JP2020025088A - Substrate processing system, substrate processing device, and manufacturing method for semiconductor device - Google Patents

Abstract

To perform abnormality analysis using both of image data at the time of substrate transfer and image data at the time of transfer error occurrence.SOLUTION: A substrate processing system comprises: first control means 210 (device controller) for acquiring event data generated at the time of substrate transfer and alarm data generated at the time of occurrence of a transfer error; storage means 216 for storing substrate transfer operation as first image data and storing the substrate transfer operation as second image data having resolution higher than that of the first image data; second control means 310 (supervisory controller) for making the first image data stored by the storage means be stored in a first storage unit on the basis of the event data and making the second image data stored by the storage means be stored in a second storage unit on the basis of the alarm data; and an operation unit (input-output device) for displaying at least the first image data and the second image data. The second control means makes the first image data and the second image data stored at the time of transfer error occurrence be displayed on the same screen.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a substrate processing system, a substrate processing apparatus, and a method for manufacturing a semiconductor device.

  The substrate processing apparatus is configured to transfer a substrate (hereinafter also referred to as a wafer) into a processing chamber by a transfer unit, and to perform a predetermined process on the substrate in the processing chamber. During the transfer of the substrate, the substrate may be shifted, dropped, or damaged due to, for example, a trouble in the transfer unit or a pressure difference between the inside and outside of the processing chamber.

  2. Description of the Related Art Conventionally, it has been performed to ascertain the transport status of this transport unit (for example, see Patent Document 1). Further, a detecting means (for example, sensors such as an optical sensor and a mapping sensor) for detecting a state of the substrate is provided, and when the state of the substrate at a predetermined position is different from an expected value, it is detected as a transport error, and On the operation screen, a transport error status and a monitor screen of a transport system at the time of occurrence of the transport error are displayed (for example, see Patent Document 2). However, even if it is known that a transport error has occurred, it is not possible to immediately know the detailed state of the substrate such as displacement, dropping, breakage, and the like and the cause of the state.

  In order to solve such a situation, for example, it is conceivable that a recording unit such as a video camera is installed in the substrate processing apparatus and used for analyzing a transport error (for example, see Patent Document 3). However, if image data during operation is simply kept stored, appropriate image data is selected and displayed from an enormous amount of image data when a transport error occurs, and it takes time for analysis. .

JP 2010-161346 A JP 2011-155244 A JP 2013-030747 A

  An object of the present disclosure is to provide a configuration for performing analysis using image data when a substrate is transported and image data when a transport error occurs.

According to one aspect of the present disclosure,
First control means for acquiring event data generated when a substrate is transported and alarm data generated when a transport error occurs;
Recording means for recording the transport operation of the substrate as second image data having higher definition than the first image data while recording the transport operation of the substrate as first image data;
A second storing unit that stores the first image data recorded by the recording unit in the first storage unit based on the event data and stores the second image data recorded by the recording unit in the second storage unit based on the alarm data; Control means;
An operation unit for displaying at least the first image data and the second image data,
A technique is provided in which the second control means displays both the first image data and the second image data recorded at the time of occurrence of the transport error on the same screen.

  According to the present disclosure, it is possible to perform an abnormality analysis of a transport error by using the image data when the substrate is transported and the image data when a transport error occurs.

FIG. 2 is an oblique perspective view of a storage chamber suitably used in the first embodiment of the present disclosure. 1 is a cross-sectional view of a substrate processing apparatus suitably used in a first embodiment of the present disclosure. 1 is a schematic configuration diagram of a vertical processing furnace of a substrate processing apparatus suitably used in an embodiment of the present disclosure, and is a longitudinal sectional view of a processing furnace portion. FIG. 1 is a schematic configuration diagram of a controller of a substrate processing apparatus suitably used in an embodiment of the present disclosure, and is a diagram illustrating a control system of the controller in a block diagram. FIG. 1 is a diagram illustrating a system configuration of a controller suitably used in an embodiment of the present disclosure. FIG. 3 is a diagram for describing a program configuration executed by a monitoring controller that processes image data recorded by a recording unit suitably used in an embodiment of the present disclosure. FIG. 3 is a diagram illustrating image data recorded by a recording unit suitably used in an embodiment of the present disclosure. FIG. 3 is a diagram for describing an MJPEG format. H. It is a figure for explaining a H.264 format. FIG. 8A and 8B are diagrams for explaining the H.264 format, and FIG. It is a figure for explaining a H.265 format. (A) and (B) are diagrams for explaining how to save a file in the MJPEG format. FIG. 9 is a diagram for explaining frame-by-frame playback of alarm recording. FIG. 2 is a diagram for describing recording means suitably used in an embodiment of the present disclosure. FIG. 2 is a diagram for describing recording means suitably used in an embodiment of the present disclosure. FIG. 4 is a diagram illustrating a flow of an image monitoring program suitably used in an embodiment of the present disclosure. 5 is an illustrative example of an event cueing function suitably used in an embodiment of the present disclosure. FIG. 3 is a diagram illustrating a main part of an image monitoring program flow suitably used in an embodiment of the present disclosure. 7 is a sequence illustrating a comparison screen display function suitably used in an embodiment of the present disclosure. 5 is an illustrative example of an operation screen of a device controller suitably used in an embodiment of the present disclosure. It is an illustration example of an alarm ID search screen display suitably used in one embodiment of the present disclosure. 5 is an illustrative example of a comparison screen display suitably used in an embodiment of the present disclosure. 5 is an illustrative example of a comparison screen display suitably used in an embodiment of the present disclosure.

  Hereinafter, a first embodiment of the present disclosure will be described with reference to FIGS. 1 to 3.

(1) Configuration of Substrate Processing Apparatus As shown in FIG. 1, in the present embodiment, the substrate processing apparatus 4 is configured as a vertical heat treatment apparatus (batch type vertical heat treatment apparatus) that performs a heat treatment step in an IC manufacturing method. Have been. In the vertical heat treatment apparatus to which the present disclosure is applied, a FOUP (Front Opening Unified Pod: hereinafter, referred to as a pod) 20 is used as a carrier for transporting a wafer W as a substrate. The substrate processing apparatus 4 includes a processing furnace 8, a storage chamber 12, and a transfer chamber 16 which will be described later.

(Containment room)
On the front side of the inside of the housing of the substrate processing apparatus 4, an accommodation room 12 for carrying the pod 20 into the apparatus and storing the pod 20 is arranged. On the front side of the housing of the housing room 12, a loading / unloading opening 22A, which is an opening for carrying the pod 20 into and out of the housing room 12, is opened so as to communicate inside and outside the housing of the housing room 12. The loading / unloading port 22A may be configured to be opened and closed by a front shutter. An AGV port (I / O stage) 22 as a load port (pod mounting device) is provided inside the housing of the loading / unloading port 22A. A transfer port 42 is provided on a wall surface between the accommodation room 12 and the transfer room 16. The pod 20 is carried into the substrate processing apparatus 4 by an in-process transport device (inter-process transport device) outside the substrate processing device 4 on the AGV port 22, and is unloaded from the AGV port 22.

  Above the AGV port 22 in the front of the housing of the housing room 12, storage shelves (pod shelves) 30A for storing the pods 20 are provided in two vertical stages. Further, a storage shelf (pod shelf) 30B for storing the pod 20 is arranged in a matrix shape in the rear of the housing of the accommodation room 12.

  OHT ports 32 as load ports are installed side by side on the same straight line in the horizontal direction as the upper storage shelf 30A in the front of the housing. The pod 20 is loaded onto the OHT port 32 from above the substrate processing apparatus 4 by an in-process transport apparatus (inter-process transport apparatus) outside the substrate processing apparatus 4, and unloaded from the OHT port 32. The AGV port 22, the storage shelf 30A, and the OHT port 32 are configured so that the pod 20 can be moved horizontally between the placement position and the delivery position by the horizontal drive mechanism 26. Hereinafter, the AGV port 22 may be referred to as a first load port, and the OHT port 32 may be referred to as a second load port.

  As shown in FIG. 2, the space between the front storage shelf 30A and the rear storage shelf 30B in the housing of the storage room 12 forms a pod transport area 14. Is delivered and transported. A rail mechanism 40A as a traveling path of a pod transport mechanism 40 as a pod transport device is formed at a ceiling of the pod transport area 14 (a ceiling of the accommodation room 12). Here, the delivery position is located in the pod transport area 14 and is, for example, a position directly below the pod transport mechanism 40.

  The pod transport mechanism 40 that transports the pod 20 includes a traveling unit 40B that travels on a traveling path, a holding unit 40C that holds the pod 24, and a lifting unit 40D that vertically moves the holding unit 40C. By detecting the encoder of the motor that drives the traveling section 40B, a position in the traveling path 40B can be detected, and the traveling section 40B can be moved to an arbitrary position.

(Transfer room)
A transfer chamber 16 is formed adjacent to the rear of the storage chamber 12. A plurality of wafer loading / unloading ports for loading / unloading wafers W into / from the transfer chamber 16 are provided in the accommodation room 12 on the side of the transfer chamber 16 in a horizontal direction. Ports 42 are provided respectively. In the transfer port 42, the mounting table 42B on which the pod 20 is mounted is horizontally moved and pressed against the wafer loading / unloading port, and the pod is opened by a FIMS (Front-Opening Interface Standard) opener as a lid opening / closing mechanism (lid opening / closing device) (not shown). Twenty lids are deployed. When the lid of the pod 20 is opened, the wafer W is transferred into and out of the pod 20 by the substrate transfer device 86 as a substrate transfer device.

(Processing furnace)
A processing furnace 8 is provided above the transfer chamber 16. As shown in FIG. 3, the processing furnace 8 has a heater 46 as a heating means (heating mechanism). The heater 46 has a cylindrical shape, and is vertically installed by being supported by a heater base (not shown) as a holding plate. The heater 46 also functions as an activation mechanism (excitation unit) that activates (excites) the gas with heat as described later.

Inside the heater 46, a reaction tube 50 that constitutes a reaction container (processing container) concentrically with the heater 46 is provided. The reaction tube 50 is made of a heat-resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC), and is formed in a cylindrical shape having a closed upper end and an open lower end. A processing chamber 54 is formed in the hollow portion of the reaction tube 50. The processing chamber 54 is configured to be capable of housing wafers W as substrates in a state where the wafers W are aligned in a horizontal posture and vertically in multiple stages by a boat 58 described later.

  A nozzle 60 is provided in the processing chamber 54 so as to penetrate a lower portion of the reaction tube 50. The nozzle 60 is made of a heat-resistant material such as quartz or SiC. A gas supply pipe 62a and a gas supply pipe 62c are connected to the nozzle 60. The gas supply pipes 62a and 62c are provided with mass flow controllers (MFCs) 64a and 64c as flow controllers (flow controllers) and valves 66a and 66c as opening and closing valves, respectively, in order from the upstream direction. Gas supply pipes 62b and 62d for supplying an inert gas are connected downstream of the valves 66a and 66c of the gas supply pipes 62a and 62c, respectively. The gas supply pipes 62b and 62d are provided with MFCs 64b and 64d and valves 66b and 66d, respectively, in order from the upstream direction. Mainly, the gas supply pipe 62a, the MFC 64a, and the valve 66a constitute a processing gas supply unit which is a processing gas supply system. The gas supply pipe 62c, the MFC 64c, and the valve 66c constitute a reaction gas supply unit that is a reaction gas supply system. The gas supply pipes 62b and 62d, the MFCs 64b and 64d, and the valves 66b and 66d form an inert gas supply unit that is an inert gas supply system.

  The nozzle 60 is provided in an annular space between the inner wall of the reaction tube 50 and the wafer W so as to rise upward from the lower portion of the inner wall of the reaction tube 50 upward in the arrangement direction of the wafer W. I have. That is, the nozzle 60 is provided in a region horizontally surrounding the wafer arrangement region on the side of the wafer arrangement region in which the wafers W are arranged, along the wafer arrangement region. The nozzle 60 is configured as an L-shaped long nozzle, and its horizontal portion is provided so as to penetrate the lower side wall of the reaction tube 50, and its vertical portion is at least one end to the other end of the wafer arrangement region. It is provided to stand up to the side. On the side surface of the nozzle 60, a gas supply hole 60A for supplying gas is provided. The gas supply holes 60A are respectively opened so as to face the center of the reaction tube 50, so that gas can be supplied toward the wafer W. Gas supply holes 60A, a plurality provided from the lower portion to the upper portion of the reaction tube 50, have the same opening area are provided at the same opening pitch.

  The reaction pipe 50 is provided with an exhaust pipe 68 for exhausting the atmosphere in the processing chamber 54. The exhaust pipe 68 is connected via a pressure sensor 70 as a pressure detector (pressure detecting unit) for detecting the pressure of the processing chamber 54 and an APC (Auto Pressure Controller) valve 72 as a pressure regulator (pressure adjusting unit). A vacuum pump 74 as an evacuation device is connected. The APC valve 72 can open and close the processing chamber 54 by opening and closing the valve while the vacuum pump 74 is operating. The valve is configured such that the pressure in the processing chamber 54 can be adjusted by adjusting the valve opening based on the pressure information detected by the sensor 70. An exhaust system mainly includes the exhaust pipe 68, the APC valve 72, and the pressure sensor 70. The vacuum pump 74 may be included in the exhaust system.

  The reaction tube 50 is provided with a temperature detector 76 as a temperature detector. By adjusting the power supply to the heater 46 based on the temperature information detected by the temperature detection unit 76, the temperature of the processing chamber 54 is configured to have a desired temperature distribution. The temperature detecting section 76 is formed in an L shape like the nozzle 60, and is provided along the inner wall of the reaction tube 50.

  Below the reaction tube 50, a seal cap 78 is provided as a furnace port lid that can airtightly close the lower end opening of the reaction tube 50. The seal cap 78 is made of, for example, a metal such as SUS or stainless steel, and is a disk-shaped member. An O-ring 78 </ b> A is provided on the upper surface of the seal cap 78 as a seal member that contacts the lower end of the reaction tube 50. Further, a seal cap plate 78B for protecting the seal cap 78 is provided in a region inside the O-ring 78A on the upper surface of the seal cap 78. The seal cap plate 78B is made of a heat-resistant material such as quartz or SiC, and is a disk-shaped member. The seal cap 78 is configured to contact the lower end of the reaction tube 50 from below in the vertical direction.

  The boat 58 as a substrate support (substrate support device) supports a plurality of, for example, 25 to 200, wafers W in a horizontal posture and vertically aligned with their centers aligned with each other in multiple stages. That is, it is configured to be arranged at intervals. The boat 58 is made of a heat-resistant material such as quartz or SiC.

  On the opposite side of the processing chamber 54 of the seal cap 78, a rotation mechanism 80 as a boat rotation device for rotating the boat 58 is installed. The rotation shaft 80A of the rotation mechanism 80 is connected to the boat 58 through the seal cap 78. The rotation mechanism 80 is configured to rotate the wafer W by rotating the boat 58.

  As shown in FIG. 4, an apparatus controller (first control means) 210 as a control unit (control means) includes a CPU (Central Processing Unit) 212, a RAM (Random Access Memory) 214, a storage device 216, and an I / O port. 218 is configured as a computer. The RAM 214, the storage device 216, and the I / O port 218 are configured to be able to exchange data with the CPU 212 via the internal bus 220. An input / output device 222 configured as, for example, a touch panel or the like is connected to the device controller 210. Further, the device controller 210 includes, via a hub 309, a monitoring controller 310 as a second control unit, and imaging devices (hereinafter, referred to as cameras) 91, 92, 93, 94, 95 (hereinafter, 91 to 91) as recording units. 95) is connected. The details of the cameras 91 to 95 will be described later.

  The storage device 216 is configured by, for example, a flash memory, a hard disk drive (HDD), or the like. In the storage device 216, a control program for controlling the operation of the substrate processing apparatus, a process recipe in which a procedure and conditions of a substrate processing described later are described, and the like are stored in a readable manner. The process recipe is a combination that allows the apparatus controller 210 to execute each procedure in a substrate processing step described later and obtain a predetermined result, and functions as a program. Hereinafter, the process recipe, the control program, and the like are collectively referred to simply as a program. When the word program is used in this specification, it may include only a process recipe alone, may include only a control program, or may include both. The RAM 214 is configured as a memory area (work area) in which programs, data, and the like read by the CPU 212 are temporarily stored.

  The I / O port 218 includes the MFCs 64a, 64b, 64c, 64d, the valves 66a, 66b, 66c, 66d, the pressure sensor 70, the APC valve 72, the heater 46, the temperature detector 76, the vacuum pump 74, the rotation mechanism 80, It is connected to a boat elevator 82 as a boat elevating device, a pod transport mechanism 40, sensors (detectors) 25B and 28A, a horizontal drive mechanism 26, and the like.

  The CPU 212 is configured to read and execute a control program from the storage device 216 and read a process recipe from the storage device 216 in response to an input of an operation command from the input / output device 222 or the like. The CPU 212 adjusts the flow rates of various gases by the MFCs 64a, 64b, 64c, 64d, opens and closes the valves 66a, 66b, 66c, 66d, opens and closes the APC valve 72, and operates the pressure sensor according to the contents of the read process recipe. 70, a pressure adjusting operation by the APC valve 72 based on 70, a start and stop of the vacuum pump 74, a temperature adjusting operation of the heater 46 based on the temperature detecting unit 76, a rotation and rotation speed adjusting operation of the boat 58 by the rotating mechanism 80, and a boat elevator 82. It is configured to control the raising / lowering operation of the boat 58, the pod transport operation by the pod transport mechanism 40, the driving operation of the horizontal drive mechanism 26 based on the sensors 25B and 28A, the substrate transport operation by the substrate transfer device 86 to the boat 58, and the like. I have.

  The device controller 210 is stored in an external storage device (for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or a DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card) 224. The above-described program can be configured by installing the program in a computer. The storage device 216 and the external storage device 224 are configured as computer-readable recording media. Hereinafter, these are collectively simply referred to as a recording medium. In this specification, the term “recording medium” may include only the storage device 216, may include only the external storage device 224, or may include both. The provision of the program to the computer may be performed using communication means such as the Internet or a dedicated line without using the external storage device 224.

  Next, conveyance of the pod 20 using the above-described substrate processing apparatus 4 will be described.

(Carrier loading process: S10)
When the pod 20 is supplied to the AGV port 22 or the OHT port 32, the pod 20 above the AGV port 22 or the OHT port 32 is carried into the substrate processing apparatus 4. The pod 20 carried in is automatically conveyed and transferred to the designated stage 25 of the storage shelf 30 by the pod conveyance mechanism 40, temporarily stored, and then transferred from the storage shelf 30 to one of the transfer ports 42. It is conveyed and delivered, or directly conveyed to the transfer port 42.

  The traveling unit 40B is controlled to move the pod transport mechanism 40 above the transfer position of the stage 25 of the AGV port 22 on which the pod 20 to be transported is placed. Here, the position above the transfer position is a position where the pod transport mechanism 40 can hold the pod 20 by lowering the holding unit 40C by the elevating unit 40D, that is, a position where the holding unit 40C is directly above the pod 20.

  After confirming that the pod transport mechanism 40 is waiting above the transfer position, the stage 25 of the AGV port 22 on which the pod 20 to be unloaded is placed is horizontally moved (slid) to the transfer position. Here, the sliding operation of the AGV port 22 and the driving of the pod transport mechanism 40 may be performed simultaneously.

  After confirming that the stage 25 has been slid to the delivery position by the sensor 28A, the elevator 40D is controlled, the holder 40C is lowered to a position where the pod 20 can be held, and the pod 20 is held by controlling the holder 40C. I do. After confirming that the holding unit 40C holds the pod 20, the lifting unit 40D is controlled to raise the holding unit 40C.

  After confirming from the sensor 25B of the stage 25 that the pod 20 is not mounted on the stage 25, the stage 25 is slid to the mounting position. After it is confirmed by the sensor 28A that the stage 25 has returned to the mounting position, the pod transport mechanism 40 is moved to the transfer port 42 to be transferred or the transfer position of the storage shelf 30 above the transfer position.

  When the pod is transported to the transfer port 42, the pod transport mechanism 40 moves above the mounting portion of the transfer port 42, and then controls the elevating portion 40D, lowers the holding portion 40C, and moves the mounting portion of the transfer port 42. Is placed on the pod 20. The placement portion of the transfer port 42 is located immediately below the pod transport mechanism 40 and does not need to be moved horizontally for delivery.

  When transporting to the storage shelf 30, the stage 25 of the storage shelf 30 of the transfer destination is horizontally moved (slid) to the delivery position, and after the sensor 28A confirms that the stage 25 has been slid to the delivery position, the lifting unit 40D , The holding unit 40 </ b> C is lowered, and the pod 20 is placed on the stage 25. Here, the sliding operation of the stage 25 of the storage shelf 30 and the driving of the pod transport mechanism 40 may be performed simultaneously.

(Lid deployment step: S11)
When the pod 20 is placed on the placement portion of the transfer port 42, the lid of the pod 20 is opened by a FIMS opener as a lid opening / closing mechanism.

(Wafer charging step: S12)
When the lid of the pod 20 is opened, a plurality of wafers W in the pod 20 are loaded (wafer charging) on the boat 58 by the substrate transfer device 86.

(Boat loading process: S13)
When a plurality of wafers W are loaded in the boat 58, the boat 58 is loaded (boat loaded) into the processing chamber 54 by the boat elevator 82. At this time, the seal cap 78 is in a state where the lower end of the reaction tube 50 is hermetically closed (sealed) via the O-ring 78A.

  Next, a sequence example of a process of forming a film on a substrate (hereinafter, also referred to as a film forming process) will be described as one process of manufacturing a semiconductor device (device) using the above-described substrate processing apparatus 4. Here, an example in which a film is formed on a wafer W by alternately supplying a first processing gas (a source gas) and a second processing gas (a reactive gas) to a wafer W as a substrate. explain.

Hereinafter, a hexachlorodisilane (Si ₂ Cl ₆ , abbreviated to HCDS) gas is used as a source gas, an ammonia (NH ₃ ) gas is used as a reaction gas, and a silicon nitride film (Si ₃ N ₄ film; (Also referred to as a film) will be described. In the following description, the operation of each unit constituting the substrate processing apparatus 4 is controlled by the apparatus controller 210.

In the film forming process according to the present embodiment, a step of supplying the HCDS gas to the wafer W in the processing chamber 54, a step of removing the HCDS gas (residual gas) from the processing chamber 54, and a step of By performing a predetermined number of (one or more) cycles of non-simultaneously performing the step of supplying the NH ₃ gas through the process and the step of removing the NH ₃ gas (residual gas) from the processing chamber 54, the SiN film To form

  Further, the use of the word “substrate” in this specification is synonymous with the use of the word “wafer”.

(Deposition process: S14)
The processing chamber 54, that is, the space in which the wafer W is present is evacuated (depressurized and evacuated) by the vacuum pump 74 so as to have a predetermined pressure (degree of vacuum). At this time, the pressure in the processing chamber 54 is measured by the pressure sensor 70, and the APC valve 72 is feedback-controlled based on the measured pressure information. Vacuum pump 74 maintains the state processing for at least the wafer W is until the end of that was operated at all times.

  Further, the wafer W in the processing chamber 54 is heated by the heater 46 so as to be at a predetermined temperature. At this time, the power supply to the heater 46 is feedback-controlled based on the temperature information detected by the temperature detection unit 76 so that the processing chamber 54 has a predetermined temperature distribution. The heating of the inside of the processing chamber 54 by the heater 46 is continuously performed at least until the processing on the wafer W is completed.

  Further, the rotation of the boat 58 and the wafer W by the rotation mechanism 80 is started. When the boat 58 is rotated by the rotation mechanism 80, the wafer W is rotated. The rotation of the boat 58 and the wafer W by the rotation mechanism 80 is continuously performed at least until the processing on the wafer W ends.

  When the temperature of the processing chamber 54 is stabilized at a preset processing temperature, the following two steps, that is, steps 1 and 2, are sequentially performed.

[Step 1]
Opening the valve 66a, flow HCDS gas to the gas supply pipe 62a. The flow rate of the HCDS gas is adjusted by the MFC 64 a, supplied to the processing chamber 54 via the nozzle 60, and exhausted from the exhaust pipe 68. At this time, the HCDS gas is supplied to the wafer W. At this time, the valve 66b is opened at the same time, and N ₂ gas flows into the gas supply pipe 62b. The flow rate of the N ₂ gas is adjusted by the MFC 64b, supplied to the processing chamber 54 together with the HCDS gas, and exhausted from the exhaust pipe 68. By supplying the HCDS gas to the wafer W, a silicon (Si) -containing layer having a thickness of, for example, less than one atomic layer to several atomic layers is formed as the first layer on the outermost surface of the wafer W. .

After the first layer is formed, the valve 66a is closed, and the supply of the HCDS gas is stopped. At this time, the processing chamber 54 is evacuated by the vacuum pump 74 while the APC valve 72 is kept open, and the HCDS gas remaining in the processing chamber 54 or remaining after contributing to the formation of the first layer is removed. Discharged from At this time, the supply of the N ₂ gas to the processing chamber 54 is maintained while the valve 66b is kept open. The N ₂ gas acts as a purge gas, which can enhance the effect of discharging the gas remaining in the processing chamber 54 from the processing chamber 54.

[Step 2]
After step 1 is completed, NH ₃ gas is supplied to the wafer W in the processing chamber 54, that is, the first layer formed on the wafer W. The NH ₃ gas is activated by heat and supplied to the wafer W.

In this step, the opening and closing control of the valves 66c and 66d is performed in the same procedure as the opening and closing control of the valves 66a and 66b in step 1. The flow rate of the NH ₃ gas is adjusted by the MFC 64 c, supplied to the processing chamber 54 through the nozzle 60, and exhausted from the exhaust pipe 68. At this time, the NH ₃ gas is supplied to the wafer W. The NH ₃ gas supplied to the wafer W reacts with at least a part of the first layer formed on the wafer W in step 1, that is, the Si-containing layer. Thus, the first layer is thermally nitrided by non-plasma, and is changed (modified) into a second layer containing Si and N, that is, a silicon nitride layer (SiN layer). At this time, the plasma-excited NH ₃ gas is supplied to the wafer W, and the first layer is changed to the second layer (SiN layer) by plasma nitriding the first layer. You may.

After the second layer is formed, the valve 66c is closed, and the supply of the NH ₃ gas is stopped. Then, the NH ₃ gas and the reaction by-product remaining in the processing chamber 54 or having contributed to the formation of the second layer are discharged from the processing chamber 54 by the same processing procedure as in Step 1. At this time, the point that the gas or the like remaining in the processing chamber 54 does not need to be completely exhausted is the same as in Step 1.

  By performing the above two steps non-simultaneously, that is, without performing synchronization, a predetermined number of times (n times), a SiN film having a predetermined composition and a predetermined thickness can be formed on the wafer W. Note that the above cycle is preferably repeated a plurality of times. That is, the second layer (SiN layer) formed when the above-described cycle is performed once is made smaller than a predetermined thickness, and the second layer (SiN layer) is laminated. It is preferable to repeat the above cycle a plurality of times until the thickness of the SiN film reaches a predetermined thickness.

After the film forming process is completed, the valves 66b and 66d are opened, N ₂ gas is supplied from the gas supply pipes 62b and 62d to the processing chamber 54, and exhausted from the exhaust pipe 68. N ₂ gas acts as a purge gas. As a result, the processing chamber 54 is purged, and gases and reaction by-products remaining in the processing chamber 54 are removed from the processing chamber 54 (purge). Thereafter, the atmosphere in the processing chamber 54 is replaced with an inert gas (inert gas replacement), and the pressure in the processing chamber 54 is returned to normal pressure (return to atmospheric pressure).

(Boat unloading process: S15)
After returning to the atmospheric pressure, the seal cap 78 is lowered by the boat elevator 82, and the lower end of the reaction tube 50 is opened. Then, the processed wafer W is carried out from the lower end of the reaction tube 50 to the outside of the reaction tube 50 while being supported by the boat 58 (boat unloading).

(Wafer discharge step: S16)
The processed wafer W is taken out of the boat 58 by the substrate transfer machine 86 (wafer discharging).

(Carrier unloading step: S17)
The next processed wafer W is stored in the pod 20 by the substrate transfer machine 86, and the pod 20 storing the processed wafer W is loaded in the load port (AGV port 22, OHT It is returned to the port 32) and collected by the external transport device.

  Next, an apparatus monitor control system as a substrate processing system according to the present embodiment will be described with reference to FIG.

  The apparatus monitoring system according to the present embodiment includes cameras 91 to 95, a monitoring controller 310 that saves image data recorded by the cameras 91 to 95, an apparatus controller 210, an apparatus controller 210, a monitoring controller, and cameras 91 to 95. And an operation unit PC (Personal Computer) 400 as an operation unit controller connected to the device controller 210 and the monitoring controller 310. Further, the operation unit in the device controller 210 may be used as the operation unit. In FIG. 5, the device controller 210, the monitoring controller 310, and the operation unit PC 400 are shown separately, but the monitoring controller 310 and the operation unit PC 400 are included in one of the components of the substrate processing apparatus 4. Needless to say. Here, the monitoring controller 310 and the operation unit PC 400 may have the same configuration as the device controller 210. The monitoring controller 310 and the clocks of the cameras 91 to 95 are synchronized with the accuracy of msec, so that the monitoring controller 310 can accurately hold the image data recorded by the cameras 91 to 95.

  The apparatus controller 210 and the monitoring controller 310 are installed in a clean room where the substrate processing apparatus 4 is installed, and the operation unit PC 400 is installed in an office room or the like separate from the clean room. That is, the device controller 210 and the monitoring controller 310 are remotely controlled by using the operation unit PC 400 distant from the clean room as the input / output device 222. The apparatus controller 210 acquires event data generated when a wafer W is transferred, and alarm data generated when a transfer error occurs. When acquiring the event data, the device controller 210 transmits an event notification based on the event data to the monitoring controller 310 and the operation unit PC 400. Further, the apparatus controller 210 is configured to transmit an alarm notification including error information based on alarm data to the monitoring controller 310 and the operation unit PC 400 when a transport error occurs. Also, an alarm notification including error information is transmitted to the management device 402 and the host PC 404 of the customer or the like by e-mail, and a screen similar to the display unit of the operation unit PC 400 is displayed on the display unit of the management device 402 or the host PC 404. Is configured to allow remote display. Here, the event data is data acquired from a sensor provided in each transport mechanism such as a transport robot, and includes a carrier loading step, a lid expanding step, a wafer charging step, a boat loading step, a film forming step, and a boat unloading step. Information (event information) indicating the timing of starting and ending wafer transfer in each step (event) such as a loading step, a wafer discharging step, and a carrier unloading step, and includes an event occurrence date and time. The alarm data is information (error information) indicating the occurrence of a transfer error caused by the transfer means such as a position shift, a drop, a break, a remaining transfer, and the like, which occur when the wafer W is transferred. Contains. Specifically, the error information includes information on the name of the device in which the transport error has occurred, the alarm ID set for the transport error, the time at which the transport error occurred, and the like. The details of the cameras 91 to 95 will be described later.

  As shown in FIG. 6, the monitoring controller 310 uses a video recording program executed by the monitoring controller 310 to execute a moving image (high-compression / low-quality moving image) in H.264 format, which is event image data as first image data described later. ) And a moving image (low-compression / high-definition moving image) in Motion JPEG (Joint Photographic Experts Group) or M-JPEG (hereinafter referred to as MJPEG) format, which is alarm image data as second image data described later. It is configured as follows. The alarm image data is the image data when a failure such as a transport error occurs, whereas the event image data is the status when the substrate is transported until the failure such as a transport error occurs or the failure occurs. 7 is image data showing a normal state of a board when it is transported. The monitoring controller 310 includes a database 311a as a storage unit for storing a list of event image data and alarm image data, and memories 312a and 312b as buffer units for temporarily storing moving images of the event image data and alarm image data, respectively. And storage units 313a and 313b as hard disk drives for storing (storing) event image data and alarm image data, respectively. Hereinafter, a storage unit that stores event image data is referred to as a first storage unit 313a, and a memory that temporarily stores event image data is referred to as a first memory 312a. The second storage unit 313b stores a storage unit that stores the alarm image data for each of the cameras 91 to 95, and a second memory 312b stores a memory that temporarily stores the alarm image data for each of the cameras 91 to 95. Called.

  For example, upon receiving an event notification indicating the start of transfer of the wafer W (or the pod 20) from the apparatus controller 210, the monitoring controller 310 stores the first image data (event image data) in the memory (event image data) recorded by the cameras 91 to 95, respectively. The storage in the first memory 312a) is started. The event image data is collected in one first memory 312a for temporarily storing image data recorded by the cameras 91 to 95, and is periodically stored in the first storage unit 313a. In this case, upon receiving an event notification from the device controller 210 indicating that the transfer of the wafer W (or the pod 20) has been completed, the monitoring controller 310 transfers the first image data recorded by the cameras 91 to 95 to the first memory 312a. The storage is ended, and the first image data in the first memory 312a is stored in the first storage unit 313a. For example, when the first memory 312a is full, the data may be transferred to the first storage unit 313a in a lump, or the transfer time to the first storage unit 313a may be determined in advance by a set value. Then, the event image data (first image data) is stored in a database DB as an “event recording information list” to be described later including a storage destination directory of the event recording file of the event image data and event information. For example, while the event information is registered in the database 311a at the timing of the event notification indicating the start, the file creation of the event image data is started in the first storage unit 313a. While the database 311a is being updated at the timing of the event notification indicating the end, the end processing (file close processing) of filing in the first storage unit 313a is performed.

  After being activated and connected to the cameras 91 to 95, the monitoring controller 310 starts storing second image data (alarm image data) for several tens of seconds in each memory (second memory 312b). With a ring buffer for several tens of seconds, the oldest image data is overwritten with the latest image data, and data for the past several tens of seconds is always stored. The alarm image data is temporarily stored in the second memory 312b provided for each of the cameras 91 to 95. When the monitoring controller 310 receives from the apparatus controller 210 an alarm notification indicating the occurrence of a transfer error caused by the transfer means such as a position shift, a drop, a break, a remaining transfer, and the like, which occur when the wafer W is transferred, the camera 91 to 95 Is a predetermined range before and after the occurrence of the transport error of the alarm image data stored in the second memory 312b provided in the second memory 312b, and data for several tens of seconds before and after the occurrence of the transport error, for example, 20 seconds before and after the occurrence of the transport error The file is stored in the second storage unit 313b provided for each of the cameras 91 to 95. Further, although not shown, the alarm image data is stored in a database DB as an “alarm recording information list” to be described later including a storage directory of the recording file and error information.

  The monitoring controller 310 executes the event recording task and the alarm recording task incorporated in the recording monitoring program, so that the event image data is stored in the first storage unit 313a, the event recording file is created, and the alarm image data is stored in the second storage unit 313a. The storage in the storage unit 313b and the creation of the alarm recording file are performed. In the case where the HDD capacity of the first storage unit 313a is sufficient, or in the case of a camera showing a part to be recorded even when the first storage unit 313a is not operating, the event image data is transmitted from the device controller 210 to the start of conveyance of the conveyance mechanism and Instead of the event notification indicating the end, the image data may be constantly recorded image data in which the event image data is periodically stored in the first storage unit 313a. For example, image data recorded for 24 hours N (natural number) days may be used. On the other hand, when the HDD capacity is limited, or when image data during the transport operation is to be held for as long as possible, event image data is recorded in the first storage unit 313a only during transport according to the event notification. You. The recording method of such event image data (first image data) is set for each of the cameras 91 to 95.

  FIG. 7 shows a moving image format obtained from the cameras 91 to 95. In the present disclosure, the monitoring controller 310 is configured to be able to simultaneously acquire two types of moving images (image data), that is, moving images in H.264 format (event image data) and moving images in MJPEG format (alarm image data) from one camera. Have been. That is, the cameras 91 to 95 each record the transfer operation of the wafer W as event image data, and record the transfer operation of the wafer W as alarm image data with higher definition than the event image data.

  Here, an image in the MJPEG format (second image data) forms a moving image by a series of one JPEG format image (hereinafter, also referred to as a frame) as shown in FIG. 8, for example. FIG. 8 shows a moving image in which the boat 58 rises to the reaction tube 50 in MJPEG format from left to right for each frame. In MJPEG, there is no dependency between frames, and an MJPEG image is very stable because even if one frame is lost during data transmission, it does not affect the remaining frames at all. The advantage of the MJPEG format is that there is no compression other than JPEG compression, and the image quality does not deteriorate. Therefore, for example, if a failure occurs during the operation of the transport mechanism and the image is recorded in the MJPEG format, it is possible to confirm the failure occurrence status with an image (moving image) having no compression other than JPEG compression and image quality. . The disadvantage is that the data cannot be compressed using video compression techniques because of the complete sequence of images. In the present embodiment, 30 frames of images are recorded per second and stored in the second storage unit 313b of the monitoring controller 310. That is, when an alarm occurs, high-definition image data is stored every about 33 msec.

As the second image data, a BMP format or a PNG format may be used. The JPEG image in the MJPEG format is not recorded in a place where there is no motion as shown in FIG. Compared to the H.264 format, there is no compression other than JPEG compression, and image quality degradation is less. However, in the JPEG compression technique, since the following processing is mainly performed, noise in block units may be seen when the image is enlarged and displayed (irreversible compression method).
1. The color information is converted from RGB to YCbCr.
2. The whole pixel is decomposed into 8 × 8 block units.
3. DCT (frequency analysis) is performed on each block, and the resulting value is quantized.
4. The quantized value is zigzag scanned and run length coding is performed.
5. The DC component is compressed by DPCM (Differential Pulse Code Modulation).
6. This is encoded with a Huffman code and output in block order.

The BMP format has no special compression and a large file size, but has a simple structure and high versatility, and maintains image information as it is (lossless compression method). Since the PNG format is a lossless compression type image format, there is no image degradation due to compression. Therefore, when the second image data is recorded in the BNP format or the PNG format, it can be expected that the state is clearly confirmed without noise in block units when the image is enlarged and displayed.

  Here, the first image data is the latest MPEG standard for video encoding, which is also called MPEG-4 Part 10 AVC (Advanced Video Coding). H.264 is expected as a standard for next-generation video compression. As shown in FIG. 7, the data size of H.264 is reduced by 80% or more compared to MJPEG and 50% or more compared to MPEG-4. For example, the storage capacity of the first storage unit 313a is significantly reduced. Can be In an image frame, the amount of data can be reduced by deleting unnecessary information. For example, as shown in FIG. 9, portions where there is no change between previous and subsequent frames are deleted. Here, FIG. In the H.264 format, a moving image in which the boat 58 rises to the reaction tube 50 is displayed frame by frame from left to right as in FIG. This one frame is 0.033 msec similarly to the image in the MJPEG format (second image data). H. In the H.264 format, when compressing image data, a moving part and a stationary part are separated between frames, and the moving part rewrites the image data as needed according to the change of the time axis. It is assumed that the image data does not change even if the time changes, and the original image data is used. However, although the compression ratio is greatly increased, if the moving part and the stationary part are not properly separated, noise may be generated and the image may become unclear.

  H. The H.264 format uses a discrete cosine transform (DCT) as a motion compensation (MC) inter-frame predictive coding method, the same as MPEG-2, and is a so-called MC + DCT method. H. The H.264 format has been standardized with the aim of realizing ultra-high compression more than twice that of the video compression coding scheme based on MPEG-2 or MPEG-4.

  In order to further compress image data, for example, as shown in FIG. The H.265 format may be used. H. In the H.264 format, as shown in FIG. 10A, the entire screen is finely divided and only the changed portions are transmitted to the monitoring controller. That is, a block that has changed greatly and a block that has relatively small change are transmitted in the same fine block. H. The H.265 format is not fixed as a fine block, but a block that has changed greatly is a fine block, and a block that has relatively little change is a large block, so that the compression ratio can be optimized and the entire information amount can be reduced. I have. Such H. H.264 format and H.264 format. When image data of the H.265 format is applied to a semiconductor manufacturing apparatus, it is an effective means for applications that generally do not require much image quality, such as monitoring the flow meter by operating a screen on an operator.

  In addition, regarding the file storage in the MJPEG format, as shown in FIG. 11A, the moving image is usually stored in one file such as “.avi” or “.mov”. That is, in this format, when one file is reproduced by the player, frame-by-frame reproduction cannot be performed, and only slow reproduction is performed.

  In the alarm recording according to the present disclosure, as shown in FIG. 11B, a still image of 30 frames per second is converted into a JPEG file, and a total of 40 seconds including 20 seconds before the failure and 20 seconds after the failure is added. Output. That is, a JPEG file of 30 frames × 40 seconds = 1200 files is stored. By using this technical solution, a method of super slow reproduction is realized by performing frame-by-frame reproduction of an image at 0.033 second intervals. FIG. 12 shows an image in which a video at 0.033 second intervals is played back frame by frame. The transfer mechanism that transfers the wafers W transfers three sets of pods 20 (maximum 75 wafers W) to the boat 58 in about 9 to 10 minutes. For this reason, it is required that a video at a shorter interval can be acquired and reproduced in the investigation at the time of occurrence of a failure.

  Some customers are required to store moving images for several months (three months or more), and to meet the demand, record the images in higher-compressed image data (H.264 format or next-generation H.265 format). Will be. However, the highly compressed image data is subjected to data compression by comparing images on the time axis, so that when an important scene at the time of occurrence of a failure is output, the image may be unclear. H. H.264 format and H.264 format. In the H.265 format, frame-by-frame playback cannot be performed because an image is created by referring to information on the preceding and following frames. Therefore, before and after the occurrence of an error are simultaneously recorded in the MJPEG format, and the image at the time of the occurrence of the failure is stored as a high-definition image.

  Here, the state in which the semiconductor substrate such as the wafer W is transferred is always recorded and stored. If a transfer error occurs, the cause of the transfer error is referred to the recorded image data. Something like checking is done.

  However, if event image data, which is always recorded, is recorded in the low-compression and high-definition MJPEG format even when a failure such as a transport error does not occur, the storage capacity for storing the image data becomes enormous.

  For this reason, in the present embodiment, the event image data that is constantly recorded even when a failure such as a transport error does not occur is a high-compression and low-quality H.264 image data. The alarm image data stored in the H.264 format and recorded only when a failure such as a transport error occurs is stored in the low compression and high definition MJPEG format.

  Next, the imaging points of the cameras 91 to 95 will be described with reference to FIG. The object to be photographed by the camera is a transfer mechanism that mainly transfers the wafer W, for example, the transfer port 42, the pod transfer mechanism 40, the substrate transfer machine 86, the boat 58, and the like. The transfer confirmation of the pod 20 at the transfer port 42, the pod transfer operation check, the removal of the wafer from the pod 20, the charge of the boat 58, the check of the discharge, the check of the state of the wafer being moved by the substrate transfer machine 86, The purpose is to confirm the elevation of the boat 58 and the wafer W loaded in the boat 58. Also, a moving image and a still image are acquired as image data, and these image data are stored in the first storage unit 313a or the second storage unit 313b of the monitoring controller 310. In addition, the cameras 91 to 95 perform exposure (illumination) control according to the operation of the transfer port 42, the pod transfer mechanism 40, the substrate transfer device 86, the transfer mechanism (the imaging target) such as the boat 58, and the surrounding environment. Automatically.

  Moving images (event image data) acquired by the cameras 91 to 95 during carrier loading / unloading by the pod transport mechanism 40, charging / discharging of the wafer W by the substrate transfer device 86, and loading / unloading of the boat 58 are performed. It is stored in the first storage unit 313a. That is, the event image data is filed and stored in the first storage unit 313a every predetermined time (predetermined event). For example, event image data is filed and stored for each substrate transfer process such as charging / discharging a wafer W. The filing cycle (the predetermined time) is not limited to each event, and can be set as appropriate.

  Further, the monitoring controller 310 is configured to acquire a still image after the FIMS is opened, after the wafer charging is completed, and after the boat is unloaded. This is because the confirmation of the wafer W after the opening of the FIMS and the completion of the transfer process can at least grasp the occurrence of an abnormality only by confirming the still image. In the present embodiment, a low-compression and high-definition still image in the same format as the alarm image data is acquired, and the detailed situation of the transport error is grasped. In addition, a moving image may be acquired in the lid expanding step of the pod 20 by the FIMS opener as in the case of another transport event.

  Next, the relationship between each of the shooting targets of the cameras 91 to 95 and the alarm ID will be described with reference to FIG. FIG. 14 shows a table used to limit recording when a transport error occurs (when a failure occurs) based on the shooting target and the alarm ID.

  As shown in FIG. 14, when the number of cameras to be installed is five, an alarm ID is set for a transport error generated due to each shooting target. In other words, the alarm ID is linked to the imaging target and the cameras 91 to 95, respectively, and the imaging target and the cameras 91 to 95 can be specified from the alarm ID.

  The camera 91 (camera number 1) captures an image of the transfer of the pod 20 as a carrier between the external transport device and the AGV port 22 and OHT port 32. Note that, even if a transport error occurs during the delivery of the pod 20, the camera number and the imaging target can be specified from the alarm ID. Detection means (for example, a sensor) for detecting that a transport error has actually occurred is provided in the AGV port 22 and the OHT port 32 or in the vicinity thereof.

  The camera 92 (camera number 2) captures a picture of the transfer of the pod 20 between the pod transport mechanism 40 and the transfer port 42. The camera 92 captures an image of the pod transport mechanism 40 between the above-described carrier loading step and carrier unloading step, that is, between the AGV port 22 and the OHT port 32 and the transfer port 42. Even if a transport error occurs between the carrier loading step and the carrier unloading step, the camera number and the imaging target can be specified from the alarm ID. A sensor for detecting that a transport error has actually occurred is provided in the pod transport mechanism 40.

  The camera 93 (camera number 3) captures an image of the pod 20 placed on the placement portion of the transfer port 42 with the lid opened by the FIMS opener. Even if an error such as a wafer jumping out occurs after the FIMS opener is opened, the camera number and the imaging target can be specified from the alarm ID. A sensor for detecting that a transport error has actually occurred is provided in a FIMS opener (lid opening / closing mechanism) provided in the transfer port 42.

  The camera 94 (camera number 4) and the camera 95 (camera number 5) show how the wafer W is transferred by the substrate transfer device 86 between the pod 20 of the mounting portion of the transfer port 42 and the boat 58. At the same time, the boat 58 is raised and lowered between the transfer chamber 16 and the processing furnace 8. In other words, the camera 94 and the camera 95 move the wafer W and move the boat 58 up and down between the above-described wafer charging step and wafer discharging step, and between the above-described boat loading step and boat unloading step. Shoot the situation. Even if a transfer error occurs between the wafer charging step and the wafer discharging step, or between the boat loading step and the boat unloading step, the camera number and the imaging target can be specified from the alarm ID. A sensor for detecting that a transport error has actually occurred is provided in the substrate transfer device 86.

  Having the table shown in FIG. 14, when the monitoring controller 310 receives the alarm notification of the occurrence of the transport error including the alarm ID from the device controller 210, the monitoring controller 310 can specify the target camera number from the notified alarm ID. . Then, the monitoring controller 310 acquires alarm image data limited to the specified camera number and performs alarm recording (saves the alarm image data in the second storage unit 313b of each camera number).

  The alarm recording function of the monitoring controller 310 can acquire a high-definition moving image (alarm image data), but the file capacity becomes large due to low compression and the storage unit is occupied. Therefore, by applying the table illustrated in FIG. 14 in which the alarm ID and the camera number are defined according to the location where the transport error has occurred, the effect of reducing the data amount of the storage unit of the monitoring controller 310 is enhanced.

  Next, a flow of monitoring the transport operation of the substrate processing apparatus 4 by the monitoring controller 310 in the present embodiment will be described mainly with reference to FIG. Here, a case where a transfer error (failure) occurs in the wafer discharge process of step S16 will be described as an example. The following describes an example in which the operation unit PC 400 is used.

(Carrier loading step: S10)
When a transport request for the pod 20 is received from an external computer or the like such as the operation unit PC 400, the device controller 210 transmits an event notification indicating a carrier load start event to the monitoring controller 310. Upon receiving this event notification, the monitoring controller 310 causes the camera 91 (camera number 1) to start shooting.

  When the pod 20 is placed on the AGV port 22 or the OHT port 32 from the external transport device, the device controller 210 may transmit an event notification indicating a carrier load start event to the monitoring controller 310.

  The camera 91 captures an image of the delivery of the pod 20 as a carrier between the external transport device and the AGV port 22 and OHT port 32. The monitoring controller 310 is configured to store the event image data captured by the camera 91 in the first storage unit 313a (event recording) when the pod 20 is placed on the AGV port 22 or the OHT port 32. .

  When the pod 20 is placed on the AGV port 22 or the OHT port 32, the monitoring controller 310 switches from the camera 91 to the camera 92 (camera number 2) and transfers the camera 92 to the AGV port 22 and the OHT port 32. It is configured for taking a picture of a pod conveying mechanism 40 between the port 42.

  When the pod 20 is placed on the placement section of the transfer port 42, the device controller 210 transmits an event notification indicating a carrier load end event to the monitoring controller 310. Upon receiving this event notification, the monitoring controller 310 ends the shooting by the camera 92. The event image data captured by the camera 92 is configured to be stored (event recording) in the first storage unit 313a.

(Lid deployment step: S11)
Next, a step of deploying the lid of the pod 20 by the FIMS opener is performed. The device controller 210 transmits an event notification indicating the lid opening operation end event of the pod 20 by the FIMS opener to the monitoring controller 310. Upon receiving the end event notification, the monitoring controller 310 causes the camera 93 to shoot an image. Note that the device controller 210 may transmit an event notification indicating the FIMS open event to the monitoring controller 310 and cause the monitoring controller 310 to shoot a moving image as with another camera.

(Wafer charging step: S12)
Upon receiving a transfer request for wafer W from an external computer or the like (not shown), apparatus controller 210 transmits an event notification indicating a wafer charge start event to monitoring controller 310. Upon receiving this event notification, the monitoring controller 310 starts shooting with the camera 94 (camera number 4) or the camera 95 (camera number 5) and creates an event recording information list.

  The camera 94 or the camera 95 captures an image of the state where the wafer W is transferred between the pod 20 of the mounting portion of the transfer port 42 and the boat 58.

  When the wafer W is loaded on the boat 58, the apparatus controller 210 transmits an event notification indicating a wafer charge end event to the monitoring controller 310. Upon receiving this event notification, the monitoring controller 310 terminates shooting by the camera 94 or the camera 95.

  The event image data captured by the camera 94 or the camera 95 is configured to be stored (event recording) in the first storage unit 313a.

(Boat loading process: S13)
Upon receiving an instruction request to execute a process recipe from an operation unit (not shown) or the like, the device controller 210 transmits an event notification indicating a boat loading start event to the monitoring controller 310. Upon receiving the event notification, the monitoring controller 310 causes the camera 94 or the camera 95 to start shooting.

  The camera 94 or the camera 95 captures an image of the boat 58 being lifted and lowered between the transfer chamber 16 and the processing furnace 8. A camera that captures the state of the boat 58 moving up and down and a camera that captures the transfer of the wafer W between the pod 20 and the boat 58 may be separately provided.

  When the boat 58 is carried into the processing furnace 8, the device controller 210 transmits an event notification indicating a boat loading end event to the monitoring controller 310. Upon receiving this event notification, the monitoring controller 310 terminates shooting by the camera 94 or the camera 95. The event image data captured by the camera 94 or the camera 95 is configured to be stored (event recording) in the first storage unit 313a.

(Deposition process: S14)
Next, a process recipe is executed, and a film forming process is performed on the wafer W. In this step, the monitoring controller 310 stops the operations of all the cameras 91 to 95. The operation unit PC400 displays image data (moving image or still image) acquired in the transport event (carrier loading step, lid opening step, wafer charging step, boat loading step) completed so far on the operation screen of the operation unit PC400 or the like. To confirm the operation.

  Specifically, as shown in FIG. 16, an event recording information list 405 is displayed on the operation screen of the operation unit PC 400. The event recording information list 405 displays event information such as the date and time of occurrence of the event and the content of the event. Then, when the event information described in the event recording information list 405 is selected, each event is searched for, and a moving image from the start to the end of each event can be reproduced. When a plurality of batches are stored, a predetermined button can be pressed on the operation screen to compare and display different batches in the same event.

  As a result, normal operation is confirmed, and no transport error occurs.However, it is possible to find a difference in time from the start to the end of the same transport event, and take a measure in advance so that a transport error does not occur. it can. The normal operation check may be performed after the substrate processing step is completed.

(Boat unloading process: S15)
At the timing of shifting to the boat unloading step of the process recipe, the device controller 210 transmits an event notification indicating a boat unloading start event to the monitoring controller 310. Upon receiving the event notification, the monitoring controller 310 causes the camera 94 or the camera 95 to start shooting.

  The camera 94 or the camera 95 captures an image of the boat 58 being lowered between the transfer chamber 16 and the processing furnace 8.

  When the boat 58 is lowered into the transfer chamber 16, the device controller 210 transmits an event notification indicating a boat unload end event to the monitoring controller 310. Upon receiving this event notification, the monitoring controller 310 terminates shooting by the camera 94 or the camera 95. The event image data captured by the camera 94 or the camera 95 is configured to be stored (event recording) in the first storage unit 313a.

(Wafer discharge step: S16)
Apparatus controller 210 transmits an event notification indicating a wafer discharge start event to monitoring controller 310. Upon receiving the event notification, the monitoring controller 310 causes the camera 94 or the camera 95 to start shooting.

  The camera 94 or the camera 95 captures an image of the state where the wafer W is transferred between the pod 20 of the mounting portion of the transfer port 42 and the boat 58. If a transfer error occurs during transfer of the wafer W between the pod 20 on the transfer port 42 and the boat 58, an alarm for several tens of seconds before and after the transfer error occurs, for example, 20 seconds before and after the transfer error occurs. The image data is stored (alarm recording) in the second storage unit 313b of the monitoring controller 310.

  The alarm notification notified from the device controller 210 when a transport error occurs includes a notification indicating the end of the transport event. However, this notification is an event abnormal end notification indicating that an error has occurred in the transport event. The event abnormal end notification is information included in the alarm notification in the present embodiment. On the other hand, the device controller 210 may be configured to separately notify the event abnormal end notification and the alarm notification to the monitoring controller 310 and the operation unit PC 400, and the notification method is not particularly limited. In the present embodiment, in the wafer discharging step (S16), image data from the event start notification to the event abnormal end notification (that is, when a transport error occurs) is filed as event image data in the first storage unit 313a of the monitoring controller 310. Is saved.

  Note that the monitoring controller 310 sets the still image after the lid unfolding step (S11), after the wafer W transfer (after the above-described wafer charging step (S12)), or after the boat 58 descends (after the above boat unloading step (S15)). Is configured to obtain At this time, the monitoring controller 310 may cause the cameras 91 to 95 to shoot still images of higher definition (MJPEG format) with lower compression than the event image data, make them into files, and store them in the second storage unit 313b. .

  Here, a sequence from the occurrence of the transport error to the execution of the abnormality analysis will be described in detail with reference to FIG. The pod transfer device 40 for transferring the wafer W, the substrate transfer device 86, the boat 58, and other transfer means are provided with sensors as detection means for detecting a transfer error occurring when the wafer W is transferred, respectively. The controller 210 has acquired event data.

  The monitoring controller 310 holds the alarm image data acquired from each of the cameras 91 to 95 in the second memory 312b so that the alarm image data which is several tens seconds earlier in the past can be recorded when a transport error occurs. When a transport error is detected by a sensor (not shown), the apparatus controller 210 acquires alarm data and stops these transport units.

  Then, the device controller 210 notifies the monitoring controller 310 of the error information as an alarm (S100). The error information includes at least a device name in which the transport error has occurred, an alarm ID indicating the transport error, and a time at which the transport error occurred. Here, the device name includes not only information (device name data) specifying the substrate processing apparatus 4 but also the load port 22, the pod transport mechanism 40, the lid opening / closing mechanism, the substrate transfer machine 86, the boat 58, and the rotating mechanism 80. , The boat elevator 82, the cameras 91 to 95, and other information (name data) for specifying the devices constituting the substrate processing apparatus 4. After acquiring the alarm notification, the monitoring controller 310 stores the low-compression and high-definition MJPEG format alarm image data for several tens of seconds before and after the transport error occurrence time, for example, 20 seconds before and after the transport error occurrence, in the second storage. The data is stored in the unit 313b (S101). That is, the monitoring controller 310 is configured to file the alarm image data held in the second memory 312b and save (alarm recording) in the second storage unit 313b.

  Further, the device controller 210 issues an alarm notification of error information to, for example, the operation unit PC 400 at the same timing as the monitoring controller 310 (S100). Then, the same failure occurrence screen as that of the failed substrate processing apparatus is displayed on the operation unit PC 400 (S102). Then, when a means for displaying the image data recorded by the cameras 91 to 95 (for example, the E-CAM button 410 shown in FIG. 19) is selected on the operation screen, the monitoring controller 310 sets the alarm ID and the occurrence of the transport error. An alarm information screen including image data (event image data) at the time of occurrence of an alarm based on error information such as time is displayed on the operation unit PC 400. Here, since the operation unit PC 400 is remotely connected to the monitoring controller 310, the alarm information screen can be displayed on the display unit of the operation unit PC 400 (S103). In the present embodiment, a button for displaying event image data and / or alarm image data recorded by the cameras 91 to 95 is provided on the operation screen (alarm information screen) of the operation unit PC 400. . In other words, the monitoring controller 310 displays the event image data and / or the alarm image data recorded by the cameras 91 to 95 on the operation screen of the operation unit PC 400, so that transport errors such as moving image analysis, comparative moving image analysis, and error information analysis are performed. Recording analysis can be performed (S104). Then, in the operation unit PC400, a recovery operation (S105) is issued to a clean room worker or the like, so that a device in which a transport error has occurred is recovered.

  FIG. 18 shows a screen display flow executed by the monitoring controller 310 to remotely display the screen on the operation screen of the operation unit PC 400.

  For example, the monitoring controller 310 acquires an alarm recording reference notification after a button (for example, the E-CAM button 410 shown in FIG. 19) for referring to a predetermined alarm related to a transport error is pressed on the operation screen of the operation unit PC 400. Then, the alarm recording information list is searched (step S20). Then, as a result of the search, the storage destination directory of the alarm recording file of the target alarm image data, the target error information such as event information at the time of occurrence of a transport error are acquired, and the search result is stored (step S21). Here, the event information in the target error information refers to any one of the timings of the carrier loading step, the lid expanding step, the wafer charging step, the boat loading step, the film forming step, the boat unloading step, the wafer discharging step, and the carrier unloading step. It is shown that it is. Furthermore, in the present embodiment, since the clocks of the monitoring controller 310 and the cameras 91 to 95 are synchronized, the start and reproduction timings of the image data recorded by the cameras 91 to 95 at the start of the event information and at the time of occurrence of a transport error are matched. (At least can be fine-tuned). Details will be described later.

  Then, when the two-screen display button is pressed on the operation screen of the operation unit PC 400, the monitoring controller 310 refers to the target error information and performs the second storage unit 313b during the two-screen switching process (step S22). Is displayed on the right screen (step S23). Then, the event information at the time of occurrence of the transport error of the target error information is obtained (step S24), and the search result of the event information search directory and the storage directory of the event recording file having the same event information is obtained from the event recording information list. It is stored in the recording candidate information (step S25).

  If there is no display candidate whose event information matches the event recording candidate information (NO in step S26), the event recording information list storing the event image data on the same date as the time stamp at the time of occurrence of the transport error is displayed on the operation unit. It is displayed on the left screen of the operation screen of the PC 400 (step S27).

  If the event recording candidate information includes a display candidate whose event information matches (YES in step S26), the event recording information list storing the event image data having the same event information as that at the time of occurrence of the transport error is recorded in the event recording. It is acquired from the candidate information and displayed on the left screen (step S28).

  Then, when an event recording file to be simultaneously reproduced is selected from the list display on the left screen, the event image data stored in the second storage unit 313a is displayed with reference to the selected event recording file (step S29). ). That is, the monitoring controller 310 displays both the event image data and the alarm image data on the same screen. Then, when the two-screen simultaneous reproduction button is pressed, the alarm image data and the event image data are synchronously reproduced (simultaneously reproduced) on the left and right screens (step S30).

  Note that the above-described two-screen display and simultaneous playback are not limited to alarm image data and event image data, but alarm image data or event image data are displayed on the same screen in two screens and played back simultaneously to analyze a transport error. Can help.

  Specifically, when the operation unit PC 400 which is remotely connected to the monitoring controller 310 and displays the operation screen receives the alarm notification, the operation screen of the device controller 210 is displayed on the operation screen as shown in FIG. Displays the same failure information screen as. The fault information screen of FIG. 19 includes an overview display unit 407 that shows an overview of the apparatus, and a fault information display unit 409 that displays fault information such as a transport error. The display contents of the overview display unit 407 and the failure information display unit 409 allow the user to grasp the device in which the transport error has occurred, the location of the transport error, the content of the transport error, and the like. . The failure information screen shown in FIG. 19 includes a unit (E-CAM button) 410 for displaying image data captured by the cameras 91 to 95. Then, for example, when the E-CAM button 410 in FIG. 14 is pressed on the operation screen of the operation unit PC 400, the transfer error of the camera that has photographed the place where the transfer error has occurred as shown in FIG. The live video screen (event image data) is displayed. This live video screen is a still image when the recording is ended together with the alarm notification. That is, for example, when the remaining transfer of the wafer W is detected in the wafer discharging process, it is possible to confirm the situation when the remaining transfer occurs. Also, on the operation screen shown in FIG. 20, the recorded video can be rewound, the recorded video can be reproduced by the play button, and the frame-by-frame playback can be performed by the frame-forward button.

  FIG. 20 also shows a search cell 406 and an alarm list 408 for searching for an alarm ID. The alarm list 408 includes at least a date and time of occurrence of a transport error and an alarm ID. When an alarm ID or a transport error occurrence time is selected from the alarm list 408, the second storage unit 313b of the corresponding camera is searched from the selected alarm ID and time stamp, and the higher than the live video screen (event image data). A moving image (alarm image data) for several tens of seconds before and after the occurrence of a detailed transport error is displayed, and the details of the alarm event occurrence state can be confirmed by referring to the high-definition alarm image data.

  As shown in FIG. 20, the transport error occurrence screen is provided with a two-screen display A button 411 and a two-screen display B button 412, which are comparison reference buttons. Then, when the two-screen display A button 411 is pressed, two screens for comparison reference are displayed as shown in FIG. That is, a list is displayed on the operation screen so that a file of low-compression and high-definition alarm image data can be selected, and a desired file is selected and displayed in comparison with another low-compression and high-definition alarm image data of the same day. Can be. It should be noted that the alarm image data can be displayed in comparison with alarm image data of a transport error having the same alarm ID but occurring at different dates and times. This makes it possible to analyze whether the cause of the transport error is the same or different.

  Further, when the two-screen display B button 412 is pressed on the transport error occurrence screen as shown in FIG. 20, the normal operation in the same transport event and the transport error as shown in FIG. The abnormal operation when the error occurs can be compared and displayed on two screens.

  Specifically, the event image data to be reproduced simultaneously with the transport error occurrence screen on the right side is selected with reference to the event label display of the event recording file. Then, the two-screen simultaneous playback button 414 is pressed to synchronously reproduce the moving image of the high-compression event image data in the normal state on the left and the low-compression and high-definition alarm image data of the right image on the right. If the images are not aligned when the synchronized playback is performed, the adjustment is made using the illustrated moving image operation buttons. That is, by comparing and displaying the abnormal operation at the time of occurrence of the transport error with the normal operation, it is possible to analyze the difference between the normal operation and the normal operation.

  Further, on the transport error occurrence screen shown in FIG. 20, a target alarm moving image is selected from the displayed alarm list 408, and a two-screen display B button 412 is pressed. Then, the database 311a is searched from the reproduction start time stamp (time stamp of alarm occurrence time—20 seconds) of the selected alarm moving image and the target camera name, and a file of the first image data (event image data) is stored in the first storage unit. Remove from 313a. The first image data is automatically located and displayed on the left side with the reproduction start time stamp. The operator can operate the first image data on the left side to check a moving image until a transport error occurs. Also, it is possible to select and reproduce a moving image until a transport error occurs with reference to the event label display.

  As a result, the moving image before and after the occurrence of the transport error and the alarm image data before and after the occurrence of the transport error (20 seconds before the occurrence of the alarm and 20 seconds after the occurrence of the alarm, a total of 40 seconds) are displayed on the screen as event image data. It can be displayed.

  According to the present embodiment, H.264. Since the image data is stored as event image data, which is a moving image in the H.264 format, the data is compressed if the operation is normal. On the other hand, if there is a part that differs between frames, specifically, a part that does not move in a normal transport operation, if there is a part that moves immediately before a transport error occurs, it can be recorded without missing, and by the time of the transport error The transition of the event image data to be reached can be confirmed.

  In addition, when displaying a moving image or a still image captured by a camera, not only the transporting means of the capturing target but also the surrounding environment is captured. With this, even if the error is not caused directly by the transporting means but caused by a component around the transporting means to be photographed, if the error is within the range of the photographing by the camera (if it is displayed in the event image data or the alarm image data, ) By analyzing the image, the cause of the error can be located.

  Then, the person in charge of the device repeatedly checks the moving image and the still image displayed on the display unit of the operation unit, performs alarm recording analysis, grasps the situation where the transport error has occurred, and determines a recovery method. A recovery instruction can be issued by telephone, e-mail, or the like. After that, the operator performs the device recovery work according to the instruction. The operation unit may be arranged at a position separated from the factory where the substrate processing apparatus 4 is arranged. In this case, the person in charge of the device instructs the operator or the device engineer in the clean room to take measures for the device recovery, and the operator or the device engineer performs the device recovery work according to the instruction.

(Carrier unloading process: S17)
Then, when the error is released by the recovery process in the wafer discharge process, the next carrier unloading process starts the operation opposite to the carrier loading as usual. When receiving the start event, the monitoring controller 310 causes the camera 91 to start recording the event image data, and causes the camera 91 to stop recording the event image data when receiving the end event. The monitoring controller 310 is configured to store the event image data acquired by the camera 91 in the first storage unit 313a and update the event recording information list during the carrier unloading process.

  According to the present embodiment, at least one or more of the following effects (a) to (d) can be obtained.

  (a) According to the present embodiment, high-definition image data is separately obtained from image data during board transfer when a transfer error occurs while obtaining image data during board transfer, and each is obtained when the transfer error is analyzed. Can be used, and a transport error analysis (failure analysis) can be performed.

  (b) In the present embodiment, a sensor provided in each transfer mechanism such as a transfer robot is configured to notify an event signal not only to the device controller 210 but also to the operation unit for each event indicating a wafer transfer start timing and the like. . Accordingly, the operation unit determines whether the event information corresponds to the camera installation location at the end timing of the event, performs cueing based on the event occurrence time of the event recording file stored in the storage unit, and performs a normal operation. Can be confirmed, and moving images (event image data) of a plurality of event information can be simultaneously compared and displayed.

  (c) In the present embodiment, when the corresponding event information is selected from the event recording information list of the monitoring controller 310, a moving image (event image data) obtained by the camera from the event occurrence time is reproduced. As described above, according to the present configuration in which the cameras 91 to 95 are provided for each event, the recording is performed only during the period when the apparatus is operating (or each transport unit that transports the wafer W is moving), and thus the recording is always performed. Compared with the case, the recording period by the camera can be made longer.

  (d) In the present embodiment, by selecting the event recording information file and the alarm recording file, respectively, the event recording information file and the alarm recording file can be displayed on the same operation screen.

  The present disclosure is not limited to the above embodiments, and it goes without saying that various changes can be made without departing from the spirit of the present disclosure.

(Other embodiments)
For example, according to the above-described embodiment, the data acquisition cycle is 30 frames per second, the second image data is stored in the second storage unit 313b as it is, and the first image data is the image data before and after the frame. In comparison, the image data is compressed depending on whether or not the data has changed, and is stored in the first storage unit 313a. However, it is not limited to this embodiment.

(Example 1)
The data acquisition cycle is 30 frames per second as in the above-described embodiment, but the first image data and the second image data have different resolutions. For example, even if the first image data is 1600 × 900 pixels and the second image data is 3840 × 2160 (4K) pixels, the same effect as in the present embodiment can be obtained. In addition, by using a multi-stream function for simultaneously transmitting the first image data and the second image data, it can be implemented with one camera.

(Example 2)
The data acquisition cycle can be changed between the first image data and the second image data. For example, the first image data is set to three frames per second, and the second image data is set to 30 frames per second as in the present embodiment. It can be a frame. As a result, the first image data can have a data amount that is one tenth of the second image data. In addition, since the handling of the second image data is the same as that of the present embodiment, the same effect as that of the present embodiment can be obtained.

  In the embodiments of the present disclosure, a case of processing a wafer has been described. However, the present disclosure can be applied to a general substrate processing apparatus that processes a glass substrate of a liquid crystal panel or a substrate such as a magnetic disk or an optical disk.

4 Processing equipment (substrate processing equipment)
91, 92, 93, 94, 95 Camera (recording means)
210 Device controller 310 Monitoring controller

Claims (5)

First control means for acquiring event data generated when a substrate is transported and alarm data generated when a transport error occurs;
Recording means for recording the transport operation of the substrate as second image data having higher definition than the first image data while recording the transport operation of the substrate as first image data;
A second storing unit that stores the first image data recorded by the recording unit in the first storage unit based on the event data and stores the second image data recorded by the recording unit in the second storage unit based on the alarm data; Control means;
An operation unit for displaying at least the first image data and the second image data,
The substrate processing system, wherein the second control means displays both the first image data and the second image data recorded at the time of occurrence of the transport error on the same screen. Transport means for transporting the substrate,
Detecting means for detecting the transport error by the transport means,
The detection unit detects event information indicating the start and end of the transfer of the substrate by the transfer unit,
The first control means notifies the second control means of the event information when the event information is detected by the detection means,
The second control means, when notified of the event information indicating that the transfer operation of the substrate has been completed, stores the first image data in which the transfer operation of the substrate from the start to the end is recorded in the first storage unit. The substrate processing system according to claim 1, wherein The first control means obtains a notification indicating the transport error from the detection means, and at least sets a device name in which the transport error has occurred, an alarm ID set for the transport error, and a time at which the transport error occurred. Notifying the second control means of the error information including
The second control means may be configured to search the second storage unit for the alarm ID and / or the time of occurrence by using the second image data and the board stored in the first storage unit in advance. 3. The substrate processing system according to claim 2, wherein the first image data recorded from the start to the end of the transfer operation is displayed on the same screen. First control means for acquiring event data generated when a substrate is transported and alarm data generated when a transport error occurs;
Recording means for recording the transport operation of the substrate as second image data having higher definition than the first image data while recording the transport operation of the substrate as first image data;
A second storing unit that stores the first image data recorded by the recording unit in the first storage unit based on the event data and stores the second image data recorded by the recording unit in the second storage unit based on the alarm data; Control means;
An operation unit for displaying at least the first image data and the second image data,
The substrate processing apparatus, wherein the second control unit displays both the first image data and the second image data recorded when the transport error occurs on the same screen. A method of manufacturing a semiconductor device having a step of transporting a substrate and a step of processing the substrate,
The step of transporting the substrate further comprises:
A step of acquiring event data generated during the transfer of the substrate and alarm data generated when a transfer error occurs,
While recording the transport operation of the substrate as first image data, the transport operation of the substrate is acquired as second image data having higher definition than the first image data, and the acquired first image data is stored in the event data. A storage step of storing the second image data in the second storage section based on the alarm data while storing the second image data in the first storage section based on the data;
A display step of displaying the first image data or the second image data,
In the display step,
A method of manufacturing a semiconductor device, wherein both the first image data and the second image data recorded when the transport error occurs are displayed on the same screen.

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