JP2011142022A - Organic el luminescent panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL luminescent panel equipped with a power-feeding terminal for a luminescent panel on a rear face of a sealing substrate at the back side. <P>SOLUTION: The organic EL luminescent panel is formed by sealing the organic EL element 3 formed on an element-forming substrate 1 between the element-forming substrate and the sealing substrate 5 facing the element-forming substrate. The sealing substrate 5, formed of an insulating raw material, has conductive layers 11a, 11b, 12a, 12b arranged on either face and a through-hole 14 formed to conduct the conductive layers of both faces. As a conductive matter 15 is filled into the through-hole 14, a transparent electrode 2 of the organic EL element is connected to the conductive layer 12a on a rear-face side of the sealing substrate 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic EL light emitting panel having an organic EL element formed on a transparent substrate and a sealing substrate for sealing the organic EL element from the back surface, and in particular, a power supply terminal for supplying power to the organic EL element The present invention relates to an organic EL light-emitting panel formed on the back side of the sealing substrate.

  Organic EL elements are driven by a low-voltage DC power source, have high luminous efficiency, and can be reduced in weight and thickness. Therefore, they are used for flat panel displays (FPD) in some portable devices. In addition, there is also provided a configuration in which the element is used as a surface light source, for example, as a backlight of a liquid crystal display element.

  On the other hand, the organic EL element can obtain various emission colors by selecting the material used for the light emitting layer. Therefore, any emission color can be obtained by combining each emission color alone or by combining two or more emission colors. It can also be obtained. Therefore, by configuring the organic EL element as a surface light source (light-emitting panel) having a relatively large area, for example, it can be used as a highly efficient light source for illuminating the interior or the interior of a vehicle in addition to a light source for lighting. it can.

  In the organic EL element described above, when a DC voltage is applied between the electrodes facing each other through the light emitting layer, electrons injected from the cathode side and holes injected from the anode side recombine in the light emitting layer. When the energy changes from the excited state to the ground state, light is emitted. For this reason, it is necessary to extract light emitted from the light emitting layer to the outside, and therefore, at least one of the electrodes is a transparent electrode. In general, indium tin oxide (ITO) or the like is used as the transparent electrode.

  Since the ITO as the transparent electrode is generally formed on the transparent substrate (hereinafter also referred to as an element formation substrate), the area of the conventional organic EL light emitting panel is smaller than that of the element formation substrate. A configuration is adopted in which an electrode lead-out portion from a transparent electrode is formed at an end portion of an element forming substrate on which a small sealing substrate is prepared and the sealing substrate is not overlapped.

  FIG. 7 shows an example thereof in a cross-sectional view. Reference numeral 1 denotes, for example, a transparent substrate made of a glass material (hereinafter also referred to as an element forming substrate), and this element forming substrate 1 (in FIG. 7). The transparent electrode 2 such as ITO is formed on the lower surface. An organic EL light emitting layer 3 is formed on the transparent electrode 2, and a counter electrode 4 is disposed on the organic EL light emitting layer 3 to constitute an organic EL element.

  A sealing substrate 5 having an area smaller than that of the element forming substrate 1 is bonded to the back surface of the element forming substrate 1 in which the organic EL element is formed with an adhesive 6 as a sealing agent, thereby the organic EL light emitting layer 3. The organic EL element including the above is sealed by the sealing substrate 5.

  The transparent electrode 2 is continuously formed so as to reach the end portion of the element forming substrate 1 where the sealing substrate 5 is not overlapped, and the transparent electrode 2 exposed at the end portion of the element forming substrate 1 is formed. On the top, an electrode lead portion for connecting a power supply line (not shown) is formed using silver paste, ACF or the like indicated by reference numeral 7.

  That is, in the configuration shown in FIG. 7, the light from the organic EL light emitting layer 3 emits light to the surface side of the element forming substrate 1 through the transparent electrode 2 and the element forming substrate 1 as indicated by the white arrow. Is done. The electrode lead structure shown in FIG. 7 is disclosed in the following prior art document.

Japanese Patent Laid-Open No. 11-26156 JP 2003-272832 A

  By the way, when the organic EL light emitting panel is used as a light emitting panel for illumination, in the configuration in which the power supply line is connected on the electrode film such as ITO as described above, the handling of the power supply line is troublesome, and the construction It is difficult to handle the light-emitting panel at the same time. That is, when considering the construction of lighting equipment or the like in which a large number of EL light-emitting panels are arranged in a plane without gaps, a configuration in which a power supply terminal to the light-emitting panel is provided on the back surface of the sealing substrate on the back surface. desirable.

  This invention makes it a subject to provide the organic electroluminescent light emission panel provided with the terminal for the electric power feeding to a light emission panel in the back surface of the sealing substrate of a back surface in consideration of the convenience of construction of the light emission panel for illumination mentioned above. Is.

  A preferred first embodiment of the organic EL light emitting panel according to the present invention, which has been made to solve the above-described problems, includes: a sealing substrate that opposes an organic EL element formed on an element forming substrate; The sealing substrate is formed of an insulating material, and a conductive layer is disposed on both sides and a through hole that conducts the conductive layer on both sides is formed. One electrode of the organic EL element is connected to a conductive layer on the back surface side of the sealing substrate via a conductive material formed and filled in a through hole of the sealing substrate. And

  In this case, in addition to the above configuration, the front and back side conductive layers of the sealing substrate are separated and insulated into a plurality, respectively, with respect to the front and back side conductive layers to which the one electrode of the organic EL element is connected. A through hole is formed in the sealing substrate to conduct the other electrically conductive surface on the other surface and the back surface side that is separated and insulated, and the other electrode of the organic EL element is connected to the back surface of the sealing substrate through the through hole. It is desirable to be connected to the conductive layer on the side.

  In addition, a second preferred embodiment of the organic EL light emitting panel according to the present invention seals the organic EL element formed on the element forming substrate with a sealing substrate facing the element forming substrate, An organic EL light emitting panel having a configuration in which a thermal conductive material is filled between the organic EL element and the sealing substrate, wherein the sealing substrate is formed of an insulating material and has a conductive layer on both sides. Is formed to form a through hole that conducts through the conductive layers on both sides, and one electrode of the organic EL element is sealed with the conductive material filled in the through hole of the sealing substrate. It is connected to the conductive layer on the back side of the substrate.

  In this case, in addition to the above configuration, the front and back side conductive layers of the sealing substrate are separated and insulated into a plurality, respectively, with respect to the front and back side conductive layers to which the one electrode of the organic EL element is connected. A through hole is further formed in the sealing substrate through the other conductive layers on the front and back sides that are separated and insulated, and the other of the organic EL elements is interposed through a conductive material filled in the through hole. It is desirable that the electrode be connected to the conductive layer on the back side of the sealing substrate.

  One electrode of the organic EL element is a transparent electrode formed on an element forming substrate, and the other electrode of the organic EL element is a back side of the organic EL element formed on the element forming substrate. The counter electrode is opposed to the sealing substrate side.

  According to the organic EL light emitting panel having the above-described configuration, a through hole is formed in the sealing substrate facing the back surface of the organic EL element formed on the element forming substrate, and the electrode of the organic EL element is sealed using the through hole. It is configured to be connected to the conductive layer on the back side of the stop substrate. Therefore, since power can be supplied to the organic EL element from the back side of the sealing substrate, when the organic EL light emitting panel is constructed as a light source for illumination, the handling is easy.

  In addition, the organic EL light-emitting panel having the above-described configuration can be formed by bonding an element formation substrate and a sealing substrate having the same dimensions, so that the mechanical strength can be ensured and the quality is stable. A light-emitting panel can be provided.

It is the fragmentary sectional view of 1st Embodiment which showed the terminal structure for electric power feeding to one electrode in an organic electroluminescent light emission panel. It is a fragmentary sectional view which shows the state which filled the through-hole with the electroconductive substance in the structure shown in FIG. It is the fragmentary sectional view of 1st Embodiment which showed the terminal structure for electric power feeding to the other electrode in an organic electroluminescent light emission panel. It is a top view of the state which looked at the sealing substrate from the back side. It is the fragmentary sectional view of 2nd Embodiment which showed the terminal structure for electric power feeding to one electrode in an organic electroluminescent light emission panel. It is the fragmentary sectional view of 2nd Embodiment which showed the terminal structure for electric power feeding to the other electrode in an organic electroluminescent light emission panel. It is the fragmentary sectional view which showed an example of the terminal structure for electric power feeding in the conventional organic electroluminescent light emission panel.

  Hereinafter, an organic EL light emitting panel according to the present invention will be described based on embodiments shown in the drawings. Note that, in the embodiment according to the present invention described below, the same reference numerals are given to the portions that perform the same functions as those shown in FIG. 7 described above, and therefore detailed description thereof will be omitted as appropriate. .

  1 to 4 show a first embodiment of an organic EL light emitting panel, and the configuration shown in FIG. 1 is based on AA in FIG. 4 showing a state in which the sealing substrate 5 is viewed from the back side. It is a partial expanded sectional view of the state looked at the arrow direction from the line. In the configuration shown in FIG. 1, an insulating glass epoxy substrate in which an epoxy resin is impregnated with a glass fiber cloth, for example, is used as the sealing substrate 5, and copper foil or the like is used on both sides thereof. A so-called double-sided copper foil substrate on which conductive layers 11a, 11b, 12a and 12b are respectively formed is used.

  In this embodiment, the sealing substrate 5 is formed in a rectangular shape having substantially the same dimensions as the element forming substrate 1 and includes an organic EL light emitting layer 3 and the like formed on the element forming substrate 1. The EL element has a structure in which the substrates 1 and 5 are sealed with an adhesive 6 as a sealant.

  As shown in the plan view seen from the back side in FIG. 4, the sealing substrate 5 has a conductive layer 12a formed on the left and right sides, and a conductive layer 12b formed on the center between the left and right conductive layers 12a. Yes. The left and right conductive layers 12a and the central conductive layer 12b are isolated and insulated in an island shape by a copper foil removing portion 12c by a known etching process or the like.

  This is the same for the opposite surface of the sealing substrate 5 shown in FIG. 4, that is, the surface facing the element forming substrate 1, and as shown in FIG. 1, the conductive layers 11a and 11b are formed by the copper foil removing portion 11c. Isolated and insulated.

  In addition, a plurality of holes 5a for forming through holes are formed at the positions where the left and right conductive layers 12a are formed in the sealing substrate 5, and the upper and lower opposing positions of the central conductive layer 12b in the sealing substrate 5 are formed. Also, a plurality of holes 5b for forming through holes are formed.

  As shown in an enlarged cross-sectional view in FIG. 1, conductive holes 11a and 12a on the front and back sides are formed in through-hole forming holes 5a drilled at the formation positions of the left and right conductive layers 12a in the sealing substrate 5. A through hole 14 is formed by plating so as to be conducted across the board.

  As shown in FIG. 2, the through hole 14 is filled with a conductive material 15 such as silver paste or solder by ultrasonic melting. Thereby, the conductive material 15 is bonded to one electrode formed on the back surface of the element forming substrate 1, that is, the transparent electrode 2 made of ITO or the like. This transparent electrode 2 is a conductive layer on the back surface side of the sealing substrate. 12a is connected.

  With this configuration, a connection terminal to the transparent electrode 2 of the organic EL element is formed on the conductive layer 12 a on the back surface side of the sealing substrate 5.

  The above-described connection configuration by filling the through hole 14 with the conductive material 15 is as shown by reference numeral 5a on the left and right conductive layers 12a in the sealing substrate 5, as shown in FIG. It will be formed in several places. In particular, as in this embodiment, a plurality of connecting portions are formed in the left and right conductive layers 12a of the sealing substrate 5, and a transparent electrode is configured by applying, for example, the same level of anode voltage (+) to each. Thus, unevenness in luminance (brightness gradient) generated due to high electrical resistivity of ITO or the like can be effectively suppressed.

  Next, the configuration shown in FIG. 3 is a partially enlarged cross-sectional view of the state when the sealing substrate 5 is viewed from the back side in FIG. 2 shows a connection structure of the other electrode, that is, the counter electrode 4.

  For this, the through-hole forming hole 5b formed at the upper and lower opposing positions in the central conductive layer 12b of the sealing substrate 5 shown in FIG. 4 is used. That is, as shown in an enlarged cross-sectional view in FIG. 3, through holes 17 for plating through holes are formed by plating so as to be conducted across the conductive layers 11b and 12b on the front and back sides. The Thereby, the conductive layers 11 b and 12 b on the front and back sides are conductively connected by the through hole 17.

  On the other hand, in the configuration shown in FIG. 3, the conductive layer 11b formed on the surface of the sealing substrate 5 facing the organic EL element is in surface contact with the counter electrode 4 of the organic EL element. Therefore, the counter electrode 4 of the organic EL element is connected to the conductive layer 12 b formed on the back surface side of the sealing substrate 5 through the conductive layer 11 b and the through hole 17.

  With this configuration, the connection terminal to the counter electrode 4 of the organic EL element is formed on the conductive layer 12b on the back side of the sealing substrate 5, and in this embodiment, the cathode voltage is applied to the conductive layer 12b. (-) Is added.

  Note that the through-hole forming hole provided in the sealing substrate 5 is not limited to a round hole, but an oval shape indicated by reference numeral 5b formed on the lower side of the sealing substrate 5 shown in FIG. The shape may be made as follows.

  Next, FIGS. 5 and 6 show a second embodiment of the organic EL light emitting panel, and the sealing substrate 5 having the configuration shown in FIG. 4 is also used in this second embodiment. It has been. That is, the configuration shown in FIG. 5 is a partial enlarged cross-sectional view of the state when the sealing substrate 5 is viewed from the back side in FIG. In FIG. 4, it is the elements on larger scale which looked at the arrow direction from the BB line.

  In the second embodiment, an insulating grease-like or gel-like substance is filled as the heat conductive substance 8 between the organic EL element formed on the element forming substrate and the sealing substrate. Has been. According to this configuration, heat generated by the organic EL element can be effectively conducted by the heat conductive material, thereby contributing to promoting heat dissipation and soaking effect of the organic EL light emitting panel.

  And the structure of the terminal for electric power feeding to one electrode (transparent electrode) 2 formed into a film on the element formation board | substrate 1 shown in FIG. 5 is the front and back in the sealing substrate 5 similarly to the example shown in FIG. The through-hole 14 formed across the conductive layers 11a and 12a is used, and the through-hole 14 is filled with a conductive material 15 to form the through-hole 14.

  Thereby, the conductive material 15 is bonded to the transparent electrode 2 made of ITO or the like formed on the back surface of the element forming substrate 1, and the transparent electrode 2 is connected to the conductive layer 12 a on the back surface side of the sealing substrate 5. Made into a configuration. With this configuration, a connection terminal to the transparent electrode 2 of the organic EL element is formed on the conductive layer 12 a on the back surface side of the sealing substrate 5.

  On the other hand, in the structure of the other electrode of the organic EL element shown in FIG. 6, that is, the terminal for feeding power to the counter electrode 4, the transparent electrode 2 made of ITO or the like is partially separated and formed in an island shape. That is, as shown in FIG. 6, the element forming substrate 1 has a partition wall 9 made of an insulating material in advance, and the transparent electrode 2 is formed in this state. A conductive film 2 a insulated from the transparent electrode 2 can be formed on a part of the element formation substrate 1.

  When the counter electrode 4 is formed, a part of the counter electrode 4 is formed so as to be superimposed on the conductive film 2a, so that the counter electrode 4 is in conductive contact with the conductive film 2a at a position indicated by reference numeral C. Is done.

  In the above-described configuration, the conductive material 15 and the conductive film 2a are formed by filling the through hole 14 formed over the conductive layers 11b and 12b on the front and back sides of the sealing substrate 5 with the conductive material 15. The counter electrode 4 is connected to the conductive layer 12 b on the back surface side of the sealing substrate 5. With this configuration, the connection terminal to the counter electrode 4 of the organic EL element is formed on the conductive layer 12 b on the back surface side of the sealing substrate 5.

  In the embodiment shown in FIG. 6, when the transparent electrode 2 made of ITO or the like is formed on the element forming substrate 1, the conductive film 2a is simultaneously formed through the insulating partition wall 9. The conductive film 2 a may be formed in a process different from the film formation of the transparent electrode 2 and using a material different from that of the transparent electrode 2.

  As described above, according to the organic EL light-emitting panel having the above-described configuration, the conductive material functioning as a power feeding terminal to the light-emitting panel on the back surface of the back sealing substrate 5 through the through-hole formed in the sealing substrate. Since the layers 12a and 12b are formed, it is possible to obtain unique operational effects as described in the column of the effect of the invention described above.

1 Element formation substrate 2 Transparent electrode (one electrode)
2a Conductive film 3 Organic EL light emitting layer 4 Counter electrode (the other electrode)
5 Sealing substrate 5a, 5b Hole for forming a through hole 6 Sealing agent (adhesive)
8 Thermal Conductive Material 9 Insulating Partition 11a, 11b Conductive Layer 12a, 12b Conductive Layer 11c, 12c Copper Foil Removed Part 14 Through Hole 15 Conductive Substance 17 Through Hole C Conductive Contact Part

Claims (6)

An organic EL light emitting panel having a configuration in which an organic EL element formed on an element forming substrate is sealed between a sealing substrate facing the element forming substrate,
The sealing substrate is formed of an insulating material, and a conductive layer is disposed on both sides to form a through hole that conducts the conductive layer on both sides. The sealing substrate is filled in the through hole of the sealing substrate. An organic EL light-emitting panel, wherein one electrode of the organic EL element is connected to a conductive layer on the back side of the sealing substrate through a conductive material.   The front and back side conductive layers of the sealing substrate are separated and insulated into a plurality of surfaces, and the other surface separated and insulated from the front and back side conductive layers to which the one electrode of the organic EL element is connected, and A through hole that conducts a conductive layer on the back side is further formed in the sealing substrate, and the other electrode of the organic EL element is connected to the conductive layer on the back side of the sealing substrate through the through hole. The organic EL light-emitting panel according to claim 1. The organic EL element formed on the element formation substrate is sealed between a sealing substrate facing the element formation substrate, and a thermally conductive substance is provided between the organic EL element and the sealing substrate. An organic EL light emitting panel having a filled configuration,
The sealing substrate is formed of an insulating material, and a conductive layer is disposed on both sides to form a through hole that conducts the conductive layer on both sides, and the through hole of the sealing substrate is filled. An organic EL light-emitting panel, wherein one electrode of the organic EL element is connected to a conductive layer on the back side of the sealing substrate through a conductive material.   The front and back side conductive layers of the sealing substrate are separated and insulated into a plurality of surfaces, and the other surface separated and insulated from the front and back side conductive layers to which the one electrode of the organic EL element is connected, and A through hole for conducting a conductive layer on the back surface side is further formed in the sealing substrate, and the other electrode of the organic EL element is connected to the back surface of the sealing substrate through a conductive material filled in the through hole. The organic EL light-emitting panel according to claim 3, wherein the organic EL light-emitting panel is connected to a conductive layer on the side.   The organic EL light-emitting panel according to claim 1 or 3, wherein one electrode of the organic EL element is a transparent electrode formed on an element formation substrate.   5. The organic EL according to claim 2, wherein the other electrode of the organic EL element is a counter electrode facing the sealing substrate side on the back side of the organic EL element formed on the element formation substrate. Luminescent panel.

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