JP2013105762A - Light-emitting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting module which has component sides consisting of two or more electrode faces where a plurality of luminous bodies are mountable, on the outer peripheral and end faces of a polyhedral shaped substrate, thereby illuminating a three-dimensional space with uniform brightness, and being excellent in heat dissipation.SOLUTION: A light-emitting module comprises a plurality of luminous bodies 13 and a polyhedral shaped substrate 12 having component sides on which the luminous bodies 13 are mounted, on a plurality of outer peripheral faces 21 to 24 and end faces 25 and 26. Insulation layers 14 and 15 which separate each component side into two or more electrode faces are formed on each of the outer peripheral and end faces, and the insulation layers are formed so as to extend from one outer peripheral face to an opposite other outer peripheral face via at least one of the end faces.

Description

  The present invention relates to a light emitting module configured by mounting a light emitter on an outer peripheral surface of a substrate made of a polyhedron.

  2. Description of the Related Art Conventionally, a light emitting module configured to obtain a wide range of light emission with high luminance by mounting a plurality of light emitters on a substrate is known. Such a light emitting module includes a flat substrate on which a plurality of pairs of electrode patterns are formed and a plurality of light emitting diodes (LEDs) having a PN junction structure. Since the planar mounting space of the substrate is limited, in order to mount a large number of LEDs, it is necessary to arrange them at high density with a small interval.

  According to the light emitting module having the above configuration, although a planar light emitting effect can be obtained, it is not suitable as a light source for illuminating a three-dimensional space like a light bulb. For this reason, in order to obtain three-dimensional light emission, an illuminating device configured by mounting LEDs on each surface of a polyhedral base body on which an electrode pattern is formed is disclosed (Patent Document 1).

  In addition, since the electrode pattern on which the LED is mounted is composed of two electrode surfaces including an anode and a cathode, a substrate having a structure in which a pair of metal materials are sandwiched between insulating members such as an adhesive may be used. . For example, in the light emitting diode disclosed in Patent Document 2, a pair of columnar electrode bodies are bonded together with an insulating material interposed therebetween, and an LED is mounted on the bonded upper surface, and each electrode body and bonding wire are electrically connected. It is formed in connection with. In this light emitting diode, in order to reduce the size of the plane on which the LED is mounted, the upper surface of the pair of electrode bodies bonded together is configured as a light emitting surface.

JP 2008-004415 A JP 2002-289924 A

  In the light emitting device disclosed in Patent Document 1, it is necessary to form a base body having a plurality of mounting surfaces facing a predetermined light emitting direction, and to form an electrode pattern on the surface of the base body by etching or the like. There is. For this reason, an electrode pattern can be formed so as to be suitable for the LED mounting form, but there is a problem in that the number of manufacturing steps and costs increase because a step of forming a base body and a step of forming an electrode pattern are required. It was.

  On the other hand, in the light emitting diode disclosed in Patent Document 2, since the upper surface where the pair of electrode bodies are bonded together is a light emitting surface, it cannot be said that the light emitting range is narrow and the reflection effect is not sufficient. In order to widen the light emitting surface, the electrode body itself must be formed in a large size, and there is a problem that manufacturing and product costs increase. Moreover, since the surface which mounts LED is one place, it is not the structure which arrange | positions several LED in three dimensions.

  Accordingly, an object of the present invention is to illuminate a three-dimensional space with uniform brightness by providing a mounting surface composed of two or more electrode surfaces on which a plurality of light emitters can be mounted on the outer peripheral surface and end surface of a polyhedral substrate. It is possible to provide a light emitting module that can be used and has excellent heat dissipation.

  In order to solve the above problems, a light emitting module of the present invention includes a plurality of light emitters and a substrate made of a polyhedron having mounting surfaces on which the plurality of light emitters are mounted on a plurality of outer peripheral surfaces and both end surfaces of the outer peripheral surfaces. And an insulating layer that separates each mounting surface into two or more electrode surfaces is formed on each of a plurality of outer peripheral surfaces and both end surfaces, and at least one of the insulating layers is disposed on the other outer peripheral surface facing from one outer peripheral surface. It extends through the end surface.

  According to the light emitting module of the present invention, the light emitting module is formed by a substrate made of a polyhedron having a mounting surface on which a light emitting body can be mounted on a plurality of outer peripheral surfaces and both end surfaces. Can be illuminated with uniform brightness. In addition, an insulating layer that separates each mounting surface into two or more electrode surfaces is formed on each of a plurality of outer peripheral surfaces and both end surfaces, and at least one of the insulating layers is opposed to another outer peripheral surface facing from one outer peripheral surface. Since it extends through the end face, electrical connection with each light emitter becomes easy, and the number of light emitters and the position of the light emitters can be set in accordance with the lighting application.

  Further, by placing one end face of the substrate on a predetermined electrode pattern on the mother board, the light emitters mounted on the plurality of outer peripheral faces and other end faces can emit light. Furthermore, by changing the voltage application pattern with respect to the electrode pattern, the light emitter mounted on the specific mounting surface can selectively emit light.

  By making the area of each electrode surface provided by dividing each mounting surface substantially equal, variation in electrical resistance in the substrate can be suppressed. Thereby, the light emission variation for each light emitting body mounted on each mounting surface is reduced, and a multi-directional space can be illuminated uniformly without unevenness.

  Furthermore, each mounting surface has high heat dissipation because the entire plane excluding the insulating layer is an electrode surface made of a metal member. Accordingly, heat generated from the light emitter mounted on each mounting surface can be efficiently released to the outside without the substrate being heated.

It is a perspective view of the light emitting module of 1st Embodiment. It is a perspective view of the board | substrate which comprises the said light emitting module. It is a top view which shows the mounting form of the said light emitting module. It is a side view which shows the mounting form of the said light emitting module. It is a side view of the said light emitting module in which the light emitting element of PN structure was mounted. It is a side view of the said light emitting module with which LED was mounted. It is a perspective view of the said light emitting module comprised using the light-emitting body which has two light emitting elements. It is a side view of the said light emitting module with which LED provided with two light emitting elements was mounted. It is the perspective view (a) and top view (b) of the light emitting module of 2nd Embodiment. It is the perspective view (a) and top view (b) of the light emitting module of 3rd Embodiment. It is an electrical connection diagram of the light emitting module. It is a top view of the light emitting module of 4th Embodiment. It is a perspective view of the light bulb type illuminating device which mounts the light emitting module of this invention.

  Hereinafter, embodiments of a light emitting module according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 6 show the structure of the light emitting module 11 according to the first embodiment of the present invention. The light emitting module 11 includes a polyhedral substrate 12 and a plurality of light emitters 13 mounted on a plurality of mounting surfaces including an outer peripheral surface and an end surface of the substrate 12.

  As shown in FIG. 2, the substrate 12 includes a first insulating layer 14 and a second insulating layer 15 which are provided so as to cross in the vertical direction in a cross shape, and the first insulating layer 14 and the second insulating layer. 15 and four electrode portions P1 to P4 made of block-shaped metal members that are electrically separated by each other, and the four electrode portions P1 to P4 sandwich the first insulating layer 14 and the second insulating layer 15 therebetween. It is integrally formed by being combined. The substrate 12 thus formed has a hexahedron shape having outer peripheral surfaces 21 to 24 facing in four directions substantially perpendicular to each other and a pair of end surfaces 25 and 26 facing the upper and lower directions of the outer peripheral surfaces. Yes. As another method for forming the substrate 12, a hexahedral base body made of a resin member having outer peripheral surfaces 21 to 24 and end surfaces 25 and 26 is formed, and the surface of the base body is shown in FIG. Such four electrode parts P1-P4 can be provided by metal plating. The electrode portions P1 to P4 have a first insulating layer 14 and a second insulating layer 15 that extend in a strip shape so as to bisect the outer peripheral surfaces 21 to 24 by intersecting the central portions of the pair of end surfaces 25 and 26. Can be separated electrically. Therefore, an insulating layer that separates the mounting surface composed of a plurality of outer peripheral surfaces and both end surfaces into two or more electrode surfaces is formed on each of the plurality of outer peripheral surfaces and both end surfaces, and this insulating layer faces from one outer peripheral surface. The other outer peripheral surface is configured to extend through at least one end surface.

  The outer peripheral surfaces 21 and 23 are separated by the first insulating layer 14 into a pair of electrode surfaces (21a, 21b) and (23a, 23b), respectively, and the outer peripheral surfaces 22 and 24 are respectively separated by a pair of electrode surfaces by the second insulating layer 15. They are separated into (22a, 22b) and (24a, 24b). Further, the end surfaces 25 and 26 are separated into two pairs of electrode surfaces when the first insulating layer 14 and the second insulating layer 15 intersect in a cross shape. Therefore, the mounting surface formed on the substrate having a plurality of outer peripheral surfaces and end surfaces is separated into a pair of electrode surfaces by a single insulating layer connecting both end surfaces, and the mounting surfaces formed on the both end surfaces are a plurality of mounting surfaces. Each insulating layer extending from the outer peripheral surface intersects to be separated into a plurality of pairs of electrode surfaces. For this reason, the number of the plurality of pairs of electrode surfaces formed on the both end surfaces corresponds to the number of the outer peripheral surfaces of the substrate. Further, since the first insulating layer 14 and the second insulating layer 15 are provided so as to equally divide the outer peripheral surface and the end surface, the areas of the separated electrode surfaces are substantially the same. As a result, heat generated from the light emitters 13 mounted on the electrode surfaces can be evenly dissipated without unevenness.

  In the light emitting module of the present invention, the electrode 13 positioned on the diagonal line through the first insulating layer 14 and the second insulating layer 15 in order to mount the light emitting body 13 having the bipolar terminal electrode composed of the anode and the cathode. The electrodes are electrically connected so that the parts have the same polarity and the electrode parts arranged in the vertical and horizontal directions have different polarities. In the present embodiment, as shown in FIG. 3, the electrode portions P1 and P3 are described as anodes (A), and the electrode portions P2 and P4 are described as cathodes (K).

  Each of the outer peripheral surfaces 21 to 24 has a pair of electrode surfaces A (anode side) and K (cathode side) composed of an anode and a cathode sandwiching either the first insulating layer 14 or the second insulating layer 15. It has become the mounting surface. Each of the end faces 25, 26 has two pairs of grid-like electrode faces A, K each composed of a pair of anodes and a pair of cathodes by intersecting the first insulating layer 14 and the second insulating layer 15. It has become the mounting surface.

  Since the outer peripheral surfaces 21 to 24 and the end surfaces 25 and 26 excluding the first insulating layer 14 and the second insulating layer 15 are metal surfaces, as will be described later, it is effective when the light emitter 13 is mounted. Heat dissipation surface (heat sink). In particular, a higher heat dissipation effect can be obtained by forming the outer peripheral surfaces 21 to 24 and the end surfaces 25 and 26 by a copper material or copper plating having excellent conductivity.

  In the substrate 12 having the above-described configuration, all the outer peripheral surfaces 21 to 24 and the end surfaces 25 and 26 are mounting surfaces on which the light emitter 13 can be mounted. However, as shown in FIG. When mounting, the lower end surface 26 serves as an electrical contact surface with the electrode patterns Q1 to Q4 provided on the external substrate 19.

  In the present embodiment, as described above, since the end surface 26 is a contact surface to the external substrate 19, the light emitter 13 is mounted on the four outer peripheral surfaces 21 to 24 and the upper end surface 25. As shown in FIG. 4, the light emitter 13 is provided with a pair of terminal electrodes 13a, 13b on the lower surface side, and a pair of electrode surfaces A, K on the outer peripheral surface corresponding to the pair of terminal electrodes 13a, 13b. Are electrically connected. Then, the electrode surfaces A and K of the end face 26 are placed on the electrode patterns Q1 to Q4 squarely arranged on the external substrate 19 through the solder 20, so that the electrical connection with the external substrate 19 is achieved. Figured.

  The light-emitting body 13 is formed by sealing a light-emitting element 31 having a PN junction structure as shown in FIG. 5 or the light-emitting element 31 as shown in FIG. 6 on a chip substrate 33 with a translucent resin body 35. A light emitting device (LED) 32 can be used. As the light emitting element 31, for example, a gallium nitride compound semiconductor, an aluminum gallium arsenide, or a gallium arsenide phosphorus semiconductor is used. These semiconductors consist of a substrate made of sapphire glass and a diffusion layer (P layer and N layer) obtained by diffusing and growing a P-type semiconductor and an N-type semiconductor on the substrate. Each of the P-type semiconductor and the N-type semiconductor includes a P-type electrode and an N-type electrode, and the exposed portions of the P-type electrode and the N-type electrode serve as a pair of element electrodes 31a and 31b.

  When the light emitting element 31 is directly mounted on each mounting surface, the element electrodes 31a and 31b are positioned and placed so as to correspond to the pair of electrode surfaces A and K, as shown in FIG. Then, the bump-shaped solder 20 is placed between the pair of electrode surfaces and each of the element electrodes 31a and 31b, and the entire light emitting module 11 is subjected to a reflow process to achieve electrical connection. Further, the color of the luminescent color can be adjusted by covering the upper surface of the light emitting element 31 with a fluorescent plate or sheet.

  On the other hand, as shown in FIG. 6, the light emitter 13 includes a chip substrate 33 having a pair of chip electrodes 34a and 34b at both ends, a light emitting element 31 mounted on the chip substrate 33, and the light emitting element 31. When configured as a surface-mounted LED 32 composed of a resin body 35 to be sealed, a pair of chip electrodes 34a and 34b are placed on the pair of electrode surfaces A and K on one outer peripheral surface in association with each other. Thereafter, they are electrically connected via solder 20 or a conductive adhesive. In the present embodiment, the light emitting element 31 and the pair of chip electrodes 34a and 34b are connected by wires. However, the LED may be a surface-mounted LED via solder bumps, and each mounting surface of the substrate 12 Any light emitter that can be electrically connected to the pair of electrode surfaces formed on the substrate may be used. In addition, by adjusting the resin body 35 to contain a fluorescent agent, it is possible to adjust the hue of the emission color.

  Since the mounting space differs between the case where the light emitter 13 is the light emitting element 31 and the case of the LED 32, the size of the substrate 12 and the size of the pair of electrode surfaces A and K provided on each mounting surface are defined according to each mode. Is done. Although one light emitter 13 is arranged on each mounting surface, a plurality of light emitters 13 including a plurality of light emitting elements 21 and LEDs 22 can be arranged in parallel on the same mounting surface.

  Further, as shown in FIG. 7, the light emitter 13 can be configured by two or more light emitting elements 31 to increase the overall light emission amount. The light emitting module 11 shown in FIG. 8 is configured using an LED 32 a that is packaged including two light emitting elements 31. Further, by using three or more light emitting elements 31 in parallel connection or series connection, the amount of light emission can be further increased. Thus, various types of light emitting modules corresponding to power consumption and brightness can be obtained by appropriately selecting LEDs having different numbers of light emitting elements and different connection forms.

  According to the light emitting module 11 of the present embodiment, as shown in FIG. 1, the light emitter 13 can be mounted on all of the outer peripheral surfaces 21 to 24 and the upper end surface 25 facing in four directions. The central space can be illuminated with uniform brightness without unevenness. Further, by forming each outer peripheral surface of the substrate 12 in the height direction, a plurality of light emitters 13 can be mounted in the height direction. By changing the size of the substrate 12 in this way, the illumination range can be expanded and overall light quantity and luminance can be improved.

  9 and 10 show the light emitting modules 41 and 51 in the second and third embodiments. In the light emitting modules 41 and 51, the substrates 42 and 52 have four electrode portions P1 to P4 through the first and second insulating layers 14 and 15 as in the light emitting module 11 of the first embodiment. Although formed, the outer peripheral surfaces 42a to 42d extend long in the vertical direction. A plurality of light emitters 13 are mounted and formed at a position close to the upper end face 43a of the outer peripheral surface. For this reason, it is a structure suitable for the illumination use for making the circumference | surroundings of the position which has a certain fixed height from the lower end surface 43b mounted in the external board | substrate 19 as shown in FIG. In FIG. 9, two light emitters 13 are mounted at equal intervals above the outer peripheral surfaces 42a to 42d. Since no light emitter is mounted on the upper end surface 43a, from the lower end surface 43b. It is suitable for illuminating a range facing a fixed height at four directions.

  The light emitting module 51 shown in FIG. 10 is configured by changing part of the number of light emitters mounted on the outer peripheral surfaces 52a to 52d. In this embodiment, three light emitters are arranged in parallel on the outer peripheral surface 52a on the front side, and two light emitters are arranged on each of the outer peripheral surfaces 52b and 52d and the upper end surface 53a. In this case, the light emission range is the entire space having a certain height from the lower end surface 53b arranged on the external substrate, but the outer peripheral surface 52a side is particularly lighter than the other outer peripheral surfaces 52b and 52d. The brightness is high. Here, among the four electrode portions P1 to P4, P1 and P3 are set as the anode (A), and P2 and P4 are set as the cathode (K). Further, the light emitter 13a and the light emitter 13b are mounted in opposite directions on the upper end surface 53a, the three light emitters 13c1 to 13c3 are mounted in parallel in the same direction on the outer peripheral surface 52a, and 2 on the outer peripheral surface 52b. Assume that two light emitters 13d1 and 13d2 are mounted in parallel in the same direction, and two light emitters 13e1 and 13e2 are mounted in parallel in the same direction on the outer peripheral surface 52d. It is assumed that no light emitter is mounted on the outer peripheral surface 52c.

FIG. 11 shows a light emission pattern of the light emitting module 51. The combination of the light emission pattern in the electrode part and light-emitting body selected below is shown.
Light emission pattern (1): The light emitters 13c1 to 13c3 emit light by applying a voltage between the electrode portions (P1 and P2).
Light emission pattern (2): The light emitter 13a and the light emitters 13e1 and 13e2 emit light by applying a voltage between the electrode portions (P1-P4).
Light emission pattern (3): The light emitter 13b and the light emitters 13d1 and 13d2 emit light by applying a voltage between the electrode portions (P3-P2).
Light emission pattern (4): All the light emitters emit light by applying a voltage between the electrode portions (P1-P2) and (P3-P4).
As described above, the light emitters mounted on the predetermined outer peripheral surface and the end surface can be selected to emit light according to the voltage application pattern to each of the electrode portions P1 to P4.

  FIG. 12 shows a planar configuration of a light emitting module 61 of the fourth embodiment formed on the basis of an octahedral substrate 62 having six outer peripheral surfaces 62a to 62f. The substrate 62 is formed to have six electrode portions P1 to P6 electrically separated by six insulating layers 64a to 64f extending radially from the central portion so as to bisect each outer peripheral surface. Accordingly, three pairs of electrode surfaces A and K are formed on the upper end surface 63a, and six light emitters can be mounted. The outer peripheral surfaces 62a to 62f adjacent to each other at an angle of 120 degrees are provided with a pair of electrode surfaces A and K via the insulating layers 64a to 64f extending in the vertical direction. Can be mounted in parallel.

  FIG. 13 shows an application example in which the light emitting module 51 is incorporated as a light source of a light bulb-type lighting device 70. The light emitting module 51 is electrically connected by placing a lower end face 53b on an electrode pattern (not shown) of a substrate 72 provided in the illumination device 70, and the upper part is a light-transmitting cover 71. Covered with. The light emitting module 51 assembled in this way is configured so that a plurality of light emitters 13 are mounted in parallel above the outer peripheral surface facing in four directions, and two light emitters 13 are arranged on the upper end face. . Since the outer peripheral surface has a space in the height direction in which a plurality of light emitters can be mounted, the number and arrangement of the light emitters can be flexibly set according to the illumination application and the illumination location. Therefore, it is possible to uniformly illuminate the entire space, and to obtain a light emitting effect suitable for lighting places and lighting applications in which the light amount and luminance are set high or low in a specific direction. it can. Furthermore, heat generated by the light emission of the plurality of light emitters 13 can be released from the electrode surface of the lower end face 53b to the substrate 72 of the lighting device 70, so that heat dissipation is also improved.

A Electrode surface (anode)
K electrode surface (cathode)
P1 to P4 electrode part Q1 to Q4 electrode pattern 11 light emitting module 12 substrate 13 light emitter 13a, 13b terminal electrode 14 first insulating layer 15 second insulating layer 19 external substrate 20 solder 21-24 outer peripheral surface 25, 26 end surface 31 light emitting element 32 LED
33 Chip substrate 34a, 34b Chip electrode 35 Resin body 41, 51, 61 Light emitting module 70 Lighting device

Claims (10)

A plurality of light emitters;
A substrate made of a polyhedron having mounting surfaces on which the plurality of light emitters are mounted on a plurality of outer peripheral surfaces and both end surfaces of the outer peripheral surface;
An insulating layer that separates each mounting surface into two or more electrode surfaces is formed on each of a plurality of outer peripheral surfaces and both end surfaces, and at least one end surface of the insulating layer faces another outer peripheral surface facing from one outer peripheral surface. A light-emitting module, characterized by extending through the panel.   Each mounting surface formed on the plurality of outer peripheral surfaces of the substrate is separated into a pair of electrode surfaces by a single insulating layer connecting both end surfaces, and the mounting surfaces formed on both end surfaces of the substrate are separated from the plurality of outer peripheral surfaces. The light emitting module according to claim 1, wherein each extending insulating layer is separated into a plurality of pairs of electrode surfaces by intersecting.   The said board | substrate is electrically isolate | separated by the said insulating layer into the block-shaped electrode part which consists of a pair of end surface which divided | segmented the electrode surface which has a predetermined angle, and adjoined. The light emitting module as described.   The light emitting module according to claim 1, wherein each of the electrode surfaces formed on the plurality of outer peripheral surfaces and both end surfaces has substantially the same area.   The light emitting module according to claim 2, wherein the number of the plurality of pairs of electrode surfaces formed on the both end surfaces corresponds to the number of the outer peripheral surfaces of the substrate.   2. The light emitting module according to claim 1, wherein any one of both end surfaces of the outer peripheral surface of the substrate is a contact surface on which the motherboard is mounted, and a light emitting body is mounted on the other mounting surface.   2. The light emitting module according to claim 1, wherein the light emitting modules are electrically connected so that voltages having different polarities are applied between adjacent electrode surfaces of the mounting surfaces.   The light emitting module according to claim 1, wherein the substrate is formed into a polyhedron by a metal member or a resin member having a surface plated with metal.   The light emitting module according to claim 1, wherein the substrate is formed by an insulating member and a plurality of block-shaped metal members that are combined into a polyhedron through the insulating member.   The light emitting module according to claim 1, wherein the light emitter is a light emitting device having a PN structure or a light emitting device configured by sealing the light emitting device on an element substrate.

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