JP2021144597A - Alarm display device - Google Patents

Abstract

To provide an alarm display device capable of displaying information assisting in specifying a cause of issuance of an alarm.SOLUTION: An alarm display device 60 comprises: a data storage unit 64 in which alarm code data associated with each of a plurality of alarms is preliminarily stored; a data collection unit 62 which collects alarm detail information data including at least the alarm code data and a combination of EES data and register data, which are associated with the alarm code data and collected during a prescribed time; an alarm data storage unit 64b in which, in response to issuance of an alarm, alarm detail information data corresponding to the alarm is stored; a display unit 65 capable of displaying the alarm detail information data stored in the alarm data storage unit 64b; and a processing unit 61 which makes a graph of measurements of a monitoring sensor included in the alarm detail information data stored in the alarm data storage unit 64b and causes the display unit to display the graph.SELECTED DRAWING: Figure 4

Description

The present invention relates to an alarm display device mounted on a device such as a substrate processing device.

In recent years, various substrate processing devices have been used to perform various processing on substrates such as semiconductor wafers. Examples of this type of substrate processing apparatus include a substrate polishing apparatus that performs a substrate polishing process.

A CMP (Chemical Mechanical Polishing) apparatus, which is an example of a substrate polishing apparatus, is used in a process of polishing the surface of a substrate such as a wafer in the manufacture of a semiconductor device. The CMP apparatus includes a polishing unit for polishing a substrate, a cleaning unit for cleaning a substrate, a drying unit for drying a substrate after cleaning, and a substrate for passing between these units. It is equipped with a transport unit and the like. The CMP apparatus is equipped with a large number of devices in each unit in order to realize various functions including polishing, cleaning, drying, and transporting the substrate.

Further, the CMP device is equipped with various sensors for directly or indirectly monitoring the operation of a large number of devices, and the control unit of the CMP device is a unit based on the measured values sent from the various sensors. Control the operation of the equipment inside. For example, the control unit controls the opening degree of the valve arranged in the pipe through which the fluid flows so that the measured value of the flow rate of the liquid sent from the flow rate sensor matches a predetermined target value. Further, the control unit determines whether or not a defect (error) has occurred in the CMP device based on the measured values sent from various sensors, and if a malfunction occurs, an alarm is issued. For example, when the flow rate of the liquid exceeds the upper limit value or the lower limit value set for the target value for a predetermined time, the control unit issues an alarm for an abnormality in the flow rate of the fluid.

Japanese Unexamined Patent Publication No. 2015-88591

In recent years, the number of inquiries about the detection conditions of alarms issued from CMP devices has been increasing. Depending on the inquired alarm and the occurrence status of the alarm, the alarm detection condition may be investigated from the program stored in the control unit. Further, in order to identify the cause of the occurrence of the alarm, the operation data such as the operation log and / or the control log of the CMP device may be analyzed in cooperation with the user of the CMP device. This type of research and analysis is a relatively laborious task and requires time savings.

Further, if a long time has passed since the alarm was generated, the operation data at the time of the alarm may be automatically deleted, and it may be difficult to identify the cause of the alarm. Further, when the operation data of the CMP device is stored in the centralized monitoring device of the user or the like, the viewing and analysis of the operation data may not be permitted by the user.

The above-mentioned problem that occurs when trying to identify the cause of the alarm is not limited to the CMP device, but may occur in all devices provided with a large number of devices. For example, a similar problem occurs in a substrate polishing apparatus that polishes a peripheral portion (also referred to as a bevel portion) of a substrate and a substrate plating apparatus that performs a plating treatment on the surface of a substrate.

Therefore, an object of the present invention is to provide an alarm display device capable of displaying information useful for identifying the cause of an alarm.

In one aspect, an alarm display device provided in a device equipped with a large number of devices, a data storage unit that stores alarm code data associated with each of the plurality of alarms in advance, the alarm code data, and the alarm code data. A data collection unit that collects at least detailed alarm information data including a combination of EES (Equipment Engineering System) data and register data associated with the alarm code data and collected during a predetermined time, and an alarm have occurred. Occasionally, an alarm data storage unit that stores the alarm detailed information data corresponding to the alarm, a display unit that can display the alarm detailed information data stored in the alarm data storage unit, and a display unit that can display the alarm detailed information data stored in the alarm data storage unit are stored. Provided is an alarm display device including a processing unit that graphs measured values of a monitoring sensor included in the detailed alarm information data and displays them on the display unit.

In one aspect, the data storage unit stores in advance the alarm coping method associated with each of the alarm code data, and the alarm detailed information data includes the alarm coping method, and the processing. The unit displays the alarm coping method on the display unit.
In one aspect, the processing unit creates a moving image of the operating state of the device immediately before the alarm is generated based on the EES data and the register data, and displays the moving image on the display unit.
In one aspect, when the processing unit can identify the cause of the alarm, the processing unit causes the display unit to display the cause of the alarm.

According to the present invention, when an alarm is issued, the alarm detailed information data corresponding to the alarm is stored in the alarm data storage unit. Therefore, when identifying the cause of the alarm at a later date, the alarm detailed information data is referred to. can do. Further, since the graph of the measured value of the monitoring sensor related to the alarm can be displayed on the display unit, the graph can be used as a visual aid for identifying the cause of the alarm.

FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus according to the embodiment. FIG. 2 is a perspective view schematically showing an example of the polishing unit shown in FIG. FIG. 3A is a schematic view showing an example of a sensor arranged in the polishing unit shown in FIG. 2, and FIG. 3B is another example of a sensor arranged in the polishing unit shown in FIG. It is a schematic diagram which shows. FIG. 4 is a block diagram schematically showing an alarm display device according to an embodiment. 5 (a) is a schematic diagram showing an example of alarm code data, FIG. 5 (b) is a schematic diagram showing another example of alarm code data, and FIG. 5 (c) is a schematic diagram showing alarm code data. It is a schematic diagram which shows still another example of. FIG. 6 is a schematic diagram showing an example of the alarm history displayed on the display unit. FIG. 7 is a schematic view showing an example of alarm individual information displayed on the display unit when the polishing head position abnormality shown in FIG. 6 is selected. FIG. 8 is an example of a graph of measured values of the monitoring sensor displayed on the display unit. FIG. 9 is a schematic diagram showing another example of alarm individual information. FIG. 10A is an example of a graph of measured values of the flow meter which is the alarm monitoring sensor shown in FIG. 9, and FIG. 10B is the measurement of the pressure gauge which is the alarm monitoring sensor shown in FIG. This is an example of a value graph. FIG. 11 is a schematic diagram for explaining an example of a moving image of the operating state of the substrate polishing apparatus immediately before the alarm is generated. FIG. 12 is another example of a graph of measured values of the flow meter, which is the alarm monitoring sensor shown in FIG. FIG. 13 is a schematic diagram showing an example of alarm occurrence cause information to be displayed on the display unit.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus according to the embodiment. The substrate processing apparatus shown in FIG. 1 is a substrate polishing apparatus (CMP apparatus) that executes a series of polishing processes of polishing the surface of a wafer, which is an example of a substrate, cleaning the polished wafer, and drying the cleaned wafer. Is. Hereinafter, the substrate polishing apparatus shown in FIG. 1 will be described as an example of the substrate processing apparatus.

As shown in FIG. 1, the substrate polishing apparatus includes a substantially rectangular housing 10 and a load port 12 on which a substrate cassette accommodating a large number of wafers (substrates) is placed. The load port 12 is arranged adjacent to the housing 10. An open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod) can be mounted on the load port 12. SMIF and FOUP are airtight containers that can maintain an environment independent of the external space by storing the substrate cassette inside and covering it with a partition wall.

Inside the housing 10, a plurality of (four in this embodiment) polishing units 14a to 14d for polishing the wafer, a first cleaning unit 16 for cleaning the polished wafer, and a second cleaning unit 18 are cleaned. A drying unit 20 for drying the wafer is housed. The polishing units 14a to 14d are arranged along the longitudinal direction of the substrate processing apparatus, and the cleaning units 16 and 18 and the drying unit 20 are also arranged along the longitudinal direction of the substrate processing apparatus.

In the present embodiment, the substrate polishing apparatus includes a plurality of polishing units 14a to 14d, but the substrate polishing apparatus is not limited to this example. For example, the substrate polishing apparatus may have one polishing unit. Further, the substrate polishing apparatus includes a bevel polishing unit for polishing the peripheral portion (also referred to as a bevel portion) of the substrate in place of the plurality of or one polishing unit, or in addition to the plurality of or one polishing unit. May be.

The first substrate transfer robot 22 is arranged in the area surrounded by the load port 12, the polishing unit 14a, and the drying unit 20, and the substrate transfer device 24 is arranged in parallel with the polishing units 14a to 14d. The first substrate transfer robot 22 receives the substrate before polishing from the load port 12 and passes it to the substrate transfer device 24, and receives the dried substrate from the drying unit 20 and returns it to the load port 12. The substrate transfer device 24 conveys the substrate received from the first substrate transfer robot 22 and transfers the substrate between the polishing units 14a to 14d. Each of the polishing units 14a to 14d polishes the surface of the substrate by sliding the substrate against the polishing surface while supplying the polishing liquid (slurry) to the polishing surface.

A second substrate transfer robot 26 that transfers a substrate between the cleaning units 16 and 18 and the substrate transfer device 24 is arranged between the first cleaning unit 16 and the second cleaning unit 18, and the second cleaning is performed. A third substrate transfer robot 28 that transfers a substrate between the units 18 and 20 is arranged between the unit 18 and the drying unit 20. The first substrate transfer robot 22, the substrate transfer device 24, the second substrate transfer robot 26, and the third substrate transfer robot 28 are of the load port 12, the polishing units 14a to 14d, the cleaning units 16 and 18, and the drying unit 20. A substrate transfer unit for transferring wafers between them is configured.

In the present embodiment, as the first cleaning unit 16, a substrate cleaning device for scrubbing the substrate by rubbing roll sponges on both the front and back surfaces of the substrate in the presence of a chemical solution is used, and as the second cleaning unit 18, a pen is used. A substrate cleaning device using a mold sponge (pen sponge) is used. In one embodiment, as the second cleaning unit 18, a substrate cleaning device that scrubs the substrate by rubbing roll sponges on both the front and back surfaces of the substrate in the presence of a chemical solution may be used. Further, as the drying unit 20, a spin drying device is used which holds the substrate, ejects IPA steam from a moving nozzle to dry the substrate, and further rotates the substrate at a high speed to dry the substrate.

The substrate is polished by at least one of the polishing units 14a-14d. The polished substrate is cleaned by the first cleaning unit 16 and the second cleaning unit 18, and the washed substrate is further dried by the drying unit 20. In one embodiment, the polished substrate may be cleaned by either the first cleaning unit 16 or the second cleaning unit 18.

FIG. 2 is a perspective view schematically showing an example of the polishing unit 14a shown in FIG. Since the polishing units 14a to 14d of the substrate polishing apparatus shown in FIG. 1 have the same configuration as each other, the polishing unit 14a will be described below.

The polishing unit 14a shown in FIG. 2 has a polishing table 35 to which a polishing pad 33 having a polishing surface 33a is attached, and a polishing head (top) that holds the wafer W and presses the wafer W against the polishing pad 33 on the polishing table 35. 37), a polishing liquid supply nozzle 38 for supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad 33, and a dresser for dressing the polishing surface 33a of the polishing pad 33. It includes a dressing device 40 having 41.

The polishing table 33 is connected to a table motor 31 arranged below the table shaft 35a via a table shaft 35a, and the table motor 31 rotates the polishing table 35 in the direction indicated by the arrow. A polishing pad 33 is attached to the upper surface of the polishing table 35, and the upper surface of the polishing pad 33 constitutes a polishing surface 33a for polishing the wafer. The polishing head 37 is connected to the lower end of the head shaft 36. The polishing head 37 is configured so that the wafer W can be held on the lower surface thereof by vacuum suction. The head shaft 36 is moved up and down by a vertical movement mechanism (not shown).

The head shaft 36 is rotatably supported by the head arm 42, and the head arm 42 is driven by a head swivel motor 54 and is configured to swivel around a head swivel shaft 43. By driving the head swivel motor 54, the polishing head 37 moves between the polishing position above the polishing pad 33 and the standby position on the side of the polishing pad 33.

Polishing of the wafer W is performed as follows. The polishing head 37 and the polishing table 35 are rotated in the directions indicated by the arrows, respectively, and the polishing liquid (slurry) is supplied onto the polishing pad 33 from the polishing liquid supply nozzle 38. In this state, the polishing head 37 presses the wafer W against the polishing surface 33a of the polishing pad 33. The surface of the wafer W is polished by the mechanical action of the abrasive grains contained in the polishing liquid and the chemical action of the polishing liquid. After the polishing is completed, the dressing device 40 dresses (conditions) the polished surface 33a.

The dressing device 40 rotatably supports the dresser 41 which is slidably contacted with the polishing pad 33, the dresser shaft 45 to which the dresser 41 is connected, the air cylinder 47 provided at the upper end of the dresser shaft 45, and the dresser shaft 45. It is equipped with a dresser arm 48. The lower surface of the dresser 41 constitutes a dressing surface 41a, and the dressing surface 41a is composed of abrasive grains (for example, diamond particles). The air cylinder 47 is arranged on a support base 50 supported by a plurality of columns 51, and these columns 51 are fixed to the dresser arm 48.

The dresser arm 48 is driven by the dresser swivel motor 55 and is configured to swivel around the dresser swivel shaft 49. The dresser shaft 45 is rotated by driving a motor (not shown), and the rotation of the dresser shaft 45 causes the dresser 41 to rotate about the dresser shaft 45 in the direction indicated by the arrow. The air cylinder 47 functions as an actuator that moves the dresser 41 up and down via the dresser shaft 45 and presses the dresser 41 against the polishing surface (surface) 33a of the polishing pad 33 with a predetermined pressing force.

Dressing of the polishing pad 33 is performed as follows. While the dresser 41 rotates about the dresser shaft 45, pure water is supplied onto the polishing pad 33 from the polishing liquid supply nozzle 38. In this state, the dresser 41 is pressed against the polishing pad 33 by the air cylinder 47, and its dressing surface 41a is slidably contacted with the polishing surface 33a of the polishing pad 33. Further, the dresser arm 48 is swiveled around the dresser swivel shaft 49 to swing the dresser 41 in the radial direction of the polishing pad 33. In this way, the polishing pad 33 is slightly scraped off by the dresser 41, and the surface 33a thereof is dressed (regenerated).

As shown in FIG. 1, the substrate polishing apparatus has a control unit 30 that is located inside the housing 10 and controls the operation of each unit of the substrate polishing apparatus. Further, the substrate polishing apparatus includes various sensors for directly or indirectly monitoring the operation of various devices arranged in each unit in the substrate polishing apparatus. The control unit 30 of the substrate polishing apparatus controls the operation of each apparatus in the substrate polishing apparatus based on the measured values sent from these sensors. Further, the control unit 30 determines whether or not a defect (error) has occurred in the substrate polishing device based on the measured values sent from various sensors, and if a defect occurs, an alarm is issued. It is configured.

For example, as shown in FIG. 3A, the polishing unit 14a of the substrate polishing apparatus is arranged in the polishing liquid supply line 70 for supplying the polishing liquid to the polishing liquid supply nozzle 38 and the polishing liquid supply line 70. It has a pressure gauge 71 and a flow meter 72. The pressure gauge 71 is a sensor that measures the pressure (supply pressure) of the polishing liquid flowing through the polishing liquid supply line 70, and the flow meter 72 is a sensor that measures the flow rate of the polishing liquid flowing through the polishing liquid supply line 70. The pressure gauge 71 and the flow meter 72 are connected to the control unit 30, and the measured values of the pressure gauge 71 and the flow meter 72 are transmitted to the control unit 30. The control unit 30 opens the supply valve (flow rate adjusting valve) 76 arranged in the polishing liquid supply line 70 so that the measured value of the flow rate of the polishing liquid sent from the flow meter 72 matches a predetermined target value. Control the degree.

Further, the control unit 30 is configured to determine whether or not a defect has occurred in the polishing unit 14a based on the measured values sent from the pressure gauge 71 and the flow meter 72. For example, when the measured value of the flow meter 72 deviates from the permissible range defined by the predetermined upper limit value and the predetermined lower limit value for a predetermined time or more, the control unit issues an alarm for an abnormality in the flow rate of the polishing liquid. The control unit 30 stores in advance a predetermined target value and an allowable range of the flow rate of the polishing liquid, and these target values and the allowable range (that is, the upper limit value and the lower limit value) are abnormalities of the polishing liquid in the polishing unit 14a. It functions as a threshold value for determining the presence or absence of occurrence of.

Further, as shown in FIG. 3B, the polishing unit 14a of the substrate polishing apparatus includes a liquid leakage sensor 73 attached to the bottom wall 79 of the polishing unit 14a. The liquid leakage sensor 73 is a sensor for detecting the leakage of liquid (for example, slurry and pure water) in the polishing unit 14a. The liquid leakage sensor 73 is also connected to the control unit 30, and the control unit 30 monitors the presence or absence of liquid leakage in the polishing unit 14a. When the on signal is transmitted from the liquid leakage sensor 73 to the control unit 30, the control unit 30 issues a liquid leakage alarm.

Further, as shown in FIG. 2, the head swivel motor 54 arranged in the polishing unit 14a has a rotation position sensor 54a capable of detecting the rotation position (or rotation amount) of the head swivel motor 54. The rotation position sensor 54a is also connected to the control unit 30, and the control unit 30 can determine the position of the polishing head 37 with respect to the polishing pad 33 from the measured value of the rotation position sensor 54a. Further, the control unit 30 monitors whether or not the polishing head 37 has moved to a desired polishing position based on the measured value of the rotation position sensor 54a before starting the polishing of the wafer W. Specifically, when the measured value of the rotation position sensor 54a does not match the predetermined target value, the control unit 30 issues an alarm for the abnormal position of the polishing head 37.

In addition to these sensors 71, 72, 73, 54a, the polishing unit 14a has various sensors for monitoring the operation of each device of the polishing unit 14a, and these sensors are also connected to the control unit 30. .. The control unit 30 monitors whether or not a defect has occurred in the polishing unit 14a based on the measured values of various sensors, and if a defect occurs, issues an alarm corresponding to the defect.

Next, the alarm display device according to the embodiment will be described. FIG. 4 is a block diagram schematically showing an alarm display device according to an embodiment.

The alarm display device 60 shown in FIG. 4 is connected to the control unit 30 so as to be able to transmit and receive information such as data. The control unit 30 is, for example, a programmable logic controller (PLC), and includes a processing unit 30a and a storage unit 30b. In one embodiment, the control unit 30 may be a dedicated computer or a general-purpose computer (for example, a personal computer), or may include an FPGA (Field-Programmable gate array).

The storage unit 30b of the control unit 30 stores a program for executing the processing of the wafer W in each unit. The processing unit 30a of the control unit 30 has a register 30c that temporarily stores register data when executing a program read from the storage unit 30b. The register 30c is a memory device provided inside the processing unit 30a. More specifically, the register 30c is a small-capacity, high-speed memory device for temporarily storing register data when the processing unit 30a executes a program. The register data is data representing a calculation result being processed by the processing unit 30a and a state of the processing unit 30a.

As shown in FIG. 4, various sensors including a pressure gauge 71, a flow meter 72, a liquid leakage sensor 73, and a rotation position sensor 54a are connected to the control unit 30. As described above, the control unit 30 controls the operation of the equipment in each unit based on the measured values sent from the various sensors. The control unit 30 transmits the measured values of various sensors and the register data to the alarm display device 60. In one embodiment, various sensors may be directly connected to the alarm display device 60. In this case, the alarm display device 60 transmits the measured values of various sensors to the control unit 30, and the control unit 30 transmits the register data to the alarm display device 60.

The alarm display device 60 shown in FIG. 4 is configured as a human machine interface (HMI) having a display unit 65, and is, for example, a graphical user interface (GUI) having a display unit 65 such as a touch panel. The alarm display device 60 further includes an input unit 68 that receives an operation from the operator, a processing unit 61 that executes processing according to the operator's operation input to the input unit 68, and register data transmitted from the control unit 30. A data collection unit 62 that collects EES data including measured values sent from various sensors and a data storage unit 64 that stores the data collected by the data collection unit 62 are provided. The input unit 68 is, for example, a keyboard and a mouse operated by an operator. When the display unit 65 is a touch panel, the input unit 68 may be built in the display unit 65.

The data collection unit 62 collects the register data transmitted from the control unit 30 and the EES data including the measured values of various sensors. In the present specification, the EES data is a general term for data for monitoring the operating status of the substrate polishing apparatus (substrate processing apparatus), and is, for example, a pressure sensor 71, a flow rate sensor 72, a liquid leakage sensor 73, and a rotation position. It includes measured values of various sensors such as the sensor 54a and operation information indicating the operating state of various devices mounted on the substrate polishing apparatus. The operation information also includes position information of the wafer W in the substrate polishing apparatus and unit processing information indicating which unit is executing the processing of the wafer W.

Further, the data collecting unit 62 creates alarm detailed information data including at least the alarm code data stored in advance in the data storage unit 64, the register data and the EES data related to the alarm code data, and the alarm details. Information data is stored in the data storage unit 64.

The alarm code data stored in the data storage unit 64 includes an alarm code, a name of an alarm corresponding to the alarm code, and a sensor (hereinafter, referred to as "monitoring sensor") to be used when identifying the alarm. Includes. For example, the alarm code data shown in FIG. 5A is alarm code data to which the alarm code A001 is attached, and the alarm code A001 corresponds to the alarm of “leakage”. The leak is detected, for example, based on the measured value (that is, the on signal) of the leak sensor 73 fixed to the bottom wall 79 of the polishing unit 14a. Therefore, the liquid leakage sensor 73 is a monitoring sensor for an alarm (that is, liquid leakage) to which the alarm code A001 is attached. Further, liquid leakage is a defect that may occur when an excessive pressure is applied to a pipe through which a liquid flows. Therefore, a pressure sensor provided in the pipe through which the liquid flows (for example, a pressure gauge 71 provided in the polishing liquid supply line 70 through which the polishing liquid flows) is also included in the alarm monitoring sensor to which the alarm code A001 is attached.

The example shown in FIG. 5B shows the alarm code data of the abnormal flow rate of the polishing liquid corresponding to the alarm code A002. The abnormal flow rate of the polishing liquid is detected based on the measured value of the flow meter 72 arranged in the polishing liquid supply line 70. Therefore, the flow meter 72 is a monitoring sensor for an alarm (that is, an abnormality in the flow rate of the polishing liquid) to which the alarm code A002 is attached. Further, the abnormal flow rate of the polishing liquid is a defect that may occur when the supply pressure of the polishing liquid fluctuates. Therefore, the pressure gauge 71 provided in the polishing liquid supply line 70 through which the polishing liquid flows is also included in the alarm monitoring sensor to which the alarm code A002 is attached. An abnormality in the flow rate of the polishing liquid may also occur due to an abnormality in the opening degree of the supply valve 76. Therefore, although not shown, when the supply valve 76 is provided with an opening degree sensor, this opening degree sensor is also included in the alarm monitoring sensor to which the alarm code A002 is attached.

The example shown in FIG. 5C shows an alarm code for an abnormality in the polishing head position corresponding to the alarm code A003. The polishing head position abnormality is detected based on the measured value of the rotation position sensor 54a of the head swivel motor 54. Therefore, the rotation position sensor 54a is included in the monitoring sensor for the alarm (that is, the polishing head position abnormality) to which the alarm code A003 is attached. Abnormal polishing head position may also occur due to fluctuations in the current and / or voltage supplied to the head swivel motor 54. Therefore, although not shown, if an ammeter and / or a voltmeter is provided in the power supply that supplies the current to the head swirl motor 54, the ammeter and / or the voltmeter is also attached with the alarm code A003. Included in the alarm monitoring sensor.

The data collecting unit 62 extracts the register data and the EES data associated with the alarm code data from the register data transmitted from the control unit 30 and the EES data including the measured values of various sensors, and extracts the detailed alarm information data. To create. For example, when creating the alarm detailed information data of "leakage", the data collection unit 62 includes the leak sensor 73, which is a monitoring sensor, and the pressure from the register data and the EES data transmitted from the control unit 30. The register data and EES data related to the sensor 71 are extracted. The extracted EES data includes at least the measured value of the liquid leakage sensor 73 and the measured value of the pressure sensor 71.

Further, the data collecting unit 62 creates alarm detailed information data by combining the EES data including at least the measured values of the liquid leakage sensor 73 and the measured values of the pressure sensor 71 and the register data related to the EES data. .. The data collection unit 62 creates alarm detailed information data from the register data and EES data accumulated during a predetermined time (for example, 10 seconds).

While the substrate polishing device is in operation, register data and EES data are transmitted from the control unit 30 to the alarm display device 60 at any time. The data storage unit 64 has a storage unit 64a capable of storing various types of data. The data collection unit 62 updates the alarm detailed information data so that the alarm detailed information data for a predetermined time is accumulated in the storage unit 64a each time the register data and the EES data are transmitted from the control unit 30. go.

When a defect occurs in the substrate polishing device, the control unit 30 transmits an alarm signal corresponding to the defect to the alarm display device 60, and the data collection unit 62 that has received the alarm signal responds to the alarm signal and said that. The alarm detailed information data stored in the storage unit 64a at the time of receiving the alarm signal is stored in the alarm data storage unit 64b. By this operation, it becomes possible to use the detailed alarm information data immediately before the alarm is generated when identifying the cause of the alarm at a later date. The alarm history is stored in the storage unit 30b of the control unit 30 and / or the data storage unit 64 of the alarm display device 60.

In the alarm display device 60 shown in FIG. 4, the data collection unit 62 is provided separately from the processing unit 61, but this embodiment is not limited to this example. For example, the processing unit 61 may also serve as the data collection unit 62, or the data collection unit 62 may be built in the processing unit 61.

Next, a method of using the alarm display device 60 when identifying the cause of the alarm will be described. First, the operator operates the input unit 68 to display the alarm history stored in the storage unit 30b of the control unit 30 and / or the data storage unit 64 of the alarm display device 60 on the display unit 65. FIG. 6 is a schematic diagram showing an example of the alarm history displayed on the display unit 65.

As shown in FIG. 6, the alarm history includes the name of the issued alarm, the alarm code corresponding to the alarm, the alarm generation unit, and the alarm generation date and time. The operator can select an alarm for identifying the cause of occurrence via the input unit 68.

When an alarm is selected from the alarm history via the input unit 68, the processing unit 61 (or the data acquisition unit 62) displays the alarm individual information corresponding to the selected alarm on the display unit 65. FIG. 7 is a schematic view showing an example of alarm individual information displayed on the display unit 65 when the polishing head position abnormality shown in FIG. 6 is selected.

The alarm individual information shown in FIG. 7 includes the above-mentioned monitoring sensor and the alarm generation condition in addition to the alarm code, the alarm name, the alarm generation date and time, and the alarm generation unit. The alarm generation condition is associated with each of the alarm code data. The alarm generation condition is included in the alarm code data stored in the data storage unit 64, for example, and the data collection unit 62 can create the alarm detailed information data including the alarm generation condition. In one embodiment, the data storage unit 64 may store the alarm generation condition in advance separately from the alarm code data. In this case, the data collection unit 62 creates the alarm detailed information data so as to include the alarm generation condition associated with the alarm code data, and the processing unit 61 (or the data collection unit 62) creates the created alarm detailed information. Based on the data, the alarm individual information including the alarm generation condition is displayed on the display unit 65.

Further, in the example shown in FIG. 7, the screen displayed on the display unit 65 has an EES information button 80, and the operator operates the input unit 68 to press the EES information button 80 on the screen. Can be done. When the display unit 65 is a touch panel, the operator can directly press the EES information button 80 on the screen.

When the operator presses the EES information button 80, the processing unit 61 (or the data collecting unit 62) graphs the measured value of the monitoring sensor included in the EES data of the detailed alarm information data and displays it on the display unit 65.

FIG. 8 is an example of a graph of measured values of the monitoring sensor displayed on the display unit 65. In the graph shown in FIG. 8, the vertical axis represents the measured value of the monitoring sensor (rotational position sensor 54a in this embodiment), and the horizontal axis represents time. Further, in the graph shown in FIG. 8, the set value of the rotation position sensor 54a corresponding to the desired polishing position of the polishing head 37 is shown by a thick solid line.

As shown in FIG. 8, since the graph of the measured value of the monitoring sensor included in the EES data is shown on the display unit 65, the operator can operate the head swivel motor 54 immediately before the alarm is generated (that is, the movement operation of the polishing head 37). ) Can recognize the details. Therefore, it becomes easy to identify the cause of the alarm based on the graph. That is, the graph of the measured value of such a monitoring sensor can be used as a visual aid for identifying the cause of the alarm.

FIG. 9 is a schematic diagram showing another example of alarm individual information. FIG. 10A is an example of a graph of measured values of the flow meter 72, which is the alarm monitoring sensor shown in FIG. 9, and FIG. 10B is a pressure gauge 71, which is the alarm monitoring sensor shown in FIG. It is an example of the graph of the measured value of. In the graphs shown in FIGS. 10 (a) and 10 (b), the vertical axis is the monitoring sensor (that is, the flow meter 72 in FIG. 10 (a) and the pressure gauge 71 in FIG. 10 (b). ) Represents the measured value, and the horizontal axis represents time. Since the configuration of the present embodiment, which is not particularly described, is the same as that of the embodiments shown in FIGS. 7 and 8, the duplicate description thereof will be omitted.

The alarm of the alarm individual information shown in FIG. 9 is an abnormality in the flow rate of the polishing liquid. As described above, the monitoring sensor for the alarm of the abnormal flow rate of the polishing liquid includes the flow meter 72 and the pressure gauge 71. Therefore, when the EES information button 80 is pressed, the processing unit 61 displays a graph of the measured values of the flow meter 72 immediately before the alarm is generated (see FIG. 10 (a)) and a graph of the measured values of the pressure gauge 71 (FIG. 10 (b). ) Is displayed on the display unit 65. In the graph shown in FIG. 10A, a target value of the flow rate of the polishing liquid and an upper limit value and a lower limit value of the flow rate set with respect to the target value are drawn. Therefore, the operator who sees the graph of the measured values of the flow meter 72 displayed on the display unit 65 can recognize that the alarm has occurred because the flow rate of the polishing liquid exceeds the upper limit value (or the lower limit value). ..

Further, in the graph shown in FIG. 10B, the set value of the pressure of the polishing liquid is drawn. Therefore, the operator who sees the graph of the measured value of the pressure gauge 71 displayed on the display unit 65 can confirm the fluctuation of the supply pressure of the polishing liquid with respect to the set value. In the example shown in FIG. 10B, it can be confirmed that the measured value of the pressure gauge 71 greatly exceeds the set value and rises. Therefore, the operator who has confirmed the graphs shown in FIGS. 10 (a) and 10 (b) can recognize that the abnormal flow rate of the polishing liquid has occurred due to the increase in the supply pressure of the polishing liquid. That is, the operator can identify the cause of the abnormal flow rate of the polishing liquid as an increase in the supply pressure of the polishing liquid. In this way, by showing the graph of the measured value of the monitoring sensor included in the EES data on the display unit 65, the graph can be used as an aid for identifying the cause of the alarm occurrence through the visual sense.

As shown in FIG. 9, the processing unit 61 may display the alarm coping method on the display unit 65. The alarm coping method is a coping method for the alarm occurrence cause estimated in advance. The alarm coping method is associated with each of the alarm code data and is stored in the data storage unit 64 in advance. In one embodiment, the alarm coping method may be included in the alarm code data. In the present embodiment, the data collection unit 62 creates the alarm detailed information data so as to include the alarm response method, and the processing unit 61 (or the data collection unit 62) displays the alarm detailed information data including the alarm response method. Displayed in unit 65.

In the example shown in FIG. 9, it is estimated that the flow meter 72 has not been able to perform accurate flow measurement as one of the causes of the alarm. Therefore, confirmation of the measured value of the flow meter 72, calibration of the flow meter 72, and replacement of the flow meter 72 are listed as alarm coping methods. Further, since the abnormality of the supply pressure of the polishing liquid is estimated as one of the causes of the alarm, the confirmation of the measured value of the pressure gauge 71 is also mentioned as one of the alarm coping methods. The operator who has read the alarm coping method displayed on the display unit 65 presses the EES information button 80 to display a graph showing the transition of the measured value of the flow meter 72 and a graph showing the transition of the measured value of the pressure gauge 71. It can be easily confirmed. Therefore, it is more likely that the cause of the alarm can be identified at an early stage.

Further, the processing unit 61 may create a moving image of the operating state of the device immediately before the alarm is generated based on the register data and the EES data included in the detailed alarm information data, and display the moving image on the display unit 65. In the example shown in FIG. 9, the display unit 65 is provided with a moving image button 82, and by pressing the moving image button 82, a moving image of the operating status of the device immediately before the alarm is generated can be displayed on the display unit 65. can.

FIG. 11 is a schematic diagram for explaining an example of a moving image of the operating state of the substrate polishing apparatus immediately before the alarm is generated. In the example shown in FIG. 11, a schematic view showing the entire substrate polishing apparatus is drawn on the display unit 65, and the operating unit is hatched. The operator who has watched this video can recognize the unit and the device that were operating immediately before the alarm was generated. For example, the operator can recognize that the polishing unit 14b and the first cleaning unit 16 are executing the polishing process of the wafer W and the cleaning process of the wafer W. Further, the operator receives the wafer W arranged in the substrate cassette 90a arranged in the load port 12 by the hand 95 of the first substrate transfer robot 22 that the head arm 42 of the polishing unit 14a is rotating. It can be recognized from the moving image that the wafer W is being transferred to and that the substrate transfer device 24 is transferring the wafer W.

The operation button sequence 87 is also displayed on the display unit 65. By pressing the various buttons arranged in the operation button sequence 87, various moving image operations such as playing, pausing, stopping, fast-forwarding, and rewinding the moving image can be executed.

FIG. 12 is another example of a graph of measured values of the flow meter 72, which is the alarm monitoring sensor shown in FIG. In the graph shown in FIG. 12, the measured values of the flow meter 72 diverge infinitely. This graph can be viewed by pressing the EES information button 80 displayed on the display unit 65.

On the other hand, the processing unit 61 can determine from the EES data for creating the graph that the flow meter 72 has a failure and that the failure of the flow meter 72 is the cause of the alarm. .. In this way, when the processing unit 61 can identify the cause of the alarm, the processing unit 61 may display the cause of the alarm on the display unit 65.

When the processing unit 61 displays the alarm occurrence cause on the display unit, the processing unit 61 causes the display unit 65 to display the occurrence cause button 65 (see the virtual line (dotted line) in FIG. 9). In this case, when the operator presses the occurrence cause button 65, the processing unit 61 causes the display unit 65 to display the alarm occurrence cause information.

FIG. 13 is a schematic diagram showing an example of alarm occurrence cause information displayed on the display unit 65. The alarm occurrence cause information includes at least an alarm occurrence cause (in FIG. 13, a failure of the flow meter 72) and a countermeasure (replacement of the flow meter 72 in FIG. 13), and this information is displayed on the display unit 65. Display it. It is assumed that the operator wants to check the transition of the measured value of the monitoring sensor (in FIG. 13, the transition of the measured value of the flow meter 72). Therefore, the alarm occurrence cause information may include a method of confirming the transition of the measured value of the monitoring sensor (in FIG. 13, the transition of the measured value of the flow meter 72). In the example shown in FIG. 13, the method of confirming the transition of the measured value of the flow meter 72, which is the monitoring sensor, is to press the EES information button 80. When the operator presses the EES information button 80, the graph shown in FIG. 12 is displayed on the display unit 65, so that the operator can easily confirm that the flow meter 72 is out of order.

In the above-described embodiment, the alarm display device is mounted on a substrate polishing apparatus (CMP apparatus) which is an example of a substrate processing apparatus. However, the substrate processing apparatus is not limited to these embodiments. For example, an alarm display device may be mounted on a substrate processing device such as a substrate polishing device for polishing an edge portion of a substrate and a substrate plating device. Further, the alarm display device can be mounted on any device as long as it is a device on which a large number of devices are mounted and malfunctions of these devices are monitored from the measured values of various sensors.

The above-described embodiment is described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention belongs to carry out the present invention. Various modifications of the above embodiment can be naturally made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments and should be the broadest scope according to the technical ideas defined by the claims.

30 Control unit 54a Rotation position sensor 60 Alarm display device 61 Processing unit 62 Data collection unit 64 Data storage unit 64a Storage unit 64b Alarm data storage unit 65 Display unit 68 Input unit 71 Pressure gauge 72 Flow meter 73 Leakage sensor 80 EES information button 82 Video button 83 Cause button 87 Operation button sequence

Claims (4)

An alarm display device installed in a device equipped with a large number of devices.
A data storage unit that stores alarm code data associated with each of a plurality of alarms in advance, and
A data collection unit that collects detailed alarm information data including at least a combination of the alarm code data and EES data and register data associated with the alarm code data and collected during a predetermined time.
When an alarm is generated, an alarm data storage unit that stores the alarm detailed information data corresponding to the alarm, and an alarm data storage unit.
A display unit capable of displaying detailed alarm information data stored in the alarm data storage unit, and a display unit capable of displaying detailed alarm information data.
An alarm display device including a processing unit that graphs measured values of a monitoring sensor included in detailed alarm information data stored in the alarm data storage unit and displays them on the display unit. The data storage unit stores in advance an alarm coping method associated with each of the alarm code data.
The alarm detailed information data includes the alarm coping method.
The alarm display device according to claim 1, wherein the processing unit displays the alarm coping method on the display unit. The processing unit creates a moving image of the operating state of the device immediately before the alarm is generated based on the EES data and the register data, and displays the moving image on the display unit. 2. The alarm display device according to 2. The alarm display according to any one of claims 1 to 3, wherein when the processing unit can identify the cause of the alarm, the processing unit displays the cause of the alarm on the display unit. Device.

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