JP2011044360A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2011044360A
JP2011044360A JP2009192411A JP2009192411A JP2011044360A JP 2011044360 A JP2011044360 A JP 2011044360A JP 2009192411 A JP2009192411 A JP 2009192411A JP 2009192411 A JP2009192411 A JP 2009192411A JP 2011044360 A JP2011044360 A JP 2011044360A
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light emitting
emitting device
power supply
emitting element
supply circuit
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JP5308274B2 (en
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Shinichi Anami
真一 阿南
Juji Sumiyama
重次 住山
Motohiro Saimi
元洋 齋見
Hideji Kawachi
秀治 河地
Osamu Tanahashi
理 棚橋
Satoshi Fukano
智 深野
Shintaro Hayashi
真太郎 林
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Panasonic Electric Works Co Ltd
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Panasonic Electric Works Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/87Arrangements for heating or cooling

Abstract

<P>PROBLEM TO BE SOLVED: To install a power supply circuit for supplying electric power to a surface light emitting element so as to be manufactured with a small area at low cost, in a light emitting device having a surface light emitting element. <P>SOLUTION: The light emitting device 1 includes: the surface light emitting element 4 having a light emitting layer 43 and electrodes 41, 46 sandwiching the light emitting layer; a transparent substrate 5 on which the surface light emitting element 4 is placed; and a sealing member 6 which seals the surface light emitting element 4. The light emitting device 1 further includes the power supply circuit 9 and a wiring pattern 10 which supply electric power to the surface light emitting element 4, and the power supply circuit 9 and the wiring pattern 10 are formed on part of the sealing member 6. As a result, part of the sealing member 6 is also used for forming the power supply circuit 9, and the power supply circuit 9 is manufactured with the small area at low cost. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、面状発光素子を有する発光装置に関する。   The present invention relates to a light emitting device having a planar light emitting element.

従来から、平面状の光源体である面状発光素子としてEL(エレクトロルミネッセンス)発光素子が知られており、特に有機EL発光素子の開発が進んでいる。有機EL発光素子は、陽極と陰極との間に有機化合物を含む有機薄膜が挟持されている。そして、陰極から電子、陽極からホール(正孔)が有機薄膜に注入され、注入された電子とホールが有機薄膜の発光層で結合して有機化合物の電子状態が励起状態となった励起子が発生し、励起子が基底状態に戻るときの発光が有機EL発光素子の外部に取り出される。有機EL発光素子は、直流電圧が供給されて発光するため、交流の商用電源を直流に変換する電源回路が必要である。   2. Description of the Related Art Conventionally, EL (electroluminescence) light-emitting elements are known as planar light-emitting elements that are planar light sources, and particularly organic EL light-emitting elements have been developed. In the organic EL light emitting device, an organic thin film containing an organic compound is sandwiched between an anode and a cathode. Then, electrons from the cathode and holes (holes) from the anode are injected into the organic thin film, and the injected electrons and holes are combined in the light emitting layer of the organic thin film, and the exciton in which the electronic state of the organic compound is in an excited state. Light emitted when the exciton is returned to the ground state is extracted outside the organic EL light emitting element. Since the organic EL light emitting element emits light when supplied with a direct current voltage, a power supply circuit for converting an alternating commercial power source into direct current is necessary.

照明器具は、その使用形態や用途によって光出力(光束)や発光部の形状等の要求仕様が異なる。照明器具に組み込まれる有機EL発光素子は、照明器具に対する多くの要求仕様に合わせて多数種類を設計生産すると、設計労力や生産コストが過大となる。そこで、汎用性のある有機EL発光素子を組み合わせて照明器具に組み込むことにより、照明器具を要求仕様に適合させることが考えられる。この場合、組み合わせる有機EL発光素子の数や接続状態によって、有機EL発光素子に電力を供給する電源の仕様が異なるため、異なる照明器具における電源の共通化が困難となる。このため、各有機EL発光素子用に個別に電源を設けることが考えられる。   The luminaires have different required specifications such as light output (light flux) and shape of the light emitting part depending on the usage and application. When many types of organic EL light-emitting elements incorporated in a lighting fixture are designed and produced in accordance with many required specifications for the lighting fixture, design labor and production cost become excessive. Therefore, it is conceivable that the lighting fixture is adapted to the required specifications by combining a versatile organic EL light emitting element and incorporating it into the lighting fixture. In this case, since the specifications of the power source for supplying power to the organic EL light-emitting elements are different depending on the number of organic EL light-emitting elements to be combined and the connection state, it is difficult to share power sources in different lighting fixtures. For this reason, it is conceivable to individually provide a power source for each organic EL light emitting element.

各有機EL発光素子用の個別の電源は、薄型の有機EL発光素子に並設するため、薄型であることが求められる。また、この電源と有機EL発光素子間の電気的接続も薄型であることが求められる。このため、例えば、電源をプリント基板を用いて作成し、この電源と有機EL発光素子間をFPC(フレキシブルプリント基板)で接続する形態が考えられる。   An individual power source for each organic EL light emitting element is required to be thin in order to be juxtaposed with a thin organic EL light emitting element. Also, the electrical connection between the power source and the organic EL light emitting element is required to be thin. For this reason, for example, a power supply is created using a printed circuit board, and this power supply and an organic EL light emitting element are connected by FPC (flexible printed circuit board).

しかし、有機EL発光素子と電源を並設した照明器具は、非発光部である電源の面積が大きくなって、見栄えが良くなく、照明器具のサイズ(面積)が大きくなる。また、電源と有機EL発光素子が別体であるので、それらの間の接続部分は、応力が発生し、応力に耐える信頼性確保が難しい。応力の発生を抑えるため、電源と有機EL発光素子を相互に固定する構造が考えられるが、その固定構造によって照明器具が高コストとなり、固定構造自体のサイズによって照明器具が大型化する。   However, a lighting fixture in which an organic EL light emitting element and a power source are arranged side by side has a large area of a power source that is a non-light-emitting portion, so that it does not look good, and the size (area) of the lighting fixture increases. In addition, since the power source and the organic EL light emitting element are separate bodies, stress is generated at the connection portion between them, and it is difficult to ensure reliability to withstand the stress. In order to suppress the generation of stress, a structure in which the power source and the organic EL light emitting element are fixed to each other is conceivable. However, the fixing structure increases the cost of the lighting fixture, and the size of the fixing structure increases the size of the lighting fixture.

また、電源を有機EL発光素子の背面に設け、有機EL発光素子間をFPCで接続する形態が知られており(例えば、特許文献1参照)、この接続形態を用いれば、有機EL発光素子と電源を並設するよりも照明器具が小型化される。しかし、この接続形態の照明器具は、有機EL発光素子の背面に電源を固定するための部品が必要になるため、部品点数が増加し、コストが増大する。   In addition, a configuration in which a power source is provided on the back surface of the organic EL light emitting element and the organic EL light emitting elements are connected by FPC is known (for example, see Patent Document 1). The luminaire can be made smaller than when power supplies are juxtaposed. However, since the lighting fixture of this connection form requires a component for fixing the power source on the back surface of the organic EL light emitting element, the number of components increases and the cost increases.

特開2006−323144号公報JP 2006-323144 A

本発明は、上記問題を解決するものであり、面状発光素子を有する発光装置において、面状発光素子に給電する電源回路を小面積かつ低コストとなるように設けることを目的とする。   An object of the present invention is to solve the above-described problem, and an object of the present invention is to provide a power supply circuit for supplying power to a planar light emitting element in a light emitting device having a planar light emitting element so as to reduce the area and cost.

上記目的を達成するために請求項1の発明は、発光層と、該発光層を挟持する電極と、を有する面状発光素子と、前記面状発光素子を載置する透明基板と、前記面状発光素子を封止する封止部材と、を備えた発光装置であって、前記面状発光素子に給電する電源回路及び配線パターンをさらに備え、前記電源回路及び配線パターンが前記封止部材の一部に実装されているものである。   In order to achieve the above object, the invention of claim 1 includes a planar light emitting device having a light emitting layer and an electrode sandwiching the light emitting layer, a transparent substrate on which the planar light emitting device is mounted, and the surface. A sealing member for sealing the planar light emitting element, further comprising a power supply circuit and a wiring pattern for supplying power to the planar light emitting element, wherein the power supply circuit and the wiring pattern are provided on the sealing member. It is implemented in part.

請求項2の発明は、請求項1に記載の発光装置において、前記封止部材は、前記透明基板の周縁より延出された部分を備え、発光装置の外部から前記電源回路に電力の供給を受ける端子部が前記延出部分に設けられているものである。   According to a second aspect of the present invention, in the light emitting device according to the first aspect, the sealing member includes a portion extending from a peripheral edge of the transparent substrate, and supplies power to the power supply circuit from the outside of the light emitting device. The terminal part to receive is provided in the said extension part.

請求項3の発明は、請求項1又は請求項2に記載の発光装置において、前記封止部材は、絶縁材料と、この絶縁材料上に設けられ、前記面状発光素子の温度分布を均一化するための面状の金属材料と、を有し、前記電源回路と配線パターンは、前記絶縁材料に実装されているものである。   According to a third aspect of the present invention, in the light emitting device according to the first or second aspect, the sealing member is provided on an insulating material and the insulating material, and the temperature distribution of the planar light emitting element is made uniform. The power supply circuit and the wiring pattern are mounted on the insulating material.

請求項1の発明によれば、面状発光素子を封止する封止部材の一部が電源回路の実装に兼用されるので、電源回路を面状発光素子と一体的に構成することができ、従って、小面積となり、また、電源回路を固定する別の部材が不要となって、低コストとなる。   According to the first aspect of the present invention, since a part of the sealing member for sealing the planar light emitting element is also used for mounting the power supply circuit, the power supply circuit can be configured integrally with the planar light emitting element. Therefore, the area is reduced, and a separate member for fixing the power supply circuit is not required, and the cost is reduced.

請求項2の発明によれば、封止部材の延出された部分に設けられた端子部を、電力の供給を受けるため及び発光装置の固定のために兼用することにより、発光しない部分(非発光部)の面積を小さくすることができる。また、複数の発光装置を配列して照明器具を構成する場合、非発光部となる端子部を重ね合わせることにより、照明器具の非発光部の面積を小さくすることができる。   According to the second aspect of the present invention, the terminal portion provided in the extended portion of the sealing member is also used for receiving power supply and fixing the light emitting device, so that the portion that does not emit light (non-lighting) The area of the light emitting part) can be reduced. Further, when a lighting fixture is configured by arranging a plurality of light emitting devices, the area of the non-light emitting portion of the lighting fixture can be reduced by superimposing the terminal portions serving as the non-light emitting portions.

請求項3の発明によれば、面状発光素子は、金属材料によって温度分布が均一化されるので、温度差による発光ムラが抑えられる。また、電源回路と配線パターンは、絶縁材料によって金属材料から絶縁されると共に、電源回路は、その発熱が金属材料に伝導して放熱されるので、温度上昇が抑えられる。   According to the invention of claim 3, since the temperature distribution of the planar light emitting element is made uniform by the metal material, the light emission unevenness due to the temperature difference is suppressed. In addition, the power supply circuit and the wiring pattern are insulated from the metal material by the insulating material, and the power supply circuit dissipates heat by conduction of heat generated in the metal material, so that the temperature rise can be suppressed.

本発明の第1の実施形態に係る発光装置を有する照明器具の斜視図。The perspective view of the lighting fixture which has a light-emitting device which concerns on the 1st Embodiment of this invention. 同照明器具の分解斜視図。The exploded perspective view of the lighting fixture. 同照明器具の発光装置を光が取り出される側の反対側から見た平面図。The top view which looked at the light-emitting device of the lighting fixture from the opposite side to the side from which light is taken out. 図3のA−A線断面図。AA line sectional view of Drawing 3. 同照明器具の平面図。The top view of the lighting fixture. 図5のB−B線断面図。BB sectional drawing of FIG. 本発明の第2の実施形態に係る照明器具の斜視図。The perspective view of the lighting fixture which concerns on the 2nd Embodiment of this invention. 同照明器具の分解斜視図。The exploded perspective view of the lighting fixture. 同照明器具の平面図。The top view of the lighting fixture. 図9のC−C線断面図。CC sectional view taken on the line of FIG. 本発明の第3の実施形態に係る発光装置の断面図。Sectional drawing of the light-emitting device which concerns on the 3rd Embodiment of this invention. 本発明の第4の実施形態に係る発光装置の断面図。Sectional drawing of the light-emitting device which concerns on the 4th Embodiment of this invention. 本発明の第5の実施形態に係る発光装置の断面図。Sectional drawing of the light-emitting device which concerns on the 5th Embodiment of this invention. 本発明の第6の実施形態に係る発光装置の断面図。Sectional drawing of the light-emitting device which concerns on the 6th Embodiment of this invention.

(第1の実施形態)
本発明の第1の実施形態に係る発光装置を有する照明器具を図1乃至図6を参照して説明する。図1に示されるように、面状の発光装置1と、発光装置1が固定される板状の照明器具本体21と、取付金具3によって照明器具2が構成される。照明器具2からの照明光は、同図において上方向に照射される。発光装置1は、例えば数十mm(ミリメートル)〜数百mm角程度の平面視で略矩形とされる。照明器具2は、壁面や天井等に設置される。図2に示されるように、発光装置1は、その端子部11が鋲状の取付金具3によって照明器具本体21に固定される。
(First embodiment)
A lighting fixture having a light emitting device according to a first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, a lighting fixture 2 is configured by a planar light emitting device 1, a plate-like lighting fixture body 21 to which the light emitting device 1 is fixed, and a mounting bracket 3. Illumination light from the luminaire 2 is irradiated upward in FIG. The light emitting device 1 has a substantially rectangular shape in a plan view of about several tens mm (millimeters) to several hundred mm square, for example. The lighting fixture 2 is installed on a wall surface, a ceiling, or the like. As shown in FIG. 2, the light emitting device 1 has a terminal portion 11 fixed to the luminaire main body 21 by a hook-shaped mounting bracket 3.

図3及び図4に示されるように、発光装置1は、面状発光素子4(以下、発光素子という)と、発光素子4を載置する透明基板5と、発光素子4を封止する封止部材6と、保護膜7と、吸湿剤8と、発光素子4に給電する電源回路9及び配線パターン10とを備える。電源回路9及び配線パターン10は、封止部材6の一部に実装される。発光素子4からの発光は、図4の下方向に照明光として取り出される。   As shown in FIGS. 3 and 4, the light emitting device 1 includes a planar light emitting element 4 (hereinafter referred to as a light emitting element), a transparent substrate 5 on which the light emitting element 4 is placed, and a seal that seals the light emitting element 4. A stop member 6, a protective film 7, a hygroscopic agent 8, and a power supply circuit 9 and a wiring pattern 10 for supplying power to the light emitting element 4 are provided. The power supply circuit 9 and the wiring pattern 10 are mounted on a part of the sealing member 6. Light emitted from the light emitting element 4 is extracted as illumination light downward in FIG.

発光素子4は、有機EL素子であり、透明基板5上に、陽極41、ホール輸送層42、発光層43、電子輸送層44、電子注入層45、陰極46の順に形成される。ホール輸送層42、発光層43、電子輸送層44、及び電子注入層45は、例えば真空蒸着等によって成膜される総厚100〜200nm(ナノメートル)程度の有機薄膜であり、図4において厚み方向に拡大して示している。この有機薄膜は、電極である陽極41と陰極46とによって挟持されている。   The light emitting element 4 is an organic EL element, and is formed on the transparent substrate 5 in the order of an anode 41, a hole transport layer 42, a light emitting layer 43, an electron transport layer 44, an electron injection layer 45, and a cathode 46. The hole transport layer 42, the light emitting layer 43, the electron transport layer 44, and the electron injection layer 45 are organic thin films having a total thickness of about 100 to 200 nm (nanometers) formed by, for example, vacuum deposition or the like. Enlarged in the direction. This organic thin film is sandwiched between an anode 41 and a cathode 46 which are electrodes.

発光素子4の各層の材料は、例えば、陽極41がITO(酸化インジウムスズ)、ホール輸送層42がアリールアミン類等、発光層43がアルミ錯体(Alq)等、電子輸送層44がオキソジアゾール類等、電子注入層45がリチウム錯体等、陰極46がアルミニウムである。ホール輸送層42、電子輸送層44、及び電子注入層45は、発光層43の発光効率を向上する。陰極46は、電源回路9に接続する部分を設けるため、一部が透明基板5上に形成される。透明基板5上の陽極41と陰極46の間は、絶縁層48によって互いに絶縁される。また、陽極41の表面の一部には、補助電極411が設けられる。補助電極411は、低抵抗であり、陽極41の電位を均一化する。 The material of each layer of the light emitting element 4 is, for example, that the anode 41 is ITO (indium tin oxide), the hole transport layer 42 is arylamines, the light emitting layer 43 is aluminum complex (Alq 3 ), and the electron transport layer 44 is oxodioxide. In the case of azoles, the electron injection layer 45 is a lithium complex, and the cathode 46 is aluminum. The hole transport layer 42, the electron transport layer 44, and the electron injection layer 45 improve the light emission efficiency of the light emitting layer 43. A part of the cathode 46 is formed on the transparent substrate 5 in order to provide a part connected to the power supply circuit 9. The anode 41 and the cathode 46 on the transparent substrate 5 are insulated from each other by an insulating layer 48. An auxiliary electrode 411 is provided on a part of the surface of the anode 41. The auxiliary electrode 411 has a low resistance and makes the potential of the anode 41 uniform.

発光層43は、透明な陽極41と透明基板5とを透過して大気中に光を出力する。透明基板5は、ガラスから成り、光取り出し側の面に光取り出しフィルム51が貼設される。光取り出しフィルム51は、表面に微細な凹凸を有する樹脂フィルム、又は微粒子状の光拡散剤が含有された樹脂フィルム等であり、大気との界面における全反射を抑えて光取り出し効率を高める。陰極46は、発光層43からの発光を透明基板5側に反射し、光取り出し効率を高める。   The light emitting layer 43 passes through the transparent anode 41 and the transparent substrate 5 and outputs light into the atmosphere. The transparent substrate 5 is made of glass, and a light extraction film 51 is attached to a surface on the light extraction side. The light extraction film 51 is a resin film having fine irregularities on its surface, a resin film containing a fine particle light diffusing agent, or the like, and suppresses total reflection at the interface with the atmosphere to increase light extraction efficiency. The cathode 46 reflects light emitted from the light emitting layer 43 to the transparent substrate 5 side, and improves light extraction efficiency.

封止部材6は、絶縁基材61と封止材62とから成り、発光素子4と電源回路9を気密封止する。絶縁基材61は、柔軟性を有する薄いフィルム状の絶縁材料から成り、例えばポリイミドフィルムである。ポリイミドフィルムは、FPC等に一般的に用いられている厚さ0.数mm程度の絶縁材料である。封止材62は、例えばエポキシ樹脂から成り、形状を自在に形成することができる。絶縁基材61に通気性及び透湿性の低いポリイミドフィルム等を用いることにより、封止材62は、主に絶縁基材61の周辺部分に用いて使用量を低減することができる。   The sealing member 6 includes an insulating base 61 and a sealing material 62 and hermetically seals the light emitting element 4 and the power supply circuit 9. The insulating base 61 is made of a thin film-like insulating material having flexibility, and is, for example, a polyimide film. The polyimide film has a thickness of 0. 0 which is generally used for FPC and the like. It is an insulating material of about several mm. The sealing material 62 is made of, for example, an epoxy resin and can be freely formed in shape. By using a polyimide film or the like having low air permeability and moisture permeability for the insulating base 61, the sealing material 62 can be used mainly for the peripheral portion of the insulating base 61 to reduce the amount of use.

絶縁基材61は、透明基板5の周縁より延出された部分を備え、その延出部分に端子部11が設けられる。本実施形態では、端子部11は、発光装置1の周縁の四隅より延出された部分に設けられる。端子部11は、発光装置1の外部から電力の供給を受けるものであり、配線パターン10によって電源回路9に接続される。電源回路9は、複数の端子部11のうち、少なくとも2つの端子部11に電気的に接続される。接続の信頼性を高めるため、全ての端子部11を電源回路9に接続してもよい。   The insulating base 61 includes a portion extending from the peripheral edge of the transparent substrate 5, and the terminal portion 11 is provided in the extending portion. In the present embodiment, the terminal portion 11 is provided at a portion extending from the four corners of the periphery of the light emitting device 1. The terminal unit 11 is supplied with power from the outside of the light emitting device 1 and is connected to the power supply circuit 9 by the wiring pattern 10. The power supply circuit 9 is electrically connected to at least two terminal portions 11 among the plurality of terminal portions 11. In order to improve the connection reliability, all the terminal portions 11 may be connected to the power supply circuit 9.

保護膜7は、陰極46上に形成され、吸湿剤8は、保護膜7上に設けられ、封止部材6は、吸湿剤8の上に設けられる。封止材62と吸湿剤8との間は、エポキシ樹脂系等の接着剤63によって接着される。吸湿剤8は、酸化カルシウム(CaO)又は酸化バリウム(BaO)等から成り、封止部材6によって気密が保たれた部分に配設され、水分による発光素子4の劣化を防止する。保護膜7は、有機化合物等から成り、吸湿剤8から陰極46を保護する。   The protective film 7 is formed on the cathode 46, the hygroscopic agent 8 is provided on the protective film 7, and the sealing member 6 is provided on the hygroscopic agent 8. The sealing material 62 and the hygroscopic agent 8 are bonded by an adhesive 63 such as an epoxy resin. The hygroscopic agent 8 is made of calcium oxide (CaO), barium oxide (BaO), or the like, and is disposed in a portion that is kept airtight by the sealing member 6, and prevents deterioration of the light emitting element 4 due to moisture. The protective film 7 is made of an organic compound or the like, and protects the cathode 46 from the hygroscopic agent 8.

電源回路9は、AC/DC回路又はDC/DC回路であり、その少なくとも一部が、絶縁基材61に実装される。電源回路9のDC出力は、電源入力部47から発光素子4に入力される。なお、絶縁基材61は、適当な特性を有して電源回路9の少なくとも一部が実装できる材料であれば、ポリイミドフィルムでなくてもよい。   The power supply circuit 9 is an AC / DC circuit or a DC / DC circuit, and at least a part thereof is mounted on the insulating base 61. The DC output of the power supply circuit 9 is input from the power supply input unit 47 to the light emitting element 4. The insulating substrate 61 may not be a polyimide film as long as it has appropriate characteristics and can be mounted on at least a part of the power supply circuit 9.

配線パターン10は、銅箔等から成る導電性パターンであり、絶縁基材61上に形成される。電源回路9は、電源回路素子91を有する。電源回路素子91は、配線パターン10の一部によって配線される。   The wiring pattern 10 is a conductive pattern made of copper foil or the like, and is formed on the insulating substrate 61. The power supply circuit 9 has a power supply circuit element 91. The power circuit element 91 is wired by a part of the wiring pattern 10.

電源入力部47は、発光素子4の電極41、46上に設けられ、電気接続部92を介して電源回路9の出力側に接続される。電気接続部92は、アルミワイヤ等であり、超音波接合によって接続され、封止材62によって保護される。   The power supply input unit 47 is provided on the electrodes 41 and 46 of the light emitting element 4, and is connected to the output side of the power supply circuit 9 through the electrical connection unit 92. The electrical connection portion 92 is an aluminum wire or the like, is connected by ultrasonic bonding, and is protected by the sealing material 62.

上記のように構成された発光装置1は、発光素子4を封止する封止部材6の一部である絶縁基材61が電源回路9の実装に兼用されるので、電源回路9を発光素子4と一体的に構成することができ、従って、小面積となり、また、電源回路9を固定する別の部材が不要となって、低コストとなる。   In the light emitting device 1 configured as described above, since the insulating base 61 that is a part of the sealing member 6 that seals the light emitting element 4 is also used for mounting the power supply circuit 9, the power supply circuit 9 is used as the light emitting element. 4, so that the area is small, and a separate member for fixing the power supply circuit 9 is not required, resulting in a low cost.

図5及び図6に示されるように、端子部11は、取付金具3によって照明器具本体21に固定される。取付金具3は、取付用部材と導電部材とを兼ね、金属を鋲状に形成したものであり、鋲としての頭部31と軸部32とを有し、頭部31の下面側にばね座金33が套設され、軸部32の一部表面に接触抵抗を低減するための銅等から成る接触部材34が設けられる。   As shown in FIGS. 5 and 6, the terminal portion 11 is fixed to the luminaire main body 21 by the mounting bracket 3. The mounting bracket 3 serves as both a mounting member and a conductive member, and is formed of a metal in a bowl shape. The mounting bracket 3 has a head portion 31 and a shaft portion 32 as a flange, and a spring washer on the lower surface side of the head portion 31. A contact member 34 made of copper or the like for reducing contact resistance is provided on a partial surface of the shaft portion 32.

端子部11は、取付金具3の軸部32を挿通するための挿通穴64が設けられた絶縁基材61と、絶縁基材61の両面に設けられた配線パターン10と、絶縁基材61に貫設されたビア12とを有する。ビア12は、絶縁基材61の両面に設けられた配線パターン10を導通する。   The terminal portion 11 is formed on the insulating base 61 provided with an insertion hole 64 for inserting the shaft portion 32 of the mounting bracket 3, the wiring pattern 10 provided on both surfaces of the insulating base 61, and the insulating base 61. And vias 12 extending therethrough. The via 12 conducts the wiring pattern 10 provided on both surfaces of the insulating base 61.

照明器具本体21は、絶縁基材61の挿通穴64に対応する位置に穴部22を有し、内部に電線23を有する。電線23は、外部の商用電源から発光装置1に電力を供給するために設けられる。照明器具本体21内に商用電源を降圧する電源を設け、その電源から電線23を介して電力を供給してもよい。電線23の端部は、穴部22の内壁に設けられた給電接触部24に接続される。給電接触部24は、板ばね状の金属部材である。   The luminaire main body 21 has a hole 22 at a position corresponding to the insertion hole 64 of the insulating base 61 and an electric wire 23 inside. The electric wire 23 is provided in order to supply electric power to the light-emitting device 1 from an external commercial power source. A power source for stepping down the commercial power source may be provided in the luminaire main body 21, and power may be supplied from the power source via the electric wire 23. An end portion of the electric wire 23 is connected to a feeding contact portion 24 provided on the inner wall of the hole portion 22. The feeding contact portion 24 is a leaf spring-shaped metal member.

そして、取付金具3の軸部32が、絶縁基材61の挿通穴64に挿通され、照明器具本体21の穴部22に嵌合される。端子部11は、取付金具3の頭部31によって照明器具本体21の表面に押し付けられて固定される。照明器具本体21から発光装置1への電流経路は、破線矢印で示されるように、電線23、給電接触部24、接触部材34、軸部32、頭部31、ばね座金33、配線パターン10となる。この電流経路により、発光装置1の電源回路9に電力が供給される。   Then, the shaft portion 32 of the mounting bracket 3 is inserted into the insertion hole 64 of the insulating base material 61 and fitted into the hole portion 22 of the lighting fixture main body 21. The terminal portion 11 is pressed against the surface of the luminaire main body 21 by the head 31 of the mounting bracket 3 and fixed. The current path from the luminaire main body 21 to the light emitting device 1 includes the electric wire 23, the power supply contact portion 24, the contact member 34, the shaft portion 32, the head portion 31, the spring washer 33, and the wiring pattern 10, as indicated by broken line arrows. Become. Power is supplied to the power supply circuit 9 of the light emitting device 1 through this current path.

このように、発光装置1は、絶縁基材61の延出された部分に設けられた端子部11を、電力の供給を受けるため及び発光装置1の固定のために兼用することにより、発光しない部分の面積を小さくすることができる。また、発光装置1を有する照明器具2は、発光装置1を異なる光出力のものに取り替えることにより、照明器具本体21を取り替えることなく、光出力の異なる器具に容易に変更される。   As described above, the light emitting device 1 does not emit light by using the terminal portion 11 provided in the extended portion of the insulating base 61 for receiving power supply and fixing the light emitting device 1. The area of the portion can be reduced. Moreover, the lighting fixture 2 which has the light-emitting device 1 is easily changed into the fixture with a different light output, without replacing the lighting fixture main body 21, by replacing the light-emitting device 1 with one having a different light output.

(第2の実施形態)
本発明の第2の実施形態に係る照明器具を図7乃至図9を参照して説明する。第1の実施形態と同等の箇所には同じ符号を付している。図7に示されるように、本実施形態の照明器具102は、第1の実施形態と同じ構成の発光装置1と、その発光装置1を複数配列して固定する1つの照明器具本体121とを有する。照明器具102に配列される発光装置1の数は、照明器具102への要求仕様に基づいて決められる。図8に示されるように、互いに隣り合う発光装置1は、それぞれの端子部11が重ねられ、取付金具3によって照明器具本体121に固定される。ここで、端子部11を重ねる上下の順序は限定されない。
(Second Embodiment)
A lighting apparatus according to a second embodiment of the present invention will be described with reference to FIGS. The same code | symbol is attached | subjected to the location equivalent to 1st Embodiment. As shown in FIG. 7, the lighting fixture 102 of the present embodiment includes a light emitting device 1 having the same configuration as that of the first embodiment, and a single lighting fixture main body 121 that fixes and arranges a plurality of the light emitting devices 1. Have. The number of light-emitting devices 1 arranged in the lighting fixture 102 is determined based on the required specifications for the lighting fixture 102. As shown in FIG. 8, the light emitting devices 1 that are adjacent to each other are fixed to the luminaire main body 121 by the mounting bracket 3 with the respective terminal portions 11 overlapped. Here, the upper and lower order of overlapping the terminal portions 11 is not limited.

図9に示されるように、複数の発光装置1が照明器具本体121に取付られて照明器具102が構成される。端子部11は、柔軟性を有する薄いフィルム状の絶縁基材61を用いて構成されることから、図10に示されるように、複数の端子部11が容易に重ね合わされる。取付金具3の軸部32が、複数の端子部11の挿通穴64に挿通され、照明器具本体121の穴部22に嵌合される。重ねられた端子部11は、取付金具3の頭部31によって照明器具本体121の表面に押し付けられて固定される。第1の実施形態と同様に、照明器具本体121から発光装置1の電源回路9に電力が供給される。   As shown in FIG. 9, a plurality of light emitting devices 1 are attached to a luminaire main body 121 to constitute a luminaire 102. Since the terminal part 11 is comprised using the thin film-like insulating base material 61 which has a softness | flexibility, as FIG. 10 shows, the several terminal part 11 is easily overlaid. The shaft portion 32 of the mounting bracket 3 is inserted into the insertion holes 64 of the plurality of terminal portions 11 and fitted into the hole portions 22 of the lighting fixture main body 121. The overlapped terminal portion 11 is pressed and fixed to the surface of the lighting fixture main body 121 by the head 31 of the mounting bracket 3. As in the first embodiment, power is supplied from the lighting fixture main body 121 to the power supply circuit 9 of the light emitting device 1.

このように、複数の発光装置1を配列して照明器具102を構成する場合、非発光部となる端子部11を重ね合わせることにより、照明器具102の非発光部の面積を小さくすることができる。また、端子部11の重ね合わせによって、複数の発光装置1を相互の隙間を小さくして配列することができる。   Thus, when the lighting fixture 102 is configured by arranging a plurality of light emitting devices 1, the area of the non-light emitting portion of the lighting fixture 102 can be reduced by overlapping the terminal portions 11 serving as the non-light emitting portions. . In addition, by overlapping the terminal portions 11, the plurality of light emitting devices 1 can be arranged with a small gap therebetween.

(第3の実施形態)
本発明の第3の実施形態に係る発光装置を図11を参照して説明する。本実施形態の発光装置103は、第1の実施形態における発光装置1と同様の構成を有し、アルミワイヤ等から成る電気接続部に替えて、絶縁基材61の一部を湾曲させて、絶縁基材61上の配線パターン10を電源入力部47に接続することにより、電源回路9から発光素子4に給電している。絶縁基材61は、柔軟性を有するフィルム状であるので、湾曲させた構成が可能となる。電源入力部47における配線パターン10の接続には、例えばACF(異方導電フィルム)接続等が用いられる。この構成により、本実施形態の発光装置103は、電源回路9と発光素子4とを接続する部品の点数が削減され、低コストとなる。
(Third embodiment)
A light emitting device according to a third embodiment of the present invention will be described with reference to FIG. The light emitting device 103 of the present embodiment has the same configuration as that of the light emitting device 1 of the first embodiment, and instead of the electrical connection portion made of aluminum wire or the like, a part of the insulating base 61 is curved, By connecting the wiring pattern 10 on the insulating base 61 to the power input unit 47, power is supplied from the power circuit 9 to the light emitting element 4. Since the insulating base 61 is a film having flexibility, a curved configuration is possible. For connection of the wiring pattern 10 in the power input unit 47, for example, ACF (anisotropic conductive film) connection or the like is used. With this configuration, the light emitting device 103 according to the present embodiment is reduced in the number of parts for connecting the power supply circuit 9 and the light emitting element 4, thereby reducing costs.

(第4の実施形態)
本発明の第4の実施形態に係る発光装置を図12を参照して説明する。本実施形態の発光装置104は、第1の実施形態における発光装置1と同様の構成に加えて、絶縁基材61上に面状の金属材料から成る金属基材66を有する。金属基材66は、例えば板状のアルミ、いわゆるアルミ基板であり、発光素子4の温度分布を均一化するため、絶縁基材61等を介して発光素子4と対向するように配設される。電源回路9と配線パターン10は、絶縁材料から成る絶縁基材61に実装される。電源回路9は、絶縁基材61等を介して金属基材66に近接する。
(Fourth embodiment)
A light emitting device according to a fourth embodiment of the present invention will be described with reference to FIG. The light emitting device 104 of the present embodiment has a metal substrate 66 made of a planar metal material on an insulating substrate 61 in addition to the same configuration as that of the light emitting device 1 of the first embodiment. The metal base 66 is, for example, plate-like aluminum, a so-called aluminum substrate, and is disposed so as to face the light emitting element 4 through the insulating base 61 or the like in order to make the temperature distribution of the light emitting element 4 uniform. . The power supply circuit 9 and the wiring pattern 10 are mounted on an insulating base 61 made of an insulating material. The power supply circuit 9 is close to the metal base 66 through the insulating base 61 and the like.

金属基材66を設けない場合、発光素子は、その素子面積が大きいと、発光時の発熱によって温度分布に高低差が生じ、その温度差によって発光ムラが生じる。本実施形態では、発光素子4の発熱は、金属基材66に伝導する。金属材料から成る金属基材66は、熱伝導率が高いため、温度分布が略均一である。発光素子4は、この金属基材66によって温度分布が均一化されるので、温度差による発光ムラが抑えられる。また、発光装置104は、金属基材66によって発光素子4の封止効果が高まり、金属基材66の機械的強度によって強度が向上する。また、電源回路9は、その発熱が金属基材66に伝導して放熱されるので、温度上昇が抑えられる。   When the metal substrate 66 is not provided, if the light emitting element has a large element area, a difference in temperature distribution occurs due to heat generation during light emission, and light emission unevenness occurs due to the temperature difference. In the present embodiment, the heat generated by the light emitting element 4 is conducted to the metal substrate 66. Since the metal base material 66 made of a metal material has high thermal conductivity, the temperature distribution is substantially uniform. Since the temperature distribution of the light emitting element 4 is made uniform by the metal base material 66, unevenness in light emission due to a temperature difference is suppressed. In addition, the light-emitting device 104 increases the sealing effect of the light-emitting element 4 by the metal base material 66, and the strength is improved by the mechanical strength of the metal base material 66. Moreover, since the heat generated in the power supply circuit 9 is conducted to the metal substrate 66 and radiated, the temperature rise can be suppressed.

(第5の実施形態)
本発明の第5の実施形態に係る発光装置を図13を参照して説明する。本実施形態の発光装置105は、第1の実施形態における発光装置1と同様の構成を有し、発光素子4に陰極を形成することに替えて、絶縁基材61の発光素子4に対向する面上に金属パターン67が形成される。この金属パターン67は、例えばアルミ、銅、銀等の高伝導率と高反射率を有する金属から成り、発光素子4の有機層に接触して給電すると共に、発光層43からの発光を反射する。このような構成により、発光素子4に陰極を形成しないので、発光装置105が低コストとなる。
(Fifth embodiment)
A light emitting device according to a fifth embodiment of the present invention will be described with reference to FIG. The light emitting device 105 of the present embodiment has the same configuration as the light emitting device 1 of the first embodiment, and faces the light emitting element 4 of the insulating base 61 instead of forming a cathode on the light emitting element 4. A metal pattern 67 is formed on the surface. The metal pattern 67 is made of a metal having high conductivity and high reflectivity, such as aluminum, copper, silver, and the like. The metal pattern 67 is in contact with the organic layer of the light emitting element 4 to supply power and reflects light emitted from the light emitting layer 43. . With such a configuration, the cathode of the light emitting element 4 is not formed, so that the cost of the light emitting device 105 is reduced.

(第6の実施形態)
本発明の第6の実施形態に係る発光装置を図14を参照して説明する。本実施形態の発光装置106は、第1の実施形態における発光装置1と同様の構成を有し、絶縁基材61に実装された電源回路9の全ての電源回路素子91を封止材62内に配置することに替えて、一部の電源回路素子91aが、発光装置106の外周近傍における封止材62の外に配置される。封止材62の外に配置される電源回路素子91aは、電源回路9の電源回路素子91のうち特に発熱の多い素子であり、例えば、スイッチング素子、インダクタンス素子等である。それ以外の電源回路素子91bは、封止材62によって封止される。絶縁基材61には、透明基板5との間隔を保つためのスペーサ13が設けられる。
(Sixth embodiment)
A light emitting device according to a sixth embodiment of the present invention will be described with reference to FIG. The light emitting device 106 of the present embodiment has the same configuration as that of the light emitting device 1 of the first embodiment, and all the power supply circuit elements 91 of the power supply circuit 9 mounted on the insulating substrate 61 are contained in the sealing material 62. In place of the arrangement, a part of the power supply circuit element 91 a is arranged outside the sealing material 62 in the vicinity of the outer periphery of the light emitting device 106. The power supply circuit element 91a disposed outside the sealing material 62 is an element that generates a large amount of heat among the power supply circuit elements 91 of the power supply circuit 9, and is, for example, a switching element or an inductance element. Other power supply circuit elements 91 b are sealed with a sealing material 62. The insulating base 61 is provided with a spacer 13 for keeping a distance from the transparent substrate 5.

このように、発熱の多い電源回路素子91aは、封止材62の外に配置されるので、放熱が良くなる。このため、電源回路素子91aの発熱による発光素子4の温度上昇が防がれ、発光素子4の発光ムラの発生が防止される。電源回路素子91aは、発光装置106の外周近傍の端子部11の近くに配置することが望ましく、このような配置により、大気への放熱に加え、端子部11を介した照明器具本体への熱伝導によって放熱が促進される。   As described above, since the power supply circuit element 91a that generates a large amount of heat is disposed outside the sealing material 62, heat dissipation is improved. For this reason, the temperature rise of the light emitting element 4 due to the heat generation of the power supply circuit element 91a is prevented, and the occurrence of uneven light emission of the light emitting element 4 is prevented. The power supply circuit element 91a is desirably disposed near the terminal portion 11 in the vicinity of the outer periphery of the light emitting device 106. With such an arrangement, in addition to heat radiation to the atmosphere, heat to the luminaire main body via the terminal portion 11 is provided. Heat dissipation is promoted by conduction.

なお、本発明は、上記の実施形態の構成に限られず、発明の要旨を変更しない範囲で種々の変形が可能である。例えば、第3乃至第6の実施形態のいずれかの発光素子を複数用いて第2の実施形態の照明器具102を構成してもよい。また、第1又は第2の実施形態において、取付金具3をボルト形状とし、照明器具本体21の穴部22の内壁の一部にメスネジを形成し、取付金具3を穴部22に螺入するように構成してもよい。また、取付金具3に替えて、略同形状の樹脂製の取付冶具を用いてもよい。その場合、ばね座金33と軸部の接触部材34が導電線等によって導通される。   In addition, this invention is not restricted to the structure of said embodiment, A various deformation | transformation is possible in the range which does not change the summary of invention. For example, you may comprise the lighting fixture 102 of 2nd Embodiment using the light emitting element in any one of 3rd thru | or 6th Embodiment. Moreover, in 1st or 2nd embodiment, the attachment metal fitting 3 is made into a bolt shape, a female screw is formed in a part of the inner wall of the hole part 22 of the lighting fixture body 21, and the attachment metal fitting 3 is screwed into the hole part 22. You may comprise as follows. Further, instead of the mounting bracket 3, a resin mounting jig having substantially the same shape may be used. In that case, the spring washer 33 and the shaft contact member 34 are electrically connected by a conductive wire or the like.

1、103、104、105、106 発光装置
2、102 照明器具
4 面状発光素子
41 陽極(電極)
43 発光層
46 陰極(電極)
5 透明基板
6 封止部材
61 絶縁基材(絶縁材料)
66 金属基材(金属材料)
9 電源回路
10 配線パターン
11 端子部
1, 103, 104, 105, 106 Light-emitting device 2, 102 Lighting fixture 4 Planar light-emitting element 41 Anode (electrode)
43 Light emitting layer 46 Cathode (electrode)
5 Transparent substrate 6 Sealing member 61 Insulating base material (insulating material)
66 Metal substrate (metal material)
9 Power supply circuit 10 Wiring pattern 11 Terminal

Claims (3)

発光層と、該発光層を挟持する電極と、を有する面状発光素子と、
前記面状発光素子を載置する透明基板と、
前記面状発光素子を封止する封止部材と、を備えた発光装置であって、
前記面状発光素子に給電する電源回路及び配線パターンをさらに備え、
前記電源回路及び配線パターンが前記封止部材の一部に実装されていることを特徴とする発光装置。
A planar light emitting device having a light emitting layer and an electrode sandwiching the light emitting layer;
A transparent substrate on which the planar light emitting element is placed;
A light-emitting device comprising a sealing member for sealing the planar light-emitting element,
A power circuit for supplying power to the planar light emitting device and a wiring pattern;
The light emitting device, wherein the power supply circuit and the wiring pattern are mounted on a part of the sealing member.
前記封止部材は、前記透明基板の周縁より延出された部分を備え、
発光装置の外部から前記電源回路に電力の供給を受ける端子部が前記延出部分に設けられていることを特徴とする請求項1に記載の発光装置。
The sealing member includes a portion extending from a peripheral edge of the transparent substrate,
The light emitting device according to claim 1, wherein a terminal portion that receives power from the outside of the light emitting device is provided in the extending portion.
前記封止部材は、絶縁材料と、この絶縁材料上に設けられ、前記面状発光素子の温度分布を均一化するための面状の金属材料と、を有し、
前記電源回路と配線パターンは、前記絶縁材料に実装されていることを特徴とする請求項1又は請求項2に記載の発光装置。
The sealing member includes an insulating material, and a planar metal material provided on the insulating material for uniforming the temperature distribution of the planar light emitting element,
The light emitting device according to claim 1, wherein the power supply circuit and the wiring pattern are mounted on the insulating material.
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