CN113593412B - Heat dissipation film and display device - Google Patents
Heat dissipation film and display device Download PDFInfo
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- CN113593412B CN113593412B CN202110871559.1A CN202110871559A CN113593412B CN 113593412 B CN113593412 B CN 113593412B CN 202110871559 A CN202110871559 A CN 202110871559A CN 113593412 B CN113593412 B CN 113593412B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The present disclosure relates to a heat dissipation film and a display device, wherein the heat dissipation film includes: a first graphene conductive layer; the first support layer is positioned on one side of the first graphene conductive layer; the first buffer layer is positioned on one side of the first supporting layer away from the first graphene conductive layer; and the heat dissipation layer is positioned on one side of the first buffer layer away from the first graphene conductive layer. The heat dissipation film provided by the present disclosure has excellent heat dissipation and static dissipation properties, and has excellent mechanical properties and good flatness.
Description
Technical Field
The disclosure relates to the technical field of manufacturing of display devices, in particular to a heat dissipation film and a display device.
Background
Currently, in the technical field of display device manufacturing, a pressure-sensitive adhesive is generally used as an adhesive layer of a heat dissipation film to a display panel. However, the pressure-sensitive adhesive is poor in conductivity due to its excessively large impedance, thus resulting in poor static dissipative ability of the heat dissipation film. Meanwhile, the pressure-sensitive adhesive is large in thickness and poor in mechanical performance and strength, so that the flatness is low, the thickness is uneven, and further the heat dissipation film is subjected to film printing, and the display effect of the display device is affected.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The present disclosure is directed to a heat dissipation film having excellent heat dissipation and static dissipation properties, and having excellent mechanical properties and good flatness, and a display device.
An aspect of the present disclosure provides a heat dissipation film, including:
a first graphene conductive layer;
the first support layer is positioned on one side of the first graphene conductive layer;
the first buffer layer is positioned on one side of the first supporting layer away from the first graphene conductive layer;
and the heat dissipation layer is positioned on one side of the first buffer layer away from the first graphene conductive layer.
In an exemplary embodiment of the present disclosure, the heat dissipation film further includes:
the first accommodating holes are arranged on the surface of the heat dissipation layer, far away from the first graphene conductive layer, and extend towards the direction, close to the first graphene conductive layer; and each first accommodating hole is filled with graphene.
In one exemplary embodiment of the present disclosure, the plurality of first receiving holes penetrate through the heat dissipation layer, the first buffer layer, and the first support layer, and the first receiving holes meet the first graphene conductive layer, and the graphene in the first receiving holes meets the first graphene conductive layer.
In one exemplary embodiment of the present disclosure, the heat dissipation layer has an edge region and a middle region, the edge region being disposed around the middle region,
the plurality of first accommodating holes are arranged in the edge area of the heat dissipation layer and extend towards the direction close to the first graphene conductive layer.
In an exemplary embodiment of the present disclosure, the heat dissipation film further includes:
the second accommodating hole is arranged on the surface, far away from the first graphene conductive layer, of the heat dissipation layer and is positioned in the middle area of the heat dissipation layer, and the second accommodating hole extends towards the direction close to the first graphene conductive layer;
the first end of the graphene conductive column is located in the second accommodating hole, the second end of the graphene conductive column extends away from the first graphene conductive layer, and the second end of the graphene conductive column is away from the first graphene conductive layer relative to the heat dissipation layer.
In an exemplary embodiment of the present disclosure, the cross-section of the first receiving hole is circular in shape, and the inner diameter of the first receiving hole is 40 to 100um.
In an exemplary embodiment of the present disclosure, the heat dissipation film further includes:
the second graphene conductive layer is positioned on one side, far away from the first graphene conductive layer, of the heat dissipation layer.
Another aspect of the present disclosure provides a display device including:
a display panel having a first flat portion having a light-emitting side and a backlight side, a bending portion, and a second flat portion, the backlight side of the first flat portion being disposed opposite to the second flat portion, and the first flat portion and the second flat portion being connected by the bending portion;
a heat dissipation film, wherein the heat dissipation film is any one of the above heat dissipation films, and the first graphene conductive layer is bonded to the backlight side of the first flat portion;
the second supporting layer is positioned on one side of the heat dissipation layer, which is far away from the first graphene conductive layer, and is attached to one side of the second flat part, which is close to the first graphene conductive layer, and the projection of the second supporting layer on the first graphene conductive layer is positioned in the projection of the heat dissipation layer on the first graphene conductive layer;
the main control circuit board is positioned at one side of the second flattening part far away from the first flattening part and extends in a direction far away from the bending part;
and the conductive cloth is positioned between the main control circuit board and the heat dissipation film and is attached to the middle area of the main control circuit board and the heat dissipation film.
In an exemplary embodiment of the disclosure, the heat dissipation film has a graphene conductive post, and a second end of the graphene conductive post is attached to the main control circuit board.
In an exemplary embodiment of the present disclosure, the second supporting layer is located in an edge area of a side of the heat dissipation layer near the bending part;
the plurality of first accommodating holes are arranged in the rest of edge regions of the heat dissipation layer except for the edge region near one side of the bending part.
The technical scheme provided by the disclosure can achieve the following beneficial effects:
compared with the pressure sensitive adhesive in the prior art, the heat dissipation film provided by the disclosure uses the first graphene conductive layer as the adhesive layer, and the impedance of graphene is very low, so that the degree of complete conduction can be achieved in the process of conducting static electricity, and the first graphene conductive layer can have excellent static electricity dissipation performance, and further the heat dissipation film has excellent static electricity dissipation performance. In addition, the graphene has better conductivity and heat dissipation performance compared with the pressure sensitive adhesive, so that the thickness of the first graphene conductive layer is smaller in the process of forming the heat dissipation film, and the overall thickness of the heat dissipation film can be greatly reduced.
Further, the graphene has a typical two-dimensional layered structure, so that higher van der Waals force can be generated between the first graphene conductive layer and the first supporting layer, extremely strong adhesive force can be generated, and good connection strength between the first graphene conductive layer and the first supporting layer is ensured. Meanwhile, the first graphene conductive layer has excellent mechanical property and strength, has higher flatness, and can be bent and deformed, so that the heat dissipation film provided by the present disclosure has excellent mechanical property and better flatness, and therefore the heat dissipation film provided by the present disclosure does not generate the problem of heat dissipation film printing caused by thickness variation. Therefore, when the heat dissipation film is applied to a display device, the display effect of the display device can be significantly improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.
Fig. 1 illustrates a schematic structural view of a first section of a heat dissipation film according to an exemplary embodiment of the present disclosure;
fig. 2 illustrates a schematic structural view of a second cross section of a heat dissipation film according to an exemplary embodiment of the present disclosure;
fig. 3 illustrates a schematic structural view of a cross section of a heat dissipation film according to another exemplary embodiment of the present disclosure;
FIG. 4 illustrates a schematic structure of a heat dissipation layer according to an exemplary embodiment of the present disclosure;
FIG. 5 illustrates a partial enlarged schematic view at A in FIG. 4 according to an exemplary embodiment of the present disclosure;
fig. 6 illustrates a structural schematic view of a first cross section of a display device according to an exemplary embodiment of the present disclosure;
fig. 7 illustrates a structural schematic diagram of a second cross section of a display device according to an exemplary embodiment of the present disclosure;
fig. 8 illustrates a schematic structural view of a cross section of a display device according to another exemplary embodiment of the present disclosure;
fig. 9 illustrates a schematic structure of a main control circuit board according to an exemplary embodiment of the present disclosure.
Reference numerals illustrate:
1. a heat dissipation film; 2. a display panel; 3. a second support layer; 4. a main control circuit board; 5. a conductive cloth; 6. carbonization boundaries; 7. a base film; 11. a first graphene conductive layer; 12. a first support layer; 13. a first buffer layer; 14. a heat dissipation layer; 15. a first accommodation hole; 16. a second accommodation hole; 17. a graphene conductive column; 18. a second graphene conductive layer; 19. a second buffer layer; 20. a glue layer; 21. a first flat portion; 22. a bending part; 23. a second flat portion; 41. a first copper exposure area; 42. and a second copper exposure area.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.
Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification for convenience only, such as in terms of the orientation of the examples described in the figures. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.
The terms "a," "an," "the," and "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first" and "second" and the like are used merely as labels, and are not intended to limit the number of their objects.
As shown in fig. 1 to 4, the present disclosure first provides a heat dissipation film 1, which may have excellent heat dissipation and static electricity dissipation properties, and excellent mechanical properties and good flatness. Meanwhile, compared with the prior art, the heat dissipation film 1 provided by the present disclosure greatly reduces the thickness of the heat dissipation film 1. Specifically, as shown in fig. 1 to 3, the heat dissipation film 1 provided by the present disclosure may include: a first graphene conductive layer 11, a first support layer 12, a first buffer layer 13, and a heat dissipation layer 14.
The first graphene conductive layer 11 may be used as an adhesive layer of the heat dissipation film 1 provided in the present disclosure. Namely: as shown in fig. 6 to 8, when the heat dissipation film 1 of the present disclosure is applied to a display device, the first graphene conductive layer 11 may be bonded with the display panel 2 in the display device to bond the entire heat dissipation film 1 into the display panel 2. It should be noted that, the heat dissipation film 1 may not be applied to a display device, but may be applied to other components requiring heat dissipation, and may be set according to actual needs, which are all within the scope of the present disclosure.
Compared with the technical scheme of adopting the pressure-sensitive adhesive as the adhesive layer in the prior art, the graphene has very low electrostatic conduction resistance, and can reach the degree of complete conduction in the electrostatic conduction process, so that the first graphene conductive layer 11 can have excellent electrostatic dissipation performance, and the heat dissipation film 1 further has excellent electrostatic dissipation performance. It should be noted that, in the present application, the electrostatic conduction resistance of the first graphene conductive layer 11 is less than 1Ω, and the electrostatic conduction resistance of the adhesive layer used in the prior art is greater than 10Ω.
Moreover, since the conductivity and heat dissipation performance of graphene are better than those of the pressure-sensitive adhesive, the thickness of the first graphene conductive layer 11 can be made smaller in the process of forming the heat dissipation film 1, for example, the thickness of the pressure-sensitive adhesive in the heat dissipation film 1 in the prior art ranges from 15 um to 20um, and the thickness of the first graphene conductive layer 11 in the present application can be smaller than 5um. That is, therefore, the thickness of the heat dissipation film 1 provided in the present application is greatly reduced since the thickness of the first graphene conductive layer 11 is smaller in the present application.
Further, as the graphene can have a typical two-dimensional layered structure, a high van der Waals force can be generated between the first graphene conductive layer 11 and the first supporting layer 12, and a very strong adhesive force can be generated, so that a good connection strength between the first graphene conductive layer 11 and the first supporting layer 12 is ensured. In addition, when the first graphene conductive layer 11 is bonded to the element requiring heat dissipation, such as the display panel 2, a high van der waals force can be generated between the first graphene conductive layer and the element, such as the display panel 2, and the bonding strength between the first graphene conductive layer 11 and the element, such as the display panel 2, can be ensured. Therefore, the first graphene conductive layer 11 is arranged, so that a strong bonding effect between the heat dissipation film 1 and the display panel 2 and other elements can be ensured.
Meanwhile, graphene has excellent mechanical properties, strength and deformability. Thus, the first graphene conductive layer 11 of the present application may have excellent mechanical properties and strength, have higher flatness, and may be bent and deformed, so that the heat dissipation film 1 provided by the present disclosure may have excellent mechanical properties and better flatness, and thus the heat dissipation film 1 provided by the present disclosure may not generate a problem of film printing of the heat dissipation film 1 due to a thickness variation of the first graphene conductive layer 11.
The first support layer 12 may be located on one side of the first graphene conductive layer 11, and the material of the first support layer 12 may be polyethylene terephthalate. The first support layer 12 is formed of polyethylene terephthalate, and thus provides good support and cushioning effects and also provides better insulation. The thickness of the first support layer 12 is not limited in this disclosure, and may be set according to actual needs.
The first buffer layer 13 may be located on a side of the first support layer 12 away from the first graphene conductive layer 11, and the material of the first buffer layer 13 may be foam, but not limited thereto, and other materials having a buffer property may be used to form the first buffer layer 13.
The heat dissipation layer 14 may be located on a side of the first buffer layer 13 away from the first graphene conductive layer 11. The material of the heat dissipation layer 14 may be copper, and specifically the heat dissipation layer 14 may be copper foil. The use of copper foil as the heat dissipation layer 14 can provide the heat dissipation film 1 with excellent electric conduction and heat dissipation properties because the copper foil has excellent electric conduction and heat dissipation properties. However, the material of the heat dissipation layer 14 is not limited thereto, and may be other materials, and may be specifically set according to actual needs.
Further, the projection of the heat dissipation layer 14 on the first graphene conductive layer 11 may be located within the projection of the first buffer layer 13 on the first graphene conductive layer 11. I.e. it can be understood that: the size of the heat dissipation layer 14 is smaller than that of the first buffer layer 13. With such an arrangement, it is possible to ensure that the heat dissipation film 1 can be mounted in a display device when the heat dissipation film 1 is applied to the display device.
In one embodiment of the present disclosure, the heat dissipation film 1 may further include a plurality of first receiving holes 15, the plurality of first receiving holes 15 may be disposed at a surface of the heat dissipation layer 14 remote from the first graphene conductive layer 11 and may extend in a direction close to the first graphene conductive layer 11, and each of the first receiving holes 15 is filled with graphene. Because the electrostatic resistance of graphene is lower, the radiating effect is better, so that the electrostatic dissipation capacity of the radiating film 1 can be enhanced and the radiating effect of the radiating film 1 can be improved by filling graphene in the first accommodating hole 15.
In one embodiment of the present disclosure, a plurality of first receiving holes 15 may penetrate through the heat dissipation layer 14, the first buffer layer 13, and the first support layer 12, and the first receiving holes 15 may be connected with the first graphene conductive layer 11, and the graphene in the first receiving holes 15 may be connected with the first graphene conductive layer 11.
By penetrating the plurality of first accommodating holes 15 through the heat dissipation layer 14, the first buffer layer 13 and the first support layer 12, and enabling the graphene in the first accommodating holes 15 to be connected with the first graphene conductive layer 11, a static dissipation route from the first graphene conductive layer 11 to the graphene in the first accommodating holes 15 to the heat dissipation layer 14 can be formed, so that the static dissipation capacity of the heat dissipation film 1 provided by the present disclosure is stronger compared with a mode of conducting static dissipation by using only the heat dissipation layer 14 in the prior art.
Further, the cross-section of the first receiving hole 15 may be circular, but not limited thereto, and the cross-section of the first receiving hole 15 may be other shapes, for example: rectangular or triangular, etc., and may be selected according to actual needs. Also, when the cross-sectional shape of the first receiving hole 15 is circular, the inner diameter of the first receiving hole 15 may be 40um to 100um, for example: 40um, 60um, 80um, 100um, etc.
In one embodiment of the present disclosure, the heat dissipation layer 14 may have an edge region and a middle region. Wherein the edge region may be disposed around the middle region. When the heat dissipation layer 14 is applied to the display device, the edge region may correspond to a non-display region of the display panel 2, and the middle region may correspond to a display region of the display panel 2. The plurality of first receiving holes 15 may be disposed in an edge region of the heat dissipation layer 14 and extend in a direction approaching the first graphene conductive layer 11. By arranging the plurality of first accommodation holes 15 in the edge region of the heat sink, the heat radiation capability of the edge region of the heat radiation film 1 can be enhanced, and when the heat radiation film 1 is applied to the display device, the first accommodation holes 15 are prevented from affecting the display region, thereby affecting the display effect of the display device.
Further, when the heat dissipation film 1 has a rectangular cross-sectional shape, the edge region thereof may have four sides, and the plurality of first receiving holes 15 may be distributed to three sides among the four sides. Also, the interval between the adjacent two first receiving holes 15 may be 1cm, but is not limited thereto, and the present disclosure does not limit the interval between the adjacent two first receiving holes 15, for example: the distance between two adjacent first accommodating holes 15 may be 0.5cm or 2cm, etc., and may be set according to actual needs, which is within the scope of the present disclosure.
As shown in fig. 5, the first receiving hole 15 provided in the present disclosure may be laser-perforated by a laser. When laser drilling is performed using a laser, a carbonized boundary 6 is formed around the first accommodation hole 15. The carbonized boundary 6 has conductivity, so that the conductivity of the graphene in the first accommodation hole 15 can be enhanced.
In addition, the graphene filled in the first accommodating hole 15 of the present disclosure may be a graphene oxide solution, which may include graphene, a nonpolar solvent, and an acrylic solvent, to thereby enhance the adhesiveness of the graphene solution, but is not limited thereto, and the first accommodating hole 15 may also be filled with solid graphene, which is within the scope of the present disclosure.
Further, the graphene may be filled in the first accommodating hole 15 by spraying the graphene solvent at high pressure, but not limited thereto, and other manners of filling the graphene in the first accommodating hole 15 may be adopted, which are all within the scope of the present disclosure.
In one embodiment of the present disclosure, as shown in fig. 3, the heat dissipation film 1 may further include: a second receiving hole 16 and a graphene conductive post 17. The second accommodating hole 16 may be disposed on a surface of the heat dissipation layer 14 away from the first graphene conductive layer 11 and in a middle region of the heat dissipation layer 14, and the second accommodating hole 16 may extend toward the first graphene conductive layer 11.
The first end of the graphene conductive post 17 may be located in the second accommodation hole 16, and the second end of the graphene conductive post 17 may extend in a direction away from the first graphene conductive layer 11. And, the second end of the graphene conductive post 17 may be remote from the first graphene conductive layer 11 with respect to the heat dissipation layer 14. It will be appreciated that the graphene conductive posts 17 are raised relative to the heat sink layer 14.
The second accommodating hole 16 may penetrate through the heat dissipation layer 14, the first buffer layer 13, and the first support layer 12, and be connected to the first graphene conductive layer 11, and the first end of the graphene conductive post 17 may be connected to the first graphene conductive layer 11. Thus, the heat dissipation film 1 of the present application can form a static dissipation path from the first graphene conductive layer 11 to the graphene conductive posts 17. Further, the static electricity dissipation capability of the heat dissipation film 1 of the present application can be further improved.
The cross-sectional shape of the second receiving hole 16 may be circular, but is not limited thereto, and the cross-sectional shape of the second receiving hole 16 may be other shapes, for example: rectangular or triangular, etc., and may be selected according to actual needs. Also, when the cross-sectional shape of the second receiving hole 16 is circular, the inner diameter of the second receiving hole 16 may be 0.5mm to 2mm, for example: 0.5mm, 1mm, 1.5mm, 2mm, etc., but is not limited thereto, and may be set according to actual needs.
The second receiving hole 16 provided by the present disclosure may also be laser perforated by a laser. When laser drilling is performed using a laser, a carbonized boundary 6 is formed around the second accommodating hole 16. The carbonized boundary 6 has conductivity, so that the conductivity of the graphene conductive pillars 17 in the second accommodation holes 16 can be enhanced.
Further, the cross-sectional shape of the graphene conductive post 17 may be the same as the cross-sectional shape of the second receiving hole 16, and may fill the entire second receiving hole 16.
In one embodiment of the present disclosure, the heat dissipation film 1 may further include a second graphene conductive layer 18, and the second graphene conductive layer 18 may be located at a side of the heat dissipation layer 14 remote from the first graphene conductive layer 11. And the material of the second graphene conductive layer 18 may be the same as that of the first graphene conductive layer 11. Through setting up second graphite alkene conducting layer 18, can make this heat dissipation membrane 1 form upper and lower two-layer graphite alkene conducting layer to when further improving heat dissipation membrane 1 static dissipative ability, also can make the surface of heat dissipation membrane 1 more level.
Further, as shown in fig. 1 to 3, the heat dissipation film 1 provided in the present disclosure may further include: a second buffer layer 19 and a glue layer 20. Wherein the adhesive layer 20 may be located at a side of the first buffer layer 13 remote from the first graphene conductive layer 11, and the second buffer layer 19 may be located between the adhesive layer 20 and the heat dissipation layer 14. Accordingly, the present disclosure is capable of bonding the second buffer layer 19 and the first buffer layer 13 through the adhesive layer 20. The adhesive layer 20 may be a pressure sensitive adhesive, and the material of the second buffer layer 19 may be polyimide, but is not limited thereto.
When the present disclosure is provided with the second buffer layer 19 and the glue layer 20, both the first receiving hole 15 and the second receiving hole 16 may penetrate the second buffer layer 19 and the glue layer 20.
The second aspect of the present disclosure provides a display device having a good heat dissipation effect, a static dissipation effect, and a display effect. Specifically, as shown in fig. 6 to 8, the display device may include: the display panel 2, the heat dissipation film 1, the second supporting layer 3, the main control circuit board 4 and the conductive cloth 5.
The display panel 2 may have a first flat portion 21, a bent portion 22, and a second flat portion 23. Wherein the first flat portion 21 may have a light emitting side and a backlight side, and the backlight side of the first flat portion 21 may be disposed opposite to the second flat portion 23, and the first flat portion 21 and the second flat portion 23 may be connected by the bent portion 22.
The heat dissipation film 1 may be the heat dissipation film 1 described above, and the first graphene conductive layer 11 may be adhered to the backlight side of the first flat portion 21. Wherein, the edge area of the heat dissipation film 1 corresponds to the non-display area of the first flat portion 21, and the middle area of the heat dissipation film 1 corresponds to the display area of the first flat portion 21.
The second support layer 3 may be located on a side of the heat dissipation layer 14 away from the first graphene conductive layer 11, and is attached to a side of the second flat portion 23 close to the first graphene conductive layer 11. I.e. it can be understood that: the second support layer 3 is located between the heat dissipation film 1 and the second flat portion 23. And the second support layer 3 may serve to support the heat dissipation film 1 and the second flat portion 23 while also shielding external interference signals.
The projection of the second support layer 3 onto the first graphene conductive layer 11 may be located within the projection of the heat dissipation layer 14 onto the first graphene conductive layer 11. I.e. it can be understood that: the second support layer 3 has a smaller size than the heat dissipation layer 14.
Further, the second supporting layer 3 may be located in an edge area of the heat dissipation layer 14 near the side of the bending portion 22. Also, when the second support layer 3 is located in the edge region of the heat dissipation layer 14 on the side near the bent portion 22, the plurality of first receiving holes 15 may be provided in the remaining edge regions of the heat dissipation layer 14 except for the edge region on the side near the bent portion 22. It is understood that the heat dissipation film 1 of the present disclosure may not be provided with the first receiving hole 15 at the side of the heat dissipation layer 14 where the second support layer 3 is provided.
Meanwhile, the first accommodating holes 15 are all positioned in the edge area of the heat dissipation layer 14, so that the heat dissipation capacity of the periphery of the heat dissipation film 1 can be improved, the heat dissipation capacity of the edge of the display device can be increased, and the problem of poor heat dissipation capacity of the edge of the display device is solved.
The main control circuit board 4 may be located at a side of the second flat portion 23 away from the first flat portion 21, and may extend in a direction away from the bending portion 22. When the heat dissipation film 1 has the graphene conductive posts 17, the second ends of the graphene conductive posts 17 can be attached to the main control circuit board 4 to form the static dissipation channels from the first graphene conductive layer 11 to the graphene conductive posts 17 to the main control circuit board 4, so that the heat dissipation film can be matched with the static dissipation channels from the first graphene conductive layer 11 to the graphene in the first accommodating holes 15 to the heat dissipation layer 14, and the static dissipation capability of the display device is further enhanced.
The main control circuit board 4 may be a flexible circuit board, as shown in fig. 9, which may have a first copper-exposed area 41 and a second copper-exposed area 42. The second end of the graphene conductive post 17 may be bonded to the first exposed copper region 41 to conduct static electricity of the display panel 2 to the first exposed copper region 41.
The conductive cloth 5 may be located between the main control circuit board 4 and the heat dissipation film 1, and is attached to the middle area of the main control circuit board 4 and the heat dissipation film 1. Thus, the present disclosure is also able to dissipate static electricity through the conductive cloth 5. When the main control circuit board 4 has the second exposed copper area 42, the conductive cloth 5 can be attached to the second exposed copper area 42 of the main control circuit board 4 to conduct static electricity to the second exposed copper area 42.
Further, since the heat dissipation film 1 of the present disclosure has graphene conductive pillars 17. Thus, the conductive cloth 5 of the present disclosure may have a size smaller than that of the conductive cloth of the related art, and in particular, the conductive cloth 5 of the present disclosure may have a size equivalent to two thirds of that of the conductive cloth of the related art, so as to reserve the arrangement area of the graphene conductive posts 17 provided by the present disclosure.
In one embodiment of the present disclosure, as shown in fig. 6 to 8, the display device may further have a base film 7, the base film 7 may be located between the backlight side of the first flat portion 21 and the heat dissipation film 1, static electricity of the display panel 2 may be accumulated in the base film 7, and the heat dissipation film 1 may dissipate the static electricity accumulated in the base film 7 through the above-described respective static electricity dissipation routes.
Accordingly, the display device provided by the present disclosure, because the heat dissipation film 1 described above is used, can have a good static dissipation capability and heat dissipation capability. Meanwhile, the heat dissipation film 1 has good mechanical properties and flatness, so that the phenomenon of film printing of the heat dissipation film 1 in the display device can be prevented, and the display effect of the display device can be effectively improved.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (8)
1. A heat dissipation film, comprising:
a first graphene conductive layer;
the first support layer is positioned on one side of the first graphene conductive layer;
the first buffer layer is positioned on one side of the first supporting layer away from the first graphene conductive layer;
the heat dissipation layer is positioned on one side, far away from the first graphene conductive layer, of the first buffer layer, and is provided with an edge area and a middle area, and the edge area is arranged around the middle area;
the first accommodating holes are arranged on the surface of the heat dissipation layer, far away from the first graphene conductive layer, in the edge area of the heat dissipation layer and extend towards the direction close to the first graphene conductive layer;
the second accommodating hole is arranged on the surface, far away from the first graphene conductive layer, of the heat dissipation layer and is positioned in the middle area of the heat dissipation layer, and the second accommodating hole extends towards the direction close to the first graphene conductive layer;
the first end of the graphene conductive column is located in the second accommodating hole, the second end of the graphene conductive column extends away from the first graphene conductive layer, and the second end of the graphene conductive column is away from the first graphene conductive layer relative to the heat dissipation layer.
2. The heat dissipation film according to claim 1, wherein each of the first accommodation holes is filled with graphene.
3. The heat dissipation film of claim 2, wherein the plurality of first receiving holes extend through the heat dissipation layer, the first buffer layer, and the first support layer, and wherein the first receiving holes are in contact with the first graphene conductive layer, and wherein the graphene in the first receiving holes is in contact with the first graphene conductive layer.
4. The heat dissipation film according to claim 1, wherein the cross section of the first accommodation hole is circular in shape, and the inner diameter of the first accommodation hole is 40-100 um.
5. The heat dissipation film of claim 1, further comprising:
the second graphene conductive layer is positioned on one side, far away from the first graphene conductive layer, of the heat dissipation layer.
6. A display device, comprising:
a display panel having a first flat portion having a light-emitting side and a backlight side, a bending portion, and a second flat portion, the backlight side of the first flat portion being disposed opposite to the second flat portion, and the first flat portion and the second flat portion being connected by the bending portion;
a heat dissipation film according to any one of claims 1 to 5, wherein the first graphene conductive layer is adhered to the backlight side of the first flat portion;
the second supporting layer is positioned on one side of the heat dissipation layer, which is far away from the first graphene conductive layer, and is attached to one side of the second flat part, which is close to the first graphene conductive layer, and the projection of the second supporting layer on the first graphene conductive layer is positioned in the projection of the heat dissipation layer on the first graphene conductive layer;
the main control circuit board is positioned at one side of the second flattening part far away from the first flattening part and extends in a direction far away from the bending part;
and the conductive cloth is positioned between the main control circuit board and the heat dissipation film and is attached to the middle area of the main control circuit board and the heat dissipation film.
7. The display device of claim 6, wherein the second end of the graphene conductive post is attached to the main control circuit board.
8. The display device according to claim 6, wherein the second supporting layer is located in an edge region of the heat dissipation layer on a side close to the bending portion;
the plurality of first accommodating holes are arranged in the rest of edge regions of the heat dissipation layer except for the edge region near one side of the bending part.
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| US20100085713A1 (en) * | 2008-10-03 | 2010-04-08 | Balandin Alexander A | Lateral graphene heat spreaders for electronic and optoelectronic devices and circuits |
| CN106991918A (en) * | 2017-06-02 | 2017-07-28 | 京东方科技集团股份有限公司 | Display base plate, display panel and display device |
| CN108389885B (en) * | 2018-04-13 | 2021-05-18 | 业成科技（成都）有限公司 | Heat dissipation structure, electronic device using same and display device |
| KR20210016231A (en) * | 2019-08-02 | 2021-02-15 | 삼성디스플레이 주식회사 | Panel bottom sheet and display including the same |
| CN110677982B (en) * | 2019-10-31 | 2021-10-19 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
| CN110718156B (en) * | 2019-10-31 | 2022-08-19 | 京东方科技集团股份有限公司 | Foldable display panel, manufacturing method and display device |
| CN110707057B (en) * | 2019-11-27 | 2021-09-17 | 南方电网科学研究院有限责任公司 | Packaging structure of SiC power device |
| CN111465178A (en) * | 2020-05-21 | 2020-07-28 | 杰群电子科技（东莞）有限公司 | Printed circuit board and electronic product using same |
| CN111682000A (en) * | 2020-06-24 | 2020-09-18 | 京东方科技集团股份有限公司 | Folding screen and display device |
| CN111864115B (en) * | 2020-07-28 | 2023-04-18 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN112867356B (en) * | 2021-01-14 | 2023-07-28 | 京东方科技集团股份有限公司 | Heat dissipation film for curved surface display module and curved surface display device |
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