sheet part 220) corresponding to the edge of the mask 100. The mask 100 made of Invar and Super Invar may be manufactured by electroplating.

Next, referring to (b1), (b2) and (c) of FIG. 9, the vacuum transfer unit 60 may adsorb the side of the mask 100. The vacuum transfer unit 60 is characterized in that the mask 100 can be flatly spread by pulling it outward after adsorbing the mask 100.

The manufactured mask 100 may be loaded onto the frame 200 in a flat state and adhered thereto. At this time, the mask 100 must be moved to the frame 200, and the mask 100 is a thin film having a thickness of about 2 μm to 50 μm, and wrinkles may occur even when a slight force is applied, so care must be taken in handling the mask 100. In addition, since a plurality of fine mask patterns P are formed on the mask 100, the mask 100 must be flattened without wrinkles so that the alignment of the mask patterns P is not misaligned. In order to move the mask 100 in an open state, if both sides of the mask 100 are held with a gripper (refer to the clamper 3 in FIG. 3), damage may occur to the mask 100, and the frame 200 ) Is not easy to load on. In addition, there is a problem in that it is very difficult to hold the mask 100 with a gripper and move it flatly without misalignment of the mask pattern P and load it onto the frame 200.

Accordingly, in the present invention, the vacuum transfer unit 60 may perform adsorption by vacuum (V) on the side of the mask 100. Here, the adsorption by vacuum (V) does not mean that the environment around the mask 100 is made into a vacuum to be adsorbed, and air is pumped to the outside along the internal gas flow path 63 of the vacuum transfer unit 60 to increase the adsorption force. It can be understood that it is generated and the mask 100 is adsorbed by the vacuum transfer unit 60.

The vacuum transfer unit 60 may include a housing 61, and a gas flow path 63 may be provided inside the housing 61. One end of the housing 61 may contact the side of the mask 100 and the other end may be connected to an external pumping means (not shown). A pumping means (not shown) such as a pump may pump air from the gas flow path 63 inside the housing 61 to make the inside of the housing 61 into a vacuum atmosphere. Accordingly, the mask 100 in contact with one end of the housing 61 may be adsorbed by the vacuum transfer unit 60.

A porous portion 65 may be disposed at one end of the housing 61. The porous part 65 may be made of a porous material including very small pores. When the mask 100 is adsorbed to the vacuum transfer unit 60 through a hole or a slit, the hole and slit are large in size and the adsorption force is not uniform in the formation area of the hole and slit. Some can be stressed. Accordingly, when a vacuum is applied between the pores of the porous portion 65, an adsorption force can be uniformly generated on the surface of the porous portion 65, so that the mask 100 can be stably adsorbed and moved.

The vacuum transfer unit 60 may adsorb at least two sides of the mask 100. For example, two sides of the left and right sides of the mask 100 may be adsorbed, or four sides of the upper, lower, left, and right sides of the mask 100 may be adsorbed.

In addition, the number of vacuum transfer units 60 may vary in consideration of the direction in which the mask 100 is pulled. As an example, (b1) of FIG. 9 shows an example in which two vacuum transfer units 60 adsorb the left and right sides of the mask 100 and pull them in the left and right directions. As another example, (b2) of FIG. 9 shows an example in which four vacuum transfer units 60 adsorb four corner portions of the mask 100 and pull the mask 100 in the left, right, upper, and lower directions. However, the present invention is not limited thereto, and the number of the vacuum transfer unit 60 may be determined in consideration of the pulling direction and movement of the mask 100. In order to move the mask 100 by pulling or adsorbing the mask 100 on the vacuum transfer unit 60 , Moving means (not shown) such as rails, belts, etc. for moving the vacuum transfer unit 60 in the X, Y, Z, and θ axes may be connected. .

Next, referring to FIGS. 10A and 10B, the mask 100 may correspond to one mask cell area CR of the frame 200. The vacuum transfer unit 60 may move to the upper portion of the frame 200 in a state in which the mask 100 is adsorbed. Flattening by pulling the mask 100 may be performed immediately before the mask 100 is brought into contact with the frame 200. After the vacuum transfer unit 60 corresponds the mask 100 to one mask cell area CR of the frame 200, the vacuum transfer unit 60 physically presses the mask 100 to frame the mask 100. 200) can also be pressed further.

Subsequently, the mask 100 may be irradiated with a laser L to adhere the mask 100 to the frame 200 by laser welding. A welding bead WB is generated in the welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the mask 100 / frame 200 and having the same material.

When the mask 100 is adsorbed using the vacuum transfer unit 60, there is an advantage of preventing deformation of the mask 100, improving adhesion with the frame 200, and clarifying alignment. However, the vacuum transfer unit 60 must adsorb the dummy DM portion avoiding the cell C portion with the mask pattern P. Since the area of the mask 100 is approximately a small area corresponding to the area of the smartphone display, and the dummy (DM) part corresponds to a width of about several mm, the vacuum transfer unit 60 is only about 1 mm to 2 mm of the dummy (DM). Since it must be adsorbed, the adsorption force is weakened, and there is a fear that an adverse effect may occur in the flattening of the mask 100.

Accordingly, the present invention is a method of stabilizing adsorption by adsorbing a wider area of the mask 100 by the vacuum transfer unit 60 and spreading the mask 100 flat according to the embodiment of FIGS. 11 to 18 Suggest.

11 is a schematic diagram showing a mask according to an embodiment of the present invention.

Referring to FIG. 11, the stick mask 150 may have a shape in which grip portions 130 are further formed on both sides of the mask 100. The grip part 130 is only a term made for convenience of description, and the grip part 130 can be understood as a concept in which the side of the dummy (DM) part is further extended, and the grip part 130 is integral with the mask 100. I can. In the process of manufacturing the stick mask 150 through electroplating, a portion of the mask 100 and a portion of the grip portion 130 may be formed at the same time. Alternatively, the mask 100 and the grip part 130 may be separately manufactured and the two components may be attached. In the present invention, the mask 100 is actually adhered to the frame 200 in the stick mask 150, refers to a part that functions as a mask in the OLED deposition process, and differs only in the presence or absence of the grip part 130, so the stick mask 150 The mask unit 110 of) is substantially the same as the mask 100, and hereinafter, the mask 100 and the stick mask 150 are referred to as being mixed.

11A shows a stick mask 150 in which the grip part 130 is in the form of a square sheet. The grip part 130 of this stick mask 150 can be adsorbed by the two vacuum transfer parts 60 shown in FIG. 9(b1). That is, the left and right grip portions 130 of the stick mask 150 may be adsorbed and pulled in the left and right directions to be supported and unfolded.

11B shows a stick mask 150' in which the grip portion 130' is in the form of a protruding ear. The four corner portions of the grip part 130 ′ of the stick mask 150 ′ may be adsorbed by the four vacuum transfer parts 60 shown in FIG. 9B2. That is, the left and right grip portions 130 ′ of the stick mask 150 ′ can be adsorbed and pulled in the left, right, upper, and lower directions to be supported and unfolded.

Since a portion of the grip part 130 extending from the side of the mask 100 is further included, when the stick mask 150 is adsorbed by the vacuum transfer part 60, a larger area and a wider width are adsorbed to the stick mask 150. There is an advantage of being able to support stably. For example, the grip part 130 is formed to extend by about 5 mm, so that it can adsorb an area twice as large as that of adsorbing the existing dummy DM of about 1 mm to 2 mm.

The mask 100 portion of the stick mask 150 is as described above with reference to FIG. 9. The stick mask 150 made of Invar and Super Invar may be manufactured by electroplating.

The mother plate used as a cathode in electroplating is made of a conductive material. As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and conductive polymers In the case of the substrate, it is highly likely to contain impurities, and the strength. Acid resistance may be weak. An element that prevents uniform formation of an electric field on the surface of the mother plate (or cathode) such as metal oxide, impurities, inclusions, grain boundaries, etc. is referred to as “defect”. Due to defects, a uniform electric field may not be applied to the cathode body made of the above-described material, so that a part of the plating film (stick mask 150) may be formed unevenly.

In implementing ultra-high definition pixels of the UHD level or higher, non-uniformity of the plating layer and the plating layer pattern (mask pattern P) may adversely affect the formation of the pixel. For example, in the case of current QHD quality, the size of the pixel reaches about 30-50㎛ at 500~600 PPI (pixel per inch), and in the case of 4K UHD and 8K UHD high quality, ~860 PPI, ~1600 PPI, which is higher. It has the same resolution. Micro-displays directly applied to VR devices, or micro-displays inserted into VR devices, aim for ultra-high quality of about 2,000 PPI or higher, and the size of pixels reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of µm, preferably smaller than 30 µm, so that even defects of several µm can occupy a large proportion of the pattern size of the mask. to be. In addition, in order to remove the defects in the cathode material of the above-described material, an additional process for removing metal oxide, impurities, etc. may be performed, and in this process, another defect such as etching of the cathode material may be caused. have.

Accordingly, in the present invention, a single crystal base plate (or a cathode body) may be used. In particular, it is preferably made of single crystal silicon. In order to have conductivity, a ^{high-concentration doping of 10 19} /cm ³ or more may be performed on the mother plate made of single crystal silicon. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.

Meanwhile, as a single crystal material, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, doping with a high concentration of 1019 or more may be performed to have conductivity. In the case of other materials, doping may be performed or oxygen vacancy may be formed to form conductivity. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.

Since there are no defects in the case of a single crystal material, there is an advantage that a uniform plating film (stick mask 150) can be generated due to the formation of a uniform electric field over the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of OLED pixels. In addition, since there is no need to perform an additional process for removing and eliminating defects, there is an advantage in that process cost is reduced and productivity is improved.

In addition, if a silicon material or a single crystal material capable of forming an insulating film on the surface by oxidation or nitridation, there is an advantage that the insulating part can be formed only by oxidizing and nitriding the surface of the mother plate as needed. have. The insulating portion may be formed using a photoresist. Electrodeposition of the plated film (stick mask 150) is prevented in the portion where the insulating portion is formed, and a pattern (mask pattern P) is formed on the plated film.

On the other hand, it should be noted that the material of the base plate of the present invention is not necessarily limited to the aforementioned single crystal material as long as it is within the range of reducing the defects of the cathode body.

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), the mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56). ) May also be provided in plural.

12 and 13 are schematic diagrams showing a process of adhering the mask 100 to the frame 200 using the vacuum transfer unit 60 according to an embodiment of the present invention. FIG. 12(b) is a side cross-sectional view in the direction D-D' of FIG. 12(a).

Referring to FIGS. 12A and 12B, the vacuum transfer units 60 facing each other may adsorb a corner of the stick mask 150, that is, a part of the grip unit 130.

The vacuum transfer unit moving means (not shown) may move the vacuum transfer unit 60 in the x-axis, y-axis, and z-axis directions. Meanwhile, the vacuum transfer unit moving means (not shown) may further move the vacuum transfer unit 60 in the θ-axis direction. The θ-axis direction is an angle at which the vacuum transfer unit 60 rotates on the xy plane, and is an axial direction that is adjusted when the stick mask 150 is aligned on the frame 200. Movement in the θ-axis direction may be performed by a combination of x-axis and y-axis movement means, or may be performed by installing a separate θ-axis movement unit.

In addition, the vacuum transfer unit moving means (not shown) may tilt the vacuum transfer unit 60. Since the vacuum transfer unit 60 is formed in a direction substantially parallel to the xy plane, one end of the vacuum transfer unit 60 may be moved in the z-axis direction with the other end as an axis to be inclined. Hereinafter, the inclination of the vacuum transfer unit 60 is referred to as a swing (S).

A stick mask loader (stick mask index) loads one stick mask 150 from an external stick loading plate (not shown) on which a plurality of stick masks 150 are loaded. Then, the vacuum transfer unit moving means may move the vacuum transfer unit 60 to the position of the stick mask 150, and the vacuum transfer unit 60 may adsorb the edge (grip unit 130) of the stick mask 150.

Next, the means for moving the vacuum transfer unit may move the stick mask 150 into the vertical upper area of the frame 200. To be precise, the stick mask 150 adsorbed by the vacuum transfer unit 60 may enter the vertical upper area of the frame 200. It is preferable to move the mask cell C of the stick mask 150 to correspond to the cell area CR (CR11) of the frame 200.

As shown in FIG. 2, in the case of the conventional stick mask 10, a plurality of cells C: C1 to C6 are included, and the outer side of the frame 20 in a state in which the clamper 3 clamps the stick mask 10. Only go to. Therefore, since it does not enter the area of the frame 20, there is no problem that interference occurs between the frame 20 and the clamper 3.

On the other hand, in the present invention, since the mask 100 includes one cell C and adheres the mask 100 one by one to the cell area CR of the frame 200, as described above, the mask ( 100) Although there are advantages such as reduction of alignment time and PPA, interference between the frame 200 and the vacuum transfer unit 60 may occur.

Accordingly, in the present invention, the vacuum transfer unit 60 may enter the upper region of the frame 200 in a state in which the stick mask 150 is adsorbed. And, the vertical height of the stick mask 150 side (grip part 130) adsorbed by the vacuum transfer part 60 and the vertical height of the stick mask 150 (mask 100) adhered to the frame 200 are different. In order to do so, an inclination may be applied to the mask 100. In other words, a part of the stick mask 150 is adsorbed at the edge of the stick mask 150 (the grip part 130) at a relatively high position, and the whole or part of the vacuum transfer part 60 swings (S) and bends. Alternatively, as the height of the mask 100 is lowered, it contacts the frame 200. Hereinafter, the whole of the vacuum transfer unit 60 is shown to swing (S), but by installing a rotation shaft in the middle of the vacuum transfer unit 60, only one end contacting the mask 100 may be configured to swing (S). have.

Referring to FIG. 13C, the vacuum transfer unit 60 is in a state in which the grip unit 130 of the stick mask 150 is adsorbed, and the vacuum transfer unit 60 swings (S) according to the stick mask 150. It is possible to create a height difference (H) from the adsorbed portion by applying an inclination to. One end portion for adsorbing the grip portion 130 of the vacuum transfer portion 60 may swing (S). When the one end of the vacuum transfer unit 60 swings (S) while the grip unit 130 of the stick mask 150 is adsorbed, the stick mask 150 is bent. The vacuum transfer unit 60 may adopt a known configuration in which one end portion can be swing (S) without limitation.

Next, referring to (d) of FIG. 13, after the frame 200 and the cell C of the stick mask 150 are matched, the frame 200 is irradiated with a laser L in a laser unit (not shown). ) And the stick mask 150 in contact therewith. When the laser L is irradiated to the welding part of the dummy DM, a part of the stick mask 150 may be melted to form a welding bead WB, thereby being adhered to the frame 200. Here, the welding part of the mask 100 may refer to a target area in which the welding bead WB is formed by irradiating the laser L. The welding portion may correspond to at least a partial area of the edge of the mask 100 or a portion of the dummy DM.

Specifically, the laser (L) needs to be irradiated to the inner region of the outermost portion of the mask 100 in contact with the frame 200. In addition, welding (W) close to the edge of the frame 200 is required to reduce the excitement space between the mask 100 and the frame 200 as much as possible and increase adhesion. Welding can be performed in the form of a line or spot, and the welding part that is melted by the laser L has the same material as the mask 100 and integrally combines the mask 100 and the frame 200. It can be a connecting medium.

Next, referring to (e) of FIG. 13, the grip part 130 of the stick mask 150 may be laser trimmed by irradiating the cutting laser CL from a laser unit (not shown). The cutting laser CL is preferably irradiated to the outside of the welded portion, for example, the boundary portion between the dummy DM and the grip portion 130. According to laser trimming, the cell (C) and the dummy (DM) around the cell (C) and the cell (C) adhered to the frame (200) in the stick mask (150) become the mask (100), and the rest are separated from the mask (100). It is in a state adsorbed to the vacuum transfer unit 60.

Next, referring to (f) of FIG. 13, the vacuum transfer unit 60 may be moved in an upper direction of the z-axis, or may be swinged in an upper direction (S).

The grip part 130 of the stick mask 150 is separated by laser trimming in step (e) of FIG. 13. Accordingly, the grip part 130 may be separated while being adsorbed by the vacuum transfer part 60, and the mask 100 may be adhered to one cell area CR of the frame 200.

14 and 15 are schematic diagrams illustrating a process of sequentially bonding the mask 100 to the frame 200 after the processes of FIGS. 12 and 13. FIG. 14(b) is a side cross-sectional view in the direction D-D' of FIG. 14(a). 14 and 15 will be described only for differences from FIGS. 12 and 13.

Referring to FIGS. 14A and 14B, again, a stick mask loader (stick mask index) from an external stick loading plate (not shown) on which a plurality of stick masks 150 are loaded is one stick mask ( 150). Then, the vacuum transfer unit moving means may move the vacuum transfer unit 60 to the position of the stick mask 150, and the vacuum transfer unit 60 may adsorb the edge (grip unit 130) of the stick mask 150.

Next, the means for moving the vacuum transfer unit may move the stick mask 150 into the vertical upper area of the frame 200. To be precise, the stick mask 150 adsorbed by the vacuum transfer unit 60 may enter the vertical upper area of the frame 200. It is preferable to move the mask support part 30 so that the mask cell C of the stick mask 150 corresponds to the cell area CR (CR12) of the frame 200. Subsequently, in order to adhere the mask 100 to the frame 200, the vacuum transfer unit 60 may be moved above the cell area CR12 adjacent to the mask 100 adhered in FIGS. 12 and 13.

Referring to FIG. 15C, the stick mask 150 may be bent by swinging the vacuum transfer unit 60 (S). In addition, a part of the bent stick mask 150 is on the frame 200, specifically, on the frame 200 including the cell area CR12 adjacent to the mask 100 adhered in FIGS. 12 and 13. I can contact you. The periphery of the cell C of the stick mask 150 may be in contact with the frame 200. The camera unit (not shown) may check the alignment of the cell C and the alignment of the mask pattern P.

Next, referring to FIG. 15D, laser welding may be performed between the frame 200 and the stick mask 150 in contact with the frame 200 by irradiating the laser L from a laser unit (not shown).

Next, referring to (e) of FIG. 15, the grip part 130 of the stick mask 150 may be laser trimmed by irradiating the cutting laser CL from a laser unit (not shown).

Next, referring to (f) of FIG. 15, the vacuum transfer unit 60 may be moved in the upper direction of the z-axis, or may be swinged upward (S). Accordingly, the grip part 130 may be separated while being adsorbed by the vacuum transfer part 60, and the mask 100 may be adhered to one cell area CR of the frame 200.

As above, the mask 100 may be adhered to each stick mask 150 by sequentially corresponding to each cell area (CR: CR11, CR12, CR13, CR21, ...) of the frame 200. .

The conventional mask 10 of FIG. 1 has a long length because it includes 6 cells (C1 to C6), whereas the mask 100 of the present invention has a short length including one cell (C). The degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including a plurality of cells (C1 to C6, ...) is 1 m and a PPA error of 10 μm occurs in the entire 1 m, the mask 100 of the present invention The above error range may be 1/n according to the reduction of the relative length (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm occurs in the entire 100 mm length. , There is an effect that the alignment error is significantly reduced. Accordingly, the pixel position accuracy (PPA) between the mask 100 attached to one mask cell area CR and the mask 100 attached to the adjacent mask cell area CR does not exceed 3 μm. As a result, there is an advantage of providing a mask for forming an ultra-high definition OLED pixel with clear alignment.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell area CR of the frame 200 within a range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Even in this case, in consideration of the process time and productivity according to the alignment, the mask 100 is preferably provided with as few cells (C) as possible.

In the case of the present invention, it is only necessary to match one cell (C) of the mask 100 and check the alignment state, so that a plurality of cells (C: C1 to C6) must be matched at the same time and all alignment conditions must be checked. Compared to the conventional method [see Fig. 2], the manufacturing time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each of the cells C11 to C16 included in the six masks 100 corresponds to each of the cell regions CR11 to CR16 and checks the alignment state. Through one process, the time can be much shorter than that of a conventional method in which the six cells C1 to C6 are simultaneously matched and the alignment state of the six cells C1 to C6 are all checked at the same time. The mask 100 already attached to the frame 200 can present a reference position.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in the process of 30 times of matching and aligning 30 masks 100 to 30 cell regions (CR: CR11 to CR56), respectively, is 6 cells (C1). The five masks 10 each including ~C6) (see Fig. 2 (a)) may appear much higher than the conventional product yield in the five processes of matching and aligning the frame 20. Since the conventional method of arranging six cells (C1 to C6) in a region corresponding to six cells (C) at a time is a much cumbersome and difficult operation, the product yield is low.

In addition, in the present invention, since the mask 100 can be loaded onto the frame 200 and adhered in a flat state without wrinkles, deformation of the mask 100 is prevented and the mask 100 and the frame 200 There is an advantage that can improve the adhesion of the. In addition, there is an advantage in that the alignment can be clarified without deformation such as the mask 100 being struck or distorted. In addition, since there is no need to design a complex device for holding and tensioning the mask 100, there is an advantage in that the configuration of the equipment is simplified and cost is reduced.

Meanwhile, the lower support 70 may be further disposed under the frame 200 (see FIG. 10(b)). The lower support 70 may have a size such that it fits into the hollow region R of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower support body 70. In this case, the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 may be better fixed.

The lower support 70 may press the opposite surface of the mask cell area CR to which the mask 100 contacts. That is, the lower support 70 may support the mask cell sheet part 220 in the upper direction to prevent the mask cell sheet part 220 from sagging downward during the bonding process of the mask 100. At the same time, the lower support 70 and the vacuum transfer unit 60 are crimped to the frame 200 (or the mask cell sheet unit 220) of the mask 100 in a direction opposite to each other, the mask 100 Can be maintained without being disturbed.

On the other hand, in the present invention, the vacuum transfer unit 60 adsorbs the stick mask 150 and applies an inclination to the stick mask 150 so that the mask 100 corresponds to the mask cell area CR of the frame 200. Since the process is completed, it is characterized in that no tensile force is applied to the mask 100 during this process.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is adhered to the mask cell sheet portion 220 while a tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked. It acts on the cell sheet part 220 and the mask cell area CR so that they may be deformed. Accordingly, it is necessary to adhere the mask 100 to the mask cell sheet part 220 without applying a tensile force to the mask 100. Thus, it is possible to prevent deformation of the frame 200 (or the mask cell sheet part 220) by acting as a tension on the frame 200 as opposed to the tensile force applied to the mask 100.

However, one problem arises when a frame-integrated mask is manufactured by attaching it to the frame 200 (or mask cell sheet part 220) without applying a tensile force to the mask 100, and the frame-integrated mask is used in the pixel deposition process. Can occur. In the pixel deposition process performed at about 25 to 45° C., the mask 100 thermally expands by a predetermined length. Even in the case of the mask 100 made of an Invar material, the length of about 1 to 3 ppm may be changed according to a temperature increase of about 10° C. for forming a pixel deposition process atmosphere. For example, when the total length of the mask 100 is 500 mm, the length may increase by about 5 to 15 μm. Then, there is a problem that the alignment error of the patterns P increases while causing deformation such as the mask 100 being struck by its own weight or being stretched and distorted while being fixed in the frame 200.

Accordingly, the present invention may correspond to and adhere to the mask cell area CR of the frame 200 without applying a tensile force to the mask 100 at a temperature higher than that of room temperature. In this specification, after raising the temperature of the process region to the first temperature (ET), it is expressed that the mask 100 corresponds to the frame 200 and adheres.

The term "process area" may refer to a space in which constituent elements such as the mask 100 and the frame 200 are located, and an adhesion process of the mask 100 is performed. The process area may be a space within a closed chamber or an open space. Further, the term "first temperature" may mean a temperature higher than or equal to the pixel deposition process temperature when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25°C to 45°C, the first temperature may be about 25°C to 60°C. The temperature increase in the process area can be performed by installing a heating means in the chamber or by installing a heating means around the process area.

Again, referring to FIG. 13A, after the stick mask 150 corresponds to the mask cell area CR, the temperature of the process area including the frame 200 is increased (ET) to the first temperature. I can. Alternatively, after raising (ET) the temperature of the process region including the frame 200 to the first temperature, the stick mask 150 may correspond to the mask cell region CR.

Since welding is performed on the mask cell sheet portion 220 without applying a tensile force to the mask 100, the mask cell sheet portion 220 (or, the edge sheet portion 221, the first and second grid sheet portions 223 , 225)], no tension is applied.

16 is a schematic diagram showing a process of lowering (LT) a temperature of a process area after bonding the mask 100 to the cell area CR of the frame 200 according to an exemplary embodiment of the present invention.

After attaching the mask 100 to the cell region CR of the frame 200, the temperature of the process region may be lowered (LT) to the second temperature. The term "second temperature" may mean a temperature lower than the first temperature. Considering that the first temperature is about 25° C. to 60° C., the second temperature may be about 20° C. to 30° C. on the assumption that the first temperature is lower than the first temperature, and preferably, the second temperature may be room temperature. Lowering the temperature of the process area may be performed by installing a cooling means in the chamber, a method of installing a cooling means around the process area, a method of naturally cooling to room temperature, or the like.

When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may heat-shrink by a predetermined length. The mask 100 may be isotropically heat-shrinkable along all lateral directions. However, since the mask 100 is fixedly connected to the frame 200 (or the mask cell sheet part 220) by welding, the heat contraction of the mask 100 is self-tensioned by the surrounding mask cell sheet part 220 (TS) is applied. The mask 100 may be adhered to the frame 200 more tightly by applying the self-tension TS of the mask 100.

In addition, since the temperature of the process region is lowered (LT) to the second temperature after all of the masks 100 are adhered to the corresponding mask cell region CR, all the masks 100 simultaneously cause heat contraction and thus the frame A problem that the 200 is deformed or the alignment error of the patterns P increases may be prevented. More specifically, even if the tension TS is applied to the mask cell sheet part 220, since the plurality of masks 100 apply tension TS in opposite directions to each other, the force is canceled and the mask cell sheet part No deformation occurs in 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is in the right direction of the mask 100 attached to the CR11 cell area. The applied tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell area may be canceled out. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) due to the tension TS is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.

17 and 18 are schematic diagrams illustrating a process of attaching a mask to a frame using a vacuum transfer unit according to another embodiment of the present invention. Fig. 17(b) is a side cross-sectional view in the direction E-E' of Fig. 17(a).

Referring to Figures 17 (a) and (b), as in Figures 12 (a) and (b), the vacuum transfer unit 60 facing each other can adsorb the grip unit 130 of the stick mask 150. have. Next, the means for moving the vacuum transfer unit may move the stick mask 150 into the vertical upper area of the frame 200.

The pressing unit 81 of the pressing unit 80 may be positioned at the top to be spaced apart from the vacuum transfer unit 60. The pressing unit 80 may be connected to the vacuum transfer unit 60 or may have a separate configuration.

Referring to (c) of FIG. 18, in a state in which the vacuum transfer unit 60 adsorbs both sides of the stick mask 150, the pressing unit 81 of the pressing unit 80 is moved into the vertical upper area of the frame 200. Can be moved. Subsequently, the vacuum transfer unit 60 swings (S), and the connection bar 82 may descend (DW) along the vertical guide rail 83. The stick mask 150 may be bent by swinging the vacuum transfer unit 60 (S). In addition, since the connection bar 82 is lowered (DW), the pressing unit 81 connected to one side of the connection bar 82 is also lowered (DW). Subsequently, after the connection bar 82 descends to the lower end of the vertical guide rail 83, the elastic portion of the pressing unit 81 is further expanded and contracted to compress the stick mask 150 with a pressing plate.

The pressing unit 81 is pressed between the stick mask 150 and the frame 200 (the border sheet portion 221, the first and second grid sheet portions 223, 225), so that the stick mask 150 200), it can be better fixed.

Next, referring to FIG. 18D, laser welding may be performed between the frame 200 and the stick mask 150 in contact with the frame 200 by irradiating the laser L from a laser unit (not shown). The laser (L) may be irradiated to the welding portion at least inside the portion of the stick mask 150 to which the pressing unit 81 applies a load.

Next, referring to (e) of FIG. 18, the grip part 130 of the stick mask 150 may be laser trimmed by irradiating the cutting laser CL in a laser unit (not shown).

Next, referring to (f) of FIG. 18, the vacuum transfer unit 60 may be moved in the upper direction of the z-axis or may be swinged upward (S). At the same time, it is possible to lift (U) the pressing unit 81 to release the load applied to the mask 100. Even when the load is released, the mask 100 remains attached to the frame 200 by welding. The grip part 130 may be separated while being adsorbed by the vacuum transfer part 60, and the mask 100 may be adhered to one cell area CR of the frame 200.

19 is a schematic diagram showing an OLED pixel deposition apparatus 1000 using the frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 19, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. It includes a deposition source supply unit 500 to supply ).

A target substrate 900 such as glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The frame-integrated masks 100 and 200 (or FMM) for allowing the organic material source 600 to be deposited for each pixel may be disposed on the target substrate 900 to be in close contact or very close to each other. The magnet 310 generates a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may reciprocate the left and right path to supply the organic material source 600, and the organic material sources 600 supplied from the deposition source supply unit 500 are pattern P formed on the frame-integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic material source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may function as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 due to the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be deposited with a uniform thickness as a whole.

Since the mask 100 is adhered and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and the mask 100 adjacent thereto may be maintained not to exceed 3 μm.

Although the present invention has been illustrated and described with reference to a preferred embodiment as described above, it is not limited to the above embodiment, and within the scope not departing from the spirit of the present invention, various It can be transformed and changed. Such modifications and variations should be viewed as falling within the scope of the present invention and the appended claims.

60: vacuum transfer unit
61: vacuum transfer unit housing
63: gas flow path
65: porous part
70: lower support
80: pressing part
81: pressing unit
82: connecting bar
83: vertical guide rail
100: mask
110: mask film
130: grip portion
150: stick mask
200: frame
210: frame frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid seat portion
225: second grid seat portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: Mask cell area
DM: dummy, mask dummy
ET: Raise the temperature of the process area to the first temperature
L: laser
LT: Lower the temperature of the process area to the second temperature
R: hollow area of the frame part
P: mask pattern
TS: tension
W: welding
WB: welding bead
V: vacuum, adsorption force

Claims (22)

A method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed,
(a) providing a frame having at least one mask cell area;
(b) providing a mask including a mask cell on which a plurality of mask patterns are formed, a dummy around the mask cell, and grip portions on both sides of the dummy;
(c) adsorbing at least a portion of the grip portion of the mask by the vacuum transfer unit;
(d) moving the vacuum transfer unit to correspond the mask to the mask cell area of the frame; And
(e) attaching the mask to the frame by irradiating a laser to the welding portion of the mask
Including,
A method of manufacturing a frame-integrated mask, wherein the vacuum transfer unit tilts the mask so that the vertical height of the adsorbed mask side and the vertical height of the mask adhered to the frame are different from each other. The method of claim 1,
Step (a) is:
(a1) providing a frame unit including a hollow area;
(a2) connecting the planar mask cell sheet portion to the frame frame portion; And
(a3) manufacturing a frame by forming a plurality of mask cell regions on the mask cell sheet portion
Containing, the manufacturing method of the frame-integrated mask. The method of claim 1,
Step (a) is:
(a1) providing a frame unit including a hollow area; And
(a2) manufacturing a frame by connecting a mask cell sheet portion having a plurality of mask cell regions to an edge frame portion
Containing, the manufacturing method of the frame-integrated mask. The method of claim 1,
One end of the vacuum transfer unit is in contact with the mask and the other end is connected to a pumping means, a method of manufacturing a frame-integrated mask. ◈ Claim 5 was abandoned upon payment of the set registration fee. The method of claim 4,
A method of manufacturing a frame-integrated mask in which a porous part is disposed at one end of the vacuum transfer part. The method of claim 1,
A method of manufacturing a frame-integrated mask, wherein two or four vacuum transfer units adsorb the mask. The method of claim 1,
In step (d), the vacuum transfer unit pulls the adsorbed mask outward to flatten the mask, a method of manufacturing a frame-integrated mask. The method of claim 1,
In step (d), at least one end portion of the vacuum conveying unit adsorbing the mask swings to apply an inclination to the mask, a method of manufacturing a frame-integrated mask. ◈ Claim 9 was abandoned upon payment of the set registration fee.◈ The method of claim 1,
In step (e), a method of manufacturing a frame-integrated mask in which the mask is adhered to the frame by irradiating a laser to a welding portion located on a pile of the mask. ◈ Claim 10 was abandoned upon payment of the set registration fee. The method of claim 1,
(f) laser trimming the grip portion by irradiating a cutting laser to at least the outer portion of the portion where the mask is welded.
A method of manufacturing a frame-integrated mask further comprising a. The method of claim 1,
The vacuum conveying unit further includes a pressing unit that applies a load to the inside of the adsorbed mask to bring the mask into contact with the frame. ◈ Claim 12 was abandoned upon payment of the set registration fee. The method of claim 11,
A method of manufacturing a frame-integrated mask, wherein the pressing portion applies a laser to a welded portion at least an inner portion of the mask to which a load is applied to adhere the mask to the frame. ◈ Claim 13 was abandoned upon payment of the set registration fee. The method of claim 1,
A method of manufacturing a frame-integrated mask, wherein a welding bead is formed in a portion of the welding portion irradiated with a laser, and the welding bead is mediated so that the mask and the frame are integrally connected. ◈ Claim 14 was abandoned upon payment of the set registration fee. The method according to any one of claims 1 to 3,
Before or after the mask corresponds to the mask cell region, the temperature of the process region including the frame is raised to a first temperature,
A method of manufacturing a frame-integrated mask, wherein the temperature of the process region including the frame is lowered to a second temperature after the mask is adhered to the frame. ◈ Claim 15 was abandoned upon payment of the set registration fee.◈ The method of claim 14,
The first temperature is equal to or higher than the OLED pixel deposition process temperature, and the second temperature is at least lower than the first temperature. ◈ Claim 16 was abandoned upon payment of the set registration fee. The method of claim 15,
The first temperature is any one of 25°C to 60°C,
The second temperature is any one of 20°C to 30°C lower than the first temperature,
The OLED pixel deposition process temperature is any one of 25° C. to 45° C., a method of manufacturing a frame-integrated mask. ◈ Claim 17 was abandoned upon payment of the set registration fee. The method according to any one of claims 1 to 3,
A method of manufacturing a frame-integrated mask in which no tension is applied to the mask when the mask corresponds to the mask cell region. ◈ Claim 18 was abandoned upon payment of the set registration fee.◈ The method of claim 14,
When the temperature of the process region is lowered to the second temperature, the mask adhered to the frame is contracted and a tension is applied to the frame-integrated mask. The method according to claim 2 or 3,
A method of manufacturing a frame-integrated mask, wherein the mask cell sheet portion includes a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction. ◈ Claim 20 was abandoned upon payment of the set registration fee. The method according to claim 2 or 3,
The mask cell sheet part,
Frame sheet portion; And
A method of manufacturing a frame-integrated mask including at least one first grid sheet portion extending in a first direction and having both ends connected to the frame sheet portion. ◈ Claim 21 was abandoned upon payment of the set registration fee. The method of claim 20,
The mask cell sheet portion further includes at least one second grid sheet portion extending in a second direction perpendicular to the first direction to cross the first grid sheet portion, and having both ends connected to the edge sheet portion, the frame-integrated mask Manufacturing method. ◈ Claim 22 was abandoned upon payment of the set registration fee. The method according to any one of claims 1 to 3,
The mask and the frame are made of any one of invar, super invar, nickel, and nickel-cobalt, a method of manufacturing a frame-integrated mask.

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