TW202013572A - Substrate processing system and substrate processing apparatus - Google Patents

Abstract

There is provided a technique that includes a first controller configured to acquire event data generated at a time of transferring a substrate and alarm data generated at a time of occurrence of a transfer error, a recorder configured to, while recording a transfer operation of the substrate as first image data, record the transfer operation of the substrate as second image data having a higher resolution than the first image data, a second controller configured to store the first image data in a first memory based on the event data, and store the second image data in a second memory based on the alarm data, and an operating controller configured to display at least the first image data and the second image data. The second controller displays both the first image data and the second image data on a same screen.

Description

Substrate processing system, substrate processing device and manufacturing method of semiconductor device

The invention relates to a substrate processing system, a substrate processing device, and a method of manufacturing a semiconductor device.

The substrate processing apparatus is configured, for example, to transfer a substrate (hereinafter also referred to as a wafer) to a processing chamber by a transfer means, and perform predetermined processing on the substrate in the processing chamber. During the transfer of the substrate, for example, the substrate may be shifted, dropped, or damaged due to the failure of the transfer means or the pressure difference between the inside and outside of the processing chamber.

Since the past, the conveyance status of the conveying means has been grasped (for example, refer to Patent Document 1). In addition, detection means for detecting the state of the substrate (for example, sensors such as light sensors, mapping sensors, etc.) are provided, and when the state of the substrate at a predetermined position is different from the expected value, it is It is detected as a transport error, and then displays the transport error status or the monitor screen of the transport system when the transport error occurs on the operation screen (for example, refer to Patent Document 2). However, even if it is known that a transfer error has occurred, the detailed status of the substrate that is out of position, dropped, damaged, etc., or the cause of the status cannot be grasped immediately.

In order to solve this situation, for example, a recording means such as a camera may be provided in the substrate processing apparatus and used for analysis of transport errors (for example, refer to Patent Document 3). However, if the image data in operation is simply kept continuously, it is necessary to select and display appropriate image data from the huge amount of image data when a transport error occurs, and analysis will take time. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-161346 [Patent Document 2] Japanese Patent Laid-Open No. 2011-155244 [Patent Document 3] Japanese Patent Laid-Open No. 2013-030747

(Problems to be solved by the invention)

An object of the present invention is to provide a configuration for analyzing using image data when a substrate is transferred and image data when a transfer error occurs. (Technical means to solve problems)

According to one aspect of the present invention, a technique is provided, which includes: a first control means that obtains event data generated when a substrate is transported and an alarm data generated when a transport error occurs; and a recording method that moves the substrate while It is recorded as the first image data, and the transfer operation of the substrate is recorded as the second image data with a higher resolution than the first image data; the second control means causes the first storage unit to The event data, to store the first image data recorded by the recording means, and to cause the second storage section to store the second image data recorded by the recording means based on the alarm data; and the operation section , Which displays at least the first image data and the second image data; and the second control means displays both the first image data and the second image data recorded when the transport error occurs The same picture. (Comparing the efficacy of the previous technology)

According to the present invention, the abnormality analysis of the transport error can be performed using the image data when the substrate is transferred and the image data when the transfer error occurs, respectively.

Hereinafter, the first embodiment of the present invention will be described using FIGS. 1 to 3.

(1) Structure of substrate processing device As shown in FIG. 1, in this embodiment, the substrate processing apparatus 4 is configured as an upright type heat treatment apparatus (batch type upright type heat treatment apparatus) that implements a heat treatment step of an IC (Integrated Circuit) manufacturing method. In addition, in the upright heat treatment apparatus to which the present invention is applied, a FOUP (Front Opening Unified Pod; front opening wafer transfer cassette, hereinafter referred to as cassette) 20 that transports a wafer W as a substrate is used as a carrier. The substrate processing apparatus 4 includes a processing furnace 8 described later, a storage chamber 12, and a transfer chamber 16.

(Containment room) On the front side of the inside of the housing of the substrate processing apparatus 4, a storage chamber 12 in which the cassette 20 is carried into the apparatus and stored is arranged. On the front side of the housing of the storage room 12, a carrying-out port 22A is opened as an opening for carrying out the cassette 20 into and out of the storage room 12 so as to communicate with the inside and outside of the housing of the housing room 12. The loading/unloading port 22A may be configured to be opened and closed by a front gate. An AGV (Auto Guided Vehicle) port (I/O platform) 22 as a loading port (cassette mounting device) is provided inside the frame of the loading/unloading port 22A. A transfer port 42 is provided on the wall surface between the storage room 12 and the transfer room 16. The cassette 20 is carried into the substrate processing apparatus 4 on the AGV port 22 by an in-process transfer device (inter-process transfer device) located outside the substrate processing apparatus 4, and is also removed from the AGV port 22.

A storage shelf (cassette shelf) 30A for storing the cassette 20 is provided above and below the AGV port 22 in front of the housing of the housing chamber 12 in two stages. Further, behind the housing of the storage room 12, a storage shelf (cassette shelf) 30B for storing the cassette 20 is provided in a matrix.

OHT (Overhead Hoist Transfer; Suspended Transfer Vehicle) port 32 as a loading port is arranged on the same straight line as the storage shelf 30A in the upper section in front of the frame in the horizontal direction. The cassette 20 is carried into the OHT port 32 from above the substrate processing device 4 by the in-process transfer device (inter-process transfer device) located outside the substrate processing device 4, and is also removed from the OHT port 32. The AGV port 22, the storage shelf 30A, and the OHT port 32 are configured so that the horizontal drive mechanism 26 can horizontally move the cassette 20 to the placement position and the transfer position. Later, there are cases where the AGV port 22 is called the first loading port, and the OHT port 32 is called the second loading port.

As shown in FIG. 2, the space between the storage shelf 30A on the front side and the storage shelf 30B on the rear side in the housing of the storage chamber 12 forms a cassette transfer area 14 in which the cassette 20 is carried out Handover and transfer. A rail mechanism 40A as a moving path of the cassette transport mechanism 40 is formed on the top wall portion of the cassette transport area 14 (the top wall portion of the storage chamber 12 ). The cassette transport mechanism 40 serves as a cassette transport device. Here, the delivery position is located in the cassette transfer area 14, for example, a position directly below the cassette transfer mechanism 40.

The cassette conveying mechanism 40 that conveys the cassette 20 includes a moving portion 40B that moves on the moving path, a holding portion 40C that holds the cassette 24, and a lifting portion 40D that vertically moves the holding portion 40C. By detecting the encoder driving the motor of the moving part 40B, the position in the moving path 40B can be detected, and the moving part 40B can be moved to an arbitrary position.

(Transport Room) The transfer room 16 is formed adjacent to the storage room 12. On the side of the transfer chamber 16 of the storage chamber 12, a plurality of wafer transfer inlets for transferring wafers W into and out of the transfer chamber 16 are arranged along the horizontal direction, and transfer ports 42 are provided in each Wafers are moved out of the entrance. In the transfer port 42, the mounting table 42B on which the cassette 20 is mounted is moved horizontally to push against the wafer carrying-out port, and the lid of the cassette 20 is used as a lid opening and closing mechanism (lid opening and closing device) by a not-shown The FIMS (Front-Opening Interface Standard) opener is opened. When the lid of the cassette 20 is unfolded, the wafer W is transported toward the inside and outside of the cassette 20 by the substrate transfer machine 86 as a substrate transfer device.

(Processing furnace) A processing furnace 8 is provided above the transfer chamber 16. As shown in FIG. 3, the processing furnace 8 has a heater 46 as a heating means (heating mechanism). The heater 46 has a cylindrical shape, and is vertically installed by being supported by a heating base (not shown) as a holding plate. The heater 46 also functions as an activation mechanism (excitation unit) that activates (excites) the gas by heat as described later.

Inside the heater 46, a reaction tube 50 which is concentric with the heater 46 and constitutes a reaction vessel (processing vessel) is arranged. The reaction tube 50 is made of, for example, a heat-resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC), and is formed in a cylindrical shape with an upper end closed and an open lower end. A processing chamber 54 is formed in the hollow portion of the reaction tube 50. The processing chamber 54 is configured such that a wafer W as a substrate can be accommodated in a state where the wafer boat 58 described later is arranged in a plurality of stages along the vertical direction in a horizontal posture.

In the processing chamber 54, a nozzle 60 is provided so as to penetrate the lower part of the reaction tube 50. The nozzle 60 is made of a heat-resistant material such as quartz or SiC. The gas supply pipe 62 a and the gas supply pipe 62 c are connected to the nozzle 60. In the gas supply pipes 62a and 62c, mass flow controllers (MFCs) 64a and 64c as flow controllers (flow control parts) and valves 66a and 66c as on-off valves are provided in this order from the upstream direction. On the downstream side of the valves 66a, 66c of the gas supply pipes 62a, 62c, gas supply pipes 62b, 62d supplying inert gas are connected, respectively. The gas supply pipes 62b and 62d are respectively provided with MFCs 64b and 64d and valves 66b and 66d in order from the upstream direction. The processing gas supply unit of the processing gas supply system is mainly composed of a gas supply pipe 62a, an MFC 64a, and a valve 66a. In addition, the reaction gas supply unit as the reaction gas supply system is composed of a gas supply pipe 62c, an MFC 64c, and a valve 66c. In addition, the inert gas supply unit as an inert gas supply system is composed of gas supply pipes 62b, 62d, MFC 64b, 64d, and valves 66b, 66d.

The nozzle 60 is provided in an annular space between the inner wall of the reaction tube 50 and the wafer W from the lower part of the inner wall of the reaction tube 50 along the upper part so as to rise upward in the arrangement direction of the wafer W. That is, the nozzles 60 are horizontally surrounding the wafer arrangement region in the lateral direction of the wafer arrangement region where the wafer W is arranged, and are provided along the wafer arrangement region. The nozzle 60 is configured as an L-shaped long nozzle, its horizontal portion is provided so as to penetrate the side wall of the lower portion of the reaction tube 50, and its vertical portion is raised from at least one end side of the wafer arrangement region toward the other end side be set to. A gas supply hole 60A for supplying gas is provided on the side surface of the nozzle 60. The gas supply holes 60A are respectively opened toward the center of the reaction tube 50, and gas can be supplied toward the wafer W. A plurality of gas supply holes 60A are provided from the lower part to the upper part of the reaction tube 50, each having the same opening area and being provided at the same opening pitch.

The reaction tube 50 is provided with an exhaust pipe 68 for exhausting the ambient gas in the processing chamber 54. In the exhaust pipe 68, via a pressure sensor 70 as a pressure detector (pressure detection section) for detecting the pressure of the processing chamber 54 and an APC (Auto Pressure Controller; automatic pressure controller) as a pressure regulator (pressure adjustment section) ) The valve 72 is connected to a vacuum pump 74 as a vacuum exhaust device. The APC valve 72 is a valve constituted as follows: by opening and closing the valve while the vacuum pump 74 is operating, the vacuum exhaust and the vacuum exhaust of the processing chamber 54 can be stopped, and in the state where the vacuum pump 74 is operating, The valve opening can be adjusted according to the pressure information detected by the pressure sensor 70, whereby the pressure of the processing chamber 54 can be adjusted. The exhaust system is mainly composed of an exhaust pipe 68, an APC valve 72, and a pressure sensor 70. It is also conceivable to include the vacuum pump 74 in the exhaust system.

The reaction tube 50 is provided with a temperature detector 76 as a temperature detector. It is configured to adjust the energization status of the heater 46 based on the temperature information detected by the temperature detection unit 76, thereby making the temperature of the processing chamber 54 into a desired temperature distribution. The temperature detection unit 76 is configured like an nozzle 60 in an L-shape, and is provided along the inner wall of the reaction tube 50.

Below the reaction tube 50, there is provided a sealing cover 78 as a furnace mouth cover which can hermetically close the lower end opening of the reaction tube 50. The sealing cover 78 is made of a metal such as SUS or stainless steel, and is a disc-shaped member. On the upper surface of the sealing cover 78, an O-ring 78A as a sealing member that is in contact with the lower end of the reaction tube 50 is provided. In addition, a sealing cover plate 78B that protects the sealing cover 78 is provided on the upper surface of the sealing cover 78 on the inner side of the O-ring 78A. The sealing cover 78B is made of a heat-resistant material such as quartz or SiC, and is a disc-shaped member. The sealing cap 78 is configured to be abutted against the lower end of the reaction tube 50 from the lower side in the vertical direction.

The wafer boat 58 as a substrate supporting device (substrate supporting device) is configured to arrange a plurality of wafers W, for example, 25 to 200 wafers, in a horizontal posture and align the centers with each other in a vertical orientation and It is supported in multiple stages, that is, it is configured to arrange these at intervals. The boat 58 is made of a heat-resistant material such as quartz or SiC.

On the side opposite to the processing chamber 54 of the sealing cover 78, a rotating mechanism 80 as a boat rotating device that rotates the boat 58 is provided. The rotating shaft 80A of the rotating mechanism 80 penetrates the sealing cover 78 and is connected to the wafer boat 58. The rotating mechanism 80 is configured to rotate the wafer W by rotating the wafer boat 58.

As shown in FIG. 4, the device controller (first control means) 210 as a control section (control means) is configured to include a CPU (Central Processing Unit; central processing unit) 212, RAM (Random Access Memory), and random access Memory) 214, storage device 216, and I/O port 218 of the computer. The RAM 214, the storage device 216, and the I/O port 218 are configured to exchange data with the CPU 212 via the internal bus 220. The device controller 210 is connected to an input/output device 222 configured as a touch panel, for example. In addition, the device controller 210 is connected to a monitoring controller 310 as a second control means and a photographing device (hereinafter referred to as a camera) 91, 92, 93, 94, 95 (hereinafter abbreviated as 91~95). Furthermore, the details of cameras 91~95 will be described later.

The storage device 216 is composed of, for example, a flash memory, an HDD (Hard Disk Drive; hard disk drive), or the like. In the storage device 216, a control program for controlling the operation of the substrate processing device, a process recipe describing the sequence and conditions of substrate processing described later, etc. are readable and stored. The process recipes are combined in such a manner that the device controller 210 executes each sequence of substrate processing steps described below to obtain a predetermined result, and functions as a program. Hereinafter, the process recipe or control program will also be integrated and referred to as the program for short. When the term program is used in this manual, there may be a case that includes only process recipe monomers, only a control program monomer, or both. The RAM 214 is a memory area (work area) in which programs and data read by the CPU 212 are temporarily stored.

The I/O port 218 is connected to the aforementioned MFC 64a, 64b, 64c, 64d, valves 66a, 66b, 66c, 66d, pressure sensor 70, APC valve 72, heater 46, temperature detection section 76, vacuum pump 74, A rotating mechanism 80, a boat lift 82 as a boat lifting device, a cassette transport mechanism 40, sensors (detectors) 25B and 28A, a horizontal driving mechanism 26, and the like.

The CPU 212 is configured to read the control program from the storage device 216 and execute it, and read the process recipe from the storage device 216 according to the input of the operation command from the input/output device 222 and the like. The CPU 212 is configured to be controlled in accordance with the content of the read process recipe: the flow adjustment of various gases by MFC 64a, 64b, 64c, 64d; the opening and closing of valves 66a, 66b, 66c, 66d ; By the opening and closing action of the APC valve 72 and the pressure adjustment action of the APC valve 72 of the pressure sensor 70; the start and stop of the vacuum pump 74; the temperature adjustment action of the heater 46 of the temperature detection section 76; by the rotating mechanism The rotation and rotation speed adjustment of the crystal boat 58 by 80; the lifting motion of the crystal boat 58 by the crystal boat elevator 82; the box transporting operation by the box transport mechanism 40; according to the sensor 25B, The driving operation of the horizontal driving mechanism 26 of 28A; and the substrate transport operation by the substrate transfer machine 86 for the wafer boat 58 and the like.

The device controller 210 can be stored on an external storage device (such as a magnetic tape, floppy disk, or hard disk, etc., a CD (Compact Disc; optical disc), or a DVD (Digital Versatile Disc; digital versatile disc), etc. , MO (Magneto-Optical disc; magneto-optical disc) and other magneto-optical discs, USB (Universal Serial Bus; Universal Serial Bus) memory or semiconductor memory such as memory card) 224, the above program is installed on a computer to constitute. The storage device 216 or the external storage device 224 is configured as a computer-readable recording medium. Hereinafter, these are also referred to as a recording medium. When the term recording medium is used in this specification, there are cases where only the storage device 216 is included, only the external storage device 224 is included, or both are included. In addition, the program for the computer can be provided without using the external storage device 224 but using a communication method such as a network or a dedicated line.

Next, the conveyance of the cassette 20 using the substrate processing apparatus 4 described above will be described.

(Carrier loading step: S10) When the cassette 20 is supplied to the AGV port 22 or OHT port 32, the cassette 20 on the AGV port 22 or OHT port 32 is carried into the substrate processing apparatus 4. The loaded cassette 20 is automatically transported by the cassette transport mechanism 40 toward the designated platform 25 of the storage shelf 30 to be handed over, and after being temporarily stored, it is transported from the storage shelf 30 to be received It is transferred to a transfer port 42 or directly transferred to the transfer port 42.

The transfer unit 40B is controlled to move the cassette transport mechanism 40 above the delivery position of the platform 25 on which the AGV port 22 of the cassette 20 to be transported is placed. Here, the upper position of the delivery position refers to a position where the cassette conveying mechanism 40 lowers the holding portion 40C by the lifting portion 40D to hold the cassette 20, that is, a position where the holding portion 40C exists directly above the cassette 20.

Confirm that the cassette transport mechanism 40 is standing by above the delivery position, and move (slide) the platform 25 on which the AGV port 22 of the cassette 20 to be removed is moved to the delivery position. Here, the sliding operation of the AGV port 22 and the driving of the cassette conveying mechanism 40 may be performed simultaneously.

With the sensor 28A, after confirming that the platform 25 has been slid to the handover position, the lifting portion 40D is controlled to lower the holding portion 40C to a position capable of holding the cassette 20, and the holding portion 40C is controlled to remove the cassette 20. maintain. After confirming that the holding portion 40C has held the cassette 20, the lifting portion 40D is controlled to raise the holding portion 40C.

With the sensor 25B of the platform 25, after confirming that the cassette 20 is not mounted on the platform 25, the platform 25 is slid to the mounting position. With the sensor 28A, after confirming that the platform 25 has returned to the mounting position, the cassette transport mechanism 40 is moved to the transfer port 42 of the transfer target or the transfer position of the storage shelf 30.

In the case of being transferred to the transfer port 42, after the cassette transport mechanism 40 is moved above the placement part of the transfer port 42, the lifting part 40D is controlled to lower the holding part 40C, and the cassette 20 is placed on the transfer The loading part of the loading port 42. The placement portion of the transfer port 42 is located directly below the cassette transport mechanism 40, and there is no need to move it horizontally for delivery.

In the case of being transported to the storage shelf 30, the platform 25 of the storage shelf 30 of the transfer destination is horizontally moved (slid) to the handover position, and the sensor 28A confirms that the platform 25 has been slid to the handover After the position, the lifting section 40D is controlled to lower the holding section 40C, and the cassette 20 is placed on the platform 25. Here, the sliding operation of the platform 25 of the storage shelf 30 and the driving of the cassette transport mechanism 40 may be performed simultaneously.

(Cover unfolding step: S11) If the cassette 20 is placed on the mounting portion of the transfer port 42, the lid of the cassette 20 is opened by the FIMS opener as a lid opening and closing mechanism.

(Wafer feeding step: S12) If the lid of the cassette 20 is opened, a plurality of wafers W in the cassette 20 are fed (wafer feeding) to the wafer boat 58 by the substrate transfer machine 86.

(Crystal loading step: S13) If a plurality of wafers W are fed to the wafer boat 58, the wafer boat 58 is carried into (wafer boat loading) to the processing chamber 54 by the wafer boat elevator 82. At this time, the sealing cap 78 is in a state of hermetically closing (sealing) the lower end of the reaction tube 50 via the O-ring 78A.

Next, as a step in the manufacturing process of the semiconductor device (element), a sequence example of a process of forming a film on a substrate using the above-described substrate processing device 4 (hereinafter also referred to as a film forming process) will be described. Here, an example will be described in which a wafer W as a substrate is alternately supplied with a first processing gas (raw material gas) and a second processing gas (reaction gas), thereby forming a film on the wafer W.

Hereinafter, hexachlorodisilazane (Si ₂ Cl ₆ ; abbreviated as HCDS) gas is used as the raw material gas, and ammonia (NH ₃ ) gas is used as the reaction gas to form a silicon nitride film (Si ₃ ) on the wafer W N ₄ film; hereinafter also referred to as SiN film) will be described as an example. In addition, in the following description, the operation of each part constituting the substrate processing apparatus 4 is controlled by the device controller 210.

In the film forming process of this embodiment, the following steps are not simultaneously performed for a predetermined number of times (more than one time), thereby forming a SiN film on the wafer W: supplying HCDS gas to the wafer W in the processing chamber 54 The step of removing the HCDS gas (residual gas) from the processing chamber 54; the step of supplying NH ₃ gas to the wafer W of the processing chamber 54; and the step of removing the NH ₃ gas (remaining gas) from the processing chamber 54.

In addition, the use of the term "substrate" in this specification has the same meaning as the case of the use of the term "wafer".

(Film forming step: S14) The processing chamber 54, that is, the space where the wafer W exists, is evacuated (reduced-pressure exhaust) by the vacuum pump 74 so as to have a predetermined pressure (vacuum degree). At this time, the pressure of the processing chamber 54 is measured by the pressure sensor 70, and the APC valve 72 is feedback-controlled according to the measured pressure information. The vacuum pump 74 maintains a state of constant operation at least until the processing of the wafer W ends.

In addition, the wafer W in the processing chamber 54 is heated by the heater 46 so as to reach a predetermined temperature. At this time, the energization status of the heater 46 is feedback-controlled based on the temperature information detected by the temperature detection unit 76 so that the processing chamber 54 has a predetermined temperature distribution. The heating in the processing chamber 54 by the heater 46 is continuously performed at least until the processing of the wafer W is completed.

In addition, the rotation of the wafer boat 58 and the wafer W by the rotation mechanism 80 is started. The wafer boat 58 is rotated by the rotating mechanism 80, thereby rotating the wafer W. The rotation of the wafer boat 58 and the wafer W by the rotation mechanism 80 is continuously performed at least until the processing of the wafer W is completed.

If the temperature of the processing chamber 54 stably becomes the preset processing temperature, the following two steps, steps 1 to 2, are sequentially performed.

[Step 1] The valve 66a is opened to allow HCDS gas to flow into the gas supply pipe 62a. The flow rate of the HCDS gas is adjusted by the MFC 64a, is supplied to the processing chamber 54 through the nozzle 60, and is discharged from the exhaust pipe 68. At this time, the HCDS gas is supplied to the wafer W. At this time, the valve 66b is simultaneously opened to allow N ₂ gas to flow into the gas supply pipe 62b. The flow rate of the N ₂ gas is adjusted by the MFC 64b, is supplied to the processing chamber 54 together with the HCDS gas, and is discharged from the exhaust pipe 68. By supplying HCDS gas to the wafer W, as the first layer, for example, a silicon-containing (Si) layer having a thickness of less than 1 atomic layer to several atomic layers is formed on the outermost surface of the wafer W.

After the first layer is formed, the valve 66a is closed to stop the supply of HCDS gas. At this time, the APC valve 72 is kept open, and the processing chamber 54 is evacuated by the vacuum pump 74 to discharge the unreacted HCDS gas remaining in the processing chamber 54 or assisting the formation of the first layer from the processing chamber 54. At this time, the valve 66b is kept open, and the supply of N ₂ gas toward the processing chamber 54 is maintained. The N ₂ gas functions as a flushing gas, whereby the effect of exhausting the gas remaining in the processing chamber 54 from the processing chamber 54 can be improved.

[Step 2] After step 1, the wafer W in the processing chamber 54, that is, the first layer formed on the wafer W is supplied with NH ₃ gas. The NH ₃ gas system is activated by heat and supplied to the wafer W.

In this step, the opening and closing control of the valves 66c and 66d is performed in the same order as the opening and closing control of the valves 66a and 66b in step 1. The flow rate of NH ₃ gas is adjusted by the MFC 64c, is supplied to the processing chamber 54 through the nozzle 60, and is discharged from the exhaust pipe 68. At this time, NH ₃ gas is supplied to the wafer W. The NH ₃ gas supplied to the wafer W reacts with at least a portion of the first layer formed on the wafer W in step 1, that is, the Si-containing layer. As a result, the first layer is nitrided without plasma in a hot state and is changed (modified) to become the second layer containing Si and N, that is, a silicon nitride layer (SiN layer). Furthermore, at this time, plasma-excited NH ₃ gas may be supplied to the wafer W, and the first layer may be plasma-nitrided, thereby changing the first layer to the second layer (SiN layer).

After the second layer is formed, the valve 66c is closed, and the supply of NH ₃ gas is stopped. Then, by the same processing sequence as in step 1, the unreacted NH ₃ gas remaining in the processing chamber 54 or assisting the formation of the second layer and reaction by-products are discharged from the processing chamber 54. In this case, it is not necessary to completely exhaust the gas and the like remaining in the processing chamber 54 as in Step 1.

A SiN film with a predetermined composition and a predetermined film thickness can be formed on the wafer W by performing a predetermined number of times (n times) for the cycle that performs the above two steps asynchronously, that is, asynchronously. Furthermore, the above-mentioned cycle is preferably repeated a plurality of times. That is, it is preferable to make the thickness of the second layer (SiN layer) formed when performing the above-mentioned cycle once smaller than the predetermined film thickness, and repeat the above-mentioned cycles a plurality of times until the second layer (by layering) (SiN layer) The thickness of the SiN film formed becomes a predetermined thickness.

After the film formation process is completed, the valves 66b and 66d are opened, and N ₂ gas is supplied from the gas supply pipes 62b and 62d toward the processing chamber 54 and discharged from the exhaust pipe 68. The N ₂ gas functions as a flushing gas. As a result, the processing chamber 54 is washed, and the gas and reaction by-products remaining in the processing chamber 54 are removed (washed) from the processing chamber 54. Thereafter, the ambient gas in the processing chamber 54 is replaced with an inert gas (inert gas replacement), and the pressure in the processing chamber 54 is restored to normal pressure (return to atmospheric pressure).

(Steps to uninstall Jingzhou: S15) After returning to atmospheric pressure, the sealing cover 78 is lowered by the crystal boat elevator 82, and the lower end of the reaction tube 50 is opened. Then, the processed wafer W is carried out from the lower end of the reaction tube 50 to the outside of the reaction tube 50 while being supported by the crystal boat 58 (the crystal boat is unloaded).

(Wafer unloading step: S16) The processed wafer W is taken out from the wafer boat 58 by the substrate transfer machine 86 (wafer unloading).

(Carrier uninstall step: S17) Next, the processed wafer W is stored in the cassette 20 by the substrate transfer machine 86, and the cassette 20 containing the processed wafer W is returned to the loading port (AGV) by the reverse operation of the carrier loading Port 22, OHT port 32), and is recovered by an external transport device.

Next, a device monitoring and control system as the substrate processing system of this embodiment will be described using FIG. 5.

The device monitoring system of this embodiment includes a camera 91 to 95, a monitoring controller 310, a device controller 210, a hub, and an operation unit PC (Personal Computer; personal computer) 400 as an operation unit controller. The monitoring controller 310 stores the image data recorded by the cameras 91 to 95, the hub 309 is connected to the device controller 210, the monitoring controller, and the cameras 91 to 95, and the operation unit PC 400 is connected to the device controller 210 or the monitoring controller 310. In addition, as the operation unit, an operation unit located in the device controller 210 may be used. In addition, in FIG. 5, although the device controller 210, the monitoring controller 310, and the operation section PC 400 are shown as different members, of course, the monitoring controller 310, the operation section PC 400 may also be included in the substrate processing One of the component parts of the device 4. Here, the monitoring controller 310 or the operation unit PC 400 may have the same configuration as the device controller 210. Furthermore, since the monitoring controller 310 synchronizes with the clocks of the cameras 91-95 with an accuracy of msec (millisecond; milliseconds), the monitoring controller 310 can correctly save the image data recorded by the cameras 91-95.

In addition, the device controller 210 and the monitoring controller 310 are installed in a clean room where the substrate processing apparatus 4 is installed, and the operation unit PC 400 is installed in an office or the like that is separate from the clean room. That is, the device controller 210 and the monitoring controller 310 remotely control the operation unit PC 400 remote from the clean room as the input/output device 222. The device controller 210 obtains event data generated when the wafer W is transferred, etc., and alarm data generated when a transfer error occurs. Then, if the event data is acquired, the device controller 210 sends an event notification based on the event data to the monitoring controller 310 and the operation unit PC 400. In addition, the device controller 210 is configured to send an alarm notification including error information based on the alarm data to the monitoring controller 310 and the operation unit PC 400 if a transport error occurs. In addition, it is configured to send an alarm notification containing error information to the management device 402 and the host PC 404 of the customer, etc. by mail, and is configured to be remotely displayed on the display unit of the management device 402 or the host PC 404, etc. The operation unit PC 400 has the same screen as the display unit. Here, the event data refers to data obtained from sensors provided in each transport mechanism such as a transport robot, etc., and represents the carrier loading step, lid unfolding step, wafer feeding step, wafer boat loading step, The film formation step, wafer boat unloading step, wafer unloading step, carrier unloading step and other steps (events) of the wafer transfer start and end time information (event information), and contains the date and time of the event Wait. In addition, the alarm data refers to information (error information) indicating the occurrence of a transfer error caused by the transfer means such as positional deviation, drop, breakage, and transfer residue that occurred during the transfer of the wafer W. It also includes the date and time when the transport error occurred. Specifically, the error information includes information such as the name of the device where the transport error occurred, the alarm ID set for the transport error, and the time when the transport error occurred. Furthermore, the details of the cameras 91~95 will be described later.

As shown in FIG. 6, the monitoring controller 310 is configured to simultaneously acquire the event image data as the first image data to be described later, that is, the H.264 format, by using the image recording program executed by the monitoring controller 310 Motion image (high compression/low image quality motion image), and alarm image data as the second image data described later, namely Motion JPEG (Joint Photographic Experts Group; Joint Photographic Experts Group) or M-JPEG (motion JPEG; hereinafter referred to as MJPEG) format dynamic images (low compression/high-definition dynamic images). In contrast to the alarm image data, which is the image data when a fault such as a transport error occurs, the event image data displays the status when the substrate is transported until the fault such as a transport error occurs, or when the normal substrate that has not failed is transported Image data of the state. The monitoring controller 310 has: a database 311a as an accumulation section for storing a list of event image data and alarm image data; and a memory as a buffer section for temporarily storing dynamic images of event image data and alarm image data, respectively Bodies 312a, 312b; and storage sections 313a, 313b as hard disks that store (store) event image data and alarm image data, respectively. Hereinafter, the storage unit storing event image data is referred to as a first storage unit 313a, and the memory temporarily storing event image data is referred to as a first memory 312a. Then, the storage sections that store each of the cameras 91 to 95 that have separately recorded the alarm image data are referred to as the second storage section 313b, and temporarily store each of the cameras 91 to 95 that have separately recorded the alarm image data. The memory of 95 is called the second memory 312b.

For example, if the monitoring controller 310 receives an event notification indicating the start of the transfer of the wafer W (or cassette 20) from the device controller 210, it starts to record the first image data recorded by the cameras 91 to 95 (event map) Image data) toward the storage of the memory (the first memory 312a). The event image data is collected into a first memory 312a that temporarily stores the image data recorded by the cameras 91 to 95, and is periodically stored in the first storage unit 313a. In this case, if the monitoring controller 310 receives an event notification from the device controller 210 indicating the end of the transfer of the wafer W (or cassette 20), it ends the recording of the first images recorded by the cameras 91 to 95, respectively. The data is stored toward the first memory 312a, and the first image data in the first memory 312a is stored in the first storage unit 313a. For example, if the first memory 312a is full, it is collectively transferred to the first storage unit 313a, or a value may be set to determine the transfer time to the first storage unit 313a in advance. Then, the event image data (the first image data) is converted into a database (DB, database) as a "destination recording information list" described later as a destination directory and event information of the event recording file containing the event image data , Where the "event recording information list". For example, while the event information is registered in the database 311a at the time of the event notification indicating the start, the first storage unit 313a starts to file the event image data. The database 311a is updated at the time of the event notification indicating the end, and at the same time, the end processing of the first storage unit 313a (file closing processing) is performed.

After the monitor controller 310 is activated and connected to the cameras 91 to 95, it starts to store the second image data (alarm image data) for several tens of seconds in each memory (second memory 312b). The structure is as follows: the amount of tens of seconds is used as a ring buffer, the latest image data is overwritten with the oldest image data, and the fixed amount of data of the past tens of seconds is saved at any time. The alarm image data is temporarily stored in the second memory 312b provided for each of the cameras 91 to 95. Then, if the monitoring controller 310 receives from the device controller 210 an alarm notification indicating that a position error, drop, breakage, or transfer residue occurred during the transfer of the wafer W due to a transfer error caused by the transfer means, For the alarm image data stored in the second memory 312b provided for each of the cameras 91 to 95, the predetermined range before and after the transport error occurs, that is, tens of seconds before and after the transport error, for example, transport The data for 20 seconds before and after the error occurs is filed and stored in the second storage section 313b provided for each of the cameras 91 to 95. Although not shown in the figure, the alarm image data is converted into a database (DB) as an "alarm recording information list" described later including a storage destination directory of recording files and error information.

The surveillance controller 310 executes the event recording work and the alarm recording work incorporated in the video monitoring program, and saves the event image data toward the first storage unit 313a, creates the event recording file, and the alarm image data toward the first 2 Storage of the storage unit 313b and production of alarm recording files. Furthermore, when the HDD capacity of the first storage unit 313a is sufficient, or when the camera is still shooting the part to be recorded even when it is not in operation, the event image data may not be based on the device controller 210. It indicates the event notification of the start and end of the transfer by the transfer mechanism, and periodically saves the event image data to the image data recorded at any time in the first storage unit 313a. For example, it is also possible to continuously record N (natural number) days of image data for 24 hours. On the other hand, when the HDD capacity is limited, or when it is desired to cover the image data in the transport operation for as long as possible, the event image data is only recorded during the transport according to the event notification To the first storage section 313a. The recording method of such event image data (first image data) is set separately for each camera 91 to 95.

The moving image format obtained from cameras 91 to 95 is shown in FIG. 7. In the present invention, it is configured that the surveillance controller 310 can be used to simultaneously acquire both H.264 format dynamic images (event image data) and MJPEG format dynamic images (alarm image data) from one camera. A variety of formats of dynamic images (image data). That is, the cameras 91 to 95 respectively record the transfer operation of the wafer W as event image data, and at the same time record the transfer operation of the wafer W as alarm image data that is higher and finer than the event image data.

Here, for example, as shown in FIG. 8, the MJPEG format image (second image data) constitutes a moving image by continuation of one JPEG format image (hereinafter also referred to as a frame). 8 is a moving image in MJPEG format and the boat 58 ascends toward the reaction tube 50, and each frame is displayed from the left side to the right side. There is no dependency between frames in MJPEG. Even if one frame is missed during data transmission, the MJPEG image will not have any impact on the remaining frames, so it is very stable. The advantage of the MJPEG format is that there is no compression other than JPEG compression, and its image quality will not deteriorate. Therefore, for example, when recording in the MJPEG format when a failure occurs during the operation of the conveying mechanism, it is possible to confirm the occurrence of the failure without the image quality (compressed image) of the compressed image (moving image) other than JPEG compression. The shortcomings, because of the complete continuity of the image, can not use video compression technology to compress data. Furthermore, in this embodiment, images of 30 frames are recorded in one second, and are stored in the second storage unit 313b of the monitoring controller 310. That is, when an alarm occurs, high-definition image data about every 33 msec is stored.

As the second image data, BMP (bitmap; bitmap) format or PNG (Portable Network Graphics; portable network graphics) format can also be used. If the JPEG image in the MJPEG format is compared with the H.264 format where recording is not changed as shown in FIG. 9, there is no compression other than JPEG compression, so the image quality is less deteriorated. However, the JPEG compression technology mainly implements the following processing. Therefore, if it is enlarged and displayed, there may be a case where noise in a block unit is seen (destructive compression method). 1. Convert color information from RGB to YCbCr. 2. Decompose the entire pixel into 8×8 square units. 3. Perform DCT (Discrete Cosine Transformation) (frequency analysis) on each block, and quantify the result. 4. Perform zigzag scan on the quantized value and run length coding. 5. The DC component is compressed with DPCM (Differential Pulse code Modulation). 6. Encode it with Huffman coding and output it in the order of the blocks.

No special compression is applied to the BMP format. Although the file size will be larger, the structure is simple and versatile, and the image information can be maintained as it is (distortionless compression method). The PNG format is an image format without distortion compression, so there is no image degradation due to compression. Therefore, if the second image data is recorded in the BNP format or the PNG format, there is no noise in the unit of a block generated during enlarged display, and it is expected to clearly confirm the status. [Table 1]

Here, the first image data is also called MPEG-4 Part 10 AVC (Advanced Video Coding; Advanced Video Coding), the latest MPEG (Moving Picture Experts Group; Motion Picture Experts Group) specification for video coding. H.264 is expected as the next-generation standard for dynamic image compression. As shown in FIG. 7, the data size of H.264 is reduced by more than 80% compared to MJPEG and more than 50% compared to MPEG-4. For example, the storage capacity of the first storage unit 313a can be greatly reduced. In the image frame, you can reduce the amount of data by deleting unnecessary information. For example, as shown in FIG. 9, the unchanging parts in the front and rear frames are reduced. Here, FIG. 9 is in the H.264 format and, as in FIG. 8, the moving image of the boat 58 ascending toward the reaction tube 50 is displayed from left to right every frame. This 1 frame is 0.033 msec similar to the MJPEG format image (second image data). When H.264 format compresses image data, it will separate the changing part from the frame and the static part. The changing part will rewrite the image data at any time with the change of the time axis, and the static part will still change it even if the time changes. It is deemed that the image data has not changed, and the original image data is continued to be used. However, although the compression ratio has been greatly improved, if there is a part where there is a change and a still part is not well separated, there may be cases where noise occurs and the image becomes unclear.

The basic method of the H.264 format is the same as that of MPEG-2, and it is a method that uses discrete cosine transform (DCT) in the motion compensation (MC) motion prediction prediction coding method, that is, the so-called MC+DCT method. The H.264 format is standardized with the goal of achieving ultra-high compression of more than twice that of MPEG-2 or MPEG-4.

In addition, in order to make the image data more compressed, the H.265 format may be used as shown in FIG. 10(B), for example. As shown in FIG. 10(A), the H.264 format blocks the whole picture finely and sends only the changed part to the monitoring controller. That is, the blocks with large changes and the blocks with small changes are sent with the same small blocks. The H.265 format is not fixed to small blocks, making the blocks with large changes to be thinner, and the blocks with relatively small changes to larger blocks, to optimize the compression ratio and reduce the overall amount of information . When the image data in the H.264 format and the H.265 format is applied to a semiconductor manufacturing device, it is not necessary for the purpose of the operator to monitor the flowmeter by screen operation, etc., which generally does not require too high image quality. It is an effective means.

In addition, as shown in FIG. 11(A), the MJPEG format file is usually saved as a single file such as ".avi" or ".mov". That is to say, when playing one file with the player in this format, it cannot be played frame by frame and can only be played at a slow speed.

The alarm recording of the present invention, as shown in FIG. 11(B), uses a still image of 30 frames per second as a JPEG file to output 20 seconds before the failure and 20 seconds after the failure A total of 40 seconds. That is, save 30 frames × 40 seconds = 1200 files of JPEG files. By using this technical solution, the ultra-slow playback method is realized by playing a frame-by-frame 0.033 second interval-only image. Fig. 12 shows a conceptual diagram of playing a frame-by-frame video at 0.033 second intervals. The transport mechanism that transports the wafer W transports three sets (up to 75 wafers W) of cassettes 20 toward the wafer boat 58 in a period of about 9 to 10 minutes. Therefore, the investigation at the time of failure is required to obtain images with shorter intervals for playback.

Some customers will request the storage of moving images for several months (more than 3 months), and in order to meet their requirements, they will use higher compression image data (H.264 format or next-generation H.265 format) recording. However, the highly compressed image data is compressed by the image comparison on the time axis. Therefore, when an important scene at the time of failure is output, there may be an unclear image. In addition, the H.264 format and the H.265 format refer to the information of the frames before and after the creation of the image, so the frame-by-frame playback cannot be performed. Therefore, by simultaneously recording the front and back of the error occurrence in the MJPEG format, and storing the image at the time of the failure with a high-definition image, it can be played frame by frame for confirmation.

Here, the status of the semiconductor substrates such as wafer W being transported is recorded and saved at any time, and when a transport error occurs, etc., the recorded image data is referred to to investigate the main cause of the transport error that occurred.

However, for event data that is recorded at any time even when there is no fault such as a transfer error, if the image data is recorded in the low-compression/high-definition MJPEG format, the storage capacity for storing the image data will change It's huge.

Therefore, in this embodiment, event image data that is recorded at any time even when there is no fault such as a transfer error will be stored in the H.264 format with high compression/low image quality. The alarm image data for video recording in the event of faults such as transport errors will be stored in the low-compression/high-definition MJPEG format.

Next, the photographic points of the cameras 91 to 95 will be described using FIG. 13. The photographic objects of the camera are mainly the transfer mechanism for transferring the wafer W, for example, the transfer port 42, the cassette transfer mechanism 40, the substrate transfer machine 86, and the wafer boat 58. The transfer of the cassette 20 at the transfer port 42 is confirmed, the transfer operation of the cassette is confirmed, the wafer is taken out from the cassette 20, the confirmation of the feeding and unloading toward the wafer boat 58 is moved on the substrate transfer machine 86 The purpose is to confirm the state of the wafer in progress, and to confirm the movement of the wafer boat 58 and the wafer W fed to the wafer boat 58. In addition, moving images and still images are acquired as image data, and these image data are stored in the first storage unit 313a or the second storage unit 313b of the monitoring controller 310. In addition, the cameras 91 to 95 are configured to be automatically based on the movement of the transfer mechanism (photographic object) such as the transfer port 42, the cassette transfer mechanism 40, the substrate transfer machine 86, and the boat 58 and the surrounding environment. Exposure (illumination) control.

Cameras 91 to 95 are used for carrier loading/unloading by the cassette transfer mechanism 40, wafer W feeding/unloading by the substrate transfer machine 86, and wafer boat 58 loading/unloading The acquired moving image (event image data) is stored in the first storage unit 313a. That is, every predetermined time (at every predetermined event), event image data is archived and stored in the first storage unit 313a. For example, the event image data will be archived and accumulated every time the substrate transfer step such as wafer W is loaded/unloaded. In addition, the archival period (the above-mentioned predetermined time) is not limited to each event, but is configured to be set appropriately.

In addition, the monitoring controller 310 is configured to obtain a still image after the FIMS is turned on, after the wafer feeding is completed, and after the wafer boat is unloaded. The reason is that the wafer W is confirmed after the FIMS is turned on and after the transfer step is completed, and at least the occurrence of the abnormality can be grasped only by confirming the still image. In this embodiment, a low-compression and high-definition still image in the same format as the alarm image data is acquired to grasp the detailed status of the transport error. Furthermore, the lid 20 unfolding step performed by the FIMS opener can also be configured to acquire moving images in the same manner as other transport events.

Next, the relationship between the photographic objects of the cameras 91 to 95 and the alarm ID will be described using FIG. 14. FIG. 14 shows a table used to limit the recording situation when a transport error occurs (when a fault occurs) based on the photographing object and alarm ID.

As shown in FIG. 14, when the number of cameras to be installed is set to 5, the alarm ID is set with respect to a transport error that occurs due to each photographic subject. That is, the alarm IDs are associated with the photographing subjects and the cameras 91 to 95, respectively, and the photographing subjects and the cameras 91 to 95 can be specified based on the alarm ID.

The camera 91 (camera number 1) is between the external transport device and the AGV port 22 and the OHT port 32, and photographs the situation in which the cassette 20 as a carrier is transferred. Furthermore, even if a transport error occurs during the handover of the cassette 20, the camera number and the object of photography can still be specified based on the alarm ID. The actual detection means (such as a sensor) for detecting the occurrence of a transport error are respectively provided in the vicinity of the AGV port 22 and the OHT port 32, or the like.

The camera 92 (camera number 2) photographs the transfer of the cassette 20 between the cassette transport mechanism 40 and the transfer port 42. In addition, the camera 92 captures the status of the cassette transport mechanism 40 between the aforementioned carrier loading step and carrier unloading step, that is, between the AGV port 22 and the OHT port 32 and the transfer port 42. That is, it is convenient for a transport error to occur between the carrier loading step and the carrier unloading step, and the camera number and photographing object can still be specified according to the alarm ID. In addition, a sensor that actually detects the occurrence of a transport error is provided in the cassette transport mechanism 40.

The camera 93 (camera number 3) photographs the state in which the lid of the cassette 20 mounted on the mounting portion of the transfer port 42 is expanded by the FIMS opener. That is, it is convenient for errors such as wafer flying out after the FIMS opener is opened, and the camera number and shooting object can still be specified according to the alarm ID. In addition, the sensor that actually detects the occurrence of a transport error is provided in the FIMS opener (cover opening/closing mechanism) located at the transfer port 42.

The camera 94 (camera number 4) and the camera 95 (camera number 5) are between the cassette 20 and the wafer boat 58 in the placement portion of the transfer port 42 to photograph the state of the wafer W being transported by the substrate transfer machine 86 And, between the transfer chamber 16 and the processing furnace 8, the boat 58 is lifted up and down. That is, the camera 94 and the camera 95 photograph the state of the wafer W being transported and the wafer between the above-mentioned wafer feeding step and wafer unloading step, and between the above-mentioned wafer boat loading step and wafer boat unloading step The condition of Zhou 58 being lifted. That is, it is convenient for the transport error to occur between the wafer feeding step and the wafer unloading step, or between the boat loading step and the boat unloading step, and the camera number and photographing object can still be specified according to the alarm ID. In addition, a sensor that actually detects the occurrence of a transport error is provided on the substrate transfer machine 86.

By having the table shown in FIG. 14, the monitoring controller 310 can receive the alarm notification including the alarm ID from the device controller 210 that a transport error has occurred, and can specify the target camera number based on the notified alarm ID. Then, the monitoring controller 310 is limited to the specified camera number to acquire the alarm image data and perform alarm recording (the alarm image data is stored in the second storage unit 313b of each camera number).

Although the alarm recording function of the monitoring controller 310 can obtain high-definition dynamic images (alarm image data), the file capacity becomes larger due to low compression, and the storage portion is occupied. Therefore, by applying the table shown in FIG. 14 corresponding to the alarm ID or camera number defined for the location where the transport error occurs, the effect of reducing the amount of data in the storage section of the monitoring controller 310 is improved.

Next, the flow of monitoring the transfer operation of the substrate processing apparatus 4 by the monitoring controller 310 of this embodiment will be mainly described using FIG. 15. Here, a case where a transfer error (failure) occurs in the wafer unloading step of step S16 will be described as an example. In the following, the case of using the operation unit PC 400 will be described as an example.

(Carrier loading step: S10) When an external computer or the like from the operation unit PC 400 or the like accepts the transfer request of the cassette 20, the device controller 210 sends an event notification indicating a carrier loading start event to the monitoring controller 310. When the monitoring controller 310 receives the event notification, it starts shooting by the camera 91 (camera number 1).

In addition, if the cassette 20 is loaded from the external transport device to the AGV port 22 or the OHT port 32, the device controller 210 may send an event notification indicating a carrier loading start event to the monitoring controller 310.

The camera 91 photographs the situation where the cassette 20 as a carrier is transferred between the external transport device and the AGV port 22 and the OHT port 32. The monitoring controller 310 is configured to store the event image data captured by the camera 91 (event recording) in the first storage unit 313a if the cassette 20 is placed in the AGV port 22 or the OHT port 32.

In addition, the monitoring controller 310 is configured to switch from the camera 91 to the camera 92 (camera number 2) when the cassette 20 is placed in the AGV port 22 or the OHT port 32, and cause the camera 92 to photograph the AGV port 22 and the OHT port The status of the cassette transport mechanism 40 between 32 and the transfer port 42.

If the cassette 20 is placed on the placement portion of the transfer port 42, the device controller 210 sends an event notification indicating that the loading of the carrier has ended to the monitoring controller 310. When the monitoring controller 310 receives the event notification, it ends the photography by the camera 92. Then, the event image data constituted by the camera 92 is stored (event recording) in the first storage unit 313a.

(Cover unfolding step: S11) Next, the step of unfolding the lid of the cassette 20 by the FIMS opener is performed. The device controller 210 sends an event notification indicating the end event of the opening operation of the cassette 20 by the FIMS opener to the monitoring controller 310. Upon receiving the notification of the end event, the monitoring controller 310 causes the camera 93 to take a picture. In addition, the device controller 210 may send an event notification indicating the FIMS on event to the monitoring controller 310, so that it may capture a moving image like other cameras.

(Wafer feeding step: S12) If the transfer request of the wafer W is accepted from an external computer or the like (not shown), the device controller 210 sends an event notification indicating the wafer feed start event to the monitoring controller 310. If the monitoring controller 310 receives the event notification, it will start photography by the camera 94 (camera number 4) or the camera 95 (camera number 5) and create an event recording information list.

The camera 94 or the camera 95 photographs the state where the wafer W is transferred between the cassette 20 and the wafer boat 58 in the mounting portion of the transfer port 42.

If the wafer W is fed to the wafer boat 58, the device controller 210 sends an event notification indicating the wafer feeding end event to the monitoring controller 310. Upon receiving the event notification, the monitoring controller 310 ends the photography performed by the camera 94 or the camera 95.

Then, the event image data constituted by the camera 94 or the camera 95 is stored (event recording) in the first storage unit 313a.

(Crystal loading step: S13) If an instruction request to execute a process recipe is received from an operation section (not shown), the device controller 210 sends an event notification indicating the start of loading of the boat to the monitoring controller 310. When the monitoring controller 310 receives the event notification, it starts shooting by the camera 94 or the camera 95.

The camera 94 or the camera 95 photographs the movement of the wafer boat 58 between the transfer chamber 16 and the processing furnace 8. Furthermore, a camera that photographs the state in which the boat 58 is raised and lowered, and a camera that photographs the transfer of the wafer W between the cassette 20 and the boat 58 may be separately provided.

When the wafer boat 58 is carried into the processing furnace 8, the device controller 210 sends an event notification indicating that the loading of the wafer boat has ended to the monitoring controller 310. Upon receiving the event notification, the monitoring controller 310 ends the photography performed by the camera 94 or the camera 95. Then, the event image data constituted by the camera 94 or the camera 95 is stored (event recording) in the first storage unit 313a.

(Film forming step: S14) Next, the process recipe is executed to perform film formation processing on the wafer W. In this step, the monitoring controller 310 stops the operations of all the cameras 91 to 95. Furthermore, the image data (moving image or image) obtained by the transport event (carrier loading step, lid unfolding step, wafer feeding step, wafer boat loading step) that has been completed so far can be operated by the operation unit PC 400 (Still image) is displayed on the operation screen of the operation unit PC 400 and the like, and the operation is confirmed.

Specifically, as shown in FIG. 16, an event recording information list 405 is displayed on the operation screen of the operation unit PC 400. The event recording information list 405 displays the event information such as the date and time of the event and the content of the event. Then, if the event information recorded in the event recording information list 405 is selected, the beginning of each event is found, and the moving images from the beginning to the end of each event can be played. In addition, when a plurality of batches are stored, a predetermined button can be pressed on the operation screen to compare and display different batches in the same event.

In this way, although the normal operation is confirmed without a transport error, the time difference from the start to the end of the same transport event can be found, and countermeasures can be implemented in advance to prevent the transport error from occurring. Furthermore, normal operation confirmation can also be performed after the substrate processing step is completed.

(Steps to uninstall Jingzhou: S15) At the time point of the wafer boat unloading step transferred to the process recipe, the device controller 210 sends an event notification indicating the boat boat unloading start event to the monitoring controller 310. If the monitoring controller 310 receives the event notification, it will start the photography by the camera 94 or the camera 95.

The camera 94 or the camera 95 photographs the state where the wafer boat 58 is lowered between the transfer chamber 16 and the processing furnace 8.

If the boat 58 is lowered toward the transfer chamber 16, the device controller 210 sends an event notification indicating that the boat unloading is completed to the monitoring controller 310. Upon receiving the event notification, the monitoring controller 310 ends the photography performed by the camera 94 or the camera 95. Then, the event image data constituted by the camera 94 or the camera 95 is stored (event recording) in the first storage unit 313a.

(Wafer unloading step: S16) The device controller 210 sends an event notification indicating a wafer unloading start event to the monitoring controller 310. If the monitoring controller 310 receives the event notification, it will start the photography by the camera 94 or the camera 95.

The camera 94 or the camera 95 photographs the state where the wafer W is transferred between the cassette 20 and the wafer boat 58 in the mounting portion of the transfer port 42. During the transfer of the wafer W between the cassette 20 on the transfer port 42 and the wafer boat 58, if a transfer error occurs, the transfer error occurs before and after tens of seconds, for example, 20 seconds before and after the transfer error occurs The alarm image data will be saved (alarm recording) in the second storage unit 313b of the monitoring controller 310.

In addition, the alarm notification notified from the device controller 210 when a transport error occurs also includes a notification indicating the end of the transport event. However, the notification is an event abend notification indicating that an abnormality has occurred in the transport event. Furthermore, in the present embodiment, the notification of the abnormal end of the event is included in the information of the alarm notification. On the other hand, the device controller 210 may individually notify the monitoring controller 310 and the operation unit PC 400 of the event abnormal end notification and the alarm notification, and the notification method is not particularly limited. In this embodiment, in the wafer unloading step (S16), the image data from the event start notification to the event abnormal end notification (i.e., when a transport error occurs) is archived as event image data. It is stored in the first storage unit 313a of the monitoring controller 310.

Further, the monitoring controller 310 is configured after the lid unfolding step (S11), after the wafer W is transported (after the above-mentioned wafer feeding step (S12)) or after the wafer boat 58 is lowered (the above-mentioned wafer boat unloading step) (After S15) Acquire a still image. At this time, the monitoring controller 310 may also cause the cameras 91 to 95 to take a still image with lower compression and higher definition (MJPEG format) than the event image data, file it and save it in the second storage unit 313b.

Here, the sequence from the occurrence of the transport error to the abnormal analysis will be described in detail using FIG. 17. In addition, the conveying means of the cassette conveying device 40, the substrate transfer machine 86, the wafer boat 58 and the like for conveying the wafer W are respectively installed as detection means for detecting conveying errors that occur during the conveyance of the wafer W Sensor, and the device controller 210 obtains event data.

The monitoring controller 310 saves the alarm image data obtained from the cameras 91 to 95 in the second memory 312b in such a way that it can record the alarm image data tracing back several tens of seconds when a transport error occurs. Then, it is configured that if a conveying error is detected by a sensor (not shown), the device controller 210 acquires alarm data and stops these conveying means.

Then, the device controller 210 notifies the monitoring controller 310 of an error information alarm (S100). The error information includes at least the name of the device where the transport error occurred, the alarm ID indicating the transport error, and the time when the transport error occurred. Here, the device name is not only the information of the specific substrate processing device 4 (name data of the device), but also the specific loading port 22, cassette transport mechanism 40, lid opening and closing mechanism, substrate transfer machine 86, wafer boat 58, rotary Information (name data) of the device constituting the substrate processing device 4 such as the mechanism 80, the boat lift 82, the cameras 91 to 95, and the like. Then, after obtaining the alarm notification, the monitoring controller 310 saves the alarm image data in the tens of seconds before and after the time when the transport error occurs, for example, 20 seconds before and after the transport error occurs, in the low-compression and high-definition MJPEG format. In the second storage unit 313b (S101). That is, the monitoring controller 310 is configured to archive and save (alarm recording) the alarm image data held in the second memory 312b in the second storage unit 313b.

In addition, the device controller 210 notifies, for example, the operation unit PC 400 of the error information alarm at the same time as the monitoring controller 310 (S100). Then, the same failure occurrence screen as that of the failed substrate processing apparatus is displayed on the operation section PC 400 (S102). Then, if the means for displaying the image data recorded by the cameras 91 to 95 on the operation screen (for example, the E-CAM button 410 shown in FIG. 19, etc.) is selected, the monitoring controller 310 will be based on the alarm ID or transport The error information such as the time when the error occurred, causes the alarm information screen including the image data (event image data) at the time of the alarm to be displayed on the operation section PC 400. Here, since the operation unit PC 400 is remotely connected to the monitoring controller 310, the alarm information screen can be displayed on the display unit of the operation unit PC 400 (S103). In this embodiment, the operation screen (alarm information screen) of the operation unit PC 400 is provided with buttons for displaying event image data and/or alarm image data recorded by the cameras 91 to 95. That is, the monitoring controller 310 can perform dynamic image analysis and comparative dynamic image analysis by displaying the event image data or/and alarm image data recorded by the cameras 91 to 95 on the operation screen of the operation unit PC 400 , Error information analysis and other transport error recording analysis (S104). Then, in the operation section PC 400, a worker or the like in the clean room is given a restoration instruction (S105), and the restoration operation of the device in which the transportation error occurs is performed.

Below, FIG. 18 shows a screen display flow executed by the monitoring controller 310 in order to remotely display the operation screen of the operation unit PC 400.

For example, if the monitoring controller 310 refers to a button of a predetermined alarm regarding a transport error (for example, the E-CAM button 410 shown in FIG. 19, etc.) and is pressed on the operation screen of the operation unit PC 400 to obtain an alarm video reference notification, The alarm recording information list is searched (step S20). Then, the object error information such as the retrieved result, the destination directory of the alarm recording file of the object alarm image data, the event information when the transportation error occurs, and the retrieval result are saved (step S21). Here, the event information of the object error information refers to the carrier loading step, lid unfolding step, wafer feeding step, boat loading step, film forming step, boat unloading step, wafer unloading step, carrier unloading The point in time of any of the steps. In addition, in this embodiment, since the monitoring controller 310 is synchronized with the clocks of the cameras 91 to 95, the image data recorded by the cameras 91 to 95 at the start of event information or when a transport error occurs The starting time points are consistent (at least fine-tuning is possible). The details will be described later.

Then, if the two screen display buttons are pressed on the operation screen of the operation unit PC 400, the monitoring controller 310 refers to the target error information when it is convenient for the two screen switching process (step S22), and will be stored in the second storage unit The alarm image data of 313b is displayed on the right screen (step S23). Then, obtain the event information when the transport error of the target error information occurs (step S24), obtain the search destination directory and event information retrieval result of the event recording file with the same event information from the event recording information list, and save it to the event recording candidate Information (step S25).

Then, when there is no display candidate that matches the event information in the event recording candidate information (NO in step S26), the left screen of the operation screen of the operation unit PC 400 is displayed with the same date and time stamp as the time when the transport error occurred. Event recording information list of event image data (step S27).

Then, when there is a display candidate that matches the event information in the event recording candidate information (YES in step S26), obtain the event recording stored with the event image data having the same event information as the transfer error occurred from the event recording candidate information The information list is displayed on the left screen (step S28).

Then, if the event recording file to be played simultaneously is selected from the list display on the left screen, the event image data stored in the second storage unit 313a is displayed with reference to the selected event recording file (step S29). That is, the monitoring controller 310 displays both the event image data and the alarm image data on the same screen. Then, if the simultaneous playback buttons on the two screens are pressed, the alarm image data and the event image data are played synchronously on the left and right screens (simultaneous playback) (step S30).

Furthermore, the above two screens display and simultaneous playback are not limited to alarm image data and event image data. Two screens can be displayed on the same screen and the alarm image data or event image data can be played simultaneously. Contributes to the analysis of faulty transport errors.

Specifically, if the operation unit PC 400 that is remotely connected to the monitoring controller 310 to display the operation screen obtains the alarm notification, as shown in FIG. 19, the same failure as the operation unit of the device controller 210 is displayed on the operation screen Information screen. The failure information screen of FIG. 19 includes a rough appearance display portion 407 of the rough appearance of the display device, and a failure information display portion 409 displaying failure information such as transport errors. Then, it is configured to be able to grasp the device in which the transport error occurred, the location of the transport error, the content of the transport error, etc., by the display contents of the outline appearance display unit 407 and the fault information display unit 409. In addition, the failure information screen shown in FIG. 19 includes a means (E-CAM button) 410 for displaying the image data captured by the cameras 91 to 95. In addition, if, for example, the E-CAM button 410 of FIG. 14 is pressed on the operation screen of the operation unit PC 400, the transport error by the camera that shoots the location where the transport error occurs as shown in FIG. 20 The live video screen (event image data) is displayed. This live video screen is a still image when recording is ended together with an alarm notification. That is, in the case where the transfer residue of the wafer W is detected in the wafer unloading step, for example, it is possible to confirm the situation when the transfer residue occurs. In addition, in the operation screen shown in FIG. 20, it is possible to rewind the video image, play the video image by the play button, or play the frame-by-frame playback by the frame-by-frame button.

In addition, FIG. 20 shows a search box 406 and an alarm list 408 for searching the alarm ID. The alarm list 408 contains at least the date and time of the transport error and the alarm ID. If the alarm ID or the time when the transport error occurs is selected from the alarm list 408, the corresponding camera's second storage unit 313b is retrieved from the selected alarm ID and time stamp, which is more than the live video screen (event image data) The moving images (alarm image data) of tens of seconds before and after the high-definition transportation error occurs are displayed, and the details of the occurrence of the alarm cause can be confirmed by referring to the high-definition alarm image data.

Further, as shown in FIG. 20, two screen display A buttons 411 and two screen display B buttons 412 are provided as comparison reference buttons on the transport error occurrence screen. Then, it is configured such that the A button 411 is pressed by two screen displays, and two screens for comparative reference are displayed as shown in FIG. 21. That is, the list can select files with low-compression and high-definition alarm image data to be displayed on the operation screen, and the desired file can be selected for comparison with other low-compression and high-definition alarm image data on the same day display. Furthermore, it can also be compared and displayed with alarm image data of the same alarm ID but transport errors that occurred at different dates and times. In this way, it can be analyzed whether the main factors causing the transport error are the same main factor or different main factors.

In addition, in the transport error occurrence screen shown in FIG. 20, by displaying the B button 412 on two screens, as shown in FIG. 22, two screens can be used to perform normal operations and The abnormal actions that occur when a transport error occurs are compared and displayed.

Specifically, the event label display of the event recording file is used as a reference to select event image data to be played simultaneously with the transport error occurrence screen on the right. Then, press the two-screen simultaneous playback button 414 to simultaneously play the dynamic image of the normal high-compression event image data on the left and the low-compression and high-definition alarm image data on the right. In the case of simultaneous playback while the images are not aligned, use the moving picture operation buttons shown in the figure to make adjustments. That is, by comparing and displaying the abnormal operation and the normal operation when the transport error occurs, it is possible to analyze what is different from the normal operation.

In addition, on the transport error occurrence screen shown in FIG. 20, the target alarm moving image is selected from the displayed alarm list 408, and the B button 412 is displayed on two screens. Then, the database 311a is searched based on the playback start time stamp of the selected alarm moving image (time stamp of the alarm occurrence time-20 seconds) and the target camera name, and the first image is retrieved from the first storage unit 313a Information (event image data) file. Automatically find the beginning of the first image data with the playback start time stamp and display it on the left. The operator can operate the first image data on the left to confirm the moving image until the transport error occurs. In addition, the event label display can be used as a reference to select and play a moving image until a transport error occurs.

In this way, the moving images until the transport error occurs can be used as event image data, and the moving images before and after the transport error (20 seconds before the alarm and 40 seconds after the alarm occurs) can be used as the alarm Image data and display these on the screen.

According to the present embodiment, since the event image data is stored as a moving image in the H.264 format, the data will be compressed if it is normal operation. On the other hand, as long as there are parts that differ between the frames, specifically, as long as there is a part that does not change in the normal transfer operation and a part that changes just before a transfer error occurs, it can be recorded without missing. , And you can confirm the change of the event image data until the transportation error.

In addition, when displaying a moving image or a still image captured by a camera, it is not only the photographing means of the photographic subject, but also the surrounding environment. In this way, even if the conveying means is not the direct cause, but the error caused by the parts around the conveying means of the photographic subject, as long as it is within the range of the camera (as long as it is displayed in the event image data or alarm image data), By analyzing the image to find the main factor of the error.

Then, the person in charge of the device confirms the moving image or static image displayed on the display unit of the operation unit several times to analyze the alarm recording, so as to grasp the situation of the transport error and determine the recovery method, and by telephone , Email, etc. to restore instructions. Thereafter, the operator performs the device restoration operation according to the instructions. Furthermore, the operation unit may be arranged at a position away from the factory where the substrate processing apparatus 4 is arranged. In this case, the person in charge of the device instructs the operator or device engineer in the clean room to respond to the device recovery, and the worker or device engineer performs the device recovery operation according to the instructions.

(Carrier uninstall step: S17) Then, if the error is resolved by the recovery process in the wafer unloading step, the next carrier unloading step starts the opposite operation to the carrier loading as usual. If the monitoring controller 310 receives a start event, it causes the camera 91 to start recording of event image data, and if it receives an end event, it causes the camera 91 to end recording of event image data. The monitoring controller 310 is configured to store the event image data acquired by the camera 91 in the first storage unit 313a and update the event recording information list during the carrier unloading step.

According to this embodiment, at least one of the following effects (a) to (d) can be exerted.

(a) According to the present embodiment, it is possible to obtain high-definition image data separately from the image data during the substrate transfer when the transfer error occurs while acquiring the image data during the substrate transfer, and when analyzing the transfer error By using the respective image data, it is possible to analyze the transport error (fault analysis).

(b) In the present embodiment, it is configured to not only notify the device controller 210 of the event signal from the sensor provided to each transport mechanism such as a transport robot for each event indicating the start time of wafer transport, etc. , And also notify the operation unit of the event signal. By this, the operation part judges whether the event information is in accordance with the camera setting part at the end time of the event, and finds the beginning with the event occurrence time of the event recording file stored in the storage part, and can confirm the normal In addition, the dynamic images of multiple event information (event image data) can be compared and displayed simultaneously.

(c) In the present embodiment, it is configured that if the matching event information is selected from the event recording information list of the monitoring controller 310, the dynamic image (event image data) acquired by the camera since the time of the event is Play. In this way, according to the basic configuration of setting the cameras 91 to 95 for each event, by recording only during the operation of the device (or the movement of each transfer means for transferring the wafer W), it can be compared with the case of recording at any time, so that The camera recording period becomes longer.

(d) In this embodiment, since the event recording information file and the alarm recording file are selected separately, they can be displayed on the same operation screen, so it is possible to find out the main factor of the transport error (fault).

Furthermore, the present invention is not limited to the above embodiments, and of course various changes can be made without departing from the scope of the gist.

(Other embodiments) For example, according to the above embodiment, the data acquisition period is 30 frames per second, the second image data is directly stored in the second storage unit 313b, and the first image data is the images before and after the frame The data is compared and the image data is compressed by the presence or absence of data changes, and stored in the first storage unit 313a. However, it is not limited to this embodiment.

(Example 1) Although the data acquisition period is 30 frames per second in the same manner as the above-described embodiment, the resolutions of the first image data and the second image data are different. For example, even if the first image data is set to 1600×900 pixels and the second image data is set to 3840×2160 (4K) pixels, the same effect as the present embodiment can be exerted. In addition, by using the multi-streaming function of sending the first image data and the second image data at the same time, it can be implemented with one camera.

(Example 2) The data acquisition period of the first image data and the second image data can be changed. For example, the first image data can be set to 3 frames per second, and the second image data can be set to be the same as in this embodiment. 30 frames per second. In this way, the first image data can be set to the data amount of 1/10 of the second image data. In addition, since the processing of the second image data is the same as in this embodiment, the same effects as in this embodiment can be achieved.

In the embodiments of the present invention, the wafer processing has been described, but the present invention can be applied to all substrate processing apparatuses that process substrates such as glass substrates, magnetic disks, or optical disks of liquid crystal panels.

4: Processing device (substrate processing device) 8: Treatment furnace 12: containment room 14: Cartridge transfer area 16: Transfer room 20: BOX (FOUP) 22: AGV port (loading port) 22A: Move out of the entrance 24: Cartridge 25: Platform 25B, 28A: Sensor (detector) 26: Horizontal drive mechanism 30: Storage scaffold 30A, 30B: Storage shelf (box shelf) 32: OHT port 40: Cartridge transport mechanism (cartridge transport device) 40A: Rail mechanism 40B: Transition Department (travel path) 40C: Holding Department 40D: Lifting Department 42: Transfer port 42B: Mounting table 46: Heater 50: reaction tube 54: processing room 58: Crystal Boat 60: Nozzle 60A: Gas supply hole 62a, 62b, 62c, 62d: gas supply pipe 64a, 64b, 64c, 64d: MFC (mass flow controller) 66a, 66b, 66c, 66d: valve 68: Exhaust pipe 70: pressure sensor 72: APC valve 74: Vacuum pump 76: Temperature detection section 78: sealing cap 78A: O-ring 78B: Sealing cover 80: Rotating mechanism 80A: Rotating axis 82: Crystal Boat Lift 86: substrate transfer machine 91, 92, 93, 94, 95: camera (recording method) 210: device controller 212: CPU 214: RAM 216: Storage device 218: I/O port 220: Internal bus 222: I/O device 224: External storage device 309: hub 310: monitoring controller 311a: database 312a: 1st memory 312b: 2nd memory 313a: First storage unit 313b: Second storage unit 400: operation department PC 402: Management device 404: Host PC 405: Event recording information list 406: search frame 407: General appearance display unit 408: Alarm list 409: Fault information display section 410: E-CAM button 411: A button displayed on 2 screens 412: 2 screens display B button 414: Simultaneous playback button on 2 screens W: Wafer

FIG. 1 is an oblique perspective view of a storage room that can be preferably applied to the first embodiment of the present invention. 2 is a cross-sectional view of a substrate processing apparatus that can be preferably applied to the first embodiment of the present invention. 3 is a schematic configuration diagram of an upright processing furnace that can be preferably applied to a substrate processing apparatus according to an embodiment of the present invention, and is a longitudinal cross-sectional view of a portion of the processing furnace. 4 is a schematic configuration diagram of a controller that can be preferably applied to a substrate processing apparatus according to an embodiment of the present invention, and a block diagram showing a control system of the controller. FIG. 5 is a diagram showing the system configuration of a controller that can be preferably applied to an embodiment of the present invention. FIG. 6 is a diagram for explaining the structure of a program executed by a monitoring controller, in which the monitoring controller processes image data recorded by a recording means that can be preferably applied to an embodiment of the present invention. 7 is a diagram illustrating image data recorded by the recording means that can be preferably applied to an embodiment of the present invention. FIG. 8 is a diagram for explaining the MJPEG format. FIG. 9 is a diagram for explaining the H.264 format. FIG. 10(A) is a diagram for explaining the H.264 format, and FIG. 10(B) is a diagram for explaining the H.265 format. 11(A) and (B) are diagrams for explaining the preservation of files in MJPEG format. FIG. 12 is a diagram for explaining the frame-by-frame playback of the alarm video. FIG. 13 is a diagram for explaining a recording method that can be preferably applied to an embodiment of the present invention. FIG. 14 is a diagram for explaining a recording method that can be applied to an embodiment of the present invention. 15 is a diagram illustrating the flow of an image monitoring program that can be preferably applied to an embodiment of the present invention. FIG. 16 is a diagram example of an event start finding function that can be preferably applied to an embodiment of the present invention. FIG. 17 is a diagram illustrating the main part of the flow of the image monitoring program that can be preferably applied to an embodiment of the present invention. FIG. 18 illustrates a sequence of comparison screen display functions that can be preferably applied to an embodiment of the present invention. FIG. 19 is a diagram example of an operation screen that can be preferably applied to a device controller according to an embodiment of the present invention. FIG. 20 is an example of a diagram that can be preferably applied to an alarm ID (Identification) search screen display according to an embodiment of the present invention. FIG. 21 is a diagram example of a comparison screen display that can be preferably applied to an embodiment of the present invention. FIG. 22 is a diagram example of a comparison screen display that can be preferably applied to an embodiment of the present invention.

4: Processing device (substrate processing device)

20: BOX (FOUP)

22: AGV port (loading port)

22A: Move out of the entrance

30A, 30B: Storage shelf (box shelf)

32: OHT port

40: Cartridge transport mechanism (cartridge transport device)

40A: Rail mechanism

42: Transfer port

Claims (9)

A substrate processing system including: The first control means, which obtains the event data generated when the substrate is transported and the alarm data generated when the transport error occurs; The recording means records the conveyance of the substrate as the first image data, and records the conveyance of the substrate as the second image data with a higher resolution than the first image data; The second control means causes the first storage section to store the first image data recorded by the recording means based on the event data, and causes the second storage section to store the recording means based on the alarm data The second image data recorded; and An operation unit that displays at least the first image data and the second image data; and The second control means displays both the first image data and the second image data recorded when the transport error occurred on the same screen. The substrate processing system according to claim 1, which further includes: Transport means, which transports the substrate; and A detection means, which detects the above-mentioned transportation error occurred in the above-mentioned transportation means; and The first control means is configured to obtain a notification indicating the transport error from the detection means, and notify the second control means and the operation unit that at least the name of the device in which the transport error has occurred and the setting for the transport error are set The alarm ID and error information at the time when the above transport error occurred. The substrate processing system according to claim 2, wherein the second control means is configured to: while acquiring the error information, file and store the second image data of a predetermined amount of time before and after the occurrence of the conveying error In the second storage unit, the operation unit displays the same screen as the operation screen of the device in which the transport error occurred based on the error information, and displays the acceptance to cause the first image data acquired by the recording means to be displayed in the Means of instruction for the same picture. The substrate processing system according to claim 2, wherein the second control means is configured to switch to include the time when the transport error occurs when receiving an instruction to display the first image data acquired by the recording means Click the screen of the first image data and the error information to display the operation section. The substrate processing system according to claim 2, wherein the second control means is configured to, when accepting the selection instruction of the alarm ID and/or the time of occurrence, cause the operation section to display the selected alarm by using the selected alarm The second image data obtained in the second storage unit is retrieved by ID and/or the occurrence time. The substrate processing system according to claim 1, wherein the detection means indicates the event data indicating the start and end of the transfer of the substrate by the transfer means, When the event data is detected by the detection means, the first control means notifies the event data to the second control means, The above-mentioned second control means is configured to save the first image data in which the beginning to the end of the transportation of the substrate is recorded in the first storage when it is notified of the event data that the transportation of the substrate has ended unit. The substrate processing system according to claim 2, wherein the second control means is configured to retrieve the second image data obtained by searching the second storage unit with the alarm ID and/or the occurrence time, and The first image data stored in advance in the first storage unit and recorded from the beginning to the end of the transfer operation of the substrate is displayed on the same screen. A substrate processing device including: The first control means, which obtains the event data generated when the substrate is transported and the alarm data generated when the transport error occurs; The recording means records the conveyance of the substrate as the first image data, and records the conveyance of the substrate as the second image data with a higher resolution than the first image data; The second control means causes the first storage section to store the first image data recorded by the recording means based on the event data, and causes the second storage section to store the recording means based on the alarm data The second image data recorded; and An operation unit that displays at least the first image data and the second image data; The second control means is configured to display both the first image data and the second image data recorded when the transport error occurs on the same screen. A manufacturing method of a semiconductor device, which has a step of transferring a substrate and a step of processing the substrate; wherein, The above step of transferring the substrate further includes: Steps to obtain the event data generated during the transportation of the above-mentioned substrate and the alarm data generated when a transportation error occurs; While recording the transfer operation of the substrate as the first image data, while acquiring the transfer operation of the substrate as the second image data having a higher resolution than the first image data, the first storage unit is The above event data is used to store the first image data acquired respectively, and the second storage unit stores the second image data according to the alarm data, and stores the image data in the first storage unit Storage steps with the second storage unit; and The display step of displaying the first image data or the second image data; and In the display step, both the first image data and the second image data recorded when the transport error occurred are displayed on the same screen.

Images