TW201944133A - Heat dissipating structure, electronic device and display device using same - Google Patents

Abstract

A heat dissipating structure includes a buffer layer and a heat dissipating layer. The heat dissipating layer includes a main portion stacked on a side of the buffer layer and at least one extending portion extending from the main portion. Each extending portion extends through the buffer layer. The present invention also provides an electronic device and a display device using the above-mentioned heat dissipating structure. The heat dissipation layer can be extended into the through hole defined in the buffer layer, so that the heat dissipation layer can directly contact with the heat-generating electronic device to facilitate the conduction and dissipation of heat.

Description

Heat radiation structure and electronic device and display device using same

The invention relates to a heat dissipation structure and an electronic device and a display device using the same.

Light-Emitting Diode (LED) and Organic Electroluminesence Display (OELD) are two commonly used light-emitting devices. The light-emitting diode uses the semiconductor P-N junction structure to generate injected minority carriers (electrons or holes), and recombines the minority carriers to emit light. Organic light-emitting diodes provide a very thin coating of organic materials on a glass substrate. When an electric current is passed through, these organic material coatings emit light. The conventional white light LED mainly uses a blue chip plus yellow fluorescent powder to encapsulate the light to produce white light. However, the sapphire substrate is generally used as the base layer of the LED. Due to its low thermal conductivity, the heat dissipation of the LED is poor, which affects the LED light emission. Efficiency and longevity. Similarly, the glass substrate of the OLED does not have a high thermal conductivity and also has a heat dissipation problem.

In view of this, it is necessary to provide a heat dissipation structure which has a good heat dissipation effect. A heat dissipation structure includes a buffer layer and a heat dissipation layer. The heat dissipation layer includes a main body portion laminated on one side of the buffer layer and at least one extension portion extending from the main body portion, and each extension portion extends through the buffer layer.

Further, the buffer layer is correspondingly provided with at least one through hole penetrating through the buffer layer, and each extension portion is embedded in a corresponding one of the through holes.

Further, an adhesive layer is provided between the main body portion and the buffer layer to combine the buffer layer and the heat dissipation layer, and the extension portion penetrates the adhesive layer.

Further, each extension is attached / contacted to the hole wall of its corresponding through hole.

Further, an adhesive layer is provided on a hole wall of each through hole to combine the extension portion and the buffer layer.

Further, the at least one through hole includes a plurality of through holes, and the plurality of through holes are arranged at intervals.

Further, an end surface of the extending portion remote from the main body portion is flush with a surface of the buffer layer.

It is also necessary to provide an electronic device applying the heat dissipation structure.

An electronic device includes a heat-generating electronic device and a heat dissipation structure laminated on one side of the heat-generating electronic device, and the heat dissipation structure is the aforementioned heat dissipation structure.

Further, the buffer layer and the extension portion of the heat dissipation structure are directly attached to the heat-generating electronic device.

Further, the heat-generating electronic device is an active matrix organic light emitting diode device.

In the present invention, by providing a through hole in the buffer layer, the heat dissipation layer can be extended into the through hole, so that the heat dissipation layer can directly contact the heat-generating electronic device, thereby facilitating heat conduction and dissipation.

The drawings show embodiments of the present invention, and the present invention can be implemented in many different forms, and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. For clarity, the dimensions of layers and regions have been exaggerated in the figure. It is understood that although the terms first, second, etc. may be used herein to describe various elements, elements, regions, layers and / or sections, these elements, elements, regions, layers and / or sections should not be limited to these terms . These terms are only used to distinguish one element, element, region, layer and / or part from another element, element, region, layer and / or part. Accordingly, the first part, element, region, layer, and / or part discussed below can be referred to as the second element, element, region, layer, and / or part without departing from the teachings of the present invention.

The proper nouns used herein are only used to describe specific embodiments and are not intended to limit the present invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and "including" are used in the specification, the presence of stated features, integers, steps, operations, elements and / or components is indicated, but one or more other features, integers, The presence of steps, operations, elements and / or components.

Embodiments of the present invention are described here with reference to cross-sectional views, which are schematic diagrams of idealized embodiments (and intermediate structures) of the present invention. Thus, variations in the shapes of the illustrations as a result of manufacturing processes and / or tolerances are to be expected. Therefore, the embodiments of the present invention should not be interpreted as being limited to the specific shape of the region illustrated here, but should include deviations in the shape due to, for example, manufacturing. The regions shown in the figures are schematic only, and their shapes are not intended to illustrate the actual shape of the device and are not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should also be understood that terms such as those defined in the general dictionary should be interpreted to have meanings consistent with their meaning in the context of the relevant field, and should not be interpreted in an over-ideal or over-formal meaning Unless explicitly defined in this article.

Referring to FIG. 1, the electronic device 100 provided by the first embodiment of the present invention is an OLED display device, which includes a heat dissipation structure 10 and an active matrix organic light emitting diode device 20 disposed on the heat dissipation structure 10. The heat dissipation structure 10 serves as a supporting substrate for the active matrix organic light emitting diode device 20.

It can be understood that the active matrix organic light emitting diode device 20 includes a thin film transistor (TFT) layer and a light emitting diode layer laminated on the TFT layer. Preferably, the active matrix organic light emitting diode device 20 may be flexible, that is, the OLED display device is a flexible OLED display device.

It can be understood that the active matrix organic light emitting diode device 20 of the electronic device 100 can also be replaced with other electronic devices that can generate thermal energy.

The heat dissipating structure 10 can not only support the active matrix organic light emitting diode device 20 but also dissipate heat from the active matrix organic light emitting diode device 20. The heat dissipation structure 10 includes a buffer layer 11, a heat dissipation layer 13, and an adhesive layer 15 disposed between the buffer layer 11 and the heat dissipation layer 13. The adhesive layer 15 is formed on a surface of the buffer layer 11 away from the active matrix organic light-emitting diode device 20, and is used to integrate the buffer layer 11 and the heat dissipation layer 13 into one body.

The buffer layer 11 may be made of a material having a force buffering function, such as foam, silicone, or the like, which is conventionally used in the art. The heat-dissipating layer 13 may be made of a material with good thermal conductivity, such as graphene, which is conventionally used in the art.

The buffer layer 11 of the heat dissipation structure 10 is directly attached to the active matrix organic light emitting diode device 20. Since the heat conduction function of the buffer layer 11 is weak, in order to improve the heat dissipation function of the heat dissipation structure 10, The buffer layer 11 and the adhesive layer 15 are correspondingly provided with at least one through hole 111 penetrating through the buffer layer 11 and the adhesive layer 15, and the heat dissipation layer 13 extends into the at least one through hole 111. The buffer layer 11 is exposed and directly contacts the active matrix organic light emitting diode device 20 to better conduct heat dissipation. That is, the heat dissipation layer 13 extends through the buffer layer 11 and the adhesive layer 15.

The heat dissipation layer 13 includes a main body portion 131 and at least one extension portion 133 extending from the main body portion 131. In this embodiment, the main body portion 131 is a layer, which is stacked on a side of the buffer layer 11 away from the active matrix organic light emitting diode device 20. The number of the extending portions 133 is the same as the number of the through holes 111, and one extending portion 133 is disposed in each of the through holes 111. In this embodiment, the at least one through-hole 111 includes a plurality of through-holes 111, and the plurality of through-holes 111 are disposed at intervals from each other; Set at intervals.

In this embodiment, an end surface of the extension portion 133 far from the main body portion 131 and a surface of the buffer layer 11 near the active matrix organic light emitting diode device 20 are flush, as shown in FIG. 1. Please refer to FIG. 2 to FIG. 4, the cross-sectional shape (planar shape) of the plurality of through holes 111 may be circular, rectangular, etc., but is not limited to the rectangle shown in FIG. 2 and the rectangle shown in FIGS. 3-4. There can also be any other regular or irregular shapes, such as triangles, ellipses, etc. The plurality of through holes 111 may be arranged in a matrix as shown in FIG. 2-3, or may be arranged in multiple rows / columns as shown in FIG. 4. It can be understood that the arrangement of the plurality of through holes 111 is not limited to that shown in Figs. 2-4, and may be any other arrangement.

In this embodiment, each extension portion 133 of the heat dissipation layer 13 is closely embedded in its corresponding through hole 111 (the extension portion 133 is attached / contacted to the hole wall of the through hole 111), so the extension The shape of the portion 133 matches the shape of the through hole 111. For example, when the cross-section of the through-hole 111 is circular, the shape of the extension 133 is cylindrical; when the cross-section of the through-hole 111 is rectangular, the shape of the extension 133 is a rectangular column. It can be understood that the extension portion 133 may also be disposed in the corresponding through hole 111, but not conformed to the hole wall of the through hole 111 (that is, is not closely embedded).

As shown in FIG. 1, the heat dissipation structure 10 further includes an electromagnetic shielding layer 17. The electromagnetic shielding layer 17 is disposed on a side of the heat dissipation layer 13 away from the buffer layer 11.

The electromagnetic shielding layer 17 may be made of a material having an electromagnetic shielding function, such as metallic copper.

It can be understood that an additional adhesive layer 15 may be further provided between the electromagnetic shielding layer 17 and the heat dissipation layer 13 to integrate the electromagnetic shielding layer 17 and the heat dissipation layer 13 into one body.

The active matrix organic light emitting diode device 20 includes an electron transport layer (not shown) formed on the heat dissipation layer 13, a light emitting layer (not shown) formed on the electron transport layer, and A hole transport layer (not shown) on the light emitting layer, and a hole injection layer (not shown) formed on the hole transport layer.

Referring to FIG. 5, the electronic device 200 provided by the second embodiment of the present invention is an OLED display device, which includes a heat dissipation structure 10 and an active matrix organic light emitting diode device 20 disposed on the heat dissipation structure 10. The heat dissipation structure 10 serves as a supporting substrate for the active matrix organic light emitting diode device 20.

It can be understood that the active matrix organic light emitting diode device 20 includes a thin film transistor (TFT) layer and a light emitting diode layer laminated on the TFT layer. Preferably, the active matrix organic light emitting diode device 20 may be flexible, that is, the OLED display device is a flexible OLED display device.

It can be understood that the active matrix organic light emitting diode device 20 of the electronic device 100 can also be replaced with other electronic devices that can generate thermal energy.

The heat dissipation structure 10 can not only support the active matrix organic light emitting diode device 20 but also conduct heat from the active matrix organic light emitting diode device 20 to be dissipated. The heat dissipation structure 10 of this embodiment also includes a buffer layer 11, a heat dissipation layer 13, and an adhesive layer 15. Unlike the heat dissipation structure 10 shown in FIG. 1, the positions of the adhesive layers 15 of this embodiment are different.

At least one through hole 111 penetrating through the buffer layer 11 is defined in the buffer layer 11. An adhesive layer 15 is disposed on the hole wall of each through hole 111. The heat dissipation layer 13 extends into the at least one through hole 111 so that the heat dissipation layer 13 can be exposed to the buffer layer 11, and the heat dissipation layer 13 can directly contact the active matrix organic light emitting diode device. 20 for better heat dissipation. That is, the heat dissipation layer 13 extends through the buffer layer 11.

The heat dissipation layer 13 includes a main body portion 131 and at least one extension portion 133 extending from the main body portion 131. The main body portion 131 is a layer, which is stacked on a side of the buffer layer 11 away from the active matrix organic light emitting diode device 20. The number of the extending portions 133 is the same as the number of the through holes 111, and one extending portion 133 is embedded in each of the through holes 111. No adhesive layer 15 is provided between the main body portion 131 and the buffer layer 11, and the adhesive layer 15 is disposed on the hole wall of the through hole 111 and is located between the buffer layer 11 and the extension portion 133 to The buffer layer 11 and the heat dissipation layer 13 are integrated into one body. In this embodiment, the at least one through-hole 111 includes a plurality of through-holes 111, and the plurality of through-holes 111 are spaced from each other. The adhesive layer 15 is formed on a hole wall of each of the through holes 111 to combine the buffer layer 11 and the heat dissipation layer 13 into one body.

In this embodiment, an end surface of the extension portion 133 far from the main body portion 131 and a surface of the buffer layer 11 near the active matrix organic light emitting diode device 20 are flush, as shown in FIG. 5. As shown in FIG. 5, the heat dissipation structure 10 further includes an electromagnetic shielding layer 17. The electromagnetic shielding layer 17 is disposed on a side of the heat dissipation layer 13 away from the buffer layer 11. The electromagnetic shielding layer 17 may be made of a material having an electromagnetic shielding function, such as metallic copper. It can be understood that an additional adhesive layer 15 may be further provided between the electromagnetic shielding layer 17 and the heat dissipation layer 13 to integrate the electromagnetic shielding layer 17 and the heat dissipation layer 13 into one body.

The above embodiments are only used to illustrate the technical solution of the present invention and are not limiting. The up, down, left, and right directions appearing in the illustration are for easy understanding, although the present invention is described in detail with reference to the preferred embodiments, and the technical field Those of ordinary skill in the art should understand that the technical solution of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solution of the present invention.

100, 200‧‧‧ electronic devices

20‧‧‧ Active Matrix Organic Light Emitting Diode Device

10‧‧‧Heat dissipation structure

11‧‧‧ buffer layer

13‧‧‧ heat dissipation layer

15‧‧‧ Adhesive layer

131‧‧‧Main body

133‧‧‧ extension

111‧‧‧through hole

17‧‧‧ electromagnetic shielding layer

FIG. 1 is a schematic cross-sectional view of an electronic device according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view of a heat dissipation structure according to the first embodiment of the present invention.

3 is a schematic plan view of a heat dissipation structure according to a second embodiment of the present invention.

4 is a schematic plan view of a heat dissipation structure according to a third embodiment of the present invention.

5 is a schematic cross-sectional view of an electronic device according to a second embodiment of the present invention.

Claims (10)

A heat dissipation structure includes a buffer layer and a heat dissipation layer. The improvement is that the heat dissipation layer includes a main body portion laminated on one side of the buffer layer and at least one extension portion extending from the main body portion, and each extension portion extends through the space. Mentioned buffer layer. The heat dissipation structure according to claim 1, wherein the buffer layer is correspondingly provided with at least one through hole penetrating through the buffer layer, and each extension is embedded in a corresponding one of the through holes. The heat dissipation structure according to claim 2, wherein an adhesive layer is provided between the main body portion and the buffer layer to combine the buffer layer and the heat dissipation layer, and the extension portion penetrates the adhesive Floor. The heat dissipation structure according to claim 2, wherein each extension portion is attached / contacted to a hole wall of its corresponding through hole. The heat dissipation structure according to claim 2, wherein an adhesive layer is provided on a hole wall of each through hole to combine the extension portion and the buffer layer. The heat dissipation structure according to claim 2, wherein the at least one through hole includes a plurality of through holes, and the plurality of through holes are arranged at intervals. The heat dissipation structure according to claim 1, wherein an end surface of the extending portion remote from the main body portion is flush with a surface of the buffer layer. An electronic device includes a heat-generating electronic device and a heat-dissipating structure laminated on one side of the heat-generating electronic device, and the heat-dissipating structure is the heat-dissipating structure according to any one of claims 1-7. The electronic device according to claim 8, wherein the buffer layer and the extension portion of the heat dissipation structure are directly attached to the heat-generating electronic device. A display device includes a substrate and an active matrix organic light emitting diode device formed on the substrate. The substrate is the heat dissipation structure according to any one of claims 1-7.