TWI757618B - Substrate processing system, substrate processing apparatus, and manufacturing method of semiconductor device - Google Patents

Abstract

An object of the present invention is to perform abnormality analysis using the image data when the substrate is transported and the image data when a transport error occurs, respectively. The present invention includes: first control means for acquiring event data generated when the substrate is transported and alarm data generated when a transport error occurs; recording means for recording the substrate transport operation as the first image data, While recording the conveying action of the substrate as second image data having a higher resolution than the first image data; the second control means makes the first storage part store the data obtained by the recording means according to the event data. recording the first image data, and causing the second storage part to store the second image data to be recorded by the recording means according to the alarm data; and an operation part displaying at least the first image data and the second image image data; and the second control means displays both the first image data and the second image data recorded when a transfer error occurs on the same screen.

Description

Substrate processing system, substrate processing apparatus, and manufacturing method of semiconductor device

The present invention relates to a substrate processing system, a substrate processing apparatus, and a method for manufacturing a semiconductor device.

The substrate processing apparatus is configured to, for example, transfer a substrate (hereinafter also referred to as a wafer) into a processing chamber by a transfer means, and perform predetermined processing on the substrate in the processing chamber. When the substrate is transported, for example, the substrate may be displaced, dropped, or damaged due to a failure of the transport means or a pressure difference between the inside and outside of the processing chamber.

In the past, the conveyance status of the conveyance means has been grasped (for example, refer to Patent Document 1). In addition, a detection means for detecting the state of the substrate (such as a photo sensor, a sensor such as a mapping sensor, etc.) is provided, and when the state of the substrate at a predetermined position is different from the expected value, the It is detected as a conveyance error, and a conveyance error state or a monitor screen of the conveyance system when a conveyance error occurs is displayed on the operation screen (for example, refer to Patent Document 2). However, even if it is known that a conveyance error has occurred, the detailed state of the board such as positional displacement, drop, damage, etc., or the cause of the state cannot be immediately known.

In order to solve this situation, for example, a recording means such as a camera can be installed in the substrate processing apparatus and used for the analysis of conveyance errors (for example, refer to Patent Document 3). However, if the image data in operation is simply stored continuously, when a transfer error occurs, it is necessary to select appropriate image data from a huge amount of image data and display it, which takes time for analysis.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-161346

[Patent Document 2] Japanese Patent Laid-Open No. 2011-155244

[Patent Document 3] Japanese Patent Laid-Open No. 2013-030747

An object of the present invention is to provide a configuration for performing analysis using image data when a substrate is transported and image data when a transport error occurs.

According to an aspect of the present invention, there is provided a technique comprising: first control means for acquiring event data generated when a substrate is transported and alarm data generated when a transport error occurs; and recording means for recording the transport operation of the substrate While recording as the first image data, the conveyance of the substrate is recorded as the second image data having a higher resolution than the first image data; and second control means for causing the first storage unit to be based on the the event data for storing the first image data recorded by the recording means, and causing the second storage unit to store the second image data recorded by the recording means based on the alarm data; and an operation unit , which displays at least the first image data and the second image data; and the second control means displays both the first image data and the second image data recorded when the transfer error occurs in the the same picture.

According to the present invention, the abnormality analysis of the transport error can be performed using the image data when the substrate is transported and the image data when the transport error occurs, respectively.

4: Processing equipment (substrate processing equipment)

8: Processing furnace

12: Containment Chamber

14: Cassette transfer area

16: Transfer room

20: Box (FOUP)

22: AGV port (loading port)

22A: Moving in and out

24: Box

25: Platform

25B, 28A: Sensor (detector)

26: Horizontal drive mechanism

30: Storage Shelves

30A, 30B: Storage Shelves (Box Shelves)

32:OHT port

40: Cassette transport mechanism (cassette transport device)

40A: Track Mechanism

40B: Transition section (transition path)

40C: Retention Department

40D: Lifting part

42: Transfer port

42B: Placing table

46: Heater

50: reaction tube

54: Processing Room

58: Crystal Boat

60: Nozzle

60A: Gas supply hole

62a, 62b, 62c, 62d: gas supply pipes

64a, 64b, 64c, 64d: MFC (Mass Flow Controller)

66a, 66b, 66c, 66d: Valves

68: Exhaust pipe

70: Pressure sensor

72: APC valve

74: Vacuum pump

76: Temperature detection section

78: Sealing cover

78A: O-ring

78B: Sealing cover

80: Rotary mechanism

80A: Rotary shaft

82: Crystal boat lift

86: Substrate transfer machine

91, 92, 93, 94, 95: Cameras (recording means)

210: Device Controller

212:CPU

214:RAM

216: Storage Device

218: I/O port

220: Internal busbar

222: I/O device

224: External Storage Device

309: Hub

310: Monitoring Controller

311a: Databases

312a: 1st memory

312b: 2nd memory

313a: Storage Section 1

313b: Storage Section 2

400: Operation PC

402: Management device

404: Host PC

405: Event Video Information List

406: Retrieval grid

407: Schematic appearance display part

408: Alert List

409: Fault information display department

410: E-CAM button

411:2 screen display A button

412:2 screen display B button

414: 2 simultaneous playback buttons

W: Wafer

FIG. 1 is an oblique perspective view of a storage chamber which can be preferably applied to the first embodiment of the present invention.

2 is a cross-sectional view of a substrate processing apparatus that can be preferably applied to the first embodiment of the present invention.

FIG. 3 is a schematic configuration diagram of a vertical processing furnace which can be preferably applied to the substrate processing apparatus according to one embodiment of the present invention, and is a longitudinal cross-sectional view of a part of the processing furnace.

4 is a schematic configuration diagram of a controller that can be preferably applied to a substrate processing apparatus according to an embodiment of the present invention, and is a block diagram showing a control system of the controller.

FIG. 5 is a diagram showing a system configuration of a controller which can be preferably applied to an embodiment of the present invention.

FIG. 6 is a diagram for explaining the configuration of a program executed by a monitoring controller that processes image data recorded by the recording means preferably applicable to one embodiment of the present invention.

FIG. 7 is a diagram illustrating image data recorded by the recording means which can be preferably applied to one embodiment of the present invention.

FIG. 8 is a diagram for explaining the MJPEG format.

FIG. 9 is a diagram for explaining the H.264 format.

FIG. 10(A) is a diagram for explaining the H.264 format, and FIG. 10(B) is a diagram for explaining the H.265 format.

11(A) and (B) are diagrams for explaining file preservation in MJPEG format.

FIG. 12 is a diagram for explaining frame-by-frame playback of an alarm recording.

FIG. 13 is a diagram for explaining a recording means which can be preferably applied to an embodiment of the present invention.

FIG. 14 is a diagram for explaining a recording means which can be relatively applied to an embodiment of the present invention.

FIG. 15 is a diagram illustrating a flow of an image monitoring program that can be preferably applied to one embodiment of the present invention.

FIG. 16 is a diagram example of a function of finding the beginning of an event which can be preferably applied to an embodiment of the present invention.

FIG. 17 is a diagram illustrating a main part of the flow of an image monitoring program that can be preferably applied to an embodiment of the present invention.

FIG. 18 illustrates a sequence of a comparison screen display function that can be preferably applied to one embodiment of the present invention.

FIG. 19 is an example of an operation screen of a device controller which can be preferably applied to an embodiment of the present invention.

FIG. 20 is an example of a display of an alarm ID (Identification; identification) retrieval screen which can be preferably applied to an embodiment of the present invention.

FIG. 21 is an example of a comparison screen display which can be preferably applied to an embodiment of the present invention.

FIG. 22 is an example of a comparison screen display which can be preferably applied to an embodiment of the present invention.

Hereinafter, the first embodiment of the present invention will be described with reference to FIGS. 1 to 3 .

(1) Configuration of substrate processing apparatus

As shown in FIG. 1 , in the present embodiment, the substrate processing apparatus 4 is configured as an upright heat treatment apparatus (batch type upright heat treatment apparatus) that implements a heat treatment step of an IC (Integrated Circuit) manufacturing method. Furthermore, in the vertical heat treatment apparatus to which the present invention is applied, a FOUP (Front Opening Unified Pod; hereinafter referred to as a cassette) 20 for transporting the wafer W as a substrate is used as a carrier system. The substrate processing apparatus 4 includes a processing furnace 8 , a storage chamber 12 , and a transfer chamber 16 which will be described later.

(containment room)

On the front side of the casing of the substrate processing apparatus 4, a storage chamber 12 in which the cassette 20 is carried into the apparatus and stored therein is arranged. On the front side of the housing of the housing chamber 12 , an export/import port 22A serving as an opening for carrying out the cassette 20 into and out of the housing chamber 12 is opened so as to communicate with the inside and the outside of the housing chamber 12 . 22A of carry-out and carry-out entrances may be comprised so that it may be opened and closed by a front shutter. An AGV (Auto Guided Vehicle; Automatic Guided Vehicle) port (I/O platform) 22 serving as a loading port (cassette placing device) is provided inside the frame body of the unloading and unloading port 22A. A transfer port 42 is provided on the wall surface between the storage chamber 12 and the transfer chamber 16 . The cassette 20 is carried into the substrate processing apparatus 4 on the AGV port 22 by an intra-process transfer device (inter-process transfer device) located outside the substrate processing apparatus 4 , and is also carried out from the AGV port 22 .

Above the AGV port 22 in the front of the frame of the storage chamber 12 , a storage shelf (cassette shelf) 30A for storing the cassettes 20 is provided in two steps up and down. Moreover, in the rear of the frame of the storage chamber 12, a storage shelf (cassette shelf) 30B for storing the cassettes 20 is provided in a matrix.

An OHT (Overhead Hoist Transfer) port 32 serving as a loading port is arranged on the same straight line in the horizontal direction as the storage shelf 30A at the front and upper part of the frame body. The cassette 20 is carried into the OHT port 32 from above the substrate processing apparatus 4 by an intra-process transfer apparatus (inter-process transfer apparatus) located outside the substrate processing apparatus 4 , and is also carried out from the OHT port 32 . The AGV port 22 , the storage shelf 30A, and the OHT port 32 are configured such that the cassette 20 can be moved horizontally to the placement position and the transfer position by the horizontal drive mechanism 26 . Later, there are cases where the AGV port 22 is referred to as the first load port, and the OHT port 32 is referred to as the second load port.

As shown in FIG. 2 , the space between the storage shelf 30A on the front side and the storage shelf 30B on the rear side in the frame of the storage chamber 12 forms the cassette conveying area 14 , and the cassette 20 is transported in the cassette conveying area 14 . Handover and transport. A rail mechanism 40A serving as a moving path of the cassette transport mechanism 40 is formed on the top wall portion of the cassette transport area 14 (the top wall portion of the storage chamber 12 ). It is used as a cassette conveying device. Here, the delivery position is located in the cassette conveyance area 14 , for example, a position directly below the cassette conveyance mechanism 40 .

The cassette conveying mechanism 40 that conveys the cassette 20 includes a moving portion 40B that travels on the moving path, a holding portion 40C that holds the cassette 24, and a lifting portion 40D that vertically lifts and lowers the holding portion 40C. By detecting the encoder of the motor that drives the travel portion 40B, the position in the travel path can be detected, and the travel portion 40B can be moved to an arbitrary position.

(transfer room)

A transfer chamber 16 is formed adjacent to the rear of the storage chamber 12 . On the transfer chamber 16 side of the storage chamber 12, a plurality of wafer unloading and unloading ports for carrying the wafers W into and out of the transfer chamber 16 are arranged in a horizontal direction, and the transfer ports 42 are respectively provided in each Wafers are unloaded from the loading port. In the transfer port 42, the mounting table 42B on which the cassette 20 is placed is moved horizontally and pushed against the wafer unloading and unloading port, and the cover of the cassette 20 is used as a cover opening and closing mechanism (a cover opening and closing device), which is not shown in the figure. The FIMS (Front-Opening Interface Standard; Front-Opening Interface Standard) opener is expanded. When the cover of the cassette 20 is unfolded, the wafer W is transferred toward the inside and outside of the cassette 20 by the substrate transfer machine 86 as a substrate transfer device.

(treatment furnace)

The processing furnace 8 is installed above the transfer chamber 16 . As shown in FIG. 3, the processing furnace 8 has the heater 46 as a heating means (heating means). The heater 46 has a cylindrical shape, and is vertically installed by being supported on a heating base (not shown) as a holding plate. The heater 46 also functions as an activation mechanism (excitation part) for activating (exciting) the gas by heat, as described later.

Inside the heater 46, a reaction tube 50 which constitutes a reaction vessel (processing vessel) concentrically with the heater 46 is disposed. The reaction tube 50 is made of, for example, a heat-resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC), and is formed in a cylindrical shape with an upper end closed and a lower end open. A processing chamber 54 is formed in the hollow portion of the reaction tube 50 . The processing chamber 54 is configured to accommodate wafers W serving as substrates in a state of being arranged in multiple stages along the vertical direction in a horizontal posture by a wafer boat 58 to be described later.

In the processing chamber 54 , a nozzle 60 is provided so as to penetrate the lower part of the reaction tube 50 . The nozzle 60 is made of, for example, a heat-resistant material such as quartz or SiC. A gas supply pipe 62a and a gas supply pipe 62c are connected to the nozzle 60 . Mass flow controllers (MFCs) 64a and 64c serving as flow controllers (flow rate controllers) and valves 66a and 66c serving as on-off valves are respectively provided in the gas supply pipes 62a and 62c in this order from the upstream direction. Gas supply pipes 62b and 62d for supplying the inert gas are connected to the downstream side of the valves 66a and 66c of the gas supply pipes 62a and 62c, respectively. The gas supply pipes 62b and 62d are provided with MFCs 64b and 64d and valves 66b and 66d in this order from the upstream direction, respectively. The process gas supply part of the process gas supply system is mainly composed of the gas supply pipe 62a, the MFC 64a, and the valve 66a. Moreover, the reaction gas supply part which is a reaction gas supply system is comprised from the gas supply pipe 62c, the MFC 64c, and the valve 66c. Moreover, the inert gas supply part which is an inert gas supply system consists of gas supply pipes 62b, 62d, MFCs 64b, 64d, and valves 66b, 66d.

The nozzle 60 is installed in the annular space between the inner wall of the reaction tube 50 and the wafers W, from the lower part of the inner wall of the reaction tube 50 along the upper part, so as to rise upward toward the arrangement direction of the wafers W. That is, the nozzle 60 horizontally surrounds the region of the wafer arrangement region in the lateral direction of the wafer arrangement region in which the wafers W are arranged, and is disposed along the wafer arrangement region. The nozzle 60 is configured as an L-shaped long nozzle, the horizontal part of which is arranged to penetrate the lower sidewall of the reaction tube 50 , and the vertical part of which is erected at least from one end side of the wafer arrangement region to the other end side. be set to. A gas supply hole 60A for supplying gas is provided on the side surface of the nozzle 60 . The gas supply holes 60A are respectively opened so as to face the center of the reaction tube 50 , and the gas can be supplied toward the wafer W. As shown in FIG. A plurality of gas supply holes 60A are provided from the lower part to the upper part of the reaction tube 50 , each of which has the same opening area and has the same opening. The mouth spacing is set.

The reaction tube 50 is provided with an exhaust pipe 68 for exhausting the ambient gas in the processing chamber 54 . In the exhaust pipe 68, a pressure sensor 70 serving as a pressure detector (pressure detecting part) for detecting the pressure of the processing chamber 54 and APC (Auto Pressure Controller) serving as a pressure regulator (pressure adjusting part) are passed. ) valve 72, and a vacuum pump 74 as a vacuum evacuation device is connected. The APC valve 72 is a valve configured as follows: by opening and closing the valve in a state in which the vacuum pump 74 is operated, the vacuum evacuation and evacuation of the processing chamber 54 can be performed and the vacuum evacuation can be stopped, and in the state in which the vacuum pump 74 is operated, The valve opening can be adjusted according to the pressure information detected by the pressure sensor 70 , whereby the pressure of the processing chamber 54 can be adjusted. The exhaust system is mainly composed of an exhaust pipe 68 , an APC valve 72 , and a pressure sensor 70 . It is also contemplated to include a vacuum pump 74 in the exhaust system.

The reaction tube 50 is provided with a temperature detection unit 76 serving as a temperature detector. It is comprised so that the temperature of the processing chamber 54 may become a desired temperature distribution by adjusting the energization state to the heater 46 based on the temperature information detected by the temperature detection part 76. The temperature detection unit 76 is configured in an L-shape similarly to the nozzle 60 , and is provided along the inner wall of the reaction tube 50 .

Below the reaction tube 50, a sealing cover 78 serving as a furnace mouth cover is provided which can airtightly close the opening at the lower end of the reaction tube 50. The sealing cover 78 is made of metal such as SUS or stainless steel, and is a disk-shaped member. On the upper surface of the sealing cover 78, an O-ring 78A as a sealing member is provided, which is in contact with the lower end of the reaction tube 50. In addition, a sealing cover plate 78B for protecting the sealing cover 78 is provided in an inner region of the upper surface of the sealing cover 78 than the O-ring 78A. The sealing cover 78B is made of, for example, a heat-resistant material such as quartz or SiC, and is a disk-shaped member. The sealing cap 78 is configured to be in contact with the lower end of the reaction tube 50 from the lower side in the vertical direction.

The wafer boat 58 serving as a substrate supporter (substrate support device) is constituted by a plurality of For example, 25 to 200 wafers W are arranged in the vertical direction and supported in multiple stages in a state where the centers are aligned with each other in a horizontal posture, that is, the wafers W are arranged at intervals. . The wafer boat 58 is made of, for example, a heat-resistant material such as quartz or SiC.

On the opposite side of the sealing cover 78 from the processing chamber 54 , a rotating mechanism 80 as a boat rotating device for rotating the boat 58 is provided. The rotating shaft 80A of the rotating mechanism 80 penetrates the sealing cover 78 and is connected to the wafer boat 58 . The rotation mechanism 80 is configured to rotate the wafer W by rotating the wafer boat 58 .

As shown in FIG. 4 , a device controller (first control means) 210 serving as a control unit (control means) is configured to include a CPU (Central Processing Unit) 212 and a RAM (Random Access Memory; random access). memory) 214, storage device 216, and computer with I/O port 218. The RAM 214 , the storage device 216 , and the I/O port 218 are configured to exchange data with the CPU 212 via the internal bus 220 . An input/output device 222 configured as, for example, a touch panel or the like is connected to the device controller 210 . In addition, the device controller 210 is connected to the monitoring controller 310 as the second control means and the photographing devices (hereinafter referred to as cameras) 91, 92, 93, 94 and 95 (hereinafter abbreviated as “cameras”) as the recording means via the hub 309. 91~95). Furthermore, the details of the cameras 91 to 95 will be described later.

The storage device 216 is constituted by, for example, a flash memory, an HDD (Hard Disk Drive), or the like. In the storage device 216, a control program for controlling the operation of the substrate processing apparatus, a process recipe in which the sequence and conditions of the substrate processing to be described later are described, and the like are stored in a readable manner. The process recipe is combined so that the device controller 210 executes each sequence of the substrate processing steps described later to obtain a predetermined result, and functions as a program. Hereinafter, the process recipes, control programs, and the like are also integrated and simply referred to as programs. When the word program is used in this manual, there are cases where only the process recipe monomer is included, only the control program monomer is included, or both are included. shape. The RAM 214 is configured as a memory area (work area) in which programs, data, and the like read by the CPU 212 are temporarily stored.

The I/O port 218 is connected to the above-mentioned MFCs 64a, 64b, 64c, 64d, valves 66a, 66b, 66c, 66d, pressure sensor 70, APC valve 72, heater 46, temperature detection unit 76, vacuum pump 74, The rotation mechanism 80, the boat lifter 82 as the boat lifter, the cassette transport mechanism 40, the sensors (detectors) 25B and 28A, the horizontal drive mechanism 26, and the like.

The CPU 212 is configured to read the control program from the storage device 216 and execute it, and to read the process recipe from the storage device 216 according to the input of the operation command from the I/O device 222 and the like. The CPU 212 is configured to control in accordance with the contents of the read process recipe: the flow adjustment operations of various gases performed by the MFCs 64a, 64b, 64c, and 64d; and the opening and closing operations of the valves 66a, 66b, 66c, and 66d. ; By the opening and closing action of the APC valve 72 and the pressure adjustment action of the APC valve 72 of the pressure sensor 70; Start and stop of the vacuum pump 74; Rotation and rotation speed adjustment of the wafer boat 58 performed by 80; lifting and lowering action of the wafer boat 58 performed by the wafer boat lift 82; cassette conveying action performed by the cassette conveying mechanism 40; The driving operation of the horizontal driving mechanism 26 of 28A; and the substrate transfer operation performed by the substrate transfer machine 86 for the wafer boat 58, and the like.

The device controller 210 can be stored in an external storage device (for example, a magnetic disk such as a magnetic tape, a floppy disk or a hard disk, a CD (Compact Disc) or a DVD (Digital Versatile Disc) and other optical disks. , MO (Magneto-Optical disc; magneto-optical disc) and other magneto-optical discs, USB (Universal Serial Bus; Universal Serial Bus) memory or semiconductor memory such as memory cards) 224 The above programs are installed in the computer to constitute. The storage device 216 or the external storage device 224 is configured as a computer-readable recording medium. Hereinafter, these are also collectively referred to simply as a recording medium. Yu Ben said When the term "recording medium" is used in the specification, there are cases where only the storage device 216 is included, only the external storage device 224 is included, or both are included. Furthermore, the provision of the program to the computer may be performed without using the external storage device 224 but using a communication means such as a network or a dedicated line.

Next, the conveyance of the cassette 20 using the above-mentioned substrate processing apparatus 4 will be described.

(Carrier loading step: S10)

If the cassette 20 is supplied to the AGV port 22 or the OHT port 32 , the cassette 20 on the AGV port 22 or the OHT port 32 is carried in toward the inside of the substrate processing apparatus 4 . The loaded cassette 20 is automatically transported by the cassette transport mechanism 40 toward the designated platform 25 of the storage shelf 30 to be handed over, and after being temporarily stored, it is transported from the storage shelf 30 to be transferred. Handed over to a transfer port 42 , or directly transferred to the transfer port 42 .

The moving part 40B is controlled, and the cassette conveying mechanism 40 is moved to the upper side of the delivery position of the platform 25 on which the AGV port 22 of the cassette 20 to be conveyed is placed. Here, the upper part of the delivery position refers to the position where the cassette conveying mechanism 40 can hold the cassette 20 by lowering the holding part 40C by the lifting part 40D, that is, the position where the holding part 40C exists directly above the cassette 20 .

Confirming that the cassette conveying mechanism 40 is standing by above the delivery position, horizontally moves (slides) the platform 25 on which the AGV port 22 of the cassette 20 to be delivered is placed to the delivery position. Here, the sliding motion of the AGV port 22 and the driving of the cassette conveying mechanism 40 may be performed simultaneously.

After confirming that the platform 25 has been slid to the transfer position by the sensor 28A, the lifting portion 40D is controlled to lower the holding portion 40C to the position where the cassette 20 can be held, and the holding portion 40C is controlled to lift the cassette 20. Keep. It is confirmed that the holding part 40C is holding the cassette 20, and the raising and lowering part 40D is controlled to raise the holding part 40C.

By the sensor 25B of the platform 25, after confirming that the cassette 20 is not placed on the platform 25, the platform 25 is slid to the placing position. After confirming that the platform 25 has returned to the placement position by the sensor 28A, the cassette transport mechanism 40 is moved to the position above the transfer port 42 of the transfer object or the transfer position of the storage shelf 30 .

In the case of transferring to the transfer port 42, after the cassette transfer mechanism 40 is moved above the mounting portion of the transfer port 42, the lifting portion 40D is controlled to lower the holding portion 40C, and the cassette 20 is mounted on the transfer port 42. The loading portion of the loading port 42 . The placement portion of the transfer port 42 is located just below the cassette transport mechanism 40, and does not need to be moved horizontally for delivery.

When transported to the storage rack 30, the platform 25 of the storage rack 30 at the destination is moved horizontally (slid) to the transfer position, and the sensor 28A confirms that the platform 25 has been slid to the transfer position. After the position, the lifting portion 40D is controlled, the holding portion 40C is lowered, and the cassette 20 is placed on the platform 25 . Here, the sliding movement of the platform 25 of the storage shelf 30 and the driving of the cassette conveying mechanism 40 may be performed simultaneously.

(Lid unfolding step: S11)

When the cassette 20 is placed on the placing portion of the transfer port 42, the cover of the cassette 20 is opened by the FIMS opener as a cover opening and closing mechanism.

(Wafer feeding step: S12)

If the cover of the cassette 20 is opened, the plurality of wafers in the cassette 20 will be fed (wafer feeding) to the wafer boat 58 by the substrate transfer machine 86 .

(Chip loading step: S13)

If a plurality of wafers W are fed into the wafer boat 58 , the wafer boat 58 is carried (wafer loading) into the processing chamber 54 by the wafer boat elevator 82 . At this time, the seal cover 78 is hermetically closed (sealed) via the O-ring 78A. The state of the lower end of the reaction tube 50 .

Next, a sequence example of a process of forming a film on a substrate using the above-mentioned substrate processing apparatus 4 (hereinafter also referred to as a film forming process) will be described as a step in the manufacturing process of the semiconductor device (element). Here, an example will be described in which a film is formed on the wafer W by alternately supplying the first process gas (raw material gas) and the second process gas (reaction gas) to the wafer W as a substrate.

Hereinafter, a silicon nitride film (Si ₃ ) is formed on the wafer W by using hexachlorodisilane (Si ₂ Cl ₆ ; abbreviated as HCDS) gas as a raw material gas and ammonia (NH ₃ ) gas as a reaction gas. An example of _N4 film; hereinafter also referred to as SiN film) will be described. Furthermore, in the following description, the operations of the respective parts constituting the substrate processing apparatus 4 are controlled by the apparatus controller 210 .

In the film-forming process of the present embodiment, the SiN film is formed on the wafer W by performing a cycle of non-simultaneously performing the following steps a predetermined number of times (more than once): supplying the HCDS gas to the wafer W in the processing chamber 54 the step of removing the HCDS gas (residual gas) from the processing chamber 54 ; the step of supplying the NH ₃ gas to the wafer W in the processing chamber 54 ; and the step of removing the NH ₃ gas (residual gas) from the processing chamber 54 .

In addition, the case where the term "substrate" is used in this specification also has the same meaning as the case where the term "wafer" is used.

(Film-forming step: S14)

The processing chamber 54 , that is, the space in which the wafer W exists, is evacuated (decompressed exhaust) by the vacuum pump 74 so as to have a predetermined pressure (vacuum degree). At this time, the pressure of the processing chamber 54 is measured by the pressure sensor 70, and the APC valve 72 is feedback-controlled based on the measured pressure information. The vacuum pump 74 maintains a state of constant operation at least until the processing of the wafer W is completed.

In addition, the wafer W in the processing chamber 54 is heated to a predetermined temperature by the heater 46 to be heated. At this time, the energization state of the heater 46 is feedback-controlled based on the temperature information detected by the temperature detection unit 76 so that the processing chamber 54 has a predetermined temperature distribution. The heating in the processing chamber 54 by the heater 46 is continuously performed at least until the processing of the wafer W is completed.

In addition, the rotation of the boat 58 and the wafer W by the rotation mechanism 80 is started. The wafer boat 58 is rotated by the rotation mechanism 80, whereby the wafer W is rotated. The rotation of the boat 58 and the wafers W by the rotation mechanism 80 is continuously performed at least until the processing of the wafers W is completed.

If the temperature of the processing chamber 54 becomes the predetermined processing temperature stably, the following two steps, namely, steps 1-2 are sequentially performed.

[step 1]

The valve 66a is opened, and the HCDS gas is made to flow into the gas supply pipe 62a. The flow rate of the HCDS gas is adjusted by the MFC 64 a , is supplied to the processing chamber 54 through the nozzle 60 , and is discharged from the exhaust pipe 68 . At this time, the HCDS gas is supplied to the wafer W. At this time, the valve 66b is simultaneously opened, and the N ₂ gas is allowed to flow into the gas supply pipe 62b. The flow rate of the N ₂ gas is adjusted by the MFC 64 b , is supplied to the processing chamber 54 together with the HCDS gas, and is discharged from the exhaust pipe 68 . By supplying the HCDS gas to the wafer W, as the first layer, a silicon (Si)-containing layer having a thickness of less than 1 atomic layer to several atomic layers, for example, is formed on the outermost surface of the wafer W.

After the first layer is formed, the valve 66a is closed to stop the supply of the HCDS gas. At this time, the APC valve 72 is kept open, the processing chamber 54 is evacuated by the vacuum pump 74 , and the unreacted HCDS gas remaining in the processing chamber 54 or after assisting the formation of the first layer is discharged from the processing chamber 54 . At this time, the valve 66b is kept open, and the supply of N ₂ gas to the processing chamber 54 is maintained. The N ₂ gas acts as a flushing gas, whereby the effect of exhausting the gas remaining in the processing chamber 54 from the processing chamber 54 can be enhanced.

[Step 2]

After step 1 is completed, NH ₃ gas is supplied to the wafer W in the processing chamber 54 , that is, the first layer formed on the wafer W. The NH ₃ gas system is supplied to the wafer W by being activated by heat.

In this step, the opening and closing control of the valves 66c and 66d is performed in the same procedure as the opening and closing control of the valves 66a and 66b in step 1. The flow rate of the NH ₃ gas is adjusted by the MFC 64 c , is supplied toward the processing chamber 54 through the nozzle 60 , and is discharged from the exhaust pipe 68 . At this time, the NH ₃ gas is supplied to the wafer W. The NH ₃ gas supplied to the wafer W reacts with the first layer formed on the wafer W in step 1, that is, at least a part of the Si-containing layer. Thereby, the first layer is nitrided in a thermal state without plasma, and is changed (modified) into a silicon nitride layer (SiN layer) which is a second layer containing Si and N. In addition, at this time, the NH ₃ gas excited by the plasma may be supplied to the wafer W to perform plasma nitridation of the first layer, thereby changing the first layer into the second layer (SiN layer).

After the second layer is formed, the valve 66c is closed to stop the supply of the NH ₃ gas. Then, the unreacted NH ₃ gas remaining in the processing chamber 54 or after assisting the formation of the second layer, and reaction by-products are discharged from the processing chamber 54 by the same processing sequence as in Step 1 . At this time, it is not necessary to completely discharge the portion of the gas or the like remaining in the processing chamber 54, which is the same as step 1. FIG.

The cycle of performing the above-mentioned two steps asynchronously, ie, asynchronously, is performed a predetermined number of times (n times), whereby a SiN film of a predetermined composition and a predetermined film thickness can be formed on the wafer W. Furthermore, the above-mentioned cycle is preferably repeated a plurality of times. That is, it is preferable to make the thickness of the second layer (SiN layer) formed when the above-mentioned cycle is performed once smaller than the predetermined film thickness, and repeat the above-mentioned cycle a plurality of times until the second layer (SiN layer) is formed by lamination. The film thickness of the SiN film formed by the SiN layer) becomes a predetermined film thickness.

After the film formation process is completed, the valves 66 b and 66 d are opened, and the N ₂ gas is supplied from the gas supply pipes 62 b and 62 d toward the processing chamber 54 and discharged from the exhaust pipe 68 . N ₂ gas acts as a flushing gas. Thereby, the processing chamber 54 is flushed, and the gas and reaction by-products remaining in the processing chamber 54 are removed (flushed) from the processing chamber 54 . After that, the ambient gas of the processing chamber 54 is replaced with an inert gas (inert gas replacement), and the pressure of the processing chamber 54 is returned to normal pressure (return to atmospheric pressure).

(Crystal boat unloading step: S15)

After returning to atmospheric pressure, the sealing cover 78 is lowered by the boat lift 82 , so that the lower end of the reaction tube 50 is opened. Then, the processed wafer W is carried out from the lower end of the reaction tube 50 to the outside of the reaction tube 50 in a state supported by the wafer boat 58 (the boat is unloaded).

(Wafer unloading step: S16)

The processed wafer W is taken out from the wafer boat 58 by the substrate transfer machine 86 (wafer unloading).

(Carrier unloading step: S17)

Next, the processed wafers W are stored in the cassette 20 by the substrate transfer machine 86, and the cassette 20 containing the processed wafers W is returned to the loading port (AGV) by the reverse action of the carrier loading. port 22, OHT port 32), and are recovered by an external transfer device.

Next, the apparatus monitoring and control system as the substrate processing system of the present embodiment will be described with reference to FIG. 5 .

The device monitoring system of the present embodiment includes cameras 91 to 95, a monitoring controller 310, a device controller 210, a hub, and an operation unit PC (Personal Computer) 400 as an operation unit controller, wherein, The monitoring controller 310 stores the image data recorded by the cameras 91-95, the hub 309 is connected to the device controller 210, the monitoring controller and the cameras 91-95, and the operation part PC 400 is connected to the device controller 210 or the monitoring controller 310. Moreover, as an operation part, the operation part located in the apparatus controller 210 can also be used. Furthermore, in Figure 5, the device controllers 210 , the monitoring controller 310 , and the operation unit PC 400 are shown as separate components, but of course, the monitoring controller 310 and the operation unit PC 400 may be included in one of the constituent parts of the substrate processing apparatus 4 . Here, the monitoring controller 310 or the operation unit PC 400 may have the same configuration as the device controller 210 . Furthermore, since the monitoring controller 310 is synchronized with the clocks of the cameras 91 to 95 with an accuracy of msec (millisecond), the monitoring controller 310 can correctly save the image data recorded by the cameras 91 to 95 .

In addition, the apparatus controller 210 and the monitoring controller 310 are installed in the clean room where the substrate processing apparatus 4 is installed, and the operation unit PC 400 is installed in an office or the like which is different from the clean room. That is, the device controller 210 and the monitoring controller 310 use the operation part PC 400 far from the clean room as the I/O device 222 to be remotely controlled. The device controller 210 acquires event data generated when the wafer W is transported, etc., and alarm data generated when a transport error occurs. Then, when the event data is acquired, the device controller 210 sends an event notification based on the event data to the monitoring controller 310 and the operation unit PC 400 . In addition, the device controller 210 is configured to transmit an alarm notification including error information based on the alarm data to the monitoring controller 310 and the operation unit PC 400 when a transport error occurs. In addition, it is configured to send an alarm notification including error information to the management device 402 and the host PC 404 of the customer, etc. by mail, and is configured to be able to remotely display and display on the display unit of the management device 402 or the host PC 404 or the like. The screen of the display part of the operation part PC 400 is the same. Here, the "event data" refers to data obtained from sensors provided in each transfer mechanism such as a transfer robot, and represents the carrier loading step, the lid unfolding step, the wafer feeding step, the boat loading step, Information (event information) of the start and end time of wafer transfer in each step (event) of film forming step, boat unloading step, wafer unloading step, carrier unloading step, etc., including the event occurrence date and time Wait. In addition, the "alert data" refers to information (error information) indicating the occurrence of a transfer error caused by the transfer means, such as positional displacement, drop, breakage, transfer residue, etc., which occur during transfer of the wafer W, It also includes the date and time when the transport error occurred. specific and As the error information, the name of the device in which the conveyance error occurred, the alarm ID set for the conveyance error, the time of occurrence of the conveyance error, and the like are included. Furthermore, the details of the cameras 91 to 95 will be described later.

As shown in FIG. 6 , the monitoring controller 310 is configured to simultaneously acquire event image data in the H.264 format, which is the first image data to be described later, by using an image recording program executed by the monitoring controller 310 . Moving images (high-compression/low-quality moving images), and alarm image data as the second image data described later, namely Motion JPEG (Joint Photographic Experts Group; Joint Photographic Experts Group) or M-JPEG (Motion JPEG) JPEG; hereinafter referred to as MJPEG) format for moving images (low compression/high definition moving images). In contrast to the image data for the alarm image data when a failure such as a transport error occurs, the event image data shows the state of the substrate during transport until a transport error or other failure occurs, or when a normal substrate is transported without a failure. image data of the state. The monitoring controller 310 has a database 311a as a storage unit for storing lists of event image data and alarm image data, and a memory as a buffer for temporarily storing moving images of event image data and alarm image data, respectively. bodies 312a, 312b; and storage parts 313a, 313b as hard disks for storing (storing) event image data and alarm image data, respectively. Hereinafter, the storage unit storing the event image data will be referred to as the first storage unit 313a, and the memory temporarily storing the event image data will be referred to as the first memory unit 312a. Then, the storage unit for storing each of the cameras 91 to 95 that have individually recorded alarm image data is called a second storage unit 313b, and each of the cameras 91 to 95 that has individually recorded alarm image data is temporarily stored separately. The memory of 95 is called the second memory 312b.

For example, when the monitoring controller 310 receives an event notification indicating the start of the transfer of the wafer W (or the cassette 20 ) from the device controller 210 , it starts to record the first image data (event map) recorded by the cameras 91 to 95 respectively. image data) toward the storage of the memory (the first memory 312a). Event image data is collected to a temporary A first memory 312a that stores image data recorded by the cameras 91 to 95 is periodically stored in the first storage unit 313a. In this case, when the monitoring controller 310 receives an event notification from the device controller 210 indicating the end of the transfer of the wafer W (or the cassette 20 ), the first images recorded by the cameras 91 to 95 are terminated. The data is stored in the first memory 312a, and the first image data in the first memory 312a is stored in the first storage part 313a. For example, if the first memory 312a is full, it is collectively transferred to the first storage unit 313a, or the transfer time to the first storage unit 313a may be predetermined by setting a value. Then, the event image data (first image data) is converted into a database (DB, database) as a storage destination directory of the event recording file including the event image data and an "event recording information list" to be described later for the event information. , among which, the "Event Recording Information List". For example, while the event information is registered in the database 311a at the time of the event notification indicating the start, the event image data is started to be archived in the first storage unit 313a. While the database 311a is updated at the time point of the event notification indicating the completion, the completion processing (file closing processing) of the archive in the first storage unit 313a is performed.

After the monitoring controller 310 is activated and connected to the cameras 91 to 95, it starts storing the second image data (alarm image data) for several tens of seconds in each memory (the second memory 312b). The structure is as follows: the amount of tens of seconds is used as a ring buffer, the newest image data is overwritten with the oldest image data, and the fixed data of the past tens of seconds is kept at any time. The alarm image data is temporarily stored in the second memory 312b provided for each of the cameras 91 to 95, respectively. Then, when the monitoring controller 310 receives an alarm notification from the apparatus controller 210 indicating the occurrence of a transfer error due to the transfer means, such as positional displacement, drop, breakage, transfer residue, etc., which occur when the wafer W is transferred, The predetermined range of the alarm image data stored in the second memory 312b provided in each of the cameras 91 to 95 before and after the occurrence of the transport error, that is, the transport for several tens of seconds before and after the occurrence of the transport error, for example. The data for 20 seconds before and after the error occurred is archived and stored in 91~95 settings for each camera. the second storage part 313b. In addition, although not shown in the figure, the alarm image data is converted into a database (DB) as an "alarm recording information list" which will be described later including the storage destination directory of the recording file and error information.

The monitoring controller 310 executes the event recording work and the alarm recording work incorporated in the video monitoring program, so as to save the event image data to the first storage unit 313a, create the event video file, and the alarm image data to the first storage unit 313a. 2. The storage of the storage unit 313b and the production of the alarm video file. Furthermore, when the HDD capacity of the first storage unit 313a is sufficient, or when the camera still captures the part to be recorded even when it is not operating, the event image data may not be based on the data from the device controller 210. It is an event notification indicating the start and end of conveying by the conveying mechanism, and the event image data is periodically stored in the image data recorded at any time in the first storage unit 313a. For example, the image data for N (natural number) days can also be recorded continuously for 24 hours. On the other hand, when the HDD capacity is limited, or when the image data during the transfer operation is to be stored for as long as possible, the event image data is recorded only during the transfer period according to the event notification. to the first storage part 313a. The recording method of such event image data (first image data) is set separately for each of the cameras 91 to 95 .

The dynamic image format obtained from the cameras 91 to 95 is shown in FIG. 7 . In the present invention, the monitoring controller 310 is configured so that both of the H.264-format moving image (event image data) and the MJPEG-format moving image (alarm image data) can be simultaneously obtained from one camera. dynamic images (image data) in various formats. That is, the cameras 91 to 95 record the conveyance operation of the wafer W as event image data, respectively, and record the conveyance operation of the wafer W as alarm image data with higher precision than the event image data.

Here, for example, as shown in FIG. 8 , an image in MJPEG format (second image data) constitutes a moving image in succession of one image in JPEG format (hereinafter also referred to as a frame). Figure 8 Series MJPEG Format and a dynamic image of the wafer boat 58 rising toward the reaction tube 50 is displayed from the left to the right for each frame. MJPEG does not have any dependencies between frames, and MJPEG images are very stable because even if one frame is missed during data transmission, the remaining frames will not be affected. The advantage of the MJPEG format is that there is no compression other than JPEG compression, and its image quality does not deteriorate. Therefore, when a failure occurs during the operation of the conveying mechanism, for example, if a video is recorded in the MJPEG format, it is possible to check the failure status without the image quality (moving image) compressed other than JPEG compression. However, its disadvantage is that it cannot use video compression technology to compress data due to complete image continuity. Furthermore, in the present embodiment, images of 30 frames are recorded in one second, and stored in the second storage unit 313b of the monitoring controller 310 . That is, when an alarm occurs, high-definition image data is stored about every 33 msec.

As the second image data, a BMP (bitmap; bitmap) format or a PNG (Portable Network Graphics; Portable Network Graphics) format may also be used. If the JPEG image in the MJPEG format is compared with the H.264 format in which the video is not recorded where there is no change as shown in Figure 9, there is no compression other than JPEG compression, so the image quality is less degraded. However, the JPEG compression technique mainly implements the following processing, so when enlarged and displayed, there is a case where noise in block units may be seen (destructive compression method). 1. Convert the color information from RGB to YCbCr. 2. Decompose the whole pixel into 8×8 square units. 3. Perform DCT (Discrete Cosine Transformation) (frequency analysis) on each block, and quantize the value of the result. 4. Perform zigzag scan on the quantized value, and perform run length coding. 5. The DC component is compressed by DPCM (Differential Pulse code Modulation; Differential Pulse Code Modulation). 6. Encode it with Huffman coding and output it in block order.

The BMP format does not apply special compression, although the file size will increase, but the structure is simple and versatile, and the image information can be maintained as it is (distortion-free compression method). PNG format as no The image format of the distortion compression method, so there is no image deterioration caused by compression. Therefore, if the second image data is recorded in the BMP format or the PNG format, there is no block-unit noise generated when enlarged and displayed, and the situation can be expected to be clearly confirmed.

Here, the first image data is also referred to as MPEG-4 Part 10 AVC (Advanced Video Coding), the latest MPEG (Moving Picture Experts Group) specification for video coding. H.264 is expected to be the standard for next-generation video compression. As shown in FIG. 7 , the data size of H.264 is reduced by more than 80% compared to MJPEG, and by more than 50% compared to MPEG-4, for example, the storage capacity of the first storage unit 313a can be greatly reduced. Within the image frame, the amount of data can be reduced by removing unnecessary information. For example, as shown in FIG. 9 , the parts that have not changed in the front and back frames are reduced. Here, FIG. 9 is in the H.264 format, and similarly to FIG. 8 , a dynamic image of the wafer boat 58 rising toward the reaction tube 50 is displayed from the left to the right every frame. This one frame is 33 msec similarly to the image (second image data) in MJPEG format. When the H.264 format compresses image data, it separates the part that changes between the frames from the static part. The changing part rewrites the image data at any time with the change of the time axis, while the static part will still be changed even if the time changes. It is deemed that the image data has not changed, and the original image data will continue to be used. However, although the compression rate is greatly improved, if the moving part and the stationary part are not well separated, noise may occur and the image may become unclear.

The basic method of H.264 format is the same as that of MPEG-2, which is based on motion compensation (MC; The discrete cosine transform (DCT) is used in the inter-frame prediction coding method of Motion Compensation), which is the so-called MC+DCT method. The H.264 format is standardized to achieve ultra-high compression more than 2 times higher than that of MPEG-2 or MPEG-4.

In addition, in order to further compress the image data, for example, as shown in FIG. 10(B), the H.265 format may be used. As shown in FIG. 10(A) , in the H.264 format, the entire screen is finely divided into blocks, and only the changed portion is sent to the monitoring controller. That is, regardless of the greatly changed block and the small changed block, the same small block is sent. The H.265 format is not fixed to a small block, so that the block that changes greatly becomes thinner, and the block that changes relatively little becomes a larger block to optimize the compression rate and reduce the overall amount of information. . When such image data in H.264 format and H.265 format are applied to semiconductor manufacturing equipment, it generally does not require high image quality for the purpose of monitoring the flowmeter by the operator through the screen operation. as an effective means.

In addition, as for file saving in MJPEG format, as shown in FIG. 11(A), a moving image is usually saved as one file such as ".avi" or ".mov". That is, in this format, when one file is played by the player, it cannot perform frame-by-frame playback but can only play at slow speed.

The alarm recording of the present invention, as shown in Fig. 11(B), uses a still image of 30 frames per second as a JPEG file to output the difference between the 20 seconds before the failure and the 20 seconds after the failure. A total of 40 seconds. That is, JPEG files of 30 frames×40 seconds=1200 files are saved. By using this technical solution, the super slow playback method is realized by playing the video with only 0.033 seconds interval. FIG. 12 is a conceptual diagram showing a frame-by-frame playback of images at intervals of 0.033 seconds. The transfer mechanism for transferring the wafers W transfers three sets of cassettes 20 (up to 75 wafers W) toward the wafer boat 58 in a period of about 9 to 10 minutes. Therefore, the investigation when the fault occurs is required to obtain images at short intervals for playback.

Some customers require the storage of dynamic images for several months (more than 3 months), and in order to meet their requirements, they use higher compressed image data (H.264 format or next-generation H.265 format) to carry out Record. However, since the highly compressed image data is compressed by comparing the images on the time axis, when the important scene at the time of the failure is output, the image may become unclear. In addition, the H.264 format and the H.265 format cannot perform frame-by-frame playback because the video is produced by referring to the information of the frame before and after. Therefore, by simultaneously recording the time before and after the error occurs in MJPEG format, and storing the image at the time of the failure as a high-definition image, it can be confirmed by frame-by-frame playback.

Here, the state in which the semiconductor substrate such as the wafer W is being conveyed is recorded and stored at any time, and in the event of a conveyance error or the like, the cause of the conveyance error is investigated by referring to the recorded image data.

However, if the image data of the event is recorded at any time even if there is no fault such as a transport error, if the image data is recorded in the low-compression/high-definition MJPEG format, the storage capacity for storing the image data will change. be huge.

Therefore, in this embodiment, the event image data that is recorded at any time even if there is no fault such as a transport error will be stored in the high-compression/low-quality H.264 format. The alarm image data recorded in the event of a failure such as a transport error will be stored in the low-compression/high-definition MJPEG format.

Next, the photographing points of the cameras 91 to 95 will be described with reference to FIG. 13 . The imaging objects of the camera are mainly the transfer mechanism that transfers the wafer W, such as the transfer port 42 , the cassette transfer mechanism 40 , the substrate transfer machine 86 , and the wafer boat 58 . Confirmation of handover of cassette 20 at transfer port 42 , confirmation of cassette transfer operation, wafer extraction from cassette 20 , confirmation of feeding and unloading to wafer boat 58 , and movement in substrate transfer machine 86 , respectively. Confirmation of the state of the wafers in the wafer boat 58 and the wafers fed into the wafer boat 58 The purpose is to confirm the rise and fall of the circle W, etc. Moreover, a moving image and a still image are acquired as image data, and these image data are stored in the 1st storage part 313a or the 2nd storage part 313b of the monitoring controller 310. Furthermore, the cameras 91 to 95 are configured to automatically operate according to the operations of the transfer port 42, the cassette transfer mechanism 40, the substrate transfer machine 86, and the transfer mechanism (photographing object) such as the wafer boat 58 and the surrounding environment. Exposure (lighting) control is carried out.

In the carrier loading/unloading by the cassette transfer mechanism 40, the feeding/unloading of the wafer W by the substrate transfer machine 86, and the loading/unloading of the wafer boat 58 by the cameras 91-95. The acquired moving image (event image data) is stored in the first storage unit 313a. That is, the event image data is archived and accumulated in the first storage unit 313a every predetermined time (at each predetermined event). For example, each time a substrate transfer step such as wafer W feeding/unloading is configured, event image data is archived and accumulated. In addition, the period of archiving (the above-mentioned predetermined time) is not limited to every event, but is configured to be appropriately set.

In addition, the monitoring controller 310 is configured to acquire a still image after the FIMS is turned on, after the wafer feeding is completed, and after the wafer boat is unloaded. The reason for this is that the wafer W is checked after the FIMS is turned on and after the transfer step is completed, and at least the occurrence of an abnormality can be grasped only by checking the still image. In this embodiment, a low-compression and high-definition still image in the same format as the alarm image data is acquired, and the detailed status of the conveyance error is grasped. Furthermore, the step of unfolding the lid of the cassette 20 performed by the FIMS opener can also be set to acquire dynamic images in the same manner as other transport events.

Next, the association between the photographing objects of the cameras 91 to 95 and the alarm ID will be described with reference to FIG. 14 . FIG. 14 shows a table used to limit the state of recording when a conveyance error occurs (when a failure occurs) based on the photographed object and the alarm ID.

As shown in Figure 14, when the number of cameras to be set is set to 5, the alarm The report ID is set for a conveyance error that occurs with each photographic object. That is, the alarm IDs are associated with the imaging objects and the cameras 91 to 95, respectively, so that the imaging objects and the cameras 91 to 95 can be specified based on the alarm IDs.

The camera 91 (camera number 1) is between the external conveying device and the AGV port 22 and the OHT port 32, and captures the state of handover to the cassette 20 as a carrier. Furthermore, even if a conveyance error occurs during the transfer of the cassette 20, the camera number and the photographing target can be specified according to the alarm ID. The detection means (such as a sensor) for actually performing (detecting) the occurrence of a conveyance error are respectively provided in the AGV port 22 and the OHT port 32 , or in the vicinity thereof.

The camera 92 (camera number 2 ) is located between the cassette conveying mechanism 40 and the transfer port 42 to photograph the state of the delivery and delivery of the cassette 20 . In addition, the camera 92 photographs the state of the cassette conveying mechanism 40 between the carrier loading step and the carrier unloading step, that is, between the AGV port 22 and the OHT port 32 and the transfer port 42 . Even if a conveyance error occurs between the carrier loading step and the carrier unloading step, the camera number and the photographing target can be specified based on the alarm ID. In addition, a sensor that actually detects the occurrence of a conveyance error is provided in the cassette conveyance mechanism 40 .

The camera 93 (camera number 3 ) photographs the state where the cover of the cassette 20 placed on the placing portion of the transfer port 42 is opened by the FIMS opener. Even if an error such as wafer flying occurs after the FIMS opener is turned on, the camera number and photographic object can still be identified based on the alarm ID. In addition, a sensor for actually detecting the occurrence of a transfer error is provided at the FIMS opener (cover opening and closing mechanism) located in the transfer port 42 .

The camera 94 (camera number 4) and the camera 95 (camera number 5) are located between the cassette 20 and the wafer boat 58 in the placement portion of the transfer port 42 to photograph the state of the wafer W being transferred by the substrate transfer machine 86 , and between the transfer chamber 16 and the processing furnace 8, the state where the wafer boat 58 is raised and lowered is photographed. That is, the camera 94 and the The camera 95 photographs the state of the wafer W being transported and the state of the wafer boat 58 being lifted and lowered between the above-mentioned wafer feeding step and the wafer unloading step, and between the above-mentioned wafer boat loading step and the wafer boat unloading step. . Even if a transfer error occurs between the wafer feeding step and the wafer unloading step, or between the wafer loading step and the wafer unloading step, the camera number and the photographing object can still be specified according to the alarm ID. In addition, a sensor for actually detecting the occurrence of a conveyance error is installed in the substrate transfer machine 86 .

By having the table shown in FIG. 14 , the monitoring controller 310 can specify the target camera number according to the notified alarm ID when the alarm notification including the alarm ID of the occurrence of the transport error is received from the device controller 210 . Then, the monitoring controller 310 obtains the alarm image data by limiting it to the specified camera number, and performs the alarm recording (the alarm image data is stored in the second storage unit 313b of each camera number).

Although the alarm recording function of the monitoring controller 310 can obtain high-definition dynamic images (alarm image data), due to the low compression, the file capacity becomes larger and occupies the storage portion. Therefore, the effect of reducing the amount of data in the storage unit of the monitoring controller 310 is enhanced by applying the table shown in FIG. 14 corresponding to the alarm ID or camera number defined in the location where the conveyance error occurs.

Next, the flow of monitoring the conveyance operation of the substrate processing apparatus 4 by the monitoring controller 310 of the present embodiment will be mainly described with reference to FIG. 15 . Here, the case where a conveyance error (failure) occurs in the wafer unloading step of step S16 is described as an example. In addition, the case where the operation part PC 400 is used is demonstrated below as an example.

(Carrier loading step: S10)

When a transfer request of the cassette 20 is received from an external computer such as the operating unit PC 400 , the device controller 210 transmits an event notification indicating a carrier loading start event to the monitoring controller 310 . When the monitoring controller 310 receives the event notification, it starts imaging by the camera 91 (camera number 1).

Furthermore, if the cassette 20 is loaded on the AGV port 22 or the OHT port 32 from the external transport device, the device controller 210 may send an event notification indicating the carrier loading start event to the monitoring controller 310 .

The camera 91 captures the state of handover to the cassette 20 as a carrier between the external transport device and the AGV port 22 and the OHT port 32 . The monitoring controller 310 is configured to save (event recording) the event image data captured by the camera 91 in the first storage unit 313a when the cassette 20 is mounted on the AGV port 22 or the OHT port 32 .

In addition, the monitoring controller 310 is configured to switch from the camera 91 to the camera 92 (camera number 2) when the cassette 20 is mounted on the AGV port 22 or the OHT port 32, and make the camera 92 photograph the AGV port 22 and the OHT port The condition of the cassette transport mechanism 40 between 32 and the transfer port 42.

When the cassette 20 is placed on the placement portion of the transfer port 42 , the device controller 210 sends an event notification indicating the carrier loading end event to the monitoring controller 310 . When the monitoring controller 310 receives the event notification, it ends the photographing by the camera 92 . Then, the event image data captured by the camera 92 is stored (event recording) in the first storage unit 313a.

(Lid unfolding step: S11)

Next, the step of unfolding the lid of the cassette 20 by the FIMS opener is performed. The device controller 210 sends an event notification to the monitoring controller 310 , which indicates the end event of the opening operation of the cassette 20 by the FIMS opener. When the monitoring controller 310 receives the end event notification, it uses the camera 93 to capture the image. Furthermore, the device controller 210 may send the event notification indicating the FIMS on event to the monitoring controller 310, so that the device controller 210 can capture moving images like other cameras.

(Wafer feeding step: S12)

If the transfer request of the wafer W is received from an external computer (not shown), the device controller 210 will An event notification indicating a wafer feed start event is sent to the monitoring controller 310 . When the monitoring controller 310 receives the event notification, it starts photographing by the camera 94 (camera number 4 ) or camera 95 (camera number 5 ) and creates an event recording information list.

The camera 94 or the camera 95 is located between the cassette 20 of the placement portion of the transfer port 42 and the wafer boat 58 to photograph the state of the wafer W being transferred.

If the wafers W are fed to the wafer boat 58 , the device controller 210 sends an event notification indicating the wafer feeding end event to the monitoring controller 310 . When the monitoring controller 310 receives the event notification, it ends the photographing by the camera 94 or the camera 95 .

Then, the event image data captured by the camera 94 or the camera 95 is stored (event recording) in the first storage unit 313a.

(Chip loading step: S13)

If an instruction request for executing the process recipe is received from an operation unit (not shown) or the like, the device controller 210 sends an event notification indicating the boat loading start event to the monitoring controller 310 . When the monitoring controller 310 receives the event notification, it starts photographing by the camera 94 or the camera 95 .

The camera 94 or the camera 95 is located between the transfer chamber 16 and the processing furnace 8 to photograph the situation of the wafer boat 58 being raised and lowered. Furthermore, a camera for photographing the state in which the wafer boat 58 is lifted and lowered, and a camera for photographing the transfer of the wafer W between the cassette 20 and the wafer boat 58 may be separately provided.

When the wafer boat 58 is carried into the processing furnace 8 , the device controller 210 sends an event notification indicating the wafer boat loading end event to the monitoring controller 310 . When the monitoring controller 310 receives the event notification, it ends the photographing by the camera 94 or the camera 95 . Then, the event image data captured by the camera 94 or the camera 95 is stored (event recording) in the first storage unit 313a.

(Film-forming step: S14)

Next, a process recipe is executed to perform a film formation process on the wafer W. FIG. In this step, the monitoring controller 310 stops the operations of all the cameras 91 to 95 . Furthermore, the image data (moving image or Still image) is displayed on the operation screen of the operation unit PC 400 and the like, and the operation is confirmed.

Specifically, as shown in FIG. 16 , an event recording information list 405 is displayed on the operation screen of the operation unit PC 400 . In the event recording information list 405, event information such as event occurrence date and time, event content and the like is displayed. Then, if the event information recorded in the event recording information list 405 is selected, the beginning of each event can be found, and the dynamic image of each event from the beginning to the end can be played. In addition, when a plurality of batches are stored, a predetermined button can be pressed on the operation screen to perform a comparison display among different batches in the same event.

Thereby, although normal operation is confirmed and no conveyance error occurs, the time difference from the start to the end of the same conveyance event can be found, and countermeasures can be taken in advance to prevent the occurrence of conveyance error. Furthermore, the normal operation confirmation may be performed after the substrate processing step is completed.

(Crystal boat unloading step: S15)

At the point of transition to the boat unloading step of the process recipe, the device controller 210 sends an event notification representing the boat unloading start event to the monitoring controller 310 . When the monitoring controller 310 receives the event notification, it starts the photography by the camera 94 or the camera 95 .

The camera 94 or the camera 95 is between the transfer chamber 16 and the processing furnace 8 to photograph the state in which the wafer boat 58 is lowered.

If the wafer boat 58 is lowered toward the transfer chamber 16 , the device controller 210 sends an event notification indicating the wafer boat unloading end event to the monitoring controller 310 . If the monitoring controller 310 receives the event The notification ends the photographing by the camera 94 or the camera 95 . Then, the event image data captured by the camera 94 or the camera 95 is stored (event recording) in the first storage unit 313a.

(Wafer unloading step: S16)

The device controller 210 sends an event notification to the monitoring controller 310 indicating the wafer unloading start event. When the monitoring controller 310 receives the event notification, it starts the photography by the camera 94 or the camera 95 .

The camera 94 or the camera 95 is located between the cassette 20 of the placement portion of the transfer port 42 and the wafer boat 58 to photograph the state of the wafer W being transferred. During the transfer of the wafer W between the cassette 20 and the wafer boat 58 on the transfer port 42, if a transfer error occurs, several tens of seconds before and after the transfer error occurs, for example, 20 seconds before and after the transfer error occurs The alarm image data will be saved (alarm recording) in the second storage part 313b of the monitoring controller 310 .

In addition, the alarm notification notified from the device controller 210 when a transfer error occurs also includes a notification indicating the end of the transfer event. However, this notification is an event abnormal end notification indicating a situation in which an abnormality occurs in the transfer event. Furthermore, in the present embodiment, the event abnormal end notification is included in the information of the alarm notification. On the other hand, the device controller 210 may be configured to separately notify the monitoring controller 310 and the operation unit PC 400 of the event abnormal end notification and the alarm notification, and the notification method is not particularly limited. In the present embodiment, in the wafer unloading step ( S16 ), the image data from the event start notification to the event abnormal end notification (that is, when a transport error occurs) is archived as event image data and stored as event image data. It is stored in the first storage unit 313 a of the monitoring controller 310 .

Furthermore, the monitoring controller 310 is configured so that after the cover unfolding step (S11), after the wafer W is transported (after the above-mentioned wafer feeding step (S12)), or after the wafer boat 58 is lowered (the above-mentioned wafer unloading step) After (S15)) a still image is acquired. At this time, the monitoring controller 310 can also make the cameras 91 to 95 capture the event map For example, still images with lower compression and high definition (MJPEG format) are archived and stored in the second storage unit 313b.

Here, the sequence from the occurrence of the conveyance error to the abnormality analysis will be described in detail with reference to FIG. 17 . In addition, the cassette transfer device 40 for transferring the wafer W, the substrate transfer machine 86, the wafer boat 58 and other transfer means are respectively installed with detection means for detecting a transfer error that occurs during the transfer of the wafer W. sensor, and the device controller 210 obtains event data.

The monitoring controller 310 stores the alarm image data obtained from the cameras 91 to 95 in the second memory 312b so that the alarm image data traced back several tens of seconds can be recorded when a conveyance error occurs. Then, when a conveyance error is detected by a sensor (not shown), the device controller 210 acquires alarm data and stops the conveyance means.

Then, the device controller 210 notifies the monitoring controller 310 of the error information alarm (S100). The error information includes at least the name of the device where the transport error occurred, the alarm ID indicating the transport error, and the time when the transport error occurred. Here, the device name is not only the information of the specific substrate processing device 4 (the name data of the device), but also the specific load port 22, the cassette transfer mechanism 40, the cover opening and closing mechanism, the substrate transfer machine 86, the wafer boat 58, the rotary Information (name data) of the devices constituting the substrate processing apparatus 4, such as the mechanism 80, the boat lift 82, and the cameras 91 to 95. Then, after obtaining the alarm notification, the monitoring controller 310 saves the alarm image data in the low-compression and high-resolution MJPEG format for several tens of seconds before and after the time when the transport error occurs, for example, 20 seconds before and after the transport error occurs. in the second storage unit 313b (S101). That is, the monitoring controller 310 is configured to archive the alarm image data held in the second memory 312b and store (alarm recording) in the second storage unit 313b.

In addition, the device controller 210 notifies, for example, the operation unit PC 400 of an error information alarm at the same timing as the monitoring controller 310 (S100). Then, it is displayed and generated on the operation unit PC 400 The same fault occurrence screen as the faulty substrate processing apparatus ( S102 ). Then, when the means for displaying the image data recorded by the cameras 91 to 95 (for example, the E-CAM button 410 shown in FIG. 19 , etc.) is selected on the operation screen, the monitoring controller 310 transmits the data according to the alarm ID or conveyance. The error information such as the time of occurrence of the error is displayed on the operation unit PC 400 on an alarm information screen including image data (event image data) at the time of the alarm occurrence. Here, since the operation part PC 400 is remotely connected to the monitoring controller 310, the alarm information screen can be displayed on the display part of the operation part PC 400 (S103). In the present embodiment, buttons for displaying event image data and/or alarm image data recorded by the cameras 91 to 95 are provided on the operation screen (alarm information screen) of the operation unit PC 400 . That is, the monitoring controller 310 can perform moving image analysis and comparative moving image analysis by displaying the event image data and/or alarm image data recorded by the cameras 91 to 95 on the operation screen of the operation unit PC 400 . , error information analysis and other transport error video analysis (S104). Then, in the operation part PC 400, the operator of the clean room or the like is given a restoration instruction (S105), and the restoration operation of the apparatus in which the conveyance error has occurred is performed.

Hereinafter, FIG. 18 shows the screen display flow executed by the monitoring controller 310 in order to remotely display the operation screen of the operation unit PC 400 .

For example, when the monitoring controller 310 refers to a button for a predetermined alarm regarding a conveyance error (for example, the E-CAM button 410 shown in FIG. 19 , etc.) and is pressed on the operation screen of the operation unit PC 400 to obtain an alarm recording reference notification, The alarm recording information list is retrieved (step S20). Then, the retrieval result, the storage destination directory of the alarm video file of the target alarm image data, and the target error information such as event information when a transfer error occurs are acquired, and the retrieval result is saved (step S21). Here, the event information of the object error information refers to the carrier loading step, the cover unfolding step, the wafer feeding step, the wafer loading step, the film forming step, the wafer unloading step, the wafer unloading step, and the carrier unloading step. The time point of any one of the steps. In addition, in this embodiment, since the monitoring controller 310 and the cameras 91 to 95 The clocks are synchronized, so that the starting time of the image data recorded by the cameras 91 to 95 at the beginning of the event information or when the transfer error occurs is consistent (at least fine adjustment can be made). Details will be described later.

Then, when the two-screen display button is pressed on the operation screen of the operating unit PC 400, the monitoring controller 310 refers to the target error information for the two-screen switching process (step S22), and stores it in the second storage unit The alarm image data of 313b is displayed on the right screen (step S23). Then, obtain the event information when the transfer error of the target error information occurs (step S24), obtain the storage destination directory of the event recording file whose event information is consistent with the event information and the retrieval result of the event information from the event recording information list, and save it to the event recording candidate information (step S25).

Then, when there is no display candidate that matches the event information in the event recording candidate information (NO in step S26), the left screen of the operation screen of the operation unit PC 400 is displayed to display the same date as the time stamp when the transport error occurred. The event recording information list of the event image data (step S27).

Then, when there is a display candidate with the same event information in the event recording candidate information (YES in step S26 ), acquire from the event recording candidate information and save the event image data with the same event information as when the transport error occurred. The information list is displayed on the left screen (step S28).

Then, if the event recording file to be played simultaneously is selected from the list display on the left screen, the event image data stored in the second storage unit 313b is displayed with reference to the selected event recording file (step S29). That is, the monitoring controller 310 displays both the event image data and the alarm image data on the same screen. Then, if the two-screen simultaneous playback button is pressed, the alarm image data and the event image data are simultaneously played (simultaneously played) on the left and right screens (step S30).

Furthermore, the above-mentioned two-screen display and simultaneous playback are not limited to the alarm image data and the The event image data can be displayed on two screens on the same screen, and the alarm image data or the event image data can be played simultaneously, which is helpful for fault analysis of transport errors.

Specifically, if the operation unit PC 400 that is remotely connected to the monitoring controller 310 to display the operation screen receives an alarm notification, as shown in FIG. 19 , the same failure as that of the operation unit of the device controller 210 is displayed on the operation screen as shown in FIG. 19 . Information screen. The failure information screen of FIG. 19 includes a schematic appearance display portion 407 for displaying a schematic appearance of the device, and a failure information display portion 409 for displaying failure information such as conveyance errors. And it is comprised so that it can grasp|ascertain the apparatus which has a conveyance error, the part of conveyance error, the content of conveyance error, etc. by the display content of the outline appearance display part 407 and the failure information display part 409. In addition, the failure information screen shown in FIG. 19 includes means (E-CAM button) 410 for displaying image data captured by the cameras 91 to 95 . In addition, if, for example, the E-CAM button 410 of FIG. 14 is pressed on the operation screen of the operation unit PC 400, as shown in FIG. The live image screen (event image data) is displayed. The live video image is a still image when the recording is ended together with the alarm notification. That is, for example, when the transfer residue of the wafer W is detected in the wafer unloading step, it is possible to confirm the situation when the transfer residue occurs. In addition, in the operation screen shown in FIG. 20, the recorded image can be rewinded, the recorded image can be played through the play button, or the frame-by-frame playback can be performed through the frame-by-frame button.

20 shows a search box 406 and an alarm list 408 for retrieving the alarm ID. The alarm list 408 contains at least the occurrence date and time of the transport error and the alarm ID. If the alarm ID or the time of occurrence of the transport error is selected from the alarm list 408, the second storage unit 313b of the corresponding camera is retrieved from the selected alarm ID and time stamp, which is more accurate than the live image screen (event image data). A dynamic image (alarm image data) for tens of seconds before and after the occurrence of a high-definition conveyance error is displayed, and the details of the occurrence of the alarm can be confirmed with reference to the high-definition alarm image data.

Moreover, as shown in FIG. 20, on the conveyance error occurrence screen, two screen display A buttons 411 and two screen display B buttons 412 are provided as comparison reference buttons. Then, when the two-screen display A button 411 is pressed, two screens for comparison and reference are displayed as shown in FIG. 21 . That is, the list can select a file of low-compression and high-definition alarm image data to be displayed on the operation screen, and a desired file can be selected to be compared with other low-compression and high-definition alarm image data of the same day. show. Furthermore, it can also be compared and displayed with the alarm image data of the same alarm ID but the transport error occurred on different dates and times. In this way, it is possible to analyze whether the main factors for the occurrence of transport errors are the same main factors or different main factors.

In addition, in the transfer error occurrence screen shown in FIG. 20, when the B button 412 is displayed on two screens, as shown in FIG. 22, the normal operation and the same transfer event can be displayed on two screens as shown in FIG. 22. The abnormal operation that occurs when a transport error occurs is compared and displayed.

Specifically, the event label display of the event recording file is used as a reference to select the event image data to be played at the same time as the transfer error occurrence screen on the right. Then, press the 2-screen simultaneous play button 414 to synchronously play the dynamic image of the normal high-compressed event image data on the left and the dynamic image of the low-compressed and high-definition alarm image data on the right. In the case of simultaneous playback and the images are not aligned, use the dynamic image operation buttons shown in the figure to adjust. That is, by comparing and displaying the abnormal operation when the conveyance error occurs and the normal operation, it is possible to analyze what is different from the normal operation.

Moreover, in the conveyance error occurrence screen shown in FIG. 20, the alarm moving image of the object is selected from the displayed alarm list 408, and two screen display B buttons 412 are pressed. Then, the database 311a is searched according to the playback start time stamp of the selected alarm moving image (the time stamp of the alarm occurrence time - 20 seconds) and the camera name of the object, and the first image is retrieved from the first storage unit 313a A file of data (event image data). The beginning of the first image data is automatically found with the playback start time stamp and displayed on the left. The operator can operate the 1st image data on the left to check the moving image until the transfer error occurs. In addition, it is possible to select and play a moving image up to the occurrence of a conveyance error using the event tag display as a reference.

In this way, the moving image up to the occurrence of the transport error can be used as event image data, and the moving image before and after the occurrence of the transport error (20 seconds before the occurrence of the alarm and 20 seconds after the occurrence of the alarm for a total of 40 seconds) can be used as the alarm. image data and display them on the screen.

According to this embodiment, since the event image data is stored as a moving image in the H.264 format, the normal motion data is compressed. On the other hand, as long as there are parts that are different between the frames, specifically, as long as there are parts that do not change during normal conveyance operations but that change just before a conveyance error occurs, they can be recorded without omission. , and the transition of the event image data up to the transfer error can be confirmed.

Furthermore, when displaying a moving image or a still image captured by the camera, not only the conveying means of the photographed object is photographed, but the surrounding environment is also photographed. Therefore, even if the transport means is not directly caused by the error of the parts around the transport means of the photographed object, as long as it is within the range captured by the camera (as long as it is displayed in the event image data or alarm image data) Identify the main cause of the error by parsing the image.

Then, the person in charge of the device confirms the dynamic image or still image displayed on the display part of the operation part several times to analyze the alarm recording, so as to grasp the situation of the transport error and determine the recovery method. , mail, etc. for recovery instructions. After that, the operator performs the device restoration work according to the instruction. In addition, the operation part may be arranged at a position away from the factory where the substrate processing apparatus 4 is arranged. In this case, the person in charge of the installation shall not The engineer's instruction corresponds to the device restoration, and the operator or the device engineer implements the device restoration operation according to the instruction.

(Carrier unloading step: S17)

Then, if the error is resolved by the recovery process in the wafer unloading step, the next carrier unloading step starts the opposite action to the carrier loading as usual. When the monitoring controller 310 receives the start event, it causes the camera 91 to start recording the event image data, and when it receives the end event, it causes the camera 91 to end the recording of the event image data. The monitoring controller 310 is configured to store the event image data acquired by the camera 91 in the first storage unit 313a and update the event recording information list during the step of unloading the carrier.

According to this embodiment, at least one or more of the following effects (a) to (d) can be exhibited.

(a) According to the present embodiment, it is possible to acquire high-resolution image data separately from the image data during substrate conveyance when a conveyance error occurs while acquiring image data during substrate conveyance, and at the time of analysis of the conveyance error Using the respective image data, it is possible to analyze the transport error (failure analysis).

(b) In the present embodiment, it is configured that not only the device controller 210 is notified of an event signal from a sensor installed in each transfer mechanism such as a transfer robot for each event indicating the start time of wafer transfer, etc. , and an event signal is also notified to the operation unit. In this way, the operation part determines whether the event information matches the camera setting part at the end time point of the event, and starts to find out the event occurrence time of the event video file stored in the storage part, so that it can be confirmed that it is normal. In addition, a plurality of dynamic images of event information (event image data) can be compared and displayed simultaneously.

(c) In this embodiment, if the corresponding event information is selected from the event recording information list of the monitoring controller 310, the dynamic image (event) obtained by the camera at the time of the occurrence of the event is configured. image data) is played. In this way, according to the present configuration in which the cameras 91 to 95 are provided for each event, by recording only during the operation of the device (or during the operation of the conveying means for conveying the wafer W), it is possible to make it possible to record the video at any time as compared with the case of recording at any time. The recording period of the camera becomes longer.

(d) In the present embodiment, since the event recording information file and the alarm recording file can be displayed on the same operation screen by respectively selecting the event recording information file and the alarm recording file, the main cause of the transport error (failure) can be found out.

In addition, this invention is not limited to the above-mentioned embodiment, It cannot be overemphasized that various changes can be added in the range which does not deviate from the summary.

(Other Embodiments)

For example, according to the above-mentioned embodiment, the data acquisition cycle is 30 frames per second, the second image data is directly stored in the second storage unit 313b, and the first image data is for the images before and after the frame. The data are compared, and the image data is compressed by the presence or absence of the data change, and stored in the first storage unit 313a. However, it is not limited to this embodiment.

(Example 1)

The data acquisition cycle is 30 frames per second as in the above-mentioned embodiment, but the resolutions of the first image data and the second image data are different. For example, even if the first image data is set to 1600×900 pixels and the second image data is set to 3840×2160 (4K) pixels, the same effects as those of the present embodiment can be exhibited. Furthermore, by using the multi-streaming function of simultaneously transmitting the first image data and the second image data, it is possible to implement a single camera.

(Example 2)

The data acquisition cycle of the first image data and the second image data can be changed. For example, the first image data can be set to 3 frames per second, and the second image data can be set to the same as this embodiment. 30 in 1 second frame. Thereby, the first image data can be set to be 1/10 of the data amount of the second image data. In addition, since the processing of the second image data is the same as that of the present embodiment, the same effects as those of the present embodiment can be achieved.

In the embodiment of the present invention, although the case of processing wafers has been described, the present invention can be applied to all substrate processing apparatuses for processing substrates such as glass substrates of liquid crystal panels, magnetic disks, or optical disks.

4: Processing equipment (substrate processing equipment)

20: Box (FOUP)

22: AGV port (loading port)

22A: Moving in and out

30A, 30B: Storage Shelves (Box Shelves)

32:OHT port

40: Cassette transport mechanism (cassette transport device)

40A: Track Mechanism

42: Transfer port

Claims (15)

A substrate processing system comprising: a first control means for acquiring event data generated when a substrate is transported and alarm data generated when a transport error occurs; and a recording means for taking the substrate transport operation as first image data while recording, the conveyance of the substrate is recorded as second image data with a higher resolution than the first image data; the second control means makes the first storage unit store the event data according to the above-mentioned event data The first image data recorded by the recording means, and the second storage part is made to store the second image data recorded by the recording means according to the alarm data; and an operation part that displays at least the above-mentioned first image data; 1 image data and the above-mentioned second image data; and the above-mentioned second control means displays both the above-mentioned first image data and the above-mentioned second image data recorded when the above-mentioned transfer error occurs on the same screen, and can Adjust the start time points of the first image data and the second image data. The substrate processing system according to claim 1, further comprising: transport means for transporting the substrate; and detection means for detecting the transport error occurring in the transport means; and the first control means is configured to automatically The detection means obtains a notification indicating the conveyance error, and notifies the second control means and the operation unit including at least the name of the device in which the conveyance error occurred, the alarm ID set for the conveyance error, and the occurrence time of the conveyance error wrong information. The substrate processing system according to claim 2, wherein the second control means is configured to file the second image data for a predetermined amount of time before and after the occurrence of the conveyance error while acquiring the error information, and store the second control means. In the above-mentioned second storage part, the above-mentioned operation is executed according to the above-mentioned error information. The operation section displays the same screen as the operation screen of the apparatus in which the above-mentioned conveyance error occurs, and displays means for accepting an instruction to display the above-mentioned first image data acquired by the above-mentioned recording means on the same screen. The substrate processing system according to claim 1, wherein the second control means is configured to switch to include the time when the transfer error occurs when an instruction to display the first image data acquired by the recording means is received. Click the screen of the above-mentioned first image data and the above-mentioned error information to display the above-mentioned operation part. The substrate processing system according to claim 2, wherein the second control means is configured to cause the operation unit to display the alarm selected by using the alarm ID and/or the selection instruction of the occurrence time when the alarm ID and/or the occurrence time are received. The ID and/or the occurrence time are searched for the second image data obtained in the second storage unit. The substrate processing system according to claim 1, wherein the detection means detects event data indicating the start and end of the conveyance of the substrate, and when the event data is detected by the detection means, the first control means to notify the event data to the second control means, and the second control means is configured to record the start to the transfer operation of the substrate when notified of the event data that the transfer operation of the substrate has ended. The completed first image data is stored in the above-mentioned first storage unit. The substrate processing system according to claim 2, wherein the second control means is configured to retrieve the second image data obtained by searching the second storage unit by the alarm ID and/or the occurrence time, and The above-mentioned first image data stored in the above-mentioned first storage unit in advance and recorded from the start to the end of the conveyance operation of the above-mentioned substrate are displayed on the same screen. The substrate processing system of claim 1, further comprising: a plurality of conveying mechanisms for conveying substrates; and detection means provided in the conveying mechanisms for detecting the conveying errors occurring in the conveying mechanisms; and the recording means are configured to perform the recording on the substrates of the conveying mechanism, which are objects of recording The second control means is configured to record the moving image of the conveyance of the substrate by the conveyance means as the first image data in the recording means, and the conveyance means to carry out the photographing. The moving image of the conveyance of the substrate is recorded in the recording means as second image data having a higher resolution than the first image data. The substrate processing system according to claim 8, wherein the second control means is configured to cause the recording means to record the first image when the substrate or the carrier in which the substrate is accommodated is conveyed by the conveyance mechanism, which is a recording object. image data and the above-mentioned 2nd image data. The substrate processing system according to claim 8, wherein the second control means is configured to prevent the recording means from recording the first image data and the second image data when the transfer mechanism, which is a recording target, is stopped. The substrate processing system according to claim 8, wherein the second control means is configured to identify the transfer mechanism that caused the transfer error based on the number of an alarm ID obtained when the transfer error occurs. The substrate processing system according to claim 11, wherein the second control means is configured to acquire only the second image data of the recording means for recording the specified conveyance means. The substrate processing system of claim 1, wherein the conveying mechanism is composed of a loading port, At least one selected from the group consisting of a cassette conveying device, a wafer boat, and a transfer machine. A substrate processing apparatus comprising: first control means for acquiring event data generated when a substrate is transported and alarm data generated when a transport error occurs; and recording means for taking the substrate transport operation as first image data while recording, the conveyance of the substrate is recorded as second image data with a higher resolution than the first image data; the second control means makes the first storage unit store the event data according to the above-mentioned event data The first image data recorded by the recording means, and the second storage part is made to store the second image data recorded by the recording means according to the alarm data; and an operation part that displays at least the first image data. 1 image data and the second image data; the second control means is configured to display both the first image data and the second image data recorded when the transfer error occurs on the same screen , and the start time point of the first image data and the second image data can be adjusted. A method for manufacturing a semiconductor device, comprising a step of transporting a substrate and a step of processing the substrate; wherein the step of transporting the substrate further comprises: acquiring event data generated when the substrate is transported and alarm data generated when a transport error occurs the step of recording the conveying action of the substrate as the first image data, recording the conveying action of the substrate as the second image data having a higher resolution than the first image data, and recording The storage step of storing the recorded first image data in the first storage part and the second storage part respectively according to the above-mentioned event data and the recorded second image data in the first storage part and the second storage part according to the above-mentioned alarm data; and A display step for displaying the first image data or the second image data; and in the displaying step, both the first image data and the second image data recorded when the transfer error occurs are displayed On the same screen, the start time points of the first image data and the second image data can be adjusted.

Images