JP2011142023A - Organic electroluminescent panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic electroluminescent panel capable of effectively releasing heat from the electroluminescent panel while considering conveniences in constructing the lighting electroluminescent panel. <P>SOLUTION: An organic electroluminescent element 3 formed on an element formed substrate 1 is sealed between a sealing substrate 5 facing the element formed substrate and itself to form an electroluminescent panel unit OP. On the sealing substrate 5 of the electroluminescent panel unit OP, a current path from a transparent electrode 2 is formed with a conductive material 15 filled in a through-hole 14. A conductive layer 24a is formed on a heat conductive substrate 23 having a core metal 21 coated with an enamel layer 22. The heat conductive substrate 23 is bonded to the sealing substrate 5 of the electroluminescent panel unit OP to make a connection between the through-hole 14 and the conductive layer 24a. An insulation displacement connector 30a is detachably attached to the end where the conductive layer 24a is formed so that a driving current from a driving power supply is applied via the insulation displacement connector 30a thereto. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic EL light-emitting panel having an organic EL element formed on a transparent substrate and a sealing substrate for sealing the organic EL element from the back surface, and particularly effectively generates heat from the organic EL element. The present invention relates to an organic EL light emitting panel that can dissipate heat.

  Organic EL elements are driven by a low-voltage DC power source, have high luminous efficiency, and can be reduced in weight and thickness. Therefore, they are used for flat panel displays (FPD) in some portable devices. In addition, there is also provided a configuration in which the element is used as a surface light source, for example, as a backlight of a liquid crystal display element.

  On the other hand, the organic EL element can obtain various emission colors by selecting the material used for the light emitting layer. Therefore, any emission color can be obtained by combining each emission color alone or by combining two or more emission colors. It can also be obtained. Therefore, by configuring the organic EL element as a surface light source (light-emitting panel) having a relatively large area, for example, it can be used as a highly efficient light source for illuminating the interior or the interior of a vehicle in addition to a light source for lighting. it can.

  In the organic EL element described above, when a DC voltage is applied between the electrodes facing each other through the light emitting layer, electrons injected from the cathode side and holes injected from the anode side recombine in the light emitting layer. When the energy changes from the excited state to the ground state, light is emitted. For this reason, it is necessary to extract light emitted from the light emitting layer to the outside, and therefore, at least one of the electrodes is a transparent electrode. In general, indium tin oxide (ITO) or the like is used as the transparent electrode.

  Since the ITO as the transparent electrode is generally formed on the transparent substrate (hereinafter also referred to as an element formation substrate), the area of the conventional organic EL light emitting panel is smaller than that of the element formation substrate. A configuration is adopted in which an electrode lead-out portion from a transparent electrode is formed at an end portion of an element forming substrate on which a small sealing substrate is prepared and the sealing substrate is not overlapped.

  FIG. 15 shows an example thereof in a cross-sectional view. Reference numeral 1 denotes a transparent substrate made of, for example, a glass material (hereinafter also referred to as an element forming substrate), and this element forming substrate 1 (in FIG. 15). The transparent electrode 2 such as ITO is formed on the lower surface. An organic EL light emitting layer 3 is formed on the transparent electrode 2, and a counter electrode 4 is disposed on the organic EL light emitting layer 3 to constitute an organic EL element.

  A sealing substrate 5 having an area smaller than that of the element forming substrate 1 is bonded to the back surface of the element forming substrate 1 on which the organic EL element is formed by an adhesive 6 as a sealing agent, thereby the organic EL light emitting layer 3. The organic EL element including the above is sealed by the sealing substrate 5.

  The transparent electrode 2 is continuously formed so as to reach the end portion of the element forming substrate 1 where the sealing substrate 5 is not overlapped, and the transparent electrode 2 exposed at the end portion of the element forming substrate 1 is formed. On the top, an electrode lead portion for connecting a power supply line (not shown) is formed using silver paste, ACF or the like indicated by reference numeral 7.

  That is, in the configuration shown in FIG. 15, the light from the organic EL light emitting layer 3 is emitted to the surface side of the element forming substrate 1 through the transparent electrode 2 and the element forming substrate 1 as indicated by the white arrow. Is done. The electrode lead structure shown in FIG. 15 is disclosed in the following prior art document.

Japanese Patent Laid-Open No. 11-26156 JP 2003-272832 A

  By the way, when the organic EL light emitting panel is used as a light emitting panel for illumination, in the configuration in which the power supply line is connected on the electrode film such as ITO as described above, handling of the power supply line is troublesome, and the light emitting panel The light-emitting panel is difficult to handle during construction. In addition, although the organic EL element has a characteristic that it generates relatively little heat, when it is used for a light-emitting panel for illumination, since the entire surface emits light, effective heat dissipation and soaking measures are taken. There is a need.

  An object of the present invention is to provide an organic EL light emitting panel capable of effectively dissipating heat generated from the light emitting panel while considering the convenience of construction of the light emitting panel for illumination described above. .

  A preferred first embodiment of the organic EL light emitting panel according to the present invention, which has been made to solve the above-described problems, includes: a sealing substrate that opposes an organic EL element formed on an element forming substrate; An organic EL light-emitting panel having a structure sealed between, wherein a heat conductive substrate in which an insulating layer and a metal layer are laminated is attached to the back surface of the sealing substrate, and the heat conductive substrate A conductive layer is formed on at least one surface, and an electrode of the organic EL element is connected to the conductive layer of a thermally conductive substrate.

  Moreover, the 2nd preferable form of the organic electroluminescent light emission panel concerning this invention is the structure which sealed the organic EL element formed on the element formation board | substrate between the sealing substrate facing the said element formation board | substrate. In the organic EL light emitting panel, the sealing substrate is formed of a thermally conductive substrate in which an insulating layer and a metal layer are laminated, and a conductive layer is formed on at least one surface of the thermally conductive substrate. And an electrode of the organic EL element is connected to the conductive layer of the thermally conductive substrate.

  In addition, in the first and second embodiments described above, an epoxy resin is preferably used as the insulating layer on which the metal layer is laminated. Moreover, the thing using the enamel layer (butter layer) as an insulating layer which laminates | stacks the said metal layer can also be utilized suitably.

  In a preferred embodiment, a conductive layer is disposed on both surfaces of the sealing substrate formed of a thermally conductive substrate, and through holes are formed to connect the conductive layers on both surfaces, and the through holes are used. A configuration in which the electrode of the organic EL element is connected to the conductive layer of the thermally conductive substrate is employed.

  According to the organic EL light emitting panel of the first embodiment described above, the organic EL element formed on the element formation substrate is sealed between the sealing substrate, and the insulating layer and the metal layer are formed on the back surface of the sealing substrate. The heat conductive substrate on which is stacked is attached. In addition, a conductor layer is formed on the thermally conductive substrate, and the electrode of the organic EL element is connected to the conductor layer of the thermally conductive substrate through a through hole formed through the sealing substrate. Configured.

  According to this configuration, heat generated from the organic EL element can be effectively radiated by the action of the heat conductive substrate, and a soaking effect for keeping the entire light emitting panel at substantially the same temperature can be expected. Thereby, the temperature dependence of the light emission efficiency of the organic EL element can be reduced, which can contribute to the elimination of light emission unevenness.

  Furthermore, since power can be supplied to the organic EL light emitting panel by using, for example, a pressure contact connector that is detachably in contact with the conductive layer formed on the heat conductive substrate, the organic EL light emitting panel is illuminated. For example, when it is constructed as a light source, it is possible to expect unique effects such as easy handling.

  In addition, according to the organic EL light emitting panel of the second embodiment described above, the sealing substrate for sealing the organic EL element formed on the element forming substrate is a thermally conductive substrate in which an insulating layer and a metal layer are laminated. Therefore, in addition to the operational effects of the organic EL light emitting panel of the first embodiment described above, the overall structure of the organic EL light emitting panel can be further simplified.

It is the fragmentary sectional view of 1st Embodiment which showed the terminal structure for electric power feeding to the transparent electrode in a light emission panel unit. It is a fragmentary sectional view which shows the state which filled the through-hole with the electroconductive substance in the structure shown in FIG. It is the fragmentary sectional view of 1st Embodiment which showed the terminal structure for electric power feeding to the counter electrode in a light emission panel unit. It is a top view of the state which looked at the sealing substrate used in 1st Embodiment from the back surface side. It is sectional drawing of the transparent electrode part which shows the state which joins a heat conductive substrate unit to the light emission panel unit in 1st Embodiment. It is the fragmentary sectional view which showed the connection structure of the transparent electrode part of the organic electroluminescent light emission panel in 1st Embodiment. It is sectional drawing of the counter electrode part which shows the state which joins a heat conductive substrate unit to the light emission panel unit in 1st Embodiment. It is the fragmentary sectional view which showed the connection structure of the counter electrode part of the organic electroluminescent light emission panel in 1st Embodiment. It is the fragmentary sectional view which showed the connection structure of the transparent electrode part of the organic electroluminescent light emission panel by the other laminated structure in 1st Embodiment. It is the fragmentary sectional view which showed the connection structure of the counter electrode part of the organic electroluminescent light emission panel by the other laminated structure in 1st Embodiment. It is the fragmentary sectional view which showed the connection structure of the transparent electrode part of the organic electroluminescent light emission panel in 2nd Embodiment. It is the fragmentary sectional view which showed the connection structure of the counter electrode part of the organic electroluminescent light emission panel in 2nd Embodiment. It is the fragmentary sectional view which showed the connection structure of the transparent electrode part of the organic electroluminescent light emission panel by the other laminated structure in 2nd Embodiment. It is the fragmentary sectional view which showed the connection structure of the counter electrode part of the organic electroluminescent light emission panel by the other laminated structure in 2nd Embodiment. It is the fragmentary sectional view which showed an example of the terminal structure for electric power feeding in the conventional organic electroluminescent light emission panel.

  Hereinafter, the organic EL light emitting panel according to the present invention will be described in order based on the embodiments shown in the drawings. Note that, in each embodiment according to the present invention described below, portions that perform the same functions as those already described in FIG. 15 are denoted by the same reference numerals, and therefore detailed description thereof is omitted as appropriate. To do. In some of the drawings described below, reference numerals are used for representative portions, and other reference numerals are omitted for the other parts.

  1 to 4 illustrate the configuration of the light-emitting panel unit OP according to the first embodiment. FIGS. 5 to 8 illustrate the heat-conductive substrate in the light-emitting panel unit OP according to the first embodiment. An example of joining the unit VE is schematically shown.

  First, the configuration shown in FIG. 1 is a partially enlarged cross-sectional view of a state in which the sealing substrate 5 is viewed from the back side in FIG. In the configuration shown in FIG. 1, as the sealing substrate 5, for example, an insulating glass epoxy substrate (hereinafter simply referred to as an epoxy substrate) in which an epoxy resin is impregnated with a glass fiber cloth overlapped is used. A so-called double-sided copper foil substrate in which conductive layers 11a, 11b, 12a and 12b such as copper foils are formed on both sides is used.

  In this embodiment, the sealing substrate 5 is formed in a rectangular shape having substantially the same dimensions as the element forming substrate 1 and includes an organic EL light emitting layer 3 and the like formed on the element forming substrate 1. The EL element has a structure in which the substrates 1 and 5 are sealed with an adhesive 6 as a sealant.

  As shown in the plan view seen from the back side in FIG. 4, the sealing substrate 5 has a conductive layer 12a formed on the left and right sides, and a conductive layer 12b formed on the center between the left and right conductive layers 12a. Yes. The left and right conductive layers 12a and the central conductive layer 12b are isolated and insulated in an island shape by a copper foil removing portion 12c by a known etching process or the like.

  This is the same for the opposite surface of the sealing substrate 5 shown in FIG. 4, that is, the surface facing the element forming substrate 1, and as shown in FIG. 1, the conductive layers 11a and 11b are formed by the copper foil removing portion 11c. Isolated and insulated.

  In addition, as shown in FIG. 4, a plurality of holes 5a for forming through holes are formed at the positions where the left and right conductive layers 12a are formed in the sealing substrate 5, and in the central conductive layer 12b in the sealing substrate 5 A plurality of through-hole forming holes 5b are also formed at the upper and lower opposing positions.

  As shown in an enlarged cross-sectional view in FIG. 1, conductive holes 11a and 12a on the front and back sides are formed in through-hole forming holes 5a drilled at the formation positions of the left and right conductive layers 12a in the sealing substrate 5. A through hole 14 is formed by plating so as to be conducted across the board.

  As shown in FIG. 2, the through hole 14 is filled with a conductive material 15 such as silver paste or solder by ultrasonic melting. Thereby, the conductive material 15 is bonded to one electrode formed on the back surface of the element forming substrate 1, that is, the transparent electrode 2 made of ITO or the like. This transparent electrode 2 is a conductive layer on the back surface side of the sealing substrate. 12a is connected. That is, a conductive portion 18a penetrating the sealing substrate 5 is formed by the through hole 14 and the conductive material 15 filled therein.

  With this configuration, a connection terminal to the transparent electrode 2 as one electrode of the organic EL element is formed on the conductive layer 12 a on the back surface side of the sealing substrate 5.

  The above-described connection configuration by filling the through hole 14 with the conductive material 15 is as shown by reference numeral 5a on the left and right conductive layers 12a in the sealing substrate 5, as shown in FIG. It will be formed in several places.

  In particular, as in this embodiment, by applying an anode voltage (+) to the left and right conductive layers 12a of the sealing substrate 5 through the conductive layers of the thermal conductive substrate unit VE described later, the transparent electrode It is possible to effectively suppress unevenness in luminance (brightness gradient) generated due to a high electrical resistivity of ITO or the like constituting the material.

  Next, the configuration shown in FIG. 3 is a partially enlarged cross-sectional view of the state when the sealing substrate 5 is viewed from the back side in FIG. 2 shows a connection structure of the other electrode, that is, the counter electrode 4.

  For this, the through-hole forming hole 5b formed at the upper and lower opposing positions in the central conductive layer 12b of the sealing substrate 5 shown in FIG. 4 is used. That is, as shown in an enlarged cross-sectional view in FIG. 3, through holes 17 for plating through holes are formed by plating so as to be conducted across the conductive layers 11b and 12b on the front and back sides. The Thereby, the conductive layers 11 b and 12 b on the front and back sides are conductively connected by the through hole 17, and this constitutes a conductive portion 18 b that penetrates the sealing substrate 5.

  In the configuration shown in FIG. 3, the conductive layer 11b formed on the surface of the sealing substrate 5 facing the organic EL element is in surface contact with the counter electrode 4 of the organic EL element. Therefore, the counter electrode 4 of the organic EL element is connected to the conductive layer 12 b formed on the back surface side of the sealing substrate 5 through the conductive layer 11 b and the through hole 17.

  With this configuration, a connection terminal to the counter electrode 4 of the organic EL element is formed on the conductive layer 12b on the back surface side of the sealing substrate 5, and in this embodiment, a thermally conductive substrate described later is used. A cathode voltage (-) is applied to the conductive layer 12b through the conductive layer of the unit VE.

  Note that the through-hole forming hole provided in the sealing substrate 5 is not limited to a round hole, but an oval shape indicated by reference numeral 5b formed on the lower side of the sealing substrate 5 shown in FIG. The shape may be made as follows.

  5 and 6 show examples of transparent electrode portions in which an organic EL light emitting panel is completed by attaching a heat conductive substrate unit VE to the back surface of the sealing substrate 5 in the light emitting panel unit OP configured as described above. It is shown in a sectional view.

  The thermally conductive substrate 23 constituting the thermally conductive substrate unit VE has a configuration in which an insulating layer and a metal layer are laminated. That is, it is constituted by the core metal 21 and the insulating layer 22 covering the entire core metal. As the core metal, for example, iron, aluminum or the like formed in a flat plate shape is used, and a vitreous glaze mainly composed of silica (silicon dioxide) is used as an insulating layer 22 on the surface of the core metal 21 at a high temperature. A so-called enameled layer is used.

  A conductive layer 24a is formed on one surface of the thermally conductive substrate 23, that is, the surface facing the conductive portion 18a formed on the sealing substrate 5, and on the surface avoiding the conductive layer 24a. The adhesive layer 25 is formed. And the heat conductive board | substrate 23 is joined to the back surface of the sealing board | substrate 5 in the light emission panel unit OP as shown in FIG.

  In this case, by applying a conductive material such as silver paste on the conductive layer 24a in advance, the conductive layer 24a and the conductive layer formed on the sealing substrate 5 in the light emitting panel unit OP in the bonded state shown in FIG. The electrical contact with the portion 18a can be improved.

  Then, as shown in FIG. 6, a pressure contact connector 30a is detachably attached to the end portion of the heat conductive substrate 23 where the conductive layer 24a is formed, and an anode voltage (from the drive power source) (via the pressure contact connector 30a). +) Can be added.

  7 and 8 are cross-sectional views of the counter electrode portion when the thermally conductive substrate unit VE is attached to the back surface of the sealing substrate 5 in the light emitting panel unit OP. That is, the steps shown in FIGS. 7 and 8 are performed simultaneously with the joining step shown in FIGS.

  In the example shown in FIGS. 7 and 8, the conductive layer 24 b is formed on the surface of the heat conductive substrate 23 facing the conductive portion 18 b formed by the through hole 17, and bonding using the adhesive layer 25 is performed. By the operation, the conductive layer 24b can be connected to the conductive portion 18b formed on the sealing substrate 5 in the light emitting panel unit OP as shown in FIG.

  As shown in FIG. 8, a press contact connector 30b is detachably attached to the end portion of the heat conductive substrate unit VE where the conductive layer 24b is formed, and the cathode voltage from the drive power source is connected via the press contact connector 30b. (-) Can be added.

  Thus, according to the organic EL light emitting panel shown in FIGS. 6 and 8, the heat conductive substrate unit VE in which the hollow layer is formed as the insulating layer 22 on the surface of the core metal 21 is joined to the light emitting panel unit OP. Therefore, it is possible to effectively dissipate heat generated from the organic EL element, and to expect a soaking effect that keeps the entire light emitting panel at substantially the same temperature.

  Next, FIG. 9 and FIG. 10 show an example in which the laminated structure of the organic EL elements in the light emitting panel unit OP is different from the examples shown in FIGS. In this example, between the organic EL element formed on the element forming substrate 1 and the sealing substrate 5, an insulating grease-like or gel-like substance is filled as the heat conductive substance 8. .

  According to this configuration, heat generated by the organic EL element can be effectively conducted by the heat conductive material 8, thereby contributing to promoting heat dissipation and soaking effect of the organic EL light emitting panel.

  FIG. 9 shows a connection configuration of the transparent electrode portion of the organic EL light emitting panel. The configuration shown in FIG. 9 is a configuration in which the heat conductive material 8 is enclosed in the configuration shown in FIG. It differs in point.

  FIG. 10 shows the connection configuration of the counter electrode portion of the organic EL light emitting panel. In the configuration shown in FIG. 10, the configuration of drawing out the counter electrode 4 of the organic EL element is the example shown in FIG. Is different from the following.

  In the configuration shown in FIG. 10, the transparent electrode 2 made of ITO or the like is partially separated and formed in an island shape. That is, as shown in FIG. 10, the element forming substrate 1 has a partition wall 9 made of an insulating material in advance, and the transparent electrode 2 is formed in this state. A conductive film 2 a insulated from the transparent electrode 2 can be formed on a part of the element formation substrate 1.

  When the counter electrode 4 is formed, a part of the counter electrode 4 is formed so as to be superimposed on the conductive film 2a, so that the counter electrode 4 is in conductive contact with the conductive film 2a at a position indicated by reference numeral C. Is done.

  In the above-described configuration, the conductive material 15 is filled in the through hole 14 formed over the conductive layers 11b and 12b on the front and back sides of the sealing substrate 5, so that the current of the counter electrode 4 is supplied to the conductive portion 18b. The road can be pulled out. By joining the heat conductive substrate unit VE to the light emitting panel unit OP configured as described above, the current path of the counter electrode 4 can be drawn out to the conductive layer 24b of the heat conductive substrate unit VE.

  Accordingly, the press contact connector 30b is detachably attached to the end portion of the heat conductive substrate unit VE where the conductive layer 24b is formed, and the cathode voltage (-) from the drive power supply is applied via the press contact connector 30b. Can do.

  In the first embodiment shown in FIGS. 1 to 10 described above, the light emitting panel unit OP formed by sealing the organic EL element formed on the element forming substrate with the sealing substrate is further provided. The heat conductive substrate unit VE is joined. On the other hand, in the second embodiment shown in FIGS. 11 to 14, instead of the sealing substrate 5 for sealing the organic EL element formed on the element forming substrate 1, an insulating layer and a metal layer are used. And a heat conductive substrate 23 in which the core metal 21 is covered with an insulating layer 22 of a hollow layer.

  FIG. 11 and FIG. 12 show the connection configuration of the transparent electrode portion and the counter electrode portion of the organic EL light emitting panel, respectively. That is, FIG. 11 uses a thermally conductive substrate 23 in which a core metal 21 is covered with an insulating layer 22 of a hollow layer instead of the sealing substrate 5 in the configuration shown in FIG. Then, the press contact connector 30a is detachably attached to the end portion where the conductive layer 11a formed on the heat conductive substrate 23 is formed, and an anode voltage (+) from the drive power supply is applied through the press contact connector 30a. Can do.

  In this case, in the connection configuration of the counter electrode portion shown in FIG. 12, the conductive layer 11b is formed on the surface of the thermally conductive substrate 23 that also serves as the sealing substrate, facing the organic EL element. Then, the press contact connector 30b is detachably attached to the end portion of the heat conductive substrate 23, and the cathode voltage (-) from the drive power source can be applied via the press contact connector 30b.

  FIG. 13 and FIG. 14 show an insulating grease-like or gel-like shape as the heat conductive substance 8 between the organic EL element formed on the element forming substrate 1 and the heat conductive substrate 23 also serving as a sealing substrate. It shows a configuration filled with a substance. That is, FIG. 13 shows the connection configuration of the transparent electrode portion of the organic EL light emitting panel. The press contact connector 30a is detachably attached to the end portion where the conductive layer 11a is formed, and is driven through the press contact connector 30a. An anode voltage (+) from the power supply can be applied.

  FIG. 14 shows the connection configuration of the counter electrode portion of the organic EL light emitting panel. A pressure contact connector 30b is detachably attached to the end portion where the conductive layer 11b is formed, and is driven through the pressure contact connector 30b. A cathode voltage (-) from the power source can be applied.

  In the second embodiment described above, an example using the thermally conductive substrate 23 in which the core metal 21 is covered with the insulating layer 22 of the enamel layer is shown, but as this thermally conductive substrate, For example, as shown in FIGS. 1 to 4, a heat conductive substrate in which an insulating layer as a sealing substrate 5 made of an epoxy resin and a metal layer made of conductive layers 11a, 11b, 12a, and 12b are stacked is used. However, the same effect can be obtained. That is, the configuration shown in FIGS. 1 to 4 can be one of the second embodiments of the present invention.

  As is clear from the above description, according to the first and second embodiments described above, both use the heat conductive substrate in which the insulating layer and the metal layer are laminated. A thermal effect can be expected, and unique operational effects as described in the above-described column of the invention can be obtained.

1 Element formation substrate 2 Transparent electrode (one electrode)
2a Conductive film 3 Organic EL light emitting layer 4 Counter electrode (the other electrode)
5 Sealing substrate 5a, 5b Hole for forming a through hole 6 Sealing agent (adhesive)
8 Thermal Conductive Material 9 Insulating Partition 11a, 11b Conductive Layer (Metal Layer)
12a, 12b Conductive layer (metal layer)
11c, 12c Copper foil removal part 14 Through hole 15 Conductive substance 17 Through hole 18a, 18b Conductive part 21 Core metal (metal layer)
22 Insulation layer (enamel layer)
23 thermal conductive substrate 24a conductive layer 24b conductive layer 25 adhesive layer 30a, 30b pressure contact connector C conductive contact portion OP light emitting panel unit VE thermal conductive substrate unit

Claims (5)

An organic EL light emitting panel having a configuration in which an organic EL element formed on an element forming substrate is sealed between a sealing substrate facing the element forming substrate,
A thermal conductive substrate in which an insulating layer and a metal layer are laminated is attached to the back surface of the sealing substrate, and a conductive layer is formed on at least one surface of the thermal conductive substrate, and the organic An organic EL light-emitting panel, wherein an electrode of an EL element is connected to the conductive layer of a thermally conductive substrate. An organic EL light emitting panel having a configuration in which an organic EL element formed on an element forming substrate is sealed between a sealing substrate facing the element forming substrate,
The sealing substrate is constituted by a thermally conductive substrate in which an insulating layer and a metal layer are laminated, and a conductive layer is formed on at least one surface of the thermally conductive substrate, and the organic EL element An organic EL light-emitting panel, wherein an electrode is connected to the conductive layer of a thermally conductive substrate.   The organic EL light-emitting panel according to claim 1 or 2, wherein the insulating layer on which the metal layer is laminated is an epoxy resin.   The organic EL light-emitting panel according to claim 1 or 2, wherein the insulating layer on which the metal layer is laminated is composed of a hollow layer.   Conductive layers are disposed on both sides of the sealing substrate formed of a thermally conductive substrate to form through holes that connect the conductive layers on both sides, and the electrodes of the organic EL element are formed using the through holes. The organic EL light-emitting panel according to any one of claims 1 to 4, wherein the organic EL light-emitting panel is connected to a conductive layer of a thermally conductive substrate.

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