CN113593412A

CN113593412A - Heat dissipation film and display device

Info

Publication number: CN113593412A
Application number: CN202110871559.1A
Authority: CN
Inventors: 吴永凯; 熊正平; 刘祺; 齐超; 麻清琳
Original assignee: BOE Technology Group Co Ltd; Mianyang BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Mianyang BOE Optoelectronics Technology Co Ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2021-11-02
Anticipated expiration: 2041-07-30
Also published as: CN113593412B

Abstract

The present disclosure relates to a heat dissipation film and a display device, wherein the heat dissipation film includes: a first graphene conductive layer; a first support layer located on one side of the first graphene conductive layer; the first buffer layer is positioned on one side, away from the first graphene conducting layer, of the first supporting layer; the heat dissipation layer is located on one side, far away from the first graphene conducting layer, of the first buffer layer. The heat dissipation film provided by the present disclosure has excellent heat dissipation and static dissipation properties, and has excellent mechanical properties and better flatness.

Description

Heat dissipation film and display device

Technical Field

The disclosure relates to the technical field of display device manufacturing, in particular to a heat dissipation film and a display device.

Background

Currently, in the field of display device manufacturing technology, a pressure-sensitive adhesive is generally used as an adhesive layer of a heat dissipation film to a display panel. However, the pressure-sensitive adhesive has poor conductivity due to its excessive resistance, thereby causing poor static dissipation capability of the heat dissipation film. Meanwhile, the pressure-sensitive adhesive has large thickness and poor mechanical property and strength, so that the flatness of the pressure-sensitive adhesive is low, the thickness of the pressure-sensitive adhesive is uneven, and the heat dissipation film generates a film printing phenomenon to influence the display effect of the display device.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The present disclosure aims to provide a heat dissipation film having excellent heat dissipation and static electricity dissipation properties, and having excellent mechanical properties and better flatness, and a display device.

An aspect of the present disclosure provides a heat dissipation film, including:

a first graphene conductive layer;

a first support layer located on one side of the first graphene conductive layer;

the first buffer layer is positioned on one side, away from the first graphene conducting layer, of the first supporting layer;

the heat dissipation layer is located on one side, far away from the first graphene conducting layer, of the first buffer layer.

In an exemplary embodiment of the present disclosure, the heat dissipation film further includes:

the first accommodating holes are formed in the surface, far away from the first graphene conducting layer, of the heat dissipation layer and extend towards the direction close to the first graphene conducting layer; and each first accommodating hole is filled with graphene.

In an exemplary embodiment of the present disclosure, the plurality of first receiving holes penetrate through the heat dissipation layer, the first buffer layer and the first support layer, and the first receiving holes are connected to the first graphene conductive layer, and graphene in the first receiving holes is connected to the first graphene conductive layer.

In one exemplary embodiment of the present disclosure, the heat dissipation layer has an edge region and a middle region, the edge region being disposed around the middle region,

the plurality of first accommodating holes are arranged in the edge area of the heat dissipation layer and extend towards the direction close to the first graphene conductive layer.

the second accommodating hole is formed in the surface, far away from the first graphene conducting layer, of the heat dissipation layer and located in the middle area of the heat dissipation layer, and extends towards the direction close to the first graphene conducting layer;

the first end of the graphene conductive column is located in the second accommodating hole, the second end of the graphene conductive column extends in the direction away from the first graphene conductive layer, and the second end of the graphene conductive column is away from the first graphene conductive layer relative to the heat dissipation layer.

In an exemplary embodiment of the present disclosure, a cross-sectional shape of the first receiving hole is a circle, and an inner diameter of the first receiving hole is 40 to 100 um.

and the second graphene conducting layer is positioned on one side, far away from the first graphene conducting layer, of the heat dissipation layer.

Another aspect of the present disclosure provides a display device including:

the display panel is provided with a first flat part, a bending part and a second flat part, the first flat part is provided with a light emitting side and a backlight side, the backlight side of the first flat part is opposite to the second flat part, and the first flat part and the second flat part are connected through the bending part;

a heat dissipation film, wherein the heat dissipation film is any one of the heat dissipation films, and the first graphene conductive layer is bonded to the backlight side of the first flat portion;

the second supporting layer is positioned on one side, away from the first graphene conducting layer, of the heat dissipation layer and attached to one side, close to the first graphene conducting layer, of the second flat part, and the projection of the second supporting layer on the first graphene conducting layer is positioned in the projection of the heat dissipation layer on the first graphene conducting layer;

the main control circuit board is positioned on one side of the second flat part, which is far away from the first flat part, and extends towards the direction far away from the bending part;

and the conductive cloth is positioned between the main control circuit board and the heat dissipation film and is attached to the middle area of the main control circuit board and the heat dissipation film.

In an exemplary embodiment of the present disclosure, the heat dissipation film has a graphene conductive pillar, and a second end of the graphene conductive pillar is attached to the main control circuit board.

In an exemplary embodiment of the disclosure, the second supporting layer is located in an edge region of the heat dissipation layer on a side close to the bending portion;

the plurality of first accommodating holes are formed in the edge regions of the heat dissipation layer except the edge region close to one side of the bending portion.

The technical scheme provided by the disclosure can achieve the following beneficial effects:

this heat dissipation membrane that this disclosure provided uses first graphite alkene conducting layer as the adhesive linkage, compares in prior art's pressure sensitive adhesive, because the impedance of graphite alkene is very low, can reach the degree of switching on completely at the in-process of conduction static to make first graphite alkene conducting layer can have good static dissipation performance, and then make the heat dissipation membrane have good static dissipation performance. In addition, as the conductivity and the heat dissipation performance of the graphene are better than those of a pressure-sensitive adhesive, the thickness of the first graphene conductive layer can be smaller in the process of forming the heat dissipation film, so that the overall thickness of the heat dissipation film can be greatly reduced.

Further, the graphene has a typical two-dimensional layered structure, so that a high van der waals force can be generated between the first graphene conducting layer and the first supporting layer, and then a strong adhesive force can be generated, and a good connection strength between the first graphene conducting layer and the first supporting layer is ensured. Meanwhile, the first graphene conductive layer has excellent mechanical properties and strength, has high flatness, and can be bent and deformed, so that the heat dissipation film provided by the disclosure has excellent mechanical properties and good flatness, and thus the heat dissipation film provided by the disclosure does not have the problem of heat dissipation film imprint caused by thickness change. Therefore, when the heat dissipation film is applied to a display device, the display effect of the display device can be significantly improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

FIG. 1 shows a schematic structural view of a first cross-section of a heat spreading film according to an exemplary embodiment of the present disclosure;

FIG. 2 illustrates a schematic structural view of a second cross-section of a heat spreading film according to an exemplary embodiment of the present disclosure;

FIG. 3 shows a schematic structural view of a cross-section of a heat spreading film according to another exemplary embodiment of the present disclosure;

FIG. 4 illustrates a schematic structural diagram of a heat spreading layer according to an exemplary embodiment of the present disclosure;

FIG. 5 illustrates a partial enlarged schematic view at A in FIG. 4 according to an exemplary embodiment of the present disclosure;

fig. 6 illustrates a schematic structural view of a first cross section of a display device according to an exemplary embodiment of the present disclosure;

fig. 7 illustrates a schematic structural view of a second cross-section of a display device according to an exemplary embodiment of the present disclosure;

fig. 8 illustrates a schematic structural view of a cross section of a display device according to another exemplary embodiment of the present disclosure;

fig. 9 shows a schematic structural diagram of a main control circuit board according to an exemplary embodiment of the present disclosure.

Description of reference numerals:

1. a heat dissipating film; 2. a display panel; 3. a second support layer; 4. a main control circuit board; 5. a conductive cloth; 6. carbonizing the boundary; 7. a base film; 11. a first graphene conductive layer; 12. a first support layer; 13. a first buffer layer; 14. a heat dissipation layer; 15. a first accommodation hole; 16. a second accommodation hole; 17. a graphene conductive post; 18. a second graphene conductive layer; 19. a second buffer layer; 20. a glue joint layer; 21. a first flattening section; 22. a bending section; 23. a second flat section; 41. a first copper exposure area; 42. and a second copper exposing area.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first" and "second", etc. are used merely as labels, and are not limiting on the number of their objects.

As shown in fig. 1 to 4, the present disclosure firstly provides a heat dissipation film 1, which can have excellent heat dissipation and static dissipation properties, as well as excellent mechanical properties and better flatness, of the heat dissipation film 1. Meanwhile, compared with the prior art, the heat dissipation film 1 provided by the present disclosure has the advantage that the thickness of the heat dissipation film 1 is greatly reduced. Specifically, as shown in fig. 1 to 3, the heat dissipation film 1 provided by the present disclosure may include: the graphene-based heat dissipation layer includes a first graphene conductive layer 11, a first support layer 12, a first buffer layer 13, and a heat dissipation layer 14.

Among them, the first graphene conductive layer 11 may serve as an adhesive layer of the heat dissipation film 1 provided by the present disclosure. Namely: as shown in fig. 6 to 8, when the heat dissipation film 1 of the present disclosure is applied to a display device, the first graphene conductive layer 11 may be bonded to the display panel 2 in the display device to bond the entire heat dissipation film 1 to the display panel 2. It should be noted that the heat dissipation film 1 may not be applied to a display device, may also be applied to other components requiring heat dissipation, and may be disposed according to actual needs, which are all within the protection scope of the present disclosure.

Compared with the technical scheme that the pressure-sensitive adhesive is used as the bonding layer in the prior art, the static conduction resistance of the graphene is very low, and the degree of complete conduction can be achieved in the static conduction process, so that the first graphene conductive layer 11 can have excellent static dissipation performance, and the heat dissipation film 1 has excellent static dissipation performance. Note that the electrostatic on-resistance of the first graphene conductive layer 11 used in the present application is less than 1 Ω, and the electrostatic on-resistance of the adhesive layer used in the related art is greater than 10 Ω.

Moreover, since the conductivity and the heat dissipation performance of the graphene are better than those of a pressure-sensitive adhesive, in the process of forming the heat dissipation film 1, the thickness of the first graphene conductive layer 11 can be smaller, for example, the thickness range of the pressure-sensitive adhesive in the heat dissipation film 1 in the prior art is 15-20 um, and the thickness of the first graphene conductive layer 11 in the present application can be smaller than 5 um. Therefore, the thickness of the heat dissipation film 1 provided by the present application is greatly reduced because the thickness of the first graphene conductive layer 11 of the present application is smaller.

Further, since the graphene may have a typical two-dimensional layered structure, a relatively high van der waals force may be generated between the first graphene conductive layer 11 and the first support layer 12, and then a very strong adhesive force may be generated, thereby ensuring that the first graphene conductive layer 11 and the first support layer 12 have a relatively good connection strength. In addition, when the first graphene conductive layer 11 is bonded to an element such as the display panel 2, which requires heat dissipation, a high van der waals force can be generated between the first graphene conductive layer 11 and the element such as the display panel 2, and the bonding strength between the first graphene conductive layer 11 and the element such as the display panel 2 can be ensured in the same manner. Therefore, the first graphene conductive layer 11 is arranged, so that a strong bonding effect between the heat dissipation film 1 and the display panel 2 can be guaranteed.

Meanwhile, the graphene has excellent mechanical properties, strength and deformability. Thus, the first graphene conductive layer 11 of the present application may have excellent mechanical properties and strength, has a higher flatness, and may be bent and deformed, thereby enabling the heat dissipation film 1 provided by the present disclosure to have excellent mechanical properties and a better flatness, and thus the heat dissipation film 1 provided by the present disclosure may not generate a problem of a film mark of the heat dissipation film 1 caused by a thickness change of the first graphene conductive layer 11.

The first support layer 12 may be located on one side of the first graphene conductive layer 11, and the material of the first support layer 12 may be polyethylene terephthalate. The first support layer 12 is formed of polyethylene terephthalate, which provides excellent support and cushioning effects, and also has better insulation properties. The thickness of the first support layer 12 is not limited in the present disclosure, and may be set according to actual needs.

The first buffer layer 13 may be located on a side of the first support layer 12 away from the first graphene conductive layer 11, and the material of the first buffer layer 13 may be foam, but is not limited thereto, and other materials with buffer performance may also be used to form the first buffer layer 13.

The heat dissipation layer 14 may be located on a side of the first buffer layer 13 away from the first graphene conductive layer 11. The material of the heat dissipation layer 14 may be copper, and specifically, the heat dissipation layer 14 may be copper foil. The use of copper foil as the heat dissipation layer 14 allows the heat dissipation film 1 to have excellent electrical conductivity and heat dissipation properties because the copper foil has excellent electrical conductivity and heat dissipation properties. But not limited thereto, the material of the heat dissipation layer 14 may also be other materials, and may be specifically configured according to actual needs.

Further, a projection of the heat dissipation layer 14 on the first graphene conductive layer 11 may be located within a projection of the first buffer layer 13 on the first graphene conductive layer 11. That is to say, it can be understood that: the size of the heat dissipation layer 14 is smaller than that of the first buffer layer 13. With such an arrangement, when the heat dissipation film 1 is applied to a display device, it can be ensured that the heat dissipation film 1 can be mounted in the display device.

In an embodiment of the present disclosure, the heat dissipation film 1 may further include a plurality of first accommodation holes 15, the plurality of first accommodation holes 15 may be disposed on a surface of the heat dissipation layer 14 away from the first graphene conductive layer 11, and may extend in a direction close to the first graphene conductive layer 11, and each of the first accommodation holes 15 is filled with graphene. Because the electrostatic impedance of graphite alkene is lower, the radiating effect is better to this application can strengthen this heat dissipation membrane 1's static dissipation ability through filling graphite alkene in first accommodation hole 15, and can improve this heat dissipation membrane 1's radiating effect.

In one embodiment of the present disclosure, the plurality of first receiving holes 15 may penetrate the heat dissipation layer 14, the first buffer layer 13, and the first support layer 12, and the first receiving holes 15 may be connected to the first graphene conductive layer 11, and graphene in the first receiving holes 15 may be connected to the first graphene conductive layer 11.

By penetrating the plurality of first accommodating holes 15 through the heat dissipation layer 14, the first buffer layer 13 and the first support layer 12, and enabling the graphene in the first accommodating holes 15 to be connected with the first graphene conductive layer 11, a static dissipation route from the first graphene conductive layer 11 to the graphene in the first accommodating holes 15 to the heat dissipation layer 14 can be formed, so that compared with a mode of only using the heat dissipation layer 14 for static dissipation in the prior art, the static dissipation film 1 provided by the present disclosure has a stronger static dissipation capability.

Further, the cross-sectional shape of the first receiving hole 15 may be a circle, but is not limited thereto, and the cross-sectional shape of the first receiving hole 15 may also be other shapes, such as: rectangle or triangle, etc., can be selected according to actual needs. When the cross-sectional shape of the first receiving hole 15 is circular, the inner diameter of the first receiving hole 15 may be 40um to 100um, for example: 40um, 60um, 80um, 100um, etc.

In one embodiment of the present disclosure, the heat dissipation layer 14 may have an edge region and a middle region. Wherein the edge region may be arranged around the middle region. When the heat dissipation layer 14 is applied to a display device, the edge region may correspond to a non-display region of the display panel 2, and the middle region may correspond to a display region of the display panel 2. The plurality of first receiving holes 15 may be disposed in an edge region of the heat dissipation layer 14 and extend in a direction close to the first graphene conductive layer 11. By arranging the plurality of first accommodating holes 15 in the edge area where heat is dissipated, the heat dissipation capability of the edge area of the heat dissipation film 1 can be enhanced, and when the heat dissipation film 1 is applied to a display device, the first accommodating holes 15 are prevented from affecting the display area, and further affecting the display effect of the display device.

Further, when the cross-sectional shape of the heat dissipation film 1 is a rectangle, the edge region thereof may have four sides, and the plurality of first accommodation holes 15 may be distributed on three sides of the four sides. And, the distance between two adjacent first receiving holes 15 may be 1cm, but is not limited thereto, and the distance between two adjacent first receiving holes 15 is not limited in the disclosure, for example: the distance between two adjacent first receiving holes 15 may also be 0.5cm or 2cm, and may be set according to actual needs, which is within the protection scope of the present disclosure.

As shown in fig. 5, the first accommodation hole 15 provided by the present disclosure may be laser-drilled by a laser. When laser drilling is performed using a laser, a carbonized boundary 6 is formed around the first accommodation hole 15. The carbonized boundary 6 has conductivity, so that the conductivity of the graphene in the first accommodation hole 15 can be enhanced.

In addition, the graphene filled in the first accommodating hole 15 of the present disclosure may be a graphene oxide solution, and the graphene solution may include graphene, a non-polar solvent and an acrylic solvent, so as to enhance the adhesion of the graphene solution, but is not limited thereto, and the first accommodating hole 15 may also be filled with solid graphene, which is within the protection scope of the present disclosure.

Further, the graphene may be filled in the first accommodating hole 15 by using a high-pressure spraying graphene solvent, but is not limited thereto, and other manners may also be used to fill the graphene in the first accommodating hole 15, which is within the protection scope of the present disclosure.

In one embodiment of the present disclosure, as shown in fig. 3, the heat dissipation film 1 may further include: the second accommodation hole 16 and the graphene conductive pillar 17. The second receiving hole 16 may be disposed on a surface of the heat dissipation layer 14 away from the first graphene conductive layer 11 and located in a middle region of the heat dissipation layer 14, and the second receiving hole 16 may extend toward the first graphene conductive layer 11.

The first ends of the graphene conductive pillars 17 may be located in the second accommodating hole 16, and the second ends of the graphene conductive pillars 17 may extend away from the first graphene conductive layer 11. Also, the second end of the graphene conductive pillar 17 may be away from the first graphene conductive layer 11 with respect to the heat dissipation layer 14. It is understood that the graphene conductive pillars 17 are raised with respect to the heat dissipation layer 14.

The second receiving hole 16 may penetrate through the heat dissipation layer 14, the first buffer layer 13, and the first support layer 12, and may be connected to the first graphene conductive layer 11, and a first end of the graphene conductive pillar 17 may be connected to the first graphene conductive layer 11. Thus, the heat dissipation film 1 of the present application may form a static electricity dissipation path from the first graphene conductive layer 11 to the graphene conductive pillar 17. The static electricity dissipation capability of the heat dissipation film 1 of the present invention can be further improved.

The cross-sectional shape of the second receiving hole 16 may be circular, but is not limited thereto, and the cross-sectional shape of the second receiving hole 16 may also be other shapes, such as: rectangle or triangle, etc., can be selected according to actual needs. When the cross-sectional shape of the second receiving hole 16 is circular, the inner diameter of the second receiving hole 16 may be 0.5mm to 2mm, for example: 0.5mm, 1mm, 1.5mm, 2mm, etc., but is not limited thereto, and may be set as needed.

The second receiving hole 16 provided by the present disclosure may also be laser drilled by a laser. When laser drilling is performed using a laser, a carbonized boundary 6 is formed around the second accommodation hole 16. The carbonized boundary 6 has conductivity, so that the conductivity of the graphene conductive pillars 17 in the second accommodation hole 16 can be enhanced.

Further, the cross-sectional shape of the graphene conductive pillars 17 may be the same as the cross-sectional shape of the second accommodation hole 16, and the graphene conductive pillars may fill the entire second accommodation hole 16.

In one embodiment of the present disclosure, the heat dissipation film 1 may further include a second graphene conductive layer 18, and the second graphene conductive layer 18 may be located on a side of the heat dissipation layer 14 away from the first graphene conductive layer 11. And the material of the second graphene conductive layer 18 may be the same as that of the first graphene conductive layer 11. Through setting up second graphite alkene conducting layer 18, can make this heat dissipation membrane 1 form two-layer graphite alkene conducting layer from top to bottom to when further improving heat dissipation membrane 1 static dissipation ability, also can make heat dissipation membrane 1's surface more level and more smooth.

Further, as shown in fig. 1 to 3, the heat dissipation film 1 provided by the present disclosure may further include: a second buffer layer 19 and an adhesive layer 20. The adhesive layer 20 may be located on a side of the first buffer layer 13 away from the first graphene conductive layer 11, and the second buffer layer 19 may be located between the adhesive layer 20 and the heat dissipation layer 14. Therefore, the present disclosure can bond the second buffer layer 19 and the first buffer layer 13 through the adhesive layer 20. The adhesive layer 20 may be a pressure sensitive adhesive, and the material of the second buffer layer 19 may be polyimide, but is not limited thereto.

When the present disclosure is provided with the second buffer layer 19 and the adhesive layer 20, both the first receiving hole 15 and the second receiving hole 16 may penetrate the second buffer layer 19 and the adhesive layer 20.

A second aspect of the present disclosure provides a display device having a superior heat dissipation effect, static dissipation effect, and display effect. Specifically, as shown in fig. 6 to 8, the display device may include: the display panel comprises a display panel 2, a heat dissipation film 1, a second supporting layer 3, a main control circuit board 4 and conductive cloth 5.

The display panel 2 may have a first flat portion 21, a bending portion 22, and a second flat portion 23. The first flat portion 21 may have a light emitting side and a backlight side, the backlight side of the first flat portion 21 may be disposed opposite to the second flat portion 23, and the first flat portion 21 and the second flat portion 23 may be connected by the bending portion 22.

The heat dissipation film 1 may be the heat dissipation film 1 described above, and the first graphene conductive layer 11 may be bonded to the backlight side of the first flattening portion 21. Wherein, the edge area of the heat dissipation film 1 corresponds to the non-display area of the first flat portion 21, and the middle area of the heat dissipation film 1 corresponds to the display area of the first flat portion 21.

The second support layer 3 may be located on a side of the heat dissipation layer 14 away from the first graphene conductive layer 11, and attached to a side of the second flat portion 23 close to the first graphene conductive layer 11. That is to say, it can be understood that: the second support layer 3 is located between the heat spreading film 1 and the second flat portion 23. And the second supporting layer 3 can be used for supporting the heat dissipation film 1 and the second flat portion 23, and can also shield external interference signals.

The projection of the second support layer 3 on the first graphene conductive layer 11 may be located within the projection of the heat dissipation layer 14 on the first graphene conductive layer 11. That is to say, it can be understood that: the size of the second support layer 3 is smaller than the size of the heat spreading layer 14.

Further, the second support layer 3 may be located in an edge region of the heat dissipation layer 14 on a side close to the bent portion 22. Also, when the second support layer 3 is located in the edge region of the heat dissipation layer 14 on the side close to the bent portion 22, the plurality of first receiving holes 15 may be disposed in the remaining edge region of the heat dissipation layer 14 except the edge region on the side close to the bent portion 22. It is understood that the heat dissipation film 1 of the present disclosure may not be provided with the first receiving holes 15 at a side of the heat dissipation layer 14 where the second support layer 3 is provided.

Meanwhile, the first accommodating holes 15 are located in the edge area of the heat dissipation layer 14, so that the heat dissipation capability of the periphery of the heat dissipation film 1 can be improved, the heat dissipation capability of the edge of the display device can be increased, and the problem of poor heat dissipation capability of the edge of the display device is solved.

The main control circuit board 4 may be located on a side of the second flat portion 23 away from the first flat portion 21, and may extend in a direction away from the bending portion 22. When the heat dissipation film 1 has the graphene conductive posts 17, the second ends of the graphene conductive posts 17 can be attached to the main control circuit board 4 to form electrostatic dissipation channels from the first graphene conductive layer 11 to the graphene conductive posts 17 to the main control circuit board 4, so that the electrostatic dissipation channels from the graphene in the first graphene conductive layer 11 to the first accommodating hole 15 to the heat dissipation layer 14 can be matched with each other, and the electrostatic dissipation capability of the display device is further enhanced.

The main control circuit board 4 may be a flexible circuit board, as shown in fig. 9, and may have a first copper exposing area 41 and a second copper exposing area 42. The second end of the graphene conductive pillar 17 may be attached to the first exposed copper region 41, so as to conduct the static electricity of the display panel 2 to the first exposed copper region 41.

The conductive cloth 5 may be located between the main control circuit board 4 and the heat dissipation film 1, and attached to the middle regions of the main control circuit board 4 and the heat dissipation film 1. Thus, the present disclosure can also dissipate static electricity through the conductive cloth 5. When the main control circuit board 4 has the second copper exposing area 42, the conductive cloth 5 may be attached to the second copper exposing area 42 of the main control circuit board 4 to conduct the static electricity to the second copper exposing area 42.

Further, the heat dissipation film 1 of the present disclosure has the graphene conductive pillars 17. Accordingly, the size of the conductive cloth 5 of the present disclosure is smaller than that of the conductive cloth of the related art, and specifically, the size of the conductive cloth 5 of the present disclosure may be equivalent to two thirds of that of the conductive cloth of the related art, so as to reserve the arrangement area of the graphene conductive pillar 17 provided by the present disclosure.

In one embodiment of the present disclosure, as shown in fig. 6 to 8, the display device may further include a base film 7, the base film 7 may be located between the backlight side of the first flat portion 21 and the heat dissipation film 1, static electricity of the display panel 2 may be accumulated in the base film 7, and the heat dissipation film 1 may dissipate the static electricity accumulated in the base film 7 through the respective static electricity dissipation routes.

Therefore, the display device provided by the present disclosure can have better static dissipation capability and heat dissipation capability because the heat dissipation film 1 described above is used. Meanwhile, the heat dissipation film 1 has good mechanical properties and flatness, so that the film printing phenomenon of the heat dissipation film 1 in the display device can be prevented, and the display effect of the display device can be effectively improved.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. A heat dissipating film, comprising:

a first graphene conductive layer;

2. The heat dissipating film of claim 1, further comprising:

3. The heat dissipating film according to claim 2, wherein the plurality of first receiving holes penetrate the heat dissipating layer, the first buffer layer, and the first support layer, and the first receiving holes are connected to the first graphene conductive layer, and graphene in the first receiving holes is connected to the first graphene conductive layer.

4. The heat spreading film of claim 3, wherein the heat spreading layer has an edge region and a middle region, the edge region being disposed around the middle region,

5. The heat dissipating film of claim 4, further comprising:

6. The heat dissipating film according to claim 4, wherein the first receiving hole has a circular cross-sectional shape, and an inner diameter of the first receiving hole is 40 to 100 μm.

7. The heat dissipating film of claim 5, further comprising:

8. A display device, comprising:

the heat dissipation film as claimed in any one of claims 1 to 7, wherein the first graphene conductive layer is bonded to the backlight side of the first flat portion;

9. The display device according to claim 8, wherein the heat dissipation film has a graphene conductive pillar, and a second end of the graphene conductive pillar is attached to the main control circuit board.

10. The display device according to claim 8, wherein the second supporting layer is located in an edge region of the heat dissipation layer on a side close to the bending portion;